CN113213745B - Cutting machine and cutting method thereof - Google Patents
Cutting machine and cutting method thereof Download PDFInfo
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- CN113213745B CN113213745B CN202110311910.1A CN202110311910A CN113213745B CN 113213745 B CN113213745 B CN 113213745B CN 202110311910 A CN202110311910 A CN 202110311910A CN 113213745 B CN113213745 B CN 113213745B
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- glass substrate
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The application discloses cutting machine and cutting method thereof, the cutting machine is used for cutting glass substrate and forming a plurality of daughter boards, the cutting method includes the steps: identifying the type of the glass substrate to be cut; when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode; when the glass substrate to be cut is identified as a second type of glass substrate, cutting the glass substrate by using a second type mode; wherein the first type of manner cuts the glass substrate into sub-sheets of a first specification and the second type of manner cuts the glass substrate into sub-sheets of a second specification; so as to meet the requirements of cutting different types of glass substrates.
Description
Technical Field
The application relates to the technical field of display, in particular to a cutting machine and a cutting method thereof.
Background
The display panel is the most important part in the display industry and is also the most important component in the display terminal product. The display panels of normal computer displays, mobile phones and the like are not directly manufactured, a large mother board needs to be manufactured firstly, and subsequent module manufacturing processes can be carried out only after the mother board is cut into middle plates or small plates.
With the diversification of the product types, different cutting operations are often required for mother boards or middle boards of different specifications, and a certain improvement needs to be performed on the cutting machine, but the cost is increased by improving the cutting machine, so that how to cut panels of different specifications by using the existing cutting machine becomes a problem to be solved urgently.
Disclosure of Invention
The application aims to provide a cutting machine and a cutting method thereof, so as to meet the requirements of cutting different types of glass substrates.
The application discloses cutting method of cutting machine, cutting machine is used for cutting glass substrate and forms a plurality of daughter boards, includes the step:
identifying the type of the glass substrate to be cut;
when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode; and
when the glass substrate to be cut is identified as a second type of glass substrate, cutting the glass substrate by using a second type mode;
the first type mode cuts the glass substrate into sub-plates with a first specification, and the second type mode cuts the glass substrate into sub-plates with a second specification.
Optionally, the step of identifying the type of the glass substrate to be cut further comprises the following steps:
and cutting the glass mother plate into a plurality of glass substrates to be cut along the cutting marks.
Optionally, before the step of cutting the mother glass substrate into a plurality of glass substrates to be cut along the cutting marks, the method further comprises:
identifying a product recipe table of the glass mother board;
when the product formula table is identified to comprise daughter boards with at least two specifications, identifying the product formula table as a composite glass mother board;
cutting the composite glass mother board along the cutting mark of the composite glass mother board to form a first type glass substrate and a second type glass substrate;
when the product formula table is identified to comprise a daughter board with one specification, the product formula table is identified as a single-type mother glass board;
and cutting the single-type glass mother plate to form a second type glass substrate.
Optionally, when the product formula table is identified to include at least two specifications of daughter boards, the step of identifying as a composite glass mother board further includes:
adding a specific mark to the area of the first type of glass substrate on the composite glass mother board according to a product formula table;
marking cutting marks according to the areas of the first glass substrate and the second glass substrate, wherein the cutting marks are used for determining that the glass mother board is cut into a plurality of glass substrates to be cut;
the step of identifying the type of the glass substrate to be cut comprises the following steps:
identifying whether the glass substrate to be cut is provided with a specific mark or not;
when the glass substrate to be cut is identified to have the specific mark, judging that the glass substrate to be cut is the first type of glass substrate;
and when the glass substrate to be cut is identified to have no specific mark, judging that the glass substrate to be cut is the second type glass substrate.
Optionally, when the glass substrate to be cut is identified as the first type of glass substrate, the step of cutting the glass substrate in the first type of manner includes the steps of:
when the glass substrate to be cut is identified to be the first type of glass substrate, the cutting machine cuts the first type of glass substrate based on the first data to form a plurality of sub-boards with the first specification.
Optionally, the first data includes: and taking the glass substrate to be cut along a preset direction, rotating the glass substrate to be cut by a first preset angle, and rotating the first specification sub-board by a second preset angle after cutting the glass substrate to be cut.
Optionally, the cutting machine cuts along the same direction.
The application also discloses a cutting machine for with a plurality of daughter boards of glass substrate cutting formation, include: the device comprises an identification module, a storage module, a cutting module, a carrying module and a control module; the identification module is used for identifying the identification code of the glass substrate; the storage module is used for storing cutting data of different glass substrates; the cutting module is used for cutting the glass substrate; the carrying module is used for carrying the glass substrate; the control module is used for controlling the operation of the carrying module, the cutting module and the identification module; wherein the cutting data comprises: when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode; and when the glass substrate to be cut is identified as the second type of glass substrate, cutting the glass substrate by using a second type mode.
Optionally, the cutting machine further includes a marking module, the identification code of the glass substrate includes a product formula table, and when the identification module identifies that the product formula table includes at least two specifications of daughter boards, the marking module marks a specific mark for the glass substrate.
Optionally, the cutting modules cut along the same direction.
Compared with the common cutting scheme that only one specification of glass substrate can be cut, the cutting machine can select different cutting modes by identifying different types of glass substrates to be cut, and can cut two sub-boards with different specifications. The specifications and the number of the sub-boards produced by the different types of glass substrates are different, the arrangement positions of the sub-boards in the glass substrates are also different, and the possible cutting paths and the like are also different; consequently, need use different cutting paths to the cutting of the glass substrate of different grade type, and the cutting machine of this application can realize the cutting of the glass substrate of different grade type, and the suitability is stronger.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a flow chart of a cutting method according to an embodiment of the present application;
FIG. 2 is a schematic view of a glass substrate according to an embodiment of the present application;
FIG. 3 is a flow chart of a cutting method of another embodiment of the present application;
FIG. 4 is a schematic view of a first type of glass substrate and a second type of glass substrate according to an embodiment of the present application;
FIG. 5 is a schematic view of a glass master according to an embodiment of the present application;
FIG. 6 is a schematic view of a cutting process for a mother glass sheet according to an embodiment of the present application;
fig. 7 is a schematic view of a cutting machine of an embodiment of the present application;
fig. 8 is a schematic view of a carrier module according to an embodiment of the present application.
100, a first type glass substrate; 200. a second type glass substrate; 500. a cutter; 510. an identification module; 520. a storage module; 530. a cutting module; 540. a carrying module; 541. a main shaft; 542. a rotating plate; 550. and a control module.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, as another embodiment of the present application, there is disclosed a cutting method of a cutting machine, including the steps of:
s100: identifying the type of the glass substrate to be cut;
s200: when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode;
s300: when the glass substrate to be cut is identified as a second type of glass substrate, cutting the glass substrate by using a second type mode;
the first type mode cuts the glass substrate into sub-plates with a first specification, and the second type mode cuts the glass substrate into sub-plates with a second specification.
For the cutting board of general glass substrate that can only cut a specification, the cutting machine of this application selects different cutting methods through the type of discerning different cutting glass substrates, can cut out two kinds of daughter boards of different specifications. The specifications and the number of the sub-boards produced by the different types of glass substrates are different, the arrangement positions of the sub-boards in the glass substrates are also different, and the possible cutting paths and the like are also different; consequently, need use different cutting paths to the cutting of the glass substrate of different grade type, and the cutting machine of this application can realize the cutting of the glass substrate of different grade type, and the suitability is stronger.
It should be noted that the first type glass substrate or the second type glass substrate stated herein may be different types of mother substrates, or may be a middle plate of different types of glass substrates generated for the same mother substrate, and the daughter board is finally formed by cutting the middle plate.
In this embodiment, when the glass substrate to be cut is used as a mother substrate, the glass substrate is cut in a single size or a sleeve cutting manner. When the glass substrate to be cut is sent to the cutting machine, the product formula table of the glass substrate is firstly identified, the number and the specification of the membranes in the glass substrate are identified, and the type of the glass substrate is judged according to the number and the specification of the membranes in the glass substrate; in brief, when designing a glass substrate to be cut, the size of the glass substrate can be considered, and the glass substrate can be divided into how many sub-boards and what specification of sub-boards.
Generally speaking, when a glass substrate to be cut is used as a mother board, a daughter board with the same specification is arranged on one substrate, the cutting is more convenient and simpler, the mass production effect is good, and the use of a mask plate for manufacturing the glass substrate is simpler. However, there is a need for panels of different sizes, and after the mother board is allocated with daughter boards of the same specification, there is a waste area B as shown in fig. 2, where the area a is a design area for large-sized daughter boards, and the small-sized daughter boards are arranged in the waste area B, and the daughter boards can be produced from this part, which greatly reduces the waste of production data. The big size daughter board here can be 43 cun daughter boards, and the small-size daughter board is 23 cun daughter boards, and 43 cun daughter boards arrange with the small-size daughter board differently, and the width direction along the daughter board of 43 cun daughter boards arranges, and 23 cun daughter boards arrange along the length direction of daughter board, according to the size of actual glass substrate, generally can be two, totally eight 43 cun daughter boards, one, totally two 23 cun daughter boards. Therefore, the glass substrate is a composite glass substrate, and the glass substrate with sub-boards of two or more specifications needs to be cut in a sleeving cutting mode. The single-type glass substrate is required to be cut by a single-type cutting method, and the case cutting and the single-type cutting method are described in detail below.
In view of the above, how to distinguish the first type glass substrate from the second type glass substrate, the present embodiment exemplifies the following ways: identifying whether the glass substrate to be cut is provided with a specific mark or not;
when the glass substrate is identified to have the specific mark, identifying the glass substrate as a first type of glass substrate;
when the glass substrate plate is identified without a specific label, the glass substrate plate is identified as a second type of glass substrate.
Specifically, the first and second types of glass substrates are distinguished by identifying whether a specific mark is provided on the glass substrate. The method comprises the steps of identifying the size and specification information of a glass substrate to be cut on a machine table, identifying a product formula table, marking the first type of glass substrate and the second type of glass substrate respectively, and generating different cutting schemes correspondingly, such as sleeve cutting and single type cutting, aiming at the first type of glass substrate and the second type of glass substrate.
In another embodiment, the glass substrate to be cut is a middle plate, which is cut from a mother glass plate, and the mother glass plate is divided into a composite mother glass plate and a single mother glass plate. The corresponding cutting method comprises the following steps:
s10: cutting the glass mother board into a plurality of glass substrates to be cut along the cutting marks;
in this embodiment, the belt-cutting glass substrate is a middle plate, that is, the glass substrate is formed by cutting the glass mother plate along the cutting mark. For the mother board, a first kind of glass substrate and a second kind of glass substrate can be cut in one mother board; another situation is where a master is cut into a plurality of second type glass substrates, where the glass substrates set forth herein are midplane boards. The mother substrate for the middle plate which can form two different types of glass substrates may be a composite type glass mother substrate, and the mother substrate for the middle plate which can only form one type, i.e., the second type of glass substrate, may be a single type glass mother substrate.
Specifically, the composite glass mother plate needs to be cut by using a sleeve cutting method, and the single-type glass mother plate needs to be cut by using a single-type cutting method. As shown in fig. 4, the composite glass mother sheet may be cut into two second-type glass substrates and one first-type glass substrate. The second glass substrate comprises transversely arranged sub-plates with a second specification, and the first glass substrate comprises longitudinally arranged sub-plates with a first specification. As mentioned above, the first-size daughter board herein is a small-sized daughter board, and is formed from a waste area of the mother glass board.
As shown in fig. 5, how the machine platform identifies different glass mother boards, the step of cutting the glass mother boards along the cutting marks into a plurality of glass substrates to be cut further includes:
s11: identifying a product recipe table of the glass mother board;
s12: when the product formula table is identified to comprise daughter boards with at least two specifications, the product formula table is identified as a composite glass mother board;
s13: cutting the composite glass mother board along the cutting mark of the composite glass mother board to form a first type glass substrate and a second type glass substrate;
s14: when the product formula table is identified to comprise a daughter board with one specification, the product formula table is identified as a single-type mother glass board;
s15: and cutting the single-type glass mother plate to form a second type glass substrate.
In the scheme, the daughter boards of the composite glass mother board and the single glass mother board are different in specification and arrangement, for example, the composite glass mother board may have one more first type glass substrate than the single glass mother board, and have the same number of second type glass substrates. The reason for this is that the composite mother glass substrate is provided with a relatively small daughter board of the first specification in the area where the daughter board is not provided on the single mother glass substrate (this area is not enough to provide the daughter board of the second specification), so that the mother glass substrate in this partial area can be used, and when cutting, this area, i.e., the first type glass substrate, needs to be cut. The first type of glass substrate includes at least two sub-panels of a first specification, and the second type of glass substrate includes at least two sub-panels of a second specification. The daughter board of the first specification and the daughter board of the second specification in the composite mother board are arranged differently, as in the above-mentioned embodiment.
Specifically, the composite glass mother board and the single glass mother board are distinguished by a cutting machine; when the product formula table is identified to comprise the daughter boards with at least two specifications, the step of identifying as the composite glass mother board further comprises the following steps:
adding a specific mark to the area of the first type of glass substrate on the composite glass mother board according to a product formula table;
marking cutting marks according to the areas of the first glass substrate and the second glass substrate, wherein the cutting marks are used for determining that the glass mother board is cut into a plurality of glass substrates to be cut;
correspondingly, at S10: the method for cutting the glass mother board into the plurality of glass substrates to be cut along the cutting marks further comprises the following steps:
s16: identifying whether the glass substrate to be cut is provided with a specific mark or not;
s17: when the glass substrate to be cut is identified to have the specific mark, judging that the glass substrate to be cut is the first type of glass substrate;
s18: and when the glass substrate to be cut is identified to have no specific mark, judging the glass substrate to be cut to be a second type glass substrate.
S19: when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode;
s20: when the glass substrate to be cut is identified as a second type glass substrate, cutting the glass substrate by using a second type mode;
the first type mode cuts the glass substrate into sub-boards with a first specification, and the second type mode cuts the glass substrate into sub-boards with a second specification.
The product recipe table of the mother glass board is directly identified by the cutting machine, generally speaking, the product recipe table can include specification and type information of the daughter board. The cutting machine adds a specific mark to the first type of glass substrate by identifying the area of the daughter board with the first specification, namely the first type of glass substrate. In the stage of identifying the glass mother board, when the glass mother board is cut to form a first type glass substrate and a second type glass substrate, the cutting machine distinguishes the first type glass substrate and the second type glass substrate by identifying whether the glass substrates are provided with specific marks or not. Thereby selecting different cutting modes.
The specific way of marking the specific mark by the cutting machine platform comprises the following steps: and identifying a product formula table of the glass mother plate, and marking a specific mark, such as Mflag, corresponding to the compound glass mother plate in the machine system. Generally, the mother glass plate and the daughter plate are respectively provided with a product identification code, the product identification code of the mother glass plate usually comprises a product recipe table and the like, the product identification code of the daughter plate comprises the specification and the type information of a product, and it should be noted that the identification code of the mother plate and the identification code of the daughter plate are corresponding IDs (identity documents), the cutting machine table directly marks Mflag through identifying the identification code corresponding to each mother glass plate and each daughter plate, and when the mother glass plate is sent to the machine table, the machine table directly identifies the product identification code carried by the mother glass plate to determine whether the mother glass plate is provided with a specific mark. Certainly, compared with a cutting machine which is low in system and does not have identification capability and is generally used for fixedly processing the cutting of the daughter boards, the identification mode can be additionally arranged on the cutting machine platform, and the Mark specific Mark can be a forming mode of a contraposition Mark or a cutting Mark, namely, before the glass mother board is designed, the specific Mark is correspondingly arranged in the area of the glass mother board corresponding to the first type of glass substrate, so that the cutting machine can distinguish the composite glass mother board from the single type of glass mother board by identifying the specific Mark.
Specifically, when the glass substrate to be cut is identified as the first type of glass substrate, the step of cutting the glass substrate in the first type manner includes the steps of: when the glass substrate to be cut is identified to be the first type of glass substrate, the cutting machine cuts the first type of glass substrate based on the first data to form a plurality of sub-boards with the first specification. When the glass mother board is designed, the cutting mark can be correspondingly designed, the cutting machine platform cuts along a preset path after recognizing the cutting mark, as shown in fig. 5, the cutting mark can be arranged between every two daughter boards, and the cutting machine platform cuts after correctly recognizing the cutting mark. Wherein, the first data respectively comprise the cutting track of the cutting machine or the direction of the glass substrate; the following is by way of two examples, respectively.
In one embodiment, the cutting machine performs cutting along the same direction, and the position of the glass substrate to be cut needs to be adjusted by a robot arm, that is, the first data is an adjusting step for the glass substrate:
after the first type of glass substrate is identified, the glass substrate to be cut is taken along the preset direction, the glass substrate to be cut is rotated by a first preset angle, the glass substrate to be cut is cut, the first specification sub-boards are rotated by a second preset angle, and the plurality of first specification sub-boards are taken out in sequence.
As shown in fig. 6, if the cutting machine recognizes that there is a specific mark, the first type of glass substrate is taken by the suction cup (the suction cup is a conveying device for the glass substrate to be cut, and is further described below), and the operation sequence is: and taking the film at 0 degree, and clockwise rotating the film by 90 degrees to put the film. Cutting along the cutting mark to form three sub-boards 09,10 and 11, and then taking the sheets at 90 degrees and placing the sheets at 0 degree anticlockwise when taking the sheets; because the daughter board has the terminal side, the terminal side is used for binding PCBA board or COF, when flowing out from the cutting board after the daughter board cutting, the orientation of terminal side need be considered in the outflow. So that the sub-board flows out in a direction from the terminal side to the opposite terminal side. The sheet taking and placing modes of the mechanical arm are different, so that the rotation directions are different. On the other hand, the second type glass substrate does not have a specific mark, and corresponds to the daughter boards 01, 02, 03, 04, 05, 06, 07, and 08 in fig. 6. Taking the film at 180 degrees and placing the film at 90 degrees; when the daughter board is taken, the 0-degree sheet taking and the 0-degree sheet placing correspondingly enable the daughter board to flow out along the direction from the terminal side to the opposite terminal side. It should be noted that the three sub-boards 09,10, and 11 are only illustrated by way of example, and are not limited to 3 sub-boards produced by the first type of glass substrate, and in other cases, one or more sub-boards are also possible, as are the second type of glass substrate. The first type glass substrate and the second type glass substrate formed by cutting the same glass mother board can be cut simultaneously by two cutting machines, correspondingly, the daughter board with the first specification can flow out from one channel, and the daughter board with the second specification can flow out from the second channel. It should be noted that, since the cutting mark corresponding to each glass substrate is determined when the daughter board is designed, the cutting mark of the glass substrate can be cut only when the glass substrate is mounted on the machine table and corresponds to the cutting machine. The device for carrying the glass is a robot or a suction cup, and the following devices are described in detail.
In another embodiment, the cutting machine can cut along different directions, so the first data corresponds to the direction of the cutting machine, and the machine with the adjustable cutting direction is more convenient for cutting: the improvement made by the application is mainly used for cutting the composite glass template and the single cutting mother board by the cutting machine table with low intellectualization and low cost.
As shown in fig. 7, as another embodiment of the present application, a cutting machine for cutting a glass substrate to form a plurality of sub-boards is disclosed, and a cutting method using the cutting machine described above includes: an identification module 510, a storage module 520, a cutting module 530, a handling module 540, and a control module 550; the identification module 510 is used for identifying the identification code of the glass substrate; the storage module 520 is used for storing cutting data of different glass substrates; the cutting module 530 is used for cutting the glass substrate; the carrying module 540 is used for carrying the glass substrate; the control module 550 is used for controlling the operation of the carrying module 540, the cutting module 530 and the identification module 520; wherein the cutting data comprises: when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode; and when the glass substrate to be cut is identified as the second type of glass substrate, cutting the glass substrate by using a second type mode. The utility model provides a cutting machine selects different cutting module methods through the type of discerning different cutting glass substrate, can cut out two kinds of daughter boards of different specifications. The specifications and the number of the sub-boards produced by the different types of glass substrates are different, the arrangement positions of the sub-boards in the glass substrates are also different, and the possible cutting paths and the like are also different; therefore, the cutting-in of different types of glass substrates requires the use of different cutting paths. It should be noted that the cutting module 530 may be a cutting knife, the identification module 510 may be a code scanning gun, and the corresponding identification code may be a bar code or a two-dimensional code. The cutting module that this application used is a cutting machine of simple structure, need not set up the removal structure of load for the cutting module, only need with the cutting module cuts along same direction, through transport module 540, the transport module that here indicates can be robotic arm or sucking disc, wherein, the sucking disc is as shown in fig. 8, sucking disc 540 includes main shaft 541 and rotor plate 542, the rotor plate can be around 360 degrees rotations of main shaft, the adsorption structure is installed to the one side that the rotor plate deviates from the main shaft, be used for with glass substrate absorption fixed, and remove glass substrate, move glass substrate to the cutting machine on or move to the transmission track on.
Specifically, the cutting machine further comprises a marking module, the identification code of the glass substrate comprises a product formula table, and when the identification module identifies that the product formula table comprises at least two specifications of daughter boards, the marking module marks a specific mark for the glass substrate. In this embodiment, a composite glass mother substrate and a single glass mother substrate are exemplified. The composite glass mother board and the single glass mother board are distinguished by a cutting machine; the cutting method corresponding to the cutting machine comprises the following steps: adding a specific mark to the area of the first type of glass substrate on the composite glass mother board according to a product formula table; marking cutting marks according to the areas of the first glass substrate and the second glass substrate, wherein the cutting marks are used for determining that the glass mother board is cut into a plurality of glass substrates to be cut; identifying whether the glass substrate to be cut is provided with a specific mark; when the glass substrate to be cut is identified to have the specific mark, judging that the glass substrate to be cut is the first type of glass substrate; and when the glass substrate to be cut is identified to have no specific mark, judging that the glass substrate to be cut is the second type glass substrate. The product recipe table of the mother glass board is directly identified by the cutting machine, generally speaking, the product recipe table can include specification and type information of the daughter board. The cutting machine adds a specific mark to the first type of glass substrate by identifying the area of the daughter board with the first specification, namely the first type of glass substrate. In the stage of identifying the glass mother board, when the glass mother board is cut to form a first type glass substrate and a second type glass substrate, the cutting machine distinguishes the first type glass substrate and the second type glass substrate by identifying whether the glass substrates are provided with specific marks or not. Thereby selecting different cutting modes.
It should be noted that, the limitations of each step in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all the steps should be considered as belonging to the protection scope of the present application.
The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and the above solution can be applied thereto.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (7)
1. A cutting method of a cutting machine for cutting a glass substrate into a plurality of sub-boards, comprising the steps of:
identifying a product recipe table of the glass mother board;
when the product formula table is identified to comprise a daughter board with one specification, the daughter board is identified to be a single-type glass mother board, the single-type glass mother board is cut to form a glass substrate to be cut, and the formed glass substrate to be cut is a second type glass substrate;
when the product formula table is identified to comprise daughter boards with at least two specifications, identifying the product formula table as a composite glass mother board;
adding a specific mark to the area of the first type of glass substrate on the composite glass mother board according to a product formula table; and
marking cutting marks according to the areas of the first glass substrate and the second glass substrate, wherein the cutting marks are used for determining that the glass mother board is cut into a plurality of glass substrates to be cut;
cutting the composite glass mother board along the cutting mark of the composite glass mother board to form a first type glass substrate and a second type glass substrate;
identifying the type of the glass substrate to be cut, namely identifying whether the glass substrate to be cut is provided with a specific mark;
when the glass substrate to be cut is identified to have a specific mark, judging that the glass substrate to be cut is a first type of glass substrate; and
when the fact that the glass substrate to be cut has no specific mark is recognized, the glass substrate to be cut is judged to be a second type of glass substrate;
when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode; and
when the glass substrate to be cut is identified as a second type glass substrate, cutting the glass substrate by using a second type mode;
the glass substrate to be cut is a middle plate and is cut by a glass mother plate.
2. The cutting method of the cutting machine according to claim 1, wherein the step of cutting the glass substrate using the first type manner when the glass substrate to be cut is identified as the first type glass substrate includes:
when the glass substrate to be cut is identified to be the first type of glass substrate, the cutting machine cuts the first type of glass substrate based on the first data to form a plurality of sub-boards with the first specification.
3. The cutting method of the cutting machine according to claim 2, wherein the first data includes: and taking the glass substrate to be cut along a preset direction, rotating the glass substrate to be cut by a first preset angle, and rotating the first specification sub-board by a second preset angle after cutting the glass substrate to be cut.
4. The cutting method of the cutting machine according to claim 1, wherein the cutting machine performs cutting in the same direction.
5. A cutting machine for cutting a glass substrate to form a plurality of sub-boards, wherein the cutting method of any one of claims 1 to 4 is used, comprising:
the identification module is used for identifying the identification code of the glass substrate;
the storage module is used for storing cutting data of different glass substrates;
a cutting module; used for cutting the glass substrate;
a carrying module for carrying the glass substrate; and
the control module is used for controlling the operation of the carrying module, the cutting module and the identification module;
wherein the cutting data comprises: when the glass substrate to be cut is identified as a first type glass substrate, cutting the glass substrate by using a first type mode; and when the glass substrate to be cut is identified as the second type of glass substrate, cutting the glass substrate by using a second type mode.
6. The cutting machine of claim 5, further comprising a marking module, wherein the identification code of the glass substrate comprises a product recipe table, and the marking module adds a specific mark to the glass substrate when the identification module identifies that the product recipe table comprises at least two sizes of daughter boards.
7. The cutting machine of claim 5 wherein the cutting modules cut in the same direction.
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