CN113218961A - Substrate defect detection device and method - Google Patents
Substrate defect detection device and method Download PDFInfo
- Publication number
- CN113218961A CN113218961A CN202110430767.8A CN202110430767A CN113218961A CN 113218961 A CN113218961 A CN 113218961A CN 202110430767 A CN202110430767 A CN 202110430767A CN 113218961 A CN113218961 A CN 113218961A
- Authority
- CN
- China
- Prior art keywords
- substrate
- shooting
- module
- illumination
- lighting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8812—Diffuse illumination, e.g. "sky"
- G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
Abstract
The invention relates to a substrate defect detection device and a method, wherein the substrate defect detection device comprises a supporting frame, an illumination and shooting module, a substrate bearing module and a control system; the supporting frame comprises a hemispherical shell, a base and a connecting section, and the hemispherical shell is arranged on the base through the connecting section; the connecting section is provided with a sheet feeding window, the hemispherical shell is uniformly provided with a plurality of mounting holes, and the axis of each mounting hole is arranged to penetrate through the spherical center of the hemispherical shell; the chip bearing module is arranged on the base and used for stably bearing the substrate to be detected; the illumination and shooting module can realize illumination and shooting of the substrate to be detected on the substrate bearing module; the control system is used for signal acquisition, data processing and linkage control of the lighting and shooting module and the bearing piece module. The invention is based on the basic principle of scattering imaging, adopts the omnibearing multi-field illumination and shooting mode to detect the substrate defects, realizes the omnibearing multi-field illumination and shooting, and makes up the deficiency of the scattering imaging method in the aspect of accurate detection of the substrate defects.
Description
Technical Field
The invention relates to the technical field of chip defect detection, in particular to a substrate defect detection device and method.
Background
Through decades of developments, the substrate defect detection technology based on the scattering imaging method has developed a plurality of technical routes:
(1) oblique Incidence (Oblique Incidence index) scattering imaging is carried out, wherein an illuminating light beam is obliquely incident on the surface of a substrate from the periphery of an imaging objective lens, scattered light is collected by a detector through the imaging objective lens, and defects are detected. The series of defect detection systems and methods have been studied based on the principle, such as the united states crystal alignment (KLA) (us patent: 8605275), Hitachi (us patent: 9933370), and chinese flying test (chinese patent: 201810954898.4).
(2) Dark Field (Dark Field) microscopic imaging, wherein an illuminating beam of the Dark Field microscopic imaging enters from an outer annular through hole inside an imaging objective lens, then uniformly irradiates on the surface of a substrate by reflection, and scattered light returns to a detector from the middle of the objective lens. Research on defect detection systems and methods based on dark-field microscopic imaging principles, such as the united states crystal alignment (KLA) (U.S. patent: 19726615) and the university of shanghai physics (chinese patent: 201611167202), has been conducted.
(3) The combined mode imaging mainly combines different lighting modes and different signal acquisition modes, improves the integrality of defect information through uniform illumination on the one hand, and on the other hand carries out the defect search through scattering imaging, carries out defect identification through bright field imaging. In order to compromise detection efficiency and integrity of defect information as much as possible, researchers have proposed a variety of combined-mode scatter imaging methods: 1) normal and oblique illumination, scatter imaging (us patent: 6590645); 2) normal and oblique illumination, coaxial bright field imaging and scatter imaging (us patent: 9053390). 3) Oblique incidence illumination, reflected bright field imaging and scatter imaging (us patent: 20160150191). 4) Normal and oblique illumination, coaxial bright field imaging, reflected bright field imaging, and scatter imaging (U.S. patent: 10551320).
The scatter imaging method is originally most sensitive to defect information, but in order to take the detection efficiency and the integrity of the defect information into consideration, only a combined imaging mode can be selected for detecting the defects of the substrate, and even the advantages of scatter imaging are sacrificed. The scattered energy intensity is directly related to the scattered angle, only local information of the energy field defect can be collected by adopting the traditional single-field illumination and shooting, the defect information cannot be completely acquired, and the size and the type of the defect cannot be accurately identified.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the invention provides a substrate defect detection device and a method, which are based on the basic principle of scattering imaging and adopt an omnibearing multi-field illumination and shooting mode to detect the substrate defects, realize omnibearing multi-field illumination and shooting and make up for the defects of the scattering imaging method in the aspect of accurate detection of the substrate defects.
The technical solution of the invention is as follows: a substrate defect detection device comprises a supporting frame, an illumination and shooting module, a substrate bearing module and a control system;
the supporting frame comprises a hemispherical shell, a base and a connecting section, and the hemispherical shell is arranged on the base through the connecting section; the connecting section is provided with a sheet feeding window, the hemispherical shell is uniformly provided with a plurality of mounting holes, and the axis of each mounting hole is arranged to penetrate through the spherical center of the hemispherical shell;
the substrate bearing module is arranged on the base and used for stably bearing a substrate to be detected;
the illuminating and shooting module comprises at least one central illuminating and shooting module positioned in the central area of the hemispherical shell and at least one peripheral illuminating and shooting module positioned at the periphery of the central area of the hemispherical shell, the illuminating and shooting modules are respectively and correspondingly installed on the installation holes of the hemispherical shell, and the illuminating and shooting module can illuminate and shoot a substrate to be detected on the substrate bearing module;
the control system is used for signal acquisition, data processing and linkage control of the lighting and shooting module and the bearing piece module.
Further, the illumination and photographing module comprises a detector, an illumination light source, a beam splitting lens barrel, a locking ring, a lens barrel lens and an imaging objective lens, the illumination and photographing module is mounted on the mounting hole through the locking ring, the detector, the illumination light source and the lens barrel lens are mounted on the beam splitting lens barrel, and the imaging objective lens is connected with the lens barrel lens.
Further, the imaging objective is an infinity objective; the tube lens is matched with the detector, the illumination light source and the imaging objective lens.
Further, the piece bearing module comprises a displacement table and a sucker, the displacement table is arranged on the base, and the sucker is arranged on the displacement table and used for adsorbing the to-be-detected substrate.
Further, the displacement table is a six-axis displacement table; the control system is used for signal acquisition, data processing and linkage control of the detector, the illumination light source and the displacement table.
Further, the control system of the substrate defect detection device is utilized to cooperatively control the illumination and shooting module and the substrate bearing module, so that the scattering characteristic analysis processing, the omnibearing signal acquisition processing, the defect identification processing or the splicing detection processing of the substrate to be detected on the substrate bearing module are realized.
Further, in the scattering characteristic analysis processing process, the at least one peripheral lighting and shooting module is controlled to sequentially start the lighting function, the at least one central lighting and shooting module is controlled to start the shooting function and collect images, and the images are used for analyzing the scattering energy intensity information of the defects on the substrate to be detected under different lighting conditions.
Further, in the process of all-directional signal acquisition and processing, the at least one central lighting and shooting module is controlled to start the lighting function, and the at least one peripheral lighting and shooting module is controlled to start the shooting function at the same time, so that scattered energy intensity information of each angle of the defect on the substrate to be detected is analyzed.
Furthermore, in the defect identification processing process, the lighting function and the shooting function of the lighting and shooting module are switched based on the detection requirement, the collected image is analyzed, and the particles, pits, scratches and/or water stain defects on the upper surface of the substrate to be detected are identified.
Further, in the process of splicing detection processing, the control system is utilized to cooperatively control the wafer bearing module and the plurality of lighting and shooting modules, so that the defect splicing detection of the whole substrate to be detected is realized.
The invention has the beneficial effects that:
1. the device arranges the multi-path illumination and shooting modules based on the spherical surface, realizes the omnibearing multi-field illumination and shooting, and makes up the defects of the scattering imaging method in the aspect of accurate detection of the substrate defects.
2. The illuminating and shooting modules with the same or different performance indexes can be arranged at different positions on the hemispherical shell of the device, and the illuminating or shooting function of any illuminating and shooting module can be turned on or off during working, so that the illuminating and shooting in any combination form can be realized.
3. Based on the device, the scattering energy intensity information of the defects under different lighting conditions can be analyzed, and then the scattering characteristics of the defects are obtained. The device can be used for analyzing the scattered energy intensity information of each dimension of the defect and cooperatively analyzing the defect characteristics based on the multi-dimension scattered energy intensity information. The device can be used for comprehensively analyzing the images collected from all paths, and further efficiently and accurately identifying the defects of particles, pits, scratches, water stains and the like on the surface of the substrate.
4. Based on the device, the chip bearing module and the lighting and shooting module can be cooperatively controlled through the control system, so that the efficient splicing detection of the defects of the whole substrate is realized.
Drawings
FIG. 1 is a schematic view of the overall structure of a substrate defect detecting apparatus according to the present invention;
FIG. 2 is a schematic view of a supporting frame structure of the substrate defect detecting apparatus of the present invention;
FIG. 3 is a schematic view of an illumination and photographing module of the substrate defect detecting apparatus according to the present invention;
FIG. 4 is a schematic structural diagram of a wafer supporting module of the substrate defect detecting apparatus according to the present invention.
Reference numerals:
the device comprises a support frame 1, a hemispherical shell 1-1, a base 1-2, an illumination and shooting module 2, a detector 2-1, an illumination light source 2-2, a beam splitting lens barrel 2-3, a locking ring 2-4, a lens barrel 2-5, an imaging objective lens 2-6, a defect characteristic 2-7, a wafer bearing module 3-1, a six-axis displacement table 3-2, a suction disc 3-3, a substrate to be detected and a control system 4.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings.
Regardless of the rayleigh scattering theory or the mie scattering theory, the scattered energy intensity and the scattering angle are directly related, only local information of energy field defects can be collected by adopting traditional single-field illumination and shooting, defect information cannot be completely acquired, and then the sizes and types of the defects cannot be accurately identified. During single-field illumination, scattering angles of defects at different spherical positions are different, and scattered energy intensities obtained at different spherical positions are different, so that complete information of the defects cannot be obtained through single-field illumination and shooting. The omnibearing multi-field illumination and shooting mode of the invention can effectively solve the relevant problems. The device arranges the multi-path illumination and shooting modules based on the spherical surface, realizes the omnibearing multi-field illumination and shooting, and makes up the defects of the scattering imaging method in the aspect of accurate detection of the substrate defects.
Referring to fig. 1-4, the apparatus comprises a support frame 1 for integrating a lighting and photographing module and a support piece module; the lighting and shooting module 2 is used for realizing omnibearing multi-field lighting and shooting; the chip bearing module 3 is used for installing the substrate and adjusting the position; and a control system 4 for signal acquisition, data processing and linkage control of the detector, the illumination light source and the displacement table. The lighting and shooting module 2 is installed on a mounting hole of a hemispherical shell 1-1 of the supporting frame 1 through a locking ring 2-4, and the sheet bearing module 3 is installed on a base 1-2 of the supporting frame 1 through a six-axis displacement table 3-1.
Referring to fig. 1-2, a supporting frame 1 of the device comprises a hemispherical shell 1-1 and a base 1-2, wherein the hemispherical shell 1-1 is installed on the base 1-2 through a connecting section. The connecting section is integrally or detachably arranged at the edge of the hemispherical shell 1-1, the connecting section is provided with a film feeding window, the film feeding window can be a rectangular window, and a sliding door is arranged outside the window, so that light leakage can be effectively prevented after the door is closed. The inner wall of the hemispherical shell 1-1 is subjected to black dyeing treatment, so that a light source can be effectively absorbed, and stray light is avoided. A plurality of mounting holes for mounting the lighting and shooting module 2 are uniformly formed in the hemispherical shell 1-1; the axis of each mounting hole passes through the center of the sphere. In this embodiment, the same number of mounting holes are disposed on different latitudinal planes, and the included angles between adjacent mounting holes on the same latitudinal plane are equal, for example, the angle between adjacent lighting and shooting modules on the same latitudinal plane is 60 °. Although the more the mounting holes are arranged on the same latitudinal plane, the more comprehensive the defect information obtained by omnibearing multi-field illumination and shooting is, the technical personnel in the field need to perform light field analysis according to the detection requirement to determine the number of the mounting holes and the size of the included angle between the adjacent mounting holes on the same latitudinal plane, and simultaneously, the spatial interference between the adjacent illumination and the shooting module 2 should be avoided.
Referring to fig. 1 and 3, an illumination and photographing module 2 of the device comprises a detector 2-1, an illumination light source 2-2, a beam splitting lens barrel 2-3, a locking ring 2-4, a lens barrel lens 2-5 and an imaging objective lens 2-6, wherein the detector 2-1, the illumination light source 2-2 and the lens barrel lens 2-5 are mounted on the beam splitting lens barrel 2-3, and the imaging objective lens 2-6 is connected with the lens barrel lens 2-5. The lighting and shooting module 2 is arranged on the hemispherical shell 1-1 and the mounting hole of the supporting frame 1 through the locking ring 2-4. The parts of the whole lighting and shooting module 2 need to be selected and matched according to the lighting wavelength, the detection field of view, the resolution and the installation layout; the detector 2-1 needs to meet the requirements of imaging field of view, resolution, sensitivity, signal-to-noise ratio and the like; the illumination light source 2-2 needs to meet the requirements of illumination area, collimation, uniformity, light intensity and the like; the imaging objective lenses 2-6 need to be infinite objective lenses, and objective lenses can be customized or standard objective lenses; the tube lens 2-5 needs to be matched with the detector 2-1, the illumination light source 2-2 and the imaging objective lens 2-6. The lighting and shooting module 2 comprises at least one central lighting and shooting module 2 positioned in the central area of the hemispherical shell 1-1 and at least one peripheral lighting and shooting module 2 positioned at the periphery of the central area of the hemispherical shell 1-1, and the lighting and shooting module 2 can realize lighting and shooting of a substrate 3-3 to be detected on the substrate bearing module 3;
referring to fig. 4, the wafer bearing module 3 of the device comprises a six-axis displacement table 3-1, a suction cup 3-2 and a substrate 3-3 to be detected, wherein the suction cup 3-2 is arranged on the six-axis displacement table 3-1, and the substrate 3-3 to be detected is adsorbed on the suction cup 3-2. The six-axis displacement table 3-1 is required to meet the stroke and precision requirements of functions of stepping detection, posture adjustment, detection focusing, substrate thickness compatibility and the like, and the sucker 3-2 is required to be compatible with the adsorption installation of the substrates to be detected 3-3 with different specifications and sizes.
The device arranges the multi-path illumination and shooting module 2 based on the spherical surface, realizes the omnibearing multi-field illumination and shooting, and makes up the deficiency of the scattering imaging method in the aspect of accurate detection of the substrate defect. Based on the detection method of the substrate defect detection device, the control system 4 receives a user instruction and sends a control signal to the lighting and shooting modules 2 positioned on different latitude layers, so that the peripheral lighting and shooting modules 2 carry out signal acquisition when the central lighting and shooting module 2 lights; or when the central and peripheral illumination and shooting modules 2 illuminate, the central illumination and shooting module 2 collects signals, and then different forms of illumination and shooting modes are realized. Of course, the lighting and photographing modules 2 with different performance indexes can be arranged and selected by those skilled in the art to be arranged at different positions according to the use requirement.
The following are several types of typical operating modes and functions:
(a) and (3) scattering characteristic analysis: the control system 4 receives a user instruction, controls the central lighting and shooting module 2 right above the substrate to only start a shooting function, and sequentially starts the lighting function for the lighting and shooting modules 2 at other positions. The illumination and camera module 2 directly above collects the scattering intensity information obtained from different illumination angles. The control system 4 processes the signal data returned by the lighting and shooting module 2 right above to obtain the characteristics of defects under the surrounding lighting condition;
(b) and (3) all-directional signal acquisition: the control system 4 receives a user instruction, controls the central lighting and shooting module 2 right above the substrate to start the lighting function, and simultaneously starts the shooting function by the lighting and shooting modules 2 at other positions. The lighting and photographing modules 2 at different azimuth angles acquire scattering intensity information obtained from lighting directly above and scattered by defects. The control system 4 processes the signal data transmitted back by the lighting and shooting modules 2 at different azimuth angles to obtain the characteristics of the defects under the conditions of right-above lighting and scattering at different azimuth angles, and further can cooperatively analyze the characteristics of the defects based on multi-dimensional scattering energy intensity information;
(c) defect identification: the control system 4 receives a user instruction, a person skilled in the art can switch the lighting and shooting functions of all the lighting and shooting modules 2 according to a detection strategy as required, the lighting and shooting modules 2 with the shooting function are started, energy obtained from the lighting and shooting modules 2 with the lighting function is collected, the collected signals are transmitted back to the control system 4, and through comprehensive analysis of the control system 4, defects such as particles, pits, scratches, water stains and the like on the surface of the substrate with different scattering intensity information are efficiently and accurately identified.
(d) Splicing detection: the control system 4 cooperatively controls the chip bearing module 3 and the lighting and shooting module 2 to realize defect splicing detection of the whole substrate. When a substrate with a large area is detected, the control system 4 controls the six-axis displacement table 3-1 to realize the movement of a substrate detection area, when the six-axis displacement table 3-1 moves the area to be detected of the substrate to the center of the hemisphere shell 1-1, any one of the modes (a) - (c) is selected as required for detection, and the control system 4 stores the acquired signals and the processed result to finish the detection of the area to be detected; then, the previous detection step is carried out in a circulating mode until the substrate is detected completely; after the detection is finished, the control system 4 splices the stored detection images, and integrates the detection results to obtain the detection result of the substrate with larger whole area.
By adopting the device provided by the invention, multi-mode detection is carried out, and compared with the traditional technology, the device can be used for more conveniently analyzing the scattered energy intensity information of the defects under different illumination conditions, so that the scattering characteristics of the defects are analyzed. The defect scattering energy intensity can be effectively improved, and therefore defects can be detected more accurately. The method can analyze the scattered energy intensity information of each dimension of the defect, thereby obtaining more accurate defect contour information and more effectively distinguishing different defect types.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto. Any person skilled in the art can appreciate that modifications and substitutions are included within the scope of the invention disclosed. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A substrate defect detecting apparatus, characterized in that: comprises a supporting frame (1), an illumination and shooting module (2), a bearing piece module (3) and a control system (4);
the supporting frame (1) comprises a hemispherical shell (1-1), a base (1-2) and a connecting section, wherein the hemispherical shell (1-1) is arranged on the base (1-2) through the connecting section; the connecting section is provided with a film feeding window, the hemispherical shell (1-1) is uniformly provided with a plurality of mounting holes, and the axis of each mounting hole is arranged to penetrate through the spherical center of the hemispherical shell (1-1);
the wafer bearing module (3) is arranged on the base (1-2) and is used for stably bearing the substrate (3-3) to be detected;
the illumination and shooting module (2) comprises at least one central illumination and shooting module (2) positioned in the central area of the hemispherical shell (1-1) and at least one peripheral illumination and shooting module (2) positioned at the periphery of the central area of the hemispherical shell (1-1), a plurality of illumination and shooting modules (2) are respectively and correspondingly installed on a plurality of installation holes of the hemispherical shell (1-1), and the illumination and shooting module (2) can realize illumination and shooting of a substrate (3-3) to be detected on the substrate bearing module (3);
the control system (4) is used for signal acquisition, data processing and linkage control of the lighting and shooting module (2) and the bearing piece module (3).
2. The substrate defect detecting apparatus according to claim 1, wherein: the illumination and shooting module (2) comprises a detector (2-1), an illumination light source (2-2), a light splitting lens barrel (2-3), a locking ring (2-4), a lens barrel lens (2-5) and an imaging objective lens (2-6), the illumination and shooting module (2) is installed on the installation hole through the locking ring (2-4), the detector (2-1), the illumination light source (2-2) and the lens barrel lens (2-5) are installed on the light splitting lens barrel (2-3), and the imaging objective lens (2-6) is connected with the lens barrel lens (2-5).
3. The substrate defect detecting apparatus according to claim 2, wherein: the imaging objective (2-6) is an infinity objective; the tube lens (2-5) is matched with the detector (2-1), the illumination light source (2-2) and the imaging objective lens (2-6).
4. The substrate defect detecting apparatus according to claim 1, wherein: the wafer bearing module (3) comprises a displacement table (3-1) and a sucker (3-2), the displacement table is arranged on the base (1-2), and the sucker (3-2) is arranged on the displacement table (3-1) and used for adsorbing a substrate (3-3) to be detected.
5. The substrate defect detecting apparatus according to claim 4, wherein: the displacement table (3-1) is a six-axis displacement table; the control system (4) is used for signal acquisition, data processing and linkage control of the detector (2-1), the illumination light source (2-2) and the six-axis displacement table (3-1).
6. The inspection method of the substrate defect inspection apparatus according to any one of claims 1 to 5, wherein: and the control system (4) of the substrate defect detection device is utilized to cooperatively control the illumination and shooting module (2) and the bearing module (3), so as to realize the scattering characteristic analysis processing, the omnibearing signal acquisition processing, the defect identification processing or the splicing detection processing of the substrate (3-3) to be detected on the bearing module (3).
7. The inspection method of a substrate defect inspection apparatus according to claim 6, wherein: and in the scattering characteristic analysis processing process, the at least one peripheral lighting and shooting module (2) is controlled to sequentially start a lighting function, the at least one central lighting and shooting module (2) is controlled to start a shooting function and acquire images, and the images are used for analyzing the scattering energy intensity information of the defects on the substrate (3-3) to be detected under different lighting conditions.
8. The inspection method of a substrate defect inspection apparatus according to claim 6, wherein: and in the process of omnibearing signal acquisition and processing, controlling the at least one central lighting and shooting module (2) to start a lighting function, and controlling the at least one peripheral lighting and shooting module (2) to start a shooting function simultaneously, wherein the functions are used for analyzing scattered energy intensity information of each angle of the defect on the substrate (3-3) to be detected.
9. The inspection method of a substrate defect inspection apparatus according to claim 6, wherein: in the defect identification processing process, the lighting function and the shooting function of the lighting and shooting modules (2) are switched based on the detection requirements, the collected images are analyzed, and the defects of particles, pits, scratches and/or water stains on the upper surface of the substrate (3-3) to be detected are identified.
10. The inspection method of a substrate defect inspection apparatus according to claim 6, wherein: in the process of splicing detection processing, the control system (4) is utilized to cooperatively control the chip bearing module (3) and the plurality of lighting and shooting modules (2), so that the defect splicing detection of the whole substrate (3-3) to be detected is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110430767.8A CN113218961B (en) | 2021-04-21 | 2021-04-21 | Substrate defect detection device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110430767.8A CN113218961B (en) | 2021-04-21 | 2021-04-21 | Substrate defect detection device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113218961A true CN113218961A (en) | 2021-08-06 |
| CN113218961B CN113218961B (en) | 2023-08-11 |
Family
ID=77088264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110430767.8A Active CN113218961B (en) | 2021-04-21 | 2021-04-21 | Substrate defect detection device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113218961B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075051A (en) * | 1996-07-05 | 1998-03-17 | Toyota Motor Corp | Visual inspection device |
| US20020196338A1 (en) * | 2001-06-04 | 2002-12-26 | Tham Yew Fei | Dome-shaped apparatus for inspecting a component or a printed circuit board device |
| CN104040287A (en) * | 2012-01-05 | 2014-09-10 | 合欧米成像公司 | Arrangement for optical measurements and related method |
| CN204629260U (en) * | 2015-05-29 | 2015-09-09 | 杭州利珀科技有限公司 | A kind of light source for crown cap defect intelligent detection equipment |
| US20150355106A1 (en) * | 2014-06-09 | 2015-12-10 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
| CN106018413A (en) * | 2016-05-12 | 2016-10-12 | 西安欣维视觉科技有限公司 | Product appearance detection device and method |
| CN206248563U (en) * | 2016-09-27 | 2017-06-13 | 西京学院 | A kind of electronic product appearance surfaces defect detecting device |
| CN108267460A (en) * | 2018-02-26 | 2018-07-10 | 湖南科创信息技术股份有限公司 | For the matrix form vision detection system and method for transparent material defects detection |
| CN108445615A (en) * | 2018-03-29 | 2018-08-24 | 中国工程物理研究院激光聚变研究中心 | A kind of optical element area scattering defect detection device |
| CN110031478A (en) * | 2019-04-18 | 2019-07-19 | 中国科学院光电技术研究所 | A kind of super-resolution defect detecting device and detection method based on hyperoscillating lens |
| CN212963235U (en) * | 2020-08-24 | 2021-04-13 | 深圳中科飞测科技股份有限公司 | Detection device |
-
2021
- 2021-04-21 CN CN202110430767.8A patent/CN113218961B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075051A (en) * | 1996-07-05 | 1998-03-17 | Toyota Motor Corp | Visual inspection device |
| US20020196338A1 (en) * | 2001-06-04 | 2002-12-26 | Tham Yew Fei | Dome-shaped apparatus for inspecting a component or a printed circuit board device |
| CN104040287A (en) * | 2012-01-05 | 2014-09-10 | 合欧米成像公司 | Arrangement for optical measurements and related method |
| US20150355106A1 (en) * | 2014-06-09 | 2015-12-10 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
| CN204629260U (en) * | 2015-05-29 | 2015-09-09 | 杭州利珀科技有限公司 | A kind of light source for crown cap defect intelligent detection equipment |
| CN106018413A (en) * | 2016-05-12 | 2016-10-12 | 西安欣维视觉科技有限公司 | Product appearance detection device and method |
| CN206248563U (en) * | 2016-09-27 | 2017-06-13 | 西京学院 | A kind of electronic product appearance surfaces defect detecting device |
| CN108267460A (en) * | 2018-02-26 | 2018-07-10 | 湖南科创信息技术股份有限公司 | For the matrix form vision detection system and method for transparent material defects detection |
| CN108445615A (en) * | 2018-03-29 | 2018-08-24 | 中国工程物理研究院激光聚变研究中心 | A kind of optical element area scattering defect detection device |
| CN110031478A (en) * | 2019-04-18 | 2019-07-19 | 中国科学院光电技术研究所 | A kind of super-resolution defect detecting device and detection method based on hyperoscillating lens |
| CN212963235U (en) * | 2020-08-24 | 2021-04-13 | 深圳中科飞测科技股份有限公司 | Detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113218961B (en) | 2023-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5241369A (en) | Two-dimensional optical scatterometer apparatus and process | |
| CN106959293A (en) | The system and method for defect on reflective surface is detected by vision system | |
| EP0935134B1 (en) | Apparatus and method for inspecting the edge micro-texture of a semiconductor wafer | |
| TWI480542B (en) | A defect detection method and apparatus therefor, and a defect observation method and apparatus therefor | |
| CN212321462U (en) | Surface defect detection device | |
| US20120092484A1 (en) | Defect inspection method and apparatus therefor | |
| KR101962072B1 (en) | Lens surface inspection device | |
| CN101019061A (en) | Apparatus and method for inspecting microstructures in reflected or transmitted infrared light | |
| JP2001524205A (en) | Automatic inspection system with brightfield and darkfield illumination | |
| US10634618B2 (en) | Apparatus and a method for inspecting a light transmissible optical component | |
| US9970884B1 (en) | Apparatus and a method for inspecting a light transmissive optical component | |
| US8908172B2 (en) | Defect inspection device and method of inspecting defect | |
| US8502966B2 (en) | Surface defect inspection method and apparatus | |
| US7924517B2 (en) | Spatial filter, a system and method for collecting light from an object | |
| CN112945988B (en) | Lens defect detection system and detection method | |
| CN107466475B (en) | For checking the device and method of light-transparent optical component | |
| CN109387518A (en) | Automatic optical detection method | |
| US7880798B2 (en) | Apparatus and method for optically converting a three-dimensional object into a two-dimensional planar image | |
| CN110715930A (en) | Precise optical surface weak defect microscopic illumination method and device | |
| CN113218961B (en) | Substrate defect detection device and method | |
| KR20160121716A (en) | Surface inspection apparatus based on hybrid illumination | |
| CN111610197A (en) | Defect detection device and defect detection method | |
| CN109937360B (en) | Device and method for detecting light-permeable optical component | |
| CN107230648A (en) | A kind of substrate defects detection means and detection method | |
| JP2003202302A (en) | Surface defect-inspecting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |