CN106554149A - Glass cover-plate excision forming method - Google Patents
Glass cover-plate excision forming method Download PDFInfo
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- CN106554149A CN106554149A CN201510641058.9A CN201510641058A CN106554149A CN 106554149 A CN106554149 A CN 106554149A CN 201510641058 A CN201510641058 A CN 201510641058A CN 106554149 A CN106554149 A CN 106554149A
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- China
- Prior art keywords
- cut
- line
- glass cover
- plate
- cutting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention relates to a kind of glass cover-plate excision forming method.The method comprising the steps of：Line of cut is defined on the glass substrate, and multiple pieces of glass cover plate is defined by the line of cut, wherein the line of cut includes the first interlaced line of cut of bearing of trend and the second line of cut；And along glass substrate described in the cutting wire cutting, multiple pieces of glass cover plate to be formed so as to the glass substrate is split, wherein, when being cut to apart from the second line of cut side predeterminable range along first line of cut towards second line of cut, stop cutting, then continue cutting towards the direction away from second line of cut along first line of cut from the opposite side predeterminable range apart from second line of cut.The glass cover-plate excision forming method yield is higher and cost is relatively low.
Description
Technical field
The present invention relates to a kind of forming method, more particularly to a kind of glass cover-plate excision forming method.
Background technology
For the glass cover-plate of electronic product, OGS (the one glass solution) product of such as mobile phone, at present
Requirement more and more higher on market to its performance, such as requires that stress layer depth is more than 35um.And it is directed to this answering
The higher OGS products of power depth, typically by knife flywheel type cutting mode excision forming, but this cut into
Type method easily makes the ruptile that substrate is produced so that product cutting yield is less than 90%, it is impossible to ensure
Product cuts yield, and it is too high to be cut then cost using laser cutting device.
The content of the invention
In view of this, it is necessary to one kind is provided and is difficult that yield is higher and lower-cost glass cover-plate excision forming
Method.
A kind of glass cover-plate excision forming method, comprises the following steps：
Line of cut is defined on the glass substrate, and multiple pieces of glass cover plate is defined by the line of cut, wherein
The line of cut includes the first interlaced line of cut of bearing of trend and the second line of cut；And
Along glass substrate described in the cutting wire cutting, so as to the glass substrate is split to form multiple pieces of glass
Cover plate, wherein, when being cut to apart from described second along first line of cut towards second line of cut
During the predeterminable range of line of cut side, stop cutting, then preset from the opposite side apart from second line of cut
Continue cutting towards the direction away from second line of cut along first line of cut at distance.
Wherein in one embodiment, the glass substrate is OGS substrates, the CF substrate for electronic installation
Or TFT substrate.
Wherein in one embodiment, the predeterminable range is 0.6-0.8 millimeters.
Wherein in one embodiment, first line of cut is interrupted in staggered place, to be divided into two-section cutting
Line, the end points of the two-section line of cut are spaced 0.6-0.8 millimeters with second line of cut.
Wherein in one embodiment, the cutting step is included using break bar along described in the cutting wire cutting
Glass substrate, when being cut to apart from the second line of cut side 0.6-0.8 millimeters along first line of cut
Apart from when, the break bar stops cutting, and from apart from edge at the second line of cut opposite side 0.6-0.8 millimeters
First line of cut and continue cutting towards the direction away from second line of cut, the break bar stops cutting
Time be the 2-3 seconds.
Wherein in one embodiment, the bearing of trend of first line of cut and prolonging for second line of cut
Stretch direction to be mutually perpendicular to.
Wherein in one embodiment, after defining glass cover-plate, on a lateral edges of the glass substrate simultaneously
Row are placed with the glass cover-plate of polylith longitudinal direction, are placed with polylith on the glass substrate in relative other edge
Horizontal glass cover-plate, the short side edge of the multiple pieces of glass cover plate of the longitudinal direction arrangement define the 3rd line of cut,
The long side edge of the multiple pieces of glass cover plate of the horizontal arrangement defines the 4th line of cut, the 3rd line of cut
Distance parallel with the 4th line of cut and therebetween is more than 4 millimeters.
Wherein in one embodiment, include the step of definition line of cut on the glass substrate：Described
Silk-screen indigo plant film is covered on glass substrate, trace line is formed on silk-screen indigo plant film, by the glass substrate
Expose, the line of cut is defined using the trace line.
Due to cutting when the first interlaced line of cut of bearing of trend and the second line of cut, on the first line of cut
Cut in place of interlocking with the second line of cut, carried out both direction in staggered place so as to avoid
Repeat to cut brought destruction, improve the cutting yield of glass cover-plate, and the cutting method need not be adopted
With laser cutting device, cutting cost is reduced.
Description of the drawings
The step of Fig. 1 is the glass cover-plate excision forming method of embodiment flow chart；
Fig. 2 is the floor map of glass substrate in an embodiment；And
Partial enlarged drawings of the Fig. 3 for glass substrate shown in Fig. 2.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.
The better embodiment of the present invention is given in accompanying drawing.But, the present invention can come in many different forms
Realize, however it is not limited to embodiments described herein.On the contrary, the purpose for providing these embodiments is
Make to the more thorough comprehensive of the disclosure understanding.
Fig. 1 to Fig. 3 is referred to, the glass cover-plate excision forming method of an embodiment is comprised the following steps：
In step s 201, line of cut 20 is defined on glass substrate 100, and defined by line of cut 20
Go out multiple pieces of glass cover plate 10.
Glass substrate 100 is the monoblock large-area glass substrate via Sensor processing procedures, i.e. glass substrate 100
On be formed with sensor circuit.Touch-screen glass cover-plate of the glass substrate 100 for electronic installation, it is in particular a kind of
OGS substrates, its stress layer depth are more than 35um.It is appreciated that glass substrate 100 can also be electricity
CF (color filter) substrates of sub- communication device or TFT (Thin Film Transistor) substrate.
In the present embodiment, the concrete size according to multiple pieces of glass cover plate 10, enterprising in glass substrate 100
Row mixed composition, forms line of cut 20 between adjacent two pieces of glass cover-plates 10.
Specifically, silk-screen indigo plant film is covered in glass substrate 100, to protect the surface of the glass substrate 100；
Trace line is formed on the silk-screen indigo plant film of glass substrate 100, glass substrate 100 is exposed, using the trace
Trace defines line of cut 20；Multiple pieces of glass cover plate 10 is defined using line of cut 20.
Wherein, line of cut 20 includes the first interlaced line of cut 21 of bearing of trend and the second line of cut 23,
Wherein the first line of cut 21 is interrupted in staggered place, to be divided into two-section line of cut 211, two-section line of cut 211
End points and the second line of cut 23 interval predeterminable range.In the present embodiment, the end of two-section line of cut 211
Point is 0.6-0.8 millimeters with the distance of the second line of cut 23.First line of cut 21 and the second line of cut 23
Crisscross to be mutually perpendicular to, the first line of cut 21 is transverse cut, and the second line of cut 23 is cut for longitudinal direction
Secant.
In the present embodiment, the size of glass cover-plate 10 is 550 millimeters * 650 millimeters, glass substrate 100
A lateral edges on laid out in parallel have the glass cover-plate 10 of three pieces of longitudinal directions, it is relative another on glass substrate 100
On edge, left and right is placed with two pieces of horizontal glass cover-plates 10, shape between the glass cover-plate 10 of adjacent two pieces of longitudinal directions
Into there is line of cut 20.Line of cut 20 is also formed between adjacent two pieces horizontal glass cover-plates 10.Arrange longitudinal direction
The short side edge of three pieces of glass cover-plates 10 of cloth defines the 3rd line of cut 24, the glass cover-plate of laterally arrangement
10 long side edge defines the 4th line of cut 25, and the 3rd line of cut 24 is parallel with the 4th line of cut 25 and two
The distance between person is more than 4 millimeters.It is appreciated that the quantity of the glass cover-plate 10 of longitudinal direction can be 3 pieces
More than, the quantity of horizontal glass cover-plate 10 can also be more than two pieces.
In step S202, along 20 glass-cutting substrate 100 of line of cut, so as to glass substrate 100 is split
Form multiple pieces of glass cover plate 10.
It is pre- when distance second line of cut 23 sides are cut to towards the second line of cut 23 along the first line of cut 21
If apart from when, stop cutting, then from the opposite side predeterminable range of the second line of cut of distance 23 along first
Line of cut 21 continues cutting towards the direction away from the second line of cut 23.
Specifically, in the present embodiment, using break bar (not shown) along 20 glass-cutting substrate 100 of line of cut,
When the end points that wherein cuts off secant 211 is cut to along the first line of cut 21, break bar leaves glass substrate
100 and cross the second line of cut 23, from another end points for cutting off secant 211 along the first line of cut continue into
Row cuts, and the time that wherein break bar leaves glass substrate 100 is the 2-3 seconds.
Due to cutting when the first interlaced line of cut 21 of extension line and the second line of cut 23, the first cutting
On line 21, staggeredly part is not cut with the second line of cut 23, carries out in staggered place so as to avoid
Brought destruction is cut in the repetition of both direction, improves the cutting yield of glass cover-plate.The cutting method
Laser cutting device need not be adopted, cutting cost is reduced.
It is appreciated that two crisscross lines of cut 20 can also be not interrupted, break bar is along the first cutting
When line 21 is cut to 23 about 0.6-0.8 millimeters of the second line of cut of distance, break bar leaves glass substrate 100 and gets over
The second line of cut 23 is crossed, from the second line of cut of distance 23 opposite sides about 0.6-0.8 millimeters along the first cutting
Another secant 211 that cuts off of line 21 proceeds cutting.
It is appreciated that the first line of cut 21 can also be longitudinally cutting line, the second line of cut 23 is laterally to cut
Secant.In addition, when glass cover-plate 20 is not rectangle, the first interlaced line of cut 21 is cut with second
Secant 23 to intersect in length and breadth, and can not also be oblique at an angle.
It is appreciated that line of cut 20 can be formed on glass substrate 100 by etching mode, or
It is virtual, not physical presence, and it is control that the operating path that line of cut 20 is converted into break bar is stored in
In program.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed,
But therefore can not be construed as limiting the scope of the patent.It should be pointed out that for this area
For those of ordinary skill, without departing from the inventive concept of the premise, some deformations can also be made and is changed
Enter, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be defined.
Claims (8)
1. a kind of glass cover-plate excision forming method, it is characterised in that comprise the following steps：
Line of cut is defined on the glass substrate, and multiple pieces of glass cover plate is defined by the line of cut, wherein
The line of cut includes the first interlaced line of cut of bearing of trend and the second line of cut；And
Along glass substrate described in the cutting wire cutting, so as to the glass substrate is split to form multiple pieces of glass
Cover plate, wherein, when being cut to apart from described second along first line of cut towards second line of cut
During the predeterminable range of line of cut side, stop cutting, then preset from the opposite side apart from second line of cut
Continue cutting towards the direction away from second line of cut along first line of cut at distance.
2. glass cover-plate excision forming method according to claim 1, it is characterised in that the glass
Substrate is for the OGS substrates of electronic installation, CF substrates or TFT substrate.
3. glass cover-plate excision forming method according to claim 1, it is characterised in that described default
Distance is 0.6～0.8 millimeter.
4. glass cover-plate excision forming method according to claim 3, it is characterised in that described first
Line of cut is interrupted in staggered place, to be divided into two-section line of cut, the end points of the two-section line of cut and described
Two lines of cut are spaced 0.6～0.8 millimeter.
5. the glass cover-plate excision forming method according to claim 3 or 4, it is characterised in that described
Cutting step is included using break bar along glass substrate described in the cutting wire cutting, when along the described first cutting
Wire cutting to apart from the second line of cut side 0.6-0.8 millimeters apart from when, the break bar stops cutting, and
From at the second line of cut opposite side 0.6-0.8 millimeters along first line of cut towards away from described the
Continue cutting in the direction of two lines of cut.
6. glass cover-plate excision forming method according to claim 4, it is characterised in that described first
The bearing of trend of line of cut is mutually perpendicular to the bearing of trend of second line of cut.
7. glass cover-plate excision forming method according to claim 1, it is characterised in that define glass
After glass cover plate, on a lateral edges of the glass substrate, laid out in parallel has the glass cover-plate of polylith longitudinal direction, described
The horizontal glass cover-plate of polylith is placed with glass substrate in relative other edge, it is many that the longitudinal direction is arranged
The short side edge of block glass cover-plate defines the 3rd line of cut, the length of the multiple pieces of glass cover plate of the horizontal arrangement
Side Edge definition goes out the 4th line of cut, and the 3rd line of cut is parallel with the 4th line of cut and therebetween
Distance be more than 4 millimeters.
8. glass cover-plate excision forming method according to claim 1, it is characterised in that in the glass
The step of line of cut is defined on glass substrate includes：Silk-screen indigo plant film is covered on the glass substrate, in the silk
Trace line is formed on the blue film of print, the glass substrate is exposed, described cutting is defined using the trace line
Secant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510641058.9A CN106554149A (en) | 2015-09-30 | 2015-09-30 | Glass cover-plate excision forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510641058.9A CN106554149A (en) | 2015-09-30 | 2015-09-30 | Glass cover-plate excision forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106554149A true CN106554149A (en) | 2017-04-05 |
Family
ID=58417955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510641058.9A Pending CN106554149A (en) | 2015-09-30 | 2015-09-30 | Glass cover-plate excision forming method |
Country Status (1)
| Country | Link |
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| CN (1) | CN106554149A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109986702A (en) * | 2017-12-29 | 2019-07-09 | 晶石科技(中国)股份有限公司 | A kind of wrist-watch sapphire glass cutting processing technique |
| CN113213745A (en) * | 2021-03-24 | 2021-08-06 | 重庆惠科金渝光电科技有限公司 | Cutting machine and cutting method thereof |
| CN115947534A (en) * | 2022-12-29 | 2023-04-11 | 安徽金视界光电科技有限公司 | Large ITO glass typesetting method for parallelogram LCD glass |
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| CN101774755A (en) * | 2008-12-10 | 2010-07-14 | 比耶斯有限公司 | Method and machine for cutting glass sheets along predetermined lines |
| CN104280922A (en) * | 2014-10-27 | 2015-01-14 | 京东方科技集团股份有限公司 | Method and device for cutting glass of liquid crystal display screen |
| CN104609715A (en) * | 2013-11-01 | 2015-05-13 | 积创科技股份有限公司 | Process for finishing side etching strengthening of single glass touch panel by single film pasting |
| CN104671740A (en) * | 2013-11-27 | 2015-06-03 | 浙江金徕镀膜有限公司 | Substrate cutting method |
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2015
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Patent Citations (4)
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|---|---|---|---|---|
| CN101774755A (en) * | 2008-12-10 | 2010-07-14 | 比耶斯有限公司 | Method and machine for cutting glass sheets along predetermined lines |
| CN104609715A (en) * | 2013-11-01 | 2015-05-13 | 积创科技股份有限公司 | Process for finishing side etching strengthening of single glass touch panel by single film pasting |
| CN104671740A (en) * | 2013-11-27 | 2015-06-03 | 浙江金徕镀膜有限公司 | Substrate cutting method |
| CN104280922A (en) * | 2014-10-27 | 2015-01-14 | 京东方科技集团股份有限公司 | Method and device for cutting glass of liquid crystal display screen |
Non-Patent Citations (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109986702A (en) * | 2017-12-29 | 2019-07-09 | 晶石科技(中国)股份有限公司 | A kind of wrist-watch sapphire glass cutting processing technique |
| CN113213745A (en) * | 2021-03-24 | 2021-08-06 | 重庆惠科金渝光电科技有限公司 | Cutting machine and cutting method thereof |
| CN115947534A (en) * | 2022-12-29 | 2023-04-11 | 安徽金视界光电科技有限公司 | Large ITO glass typesetting method for parallelogram LCD glass |
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Application publication date: 20170405 |
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