CN113206180A - LED display module and LED display screen - Google Patents
LED display module and LED display screen Download PDFInfo
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- CN113206180A CN113206180A CN202110469769.8A CN202110469769A CN113206180A CN 113206180 A CN113206180 A CN 113206180A CN 202110469769 A CN202110469769 A CN 202110469769A CN 113206180 A CN113206180 A CN 113206180A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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Abstract
The application discloses LED display module assembly and LED display screen, LED display module assembly include LED lamp plate, optics filling layer and optics rete. The side, away from the circuit board, of the LED light-emitting piece is provided with a light-emitting surface; the optical filling layer covers the plane where the light-emitting surface is located and is filled in gaps among the LED light-emitting pieces; the optical film layer comprises an ink coating; the printing ink coating is provided with a plurality of through holes, the through holes penetrate through the printing ink coating along the thickness direction of the LED display module, and printing ink areas are arranged between the adjacent through holes; the ink coating covers on the optical filling layer, the light-emitting surfaces correspond to the through holes one by one, and the ink areas correspond to the gaps. The ink area shields the gap, and the contrast and the consistency of the black screen are improved. The through holes reduce the brightness loss, and the lost brightness is finally converted into heat to influence the temperature of the LED display screen, so that the brightness loss is reduced, the converted heat is reduced, and the temperature influence on the LED display screen is reduced.
Description
Technical Field
The application relates to the technical field of display, especially, relate to a LED display module assembly and LED display screen.
Background
Light Emitting Diode (LED) display screens have the advantages of wide color gamut, high brightness, large viewing angle, low power consumption, long service life, and the like, and therefore LED display screens are widely used in the display field. Such as the common stock exchange and financial information display, airport flight dynamic information display, port and station passenger guidance information display, stadium information display, road traffic information display, electric power scheduling, vehicle dynamic tracking and other scheduling command center information display, market shopping center and other service fields business propaganda information display, advertising media products and the like.
No matter which field the LED display screen is applied to, pursuing image definition is a great trend that the requirement for resolution is higher and higher. The higher resolution means that the required LED pixel cells need to have smaller size and pitch. On the premise of meeting the requirement of higher resolution, other good performances of the LED display screen need to be ensured, wherein the contrast and the consistency of the black screen are important parameters for evaluating the performances of the LED display screen.
In order to improve contrast and black screen uniformity, to the great LED display screen of traditional LED pixel unit interval, adopt and cover the face guard scheme on LED pixel unit, or pack the black glue in LED pixel unit's clearance, thereby form black grid array in LED pixel unit's clearance, thereby effectively improve the poor problem of black screen uniformity that Printed Circuit Board (PCB) ink color is inhomogeneous to cause, simultaneously, can show the promotion contrast.
However, with the decrease of the dot pitch, the process difficulty and the cost of the conventional schemes such as glue filling at the mask or the gap are both increased sharply, and the prior art generally adopts the scheme of integrally filling the black glue on the surface of the product with small pitch or micro pitch, but these schemes also cause the reduction of the brightness of the display screen while increasing the contrast, and the lost brightness also causes the increase of the temperature of the display screen.
Disclosure of Invention
An object of this application is to provide an LED display module assembly and LED display screen, under the prerequisite of guaranteeing high contrast and black screen uniformity, reduces the loss of luminance, reduces the temperature of display screen.
This application first aspect provides a LED display module assembly, includes: the LED lamp panel comprises a circuit board and a plurality of LED luminous elements, a gap is formed between any two adjacent luminous elements, and a light emitting surface is arranged on one side, away from the circuit board, of each LED luminous element; the optical filling layer has light transmittance; the optical filling layer covers the plane of the light-emitting surface and is filled in the gap; an optical film layer comprising an ink coating; the printing ink coating is provided with a plurality of through holes, the through holes penetrate through the printing ink coating along the thickness direction of the LED display module, and printing ink areas are arranged between the adjacent through holes; the ink coating covers on the optical filling layer, the light-emitting surfaces correspond to the through holes one by one, and the ink areas correspond to the gaps.
In some embodiments, the through hole and the light exit surface are identical in shape.
In some embodiments, the center of the projection of the through hole on the circuit board coincides with the center of the projection of the light emitting surface on the circuit board.
In some embodiments, the area of the projection of the through hole on the circuit board is m, the area of the projection of the light emitting surface on the circuit board is n, and m and n satisfy the following relationship: m is more than or equal to 0.8n and less than or equal to 1.2 n.
In some embodiments, the through-holes and the light-emitting surface are both rectangular in shape; the long side of the through hole is c, and the long side of the light-emitting surface is a; a and c satisfy the following relationship: c is more than or equal to 0.9a and less than or equal to 1.1 a; the short side of the through hole is d, the short side of the light-emitting surface is b, and b and d satisfy the following relations: d is more than or equal to 0.9b and less than or equal to 1.1 b.
In some embodiments, the ink area has a light transmittance of less than or equal to 50%.
In some embodiments, the optical fill layer has a light transmittance of greater than or equal to 70%.
In some embodiments, the optical film layer further includes a light-transmitting substrate, the light-transmitting substrate covers the optical filling layer, and the ink coating covers the light-transmitting substrate.
In some embodiments, the light transmissive substrate has a light transmission of greater than or equal to 80%.
In some embodiments, the light transmissive substrate has a thickness greater than or equal to 10 micrometers and less than or equal to 100 micrometers.
In some embodiments, the light transmissive substrate is made of one or more of PC, PET, TPU, PMMA.
In some embodiments, the light transmittance of the portion of the optical filling layer covering the light emitting surface is greater than or equal to 70%.
In some embodiments, the optical filling layer comprises an optical resin layer or an optical glue layer.
In some embodiments, the optical fill layer comprises an optical resin layer and an optical glue layer; the optical resin layer covers the plane of the light-emitting surface and is filled in the gap; the optical resin layer is covered with the optical adhesive layer.
In some embodiments, the optical fill layer comprises an optical resin layer and an optical glue layer; the optical resin layer is filled in the gap and is lower than the plane of the light-emitting surface, and a residual gap is formed between the optical resin layer and the plane of the light-emitting surface; the optical adhesive layer covers the plane of the light-emitting surface and is filled in the residual gap.
The second aspect of the present application provides an LED display screen, including the LED display module of any one of the first aspects of the present application.
The application provides an LED display module assembly, through setting up the printing ink coating to make the printing ink region of printing ink coating cover the clearance between the LED illuminating part, and the through-hole on the printing ink coating is then one-to-one be located on the play plain noodles of LED illuminating part. Therefore, the ink area can shield the gap between the LED luminous pieces, and the contrast ratio and the black screen consistency of the display screen are improved. The light emitted by the LED luminous element is emitted to the through hole through the optical filling layer and then is emitted from the through hole, and the optical filling layer can improve the contrast ratio on one hand; on the other hand, the optical filling layer has light transmittance, so that the influence on the light-emitting brightness of the LED light-emitting member is small. And the through hole exposes the light emitting surface of the LED luminous element relative to the ink area, so that the influence of the ink coating on the brightness of the LED luminous element can be reduced, the brightness loss is reduced, and the lost brightness is finally converted into heat to influence the temperature of the LED display screen, so that the brightness loss is reduced, the converted heat is reduced, and the influence on the temperature of the LED display screen is reduced.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below.
FIG. 1 is a schematic diagram of an LED display module according to a first embodiment of the present disclosure;
FIG. 2 is a schematic structural view of the ink coating shown in FIG. 1;
fig. 3 is a schematic structural diagram of an LED display module according to a second embodiment of the present application;
fig. 4 is a schematic structural diagram of an LED display module according to a third embodiment of the present application;
fig. 5 is a schematic structural diagram of an LED display module according to a fourth embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of an LED display module according to a fifth embodiment of the present application;
fig. 7 is a schematic structural diagram of an LED display module according to a sixth embodiment of the present application.
Description of reference numerals:
the LED light panel 10, the circuit board 11, the LED luminous element 12, the optical filling layer 20, the optical resin layer 21, the optical adhesive layer 22, the optical film layer 30, the ink coating 31, the through hole 311, the ink area 312 and the light-transmitting substrate 32.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The thicknesses of the circuit board and the LED light-emitting piece are from the side of the circuit board where the LED light-emitting piece is not arranged to the side of the circuit board where the LED light-emitting piece is arranged, namely from the side where the LED light-emitting piece is connected with the circuit board to the side of the light-emitting surface of the LED light-emitting piece.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic view of an LED display module according to a first embodiment of the present application, and fig. 2 is a schematic view of a structure of an ink coating layer shown in fig. 1; this LED display module assembly includes: LED lamp plate 10, optics filling layer 20 and optics rete 30.
The LED lamp panel 10 includes a circuit board 11 and a plurality of LED light emitting members 12, the plurality of LED light emitting members 12 are arranged in an array on the circuit board 11, and a gap is formed between any two adjacent light emitting members. The optical filling layer 20 has light transmittance; the optical filling layer 20 covers the plane of the light emitting surface of the LED light emitting element 12 and fills the gap. The optical film layer 30 includes an ink coating 31; a plurality of through holes 311 arranged in an array are arranged on the ink coating 31, and an ink area 312 is arranged between every two adjacent through holes 311; the ink coating 31 covers the optical filling layer 20, the light emitting surfaces of the LED light emitting elements 12 correspond to the through holes 311 one by one, and the ink areas 312 correspond to the gaps.
The plurality of LED lighting elements 12 form a plurality of LED pixel units, each LED pixel unit includes at least one of a red LED chip, a green LED chip, and a blue LED chip, or each LED pixel unit includes at least one of a red LED bead, a green LED bead, and a blue LED bead packaged therein.
In this embodiment, the ink coating 31 is disposed such that the ink areas 312 of the ink coating 31 cover the gaps between the LED light emitting members 12, and the through holes 311 on the ink coating 31 are located on the light emitting surfaces of the LED light emitting members 12 in a one-to-one correspondence. Thus, the ink areas 312 may block the gaps between the LED emitters 12, thereby improving the contrast and black screen uniformity of the display screen. The light emitted by the LED light emitting element 12 is emitted to the through hole 311 through the optical filling layer 20, and then is emitted from the through hole 311, so that the optical filling layer 20 can improve the contrast ratio; on the other hand, the optical filling layer 20 has light transmittance, and thus has little influence on the emission luminance of the LED light emitting element 12. And the through hole 311 exposes the light emitting surface of the LED light emitting element 12 relative to the ink area 312, so that the influence of the ink coating 31 on the brightness of the LED light emitting element 12 can be reduced, and the brightness loss is reduced.
In summary, in this embodiment, the contrast is improved by the optical filling layer 20; gaps between the LED luminous elements 12 are shielded by the ink areas 312 of the ink coating 31, so that the contrast and the consistency of a black screen are improved; the brightness effect on the LED lighting element 12 is reduced by the through-openings 311 in the ink coating 31.
In some embodiments, referring to fig. 2, the through hole 311 is identical to the light emitting surface of the LED light emitting element 12. In order to ensure the contrast and the consistency of the black screen, the through hole 311 needs not to extend to the gap as much as possible, so as to avoid the exposure of the gap caused by the through hole 311, that is, the through hole 311 needs to be as small as possible. However, in order to ensure the brightness of the LED light emitting element 12, the through hole 311 needs to expose the light emitting surface of the LED light emitting element 12 as much as possible, that is, the through hole 311 needs to be as large as possible. Therefore, the shapes of the through hole 311 and the light emitting surface of the LED light emitting element 12 are consistent, which is beneficial to controlling the side wall of the through hole 311 and the side edge of the light emitting surface of the LED light emitting element 12 to be aligned as much as possible. Thus, the shape of the through hole 311 is prevented from being inconsistent with the shape of the light-emitting surface of the LED light-emitting element 12, but the through hole is too large to expose the light-emitting surface of the LED light-emitting element 12 as much as possible, so that the gap between the LED light-emitting elements 12 is exposed, and the contrast and the consistency of the black screen are affected; the problem that the light emitting surface of the LED light emitting element 12 is too much shielded by the ink area 312 due to the too small through hole 311, which affects the brightness of the LED light emitting element 12, can also be avoided.
The light emitting surface of the light emitting element and the through hole 311 may be triangular, circular, square, rectangular, parallelogram, pentagonal, hexagonal, etc., or irregular, which is not limited in this application.
In some embodiments, referring to fig. 2, the center of the projection of the through hole 311 on the circuit board 11 coincides with the center of the projection of the light emitting surface of the LED light emitting element 12 on the circuit board 11. Therefore, the through hole 311 and the light-emitting surface of the LED light-emitting element 12 can be controlled to be aligned as much as possible, and the error between the through hole 311 and the light-emitting surface of the LED light-emitting element 12 is prevented, so that the light-emitting surface of the LED light-emitting element 12 is partially shielded, and the brightness of the LED light-emitting element 12 is not affected; while the gaps between the LED emitters 12 are locally exposed, which affects contrast and black screen uniformity.
In some embodiments, the area of the projection of the through hole 311 on the circuit board 11 is m, the area of the projection of the light emitting surface of the LED light emitting element 12 on the circuit board 11 is n, and m and n satisfy the following relationship: m is more than or equal to 0.8n and less than or equal to 1.2 n. Specifically, when the area m is smaller than 0.8n, the light emitting surface of the LED light emitting element 12 is too much shielded by the ink area 312, and the light emitting brightness of the LED light emitting element 12 is affected. When the area m is larger than 1.2n, the gaps between the LED emitters 12 are exposed too much, which affects the contrast and the uniformity of the black screen. Therefore, m is set to be more than or equal to 0.8n and less than or equal to 1.2n, that is, the area of the through hole 311 is consistent with the area of the light-emitting surface of the LED light-emitting piece 12 as much as possible, so that the gap between the LED light-emitting pieces 12 is prevented from being exposed due to the overlarge through hole 311, and the contrast and the consistency of a black screen are prevented from being affected; and the problem that the light emitting surface of the LED light emitting element 12 is too much shielded by the ink area 312 due to the too small through hole 311, which affects the light emitting brightness of the LED light emitting element 12 can also be prevented.
Referring to fig. 2, it is taken as an example that the through hole 311 and the light emitting surface of the LED light emitting element 12 are both rectangular, the long side of the through hole 311 is c, and the long side of the light emitting surface of the LED light emitting element 12 is a; a and c satisfy the following relationship: c is more than or equal to 0.9a and less than or equal to 1.1 a; the short side of the through hole 311 is d, the short side of the light-emitting surface of the LED light-emitting element 12 is b, and b and d satisfy the following relations: d is more than or equal to 0.9b and less than or equal to 1.1 b.
Specifically, when the long side c is smaller than 0.9a, the edge of the light emitting surface of the LED light emitting element 12 substantially aligned with the long side c is too much shielded by the ink region 312, and the light emitting brightness of the LED light emitting element 12 is affected. And when the long side c is larger than 1.1a, the gap below the long side c is exposed too much, which affects the contrast and the consistency of the black screen. Similarly, when the short side d is smaller than 0.9b, the edge of the light emitting surface of the LED light emitting element 12 substantially aligned with the short side d is too much shielded by the ink area 312, and the light emitting brightness of the LED light emitting element 12 is affected. When the short side d is larger than 1.1b, the gap below the short side d is exposed too much, which affects the contrast and the uniformity of the black screen.
Therefore, c is more than or equal to 0.9a and less than or equal to 1.1a, and d is more than or equal to 0.9b and less than or equal to 1.1 b. That is, by controlling the long side of the through hole 311 to be consistent with the long side of the light emitting surface of the LED light emitting element 12 as much as possible, and controlling the short side of the through hole 311 to be consistent with the short side of the light emitting surface of the LED light emitting element 12 as much as possible, the area of the through hole 311 is consistent with the area of the light emitting surface of the LED light emitting element 12 as much as possible, so that the gap between the LED light emitting elements 12 is prevented from being exposed due to the overlarge through hole 311, and the contrast and the consistency of the black screen are prevented from being affected; and the problem that the light emitting surface of the LED light emitting element 12 is too much shielded by the ink area 312 due to the too small through hole 311, which affects the light emitting brightness of the LED light emitting element 12 can also be prevented.
Certainly, in some embodiments, the long sides and the short sides of the through hole 311 are equal, and the long sides and the short sides of the light emitting surface of the LED light emitting element 12 are equal, so that the through hole 311 and the light emitting surface of the LED light emitting element 12 are both square, and the size relationship between the through hole 311 and the light emitting surface of the LED light emitting element 12 is the same as the relationship between the two light emitting surfaces which are both square.
In some embodiments, the light transmittance of the ink region 312 is less than or equal to 50%. Therefore, the ink area 312 can better shield the gap between the LED luminous elements 12, and the contrast and the consistency of a black screen are improved.
In some embodiments, the portion of the optical fill layer 20 overlying the surface of the LED emitter 12 has a light transmittance of greater than or equal to 70%. From this, can promote the contrast of LED display screen, and can reduce the influence to the luminous luminance of LED light-emitting component 12 to promote the luminance of LED display screen.
In some embodiments, the light transmittance of the portion of the optical filling layer 20 covering the surface of the LED light emitting element 12 may be selected to be 80%, at this time, the contrast of the LED display screen is improved significantly by the optical filling layer 20, and the influence on the luminance of the LED light emitting element 12 is very small, so that the luminance of the LED display screen can be greatly improved, and the LED display screen is convenient to process and low in cost.
In some embodiments, the light transmittance of the portion of the optical filling layer 20 covering the surface of the LED light emitting element 12 may be selected to be 90%, at this time, the contrast of the LED display screen is improved significantly by the optical filling layer 20, and the influence on the luminance of the LED light emitting element 12 is very small, so that the luminance of the LED display screen can be improved greatly.
In some embodiments, the light transmittance of the portion of the optical filling layer 20 covering the light-emitting surface of the LED light-emitting element 12 is equal to the light transmittance of the portion of the optical filling layer 20 covering and filling the gap. The light transmittance of the optical filling layer 20 is thus uniform as a whole, thereby facilitating the processing of the optical filling layer 20.
In some embodiments, the light transmittance of the portion of the optical filling layer 20 covering the light emitting surface of the LED light emitting element 12 is greater than the light transmittance of the portion of the optical filling layer 20 covering and filling the gap. Specifically, the optical filling layer can be divided into two layers for processing, and the two layers are respectively processed by adopting materials with different light transmittance, so that the difference of the light transmittance of the two layers can be realized. Therefore, the influence of the optical filling layer 20 on the brightness of the LED luminous element 12 is small, the shielding effect of the gap between the LED luminous elements 12 is good, and the contrast and the consistency of a black screen are improved.
The preparation process of the LED display module of this embodiment is detailed below:
preparing the LED lamp panel 10: the circuit board 11 is provided with LED light emitting elements 12 to form an LED lamp panel 10, so that the LED light emitting elements 12 are arranged on the circuit board 11 in an array, and a gap is formed between any two adjacent light emitting elements. The circuit board 11 may be a Printed Circuit Board (PCB) 11, the LED emitting component 12 may be mounted by using a Surface Mount Device (SMD), and the LED emitting component 12 may be packaged in advance and then mounted, so as to increase the manufacturing efficiency.
Setting the optical filling layer 20: the optical filling layer 20 is prepared on the plane where the light emitting surface of the LED light emitting element 12 is located, and is filled in the gap of the LED light emitting element 12. Specifically, the surface of the LED lamp panel 10 provided with the LED light emitting element 12 is encapsulated with the optical filling layer 20, and then the optical filling layer 20 is pre-cured. The optical filling layer 20 can be encapsulated by molding, injection molding, spot coating or knife coating. The optical fill layer 20 may be pre-cured by heating or light irradiation. The pre-curing is such that the optical filling layer 20 is in a state of not being completely cured.
Setting the optical film layer 30: an ink coating 31 is prepared over the optical fill layer 20. A pre-prepared ink coating 31 may be applied to the optical fill layer 20. Finally, the optical filling layer 20 is completely cured by light or heat, so that the ink coating 31 and the optical filling layer 20 are reliably connected.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an LED display module according to a second embodiment of the present application. In this embodiment, the LED display module includes a lamp panel, an optical filling layer 20 and an optical film layer 30. Where the lamp panel and the optical fill layer 20 are the same as in the previous embodiment except that in this embodiment, the optical film layer 30 includes a light transmissive substrate 32 in addition to the ink coating 31.
The transparent substrate 32 covers the optical filling layer 20, and the ink coating 31 covers the transparent substrate 32. That is, the optical film layer 30 includes a light-transmitting substrate 32 and an ink coating 31 laminated, and the light-transmitting substrate 32 is laminated on the optical filling layer 20. The light-transmitting substrate 32 serves as a carrier for the ink coating 31, facilitating the formation of the ink coating 31 into through holes 311 and ink areas 312.
In some embodiments, the light transmittance of the light transmissive substrate 32 is greater than or equal to 80%. Therefore, the transparent substrate 32 can improve the contrast of the LED display screen and reduce the influence on the brightness of the LED light emitting element 12, so as to improve the brightness of the LED display screen, and the cost is low.
In some embodiments, the light transmittance of the transparent substrate 32 may be selected to be 90%, at this time, the contrast of the transparent substrate 32 to the LED display screen is improved significantly, and the influence on the light-emitting brightness of the LED light-emitting component 12 is very small, so that the brightness of the LED display screen can be greatly improved.
In some embodiments, the light transmissive substrate 32 is made of one or more of PC (polycarbonate), PET (polyethylene terephthalate), TPU (thermoplastic polyurethane elastomer), PMMA (polymethyl methacrylate). Wherein PET is commonly called polyester resin, and PMMA is commonly called organic glass. The transparent substrate 32 made of the materials can meet the requirements of the transparent substrate 32 on bearing performance and light transmission performance, and is low in cost.
The thickness of the transparent substrate 32 may be greater than or equal to 10 micrometers and less than or equal to 100 micrometers, and if the thickness of the transparent substrate 32 is less than 10 micrometers, the supporting performance thereof is reduced. If the thickness of the transparent substrate 32 is greater than 100 micrometers, the light transmittance is difficult to be ensured, and thus, the thickness of the transparent substrate 32 is set to be 10 micrometers to 100 micrometers, which can ensure both the supporting performance and the light transmittance.
The preparation process of the LED display module of this embodiment is detailed below:
preparing the LED lamp panel 10: the circuit board 11 is provided with LED light emitting elements 12 to form an LED lamp panel 10, so that the LED light emitting elements 12 are arranged on the circuit board 11 in an array, and a gap is formed between any two adjacent light emitting elements. The circuit board 11 may be a PCB, and the LED lighting element 12 may be mounted by SMD, and the LED lighting element 12 may be packaged in advance and then mounted, so as to increase the manufacturing efficiency.
Setting the optical filling layer 20: the optical filling layer 20 is prepared on the plane where the light emitting surface of the LED light emitting element 12 is located, and is filled in the gap of the LED light emitting element 12. Specifically, the surface of the LED lamp panel 10 provided with the LED light emitting element 12 is encapsulated with the optical filling layer 20, and then the optical filling layer 20 is pre-cured. The optical filling layer 20 can be encapsulated by molding, injection molding, spot coating or knife coating. The optical fill layer 20 may be pre-cured by heating or light irradiation. The pre-curing is such that the optical filling layer 20 is in a state of not being completely cured.
Setting the optical film layer 30: the ink coating 31 with a plurality of through holes 311 is prepared on the transparent substrate 32, and then the optical film layer 30 is prepared on the optical filling layer 20, at this time, the transparent substrate 32 is stacked on the optical filling layer 20, the light emitting surfaces of the LED light emitting elements 12 correspond to the through holes 311 one by one, and the ink regions 312 correspond to the gaps. Specifically, the ink coating 31 is prepared on the light-transmitting substrate 32 by means of a curing film or photolithography. The optical filling layer 20 is then completely cured by light or heat to securely connect the light-transmissive substrate 32 and the optical filling layer 20. The transparent substrate 32 is used as a carrier, and the ink coating 31 is printed on the transparent substrate 32 equivalently.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an LED display module according to a third embodiment of the present application. In this embodiment, the LED display module includes a lamp panel, an optical filling layer 20 and an optical film layer 30. Wherein the lamp panel and the film layer are the same as in the second embodiment described above, except that in this embodiment, the optical filling layer 20 is an optical resin layer 21.
The optical resin layer 21 is adopted as the optical filling layer 20, so that the requirement of the optical filling layer 20 on the light transmission performance can be met, and the cost is low. Specifically, the optical resin layer 21 may be made of one or more of acrylic resin, epoxy resin, and silicone resin. By adopting the materials, the cost is lower, and the light transmittance is easier to ensure.
The optical resin layer 21 has a light transmittance of 70% or more. From this, the optical resin layer 21 can promote the contrast of LED display screen, can reduce the influence to the luminance of LED light-emitting component 12 again to promote the luminance of LED display screen.
In some embodiments, the light transmittance of the optical resin layer 21 may be selected to be 80%, at this time, the contrast improvement of the optical resin layer 21 on the LED display screen is more obvious, and the influence on the light-emitting brightness of the LED light-emitting element 12 is extremely small, the brightness of the LED display screen can be greatly improved, and the processing is convenient and the cost is low.
In some embodiments, the light transmittance of the optical resin layer 21 may be selected to be 90%, at this time, the contrast of the LED display screen is improved significantly by the optical resin layer 21, and the influence on the light-emitting brightness of the LED light-emitting element 12 is very small, so that the brightness of the LED display screen can be greatly improved.
In some embodiments, the thickness of the portion of the optical resin layer 21 covering the plane where the light emitting surface of the LED light emitting element 12 is located is greater than or equal to 30 micrometers and less than or equal to 300 micrometers. The light transmittance of the optical resin layer 21 can be controlled within a reasonable range, and the overall thickness is thin.
The preparation process of the LED display module of this embodiment is detailed below:
preparing the LED lamp panel 10: the circuit board 11 is provided with LED light emitting elements 12 to form an LED lamp panel 10, so that the LED light emitting elements 12 are arranged on the circuit board 11 in an array, and a gap is formed between any two adjacent light emitting elements. The circuit board 11 may be a PCB, and the LED lighting element 12 may be mounted by SMD, and the LED lighting element 12 may be packaged in advance and then mounted, so as to increase the manufacturing efficiency.
Providing the optical resin layer 21: the optical resin layer 21 is prepared on the plane where the light emitting surface of the LED light emitting element 12 is located, and is filled in the gap of the LED light emitting element 12. Specifically, the surface of the LED lamp panel 10 provided with the LED light emitting element 12 is encapsulated with the optical resin layer 21, and then the optical resin layer 21 is pre-cured. Specifically, the optical resin layer 21 may be encapsulated by molding, injection molding, dot coating, or blade coating. The optical resin layer 21 may be pre-cured by heating or light irradiation. The precuring is to put the optical resin layer 21 in a state of not being completely cured.
Setting the optical film layer 30: the ink coating 31 with a plurality of through holes 311 is prepared on the transparent substrate 32, and then the optical film layer 30 is prepared on the optical resin layer 21, at this time, the transparent substrate 32 is laminated on the optical resin layer 21, the light emitting surfaces of the LED light emitting elements 12 correspond to the through holes 311 one by one, and the ink areas 312 correspond to the gaps. Specifically, the ink coating 31 is prepared on the light-transmitting substrate by means of a curing film or photolithography. The optical resin layer 21 is then completely cured by light irradiation or heating to reliably connect the light-transmitting substrate 32 and the optical resin layer 21.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an LED display module according to a fourth embodiment of the present application. In this embodiment, the LED display module includes a lamp panel, an optical filling layer 20 and an optical film layer 30. Wherein the lamp panel and the optical film layer 30 are the same as in the second embodiment described above.
The second embodiment of the present embodiment is different in that in this embodiment, the optical filling layer 20 includes an optical resin layer 21 and an optical glue layer 22; the optical resin layer 21 covers the plane where the light-emitting surface of the LED light-emitting element 12 is located, and is filled in the gap; the optical resin layer 21 covers the optical adhesive layer 22. The material of the optical resin layer 21 in this embodiment is the same as that in the third embodiment, and the description thereof is omitted. The optical adhesive layer 22 may be an acrylic pressure sensitive adhesive.
The thickness of the optical adhesive layer 22 may be greater than or equal to 10 micrometers and less than or equal to 50 micrometers. If the thickness of the optical adhesive layer 22 is less than 10 μm, the adhesive may be not firm; if the thickness of the optical adhesive layer 22 is greater than 50 micrometers, the overall thickness of the LED display module is relatively thick. Therefore, the thickness of the optical adhesive layer 22 is set to be between 10 micrometers and 50 micrometers, whereby the optical resin layer 21 and the optical film layer 30 can be well adhered and the optical adhesive layer 22 can be prevented from being excessively thick.
The optical filling layer 20 further includes an optical adhesive layer 22, the optical adhesive layer 22 is mainly used for bonding and fixing the optical resin layer 21 and the optical film layer 30, so that the adhesion force between the optical resin layer 21 and the optical film layer 30 can be increased, the position dislocation of the optical film layer 30 is prevented, the dislocation of the light-emitting surface of the through hole 311 and the light-emitting surface of the LED light-emitting member 12 is caused, the contrast and the consistency of a black screen are prevented from being influenced, the influence on the light-emitting brightness of the LED light-emitting member 12 is avoided, and the structural stability of the LED display module is increased. In addition, after the adhesive layer is arranged, the light-transmitting substrate 32 of the optical film layer 30 has a wider selection range, and can be prepared by selecting a material with weaker adhesion, so that the cost is reduced, and the preparation convenience is improved.
The preparation process of the LED display module of this embodiment is detailed below:
preparing the LED lamp panel 10: the circuit board 11 is provided with LED light emitting elements 12 to form an LED lamp panel 10, so that the LED light emitting elements 12 are arranged on the circuit board 11 in an array, and a gap is formed between any two adjacent light emitting elements. The circuit board 11 may be a PCB, and the LED lighting element 12 may be mounted by SMD, and the LED lighting element 12 may be packaged in advance and then mounted, so as to increase the manufacturing efficiency.
Providing the optical resin layer 21: the optical resin layer 21 is prepared on the plane where the light emitting surface of the LED light emitting element 12 is located, and is filled in the gap of the LED light emitting element 12. Specifically, the surface of the LED lamp panel 10 provided with the LED light emitting element 12 is encapsulated with the optical resin layer 21, and then the optical resin layer 21 is pre-cured. Specifically, the optical resin layer 21 may be encapsulated by molding, injection molding, dot coating, or blade coating. The optical resin layer 21 may be pre-cured by heating or light irradiation. The precuring is to put the optical resin layer 21 in a state of not being completely cured.
Setting the optical film layer 30: an ink coating 31 having a plurality of through holes 311 is prepared on a light-transmitting substrate 32. Specifically, the ink coating 31 is prepared on the light-transmitting substrate by means of a curing film or photolithography.
Setting the optical adhesive layer 22: the optical glue layer 22 is prepared on the side of the light-transmitting substrate 32 facing away from the ink coating 31. The optical adhesive layer 22 can be prepared by spin coating.
The optical film layer 30 with the optical adhesive layer 22 is adhered to the optical resin layer 21, and at this time, the optical adhesive layer 22 and the transparent substrate 32 are sequentially stacked on the optical resin layer 21, and the light-emitting surfaces of the LED light-emitting elements 12 correspond to the through holes 311 one by one, and the ink areas 312 correspond to the gaps. The optical resin layer 21 is then completely cured by light irradiation or heating to reliably connect the optical adhesive layer 22 and the optical resin layer 21.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an LED display module according to a fifth embodiment of the present application. In this embodiment, the LED display module includes a lamp panel, an optical filling layer 20 and an optical film layer 30. Wherein the lamp panel and the optical film layer 30 are the same as those in the fourth embodiment.
In this embodiment, the optical filling layer 20 includes an optical resin layer 21 and an optical glue layer 22. The difference from the fourth embodiment is that the optical resin layer 21 is filled in the gap and is lower than the plane of the light-emitting surface of the LED light-emitting element 12, and a residual gap is formed between the optical resin layer 21 and the plane of the light-emitting surface of the LED light-emitting element 12; the optical adhesive layer 22 covers the plane where the light emitting surface of the LED light emitting element 12 is located, and fills the remaining gap. The material of the optical resin layer 21 in this embodiment is the same as that in the third embodiment, and the description thereof is omitted.
The optical resin layer 21 is filled in the gap of the LED light emitting element 12, and does not cover the plane of the light emitting surface of the LED light emitting element 12. The optical adhesive layer 22 covers the plane of the light emitting surface of the LED light emitting element 12 and extends to fill the remaining gap. From this, make the adhesion of optics resin layer 21 and optics rete 30 stronger, prevent optics rete 30 position dislocation, lead to the play plain noodles dislocation of through-hole 311 and LED light-emitting component 12, avoid influencing contrast and black screen uniformity to and avoid influencing the luminous luminance of LED light-emitting component 12, increased LED display module's structural stability.
In some embodiments, the thickness of the optical resin layer 21 is greater than or equal to 1/3 of the thickness of the LED light emitting member 12 and less than the thickness of the LED light emitting member 12. The height of the remaining voids is greater than or equal to 0 and less than or equal to 2/3 the thickness of the LED emitter 12. Thereby allowing the optical glue layer 22 to extend into the remaining voids.
The preparation process of the LED display module of this embodiment is detailed below:
preparing the LED lamp panel 10: the circuit board 11 is provided with LED light emitting elements 12 to form an LED lamp panel 10, so that the LED light emitting elements 12 are arranged on the circuit board 11 in an array, and a gap is formed between any two adjacent light emitting elements. The circuit board 11 may be a PCB, and the LED lighting element 12 may be mounted by SMD, and the LED lighting element 12 may be packaged in advance and then mounted, so as to increase the manufacturing efficiency.
Providing the optical resin layer 21: the optical resin layer 21 is prepared in the gap of the LED light emitting member 12. Specifically, the surface of the LED lamp panel 10 provided with the LED light emitting element 12 is encapsulated with the optical resin layer 21, and then the optical resin layer 21 is pre-cured. Specifically, the optical resin layer 21 may be encapsulated by molding, injection molding, dot coating, or blade coating. The optical resin layer 21 may be pre-cured by heating or light irradiation. The precuring is to put the optical resin layer 21 in a state of not being completely cured.
Setting the optical film layer 30: an ink coating 31 having a plurality of through holes 311 is prepared on a light-transmitting substrate 32. Specifically, the ink coating 31 is prepared on the light-transmitting substrate by means of a curing film or photolithography.
Setting the optical adhesive layer 22: the optical glue layer 22 is prepared on the side of the light-transmitting substrate 32 facing away from the ink coating 31. The optical adhesive layer 22 can be prepared by spin coating.
The optical film layer 30 with the optical adhesive layer 22 is adhered to the light-emitting surface of the LED light-emitting elements 12, and at this time, the optical adhesive layer 22 is stacked on the plane where the light-emitting surface of the LED light-emitting elements 12 is located and filled in the gaps between the LED light-emitting elements 12, and the light-emitting surfaces of the LED light-emitting elements 12 correspond to the through holes 311 one by one, and the ink regions 312 correspond to the gaps. The optical resin layer 21 is then completely cured by light or heat to reliably connect the optical adhesive layer 22 and the LED light emitting member 12.
Referring to fig. 7, fig. 7 is a schematic structural diagram of an LED display module according to a sixth embodiment of the present application. In this embodiment, the LED display module includes a lamp panel, an optical filling layer 20 and an optical film layer 30. The lamp panel and the film layer are the same as those in the second embodiment, except that in this embodiment, the optical filling layer 20 is an optical glue layer 22. The material of the optical adhesive layer 22 is the same as that of the above embodiments, and is not described again.
The optical adhesive layer 22 is adopted as the optical filling layer 20, the process is simple, the cost is low, the optical film layer 30 is reliably bonded, the optical film layer 30 is prevented from being dislocated, the through hole 311 is prevented from being dislocated with the light-emitting surface of the LED luminous element 12, the contrast and the black screen consistency are prevented from being influenced, the brightness of the LED luminous element 12 is prevented from being influenced, and the structural stability of the LED display module is improved.
The preparation process of the LED display module of this embodiment is detailed below:
preparing the LED lamp panel 10: the circuit board 11 is provided with LED light emitting elements 12 to form an LED lamp panel 10, so that the LED light emitting elements 12 are arranged on the circuit board 11 in an array, and a gap is formed between any two adjacent light emitting elements. The circuit board 11 may be a PCB, and the LED lighting element 12 may be mounted by SMD, and the LED lighting element 12 may be packaged in advance and then mounted, so as to increase the manufacturing efficiency.
Setting the optical film layer 30: an ink coating 31 having a plurality of through holes 311 is prepared on a light-transmitting substrate 32. Specifically, the ink coating 31 is prepared on the light-transmitting substrate by means of a curing film or photolithography.
Setting the optical adhesive layer 22: the optical glue layer 22 is prepared on the side of the light-transmitting substrate 32 facing away from the ink coating 31. The optical adhesive layer 22 can be prepared by spin coating.
The optical film layer 30 with the optical adhesive layer 22 is adhered to the light-emitting surface of the LED light-emitting element 12, and at this time, the transparent substrate 32 is stacked on the optical resin layer 21, and the light-emitting surfaces of the LED light-emitting elements 12 correspond to the through holes 311 one by one, and the ink regions 312 correspond to the gaps. The optical resin layer 21 is then completely cured by light irradiation or heating to reliably connect the optical adhesive layer 22 and the optical resin layer 21.
The embodiment of the application also provides an LED display screen, which comprises any one of the LED display modules in the embodiment of the application.
The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and embodiments of the present application, and the description of the embodiments may be used to help understand the methods and their core ideas of the present application.
Claims (10)
1. The utility model provides a LED display module assembly which characterized in that includes:
the LED lamp panel comprises a circuit board and a plurality of LED luminous elements, a gap is formed between any two adjacent luminous elements, and a light emitting surface is arranged on one side, away from the circuit board, of each LED luminous element;
an optical filling layer having optical transparency; the optical filling layer covers the plane of the light-emitting surface and is filled in the gap;
an optical film layer comprising an ink coating; the printing ink coating is provided with a plurality of through holes, the through holes penetrate through the printing ink coating along the thickness direction of the LED display module, and a printing ink area is arranged between every two adjacent through holes; the ink coating covers the optical filling layer, the light emergent surfaces correspond to the through holes one by one, and the ink areas correspond to the gaps.
2. The LED display module of claim 1, wherein the through hole and the light exit surface are identical in shape.
3. The LED display module of claim 1, wherein the center of the projection of the through hole on the circuit board coincides with the center of the projection of the light exit surface on the circuit board.
4. The LED display module of claim 1, wherein the area of the projection of the through hole on the circuit board is m, the area of the projection of the light emitting surface on the circuit board is n, and m and n satisfy the following relationship: m is more than or equal to 0.8n and less than or equal to 1.2 n.
5. The LED display module of claim 1, wherein the through holes and the light exit surface are both rectangular in shape; the long edge of the through hole is c, and the long edge of the light-emitting surface is a; the a and the c satisfy the following relationship: c is more than or equal to 0.9a and less than or equal to 1.1 a; the short side of the through hole is d, the short side of the light emitting surface is b, and the b and the d satisfy the following relations: d is more than or equal to 0.9b and less than or equal to 1.1 b.
6. The LED display module of claim 1, wherein the ink area has a light transmittance of less than or equal to 50%; the optical filling layer has a light transmittance of 70% or more.
7. The LED display module of claim 1, wherein the optical film further comprises a light-transmissive substrate, the light-transmissive substrate is covered on the optical filling layer, and the ink coating is covered on the light-transmissive substrate.
8. The LED display module of claim 7, wherein the light transmittance of the light-transmissive substrate is greater than or equal to 80%; the thickness of the light-transmitting substrate is greater than or equal to 10 micrometers and less than or equal to 100 micrometers.
9. The LED display module of any of claims 1-8, wherein the optical filling layer comprises an optical resin layer or an optical glue layer;
or: the optical filling layer comprises an optical resin layer and an optical adhesive layer; the optical resin layer covers the plane of the light-emitting surface and is filled in the gap; the optical adhesive layer covers the optical resin layer;
or: the optical filling layer comprises an optical resin layer and an optical adhesive layer; the optical resin layer is filled in the gap and is lower than the plane of the light-emitting surface, and a residual gap is formed between the optical resin layer and the plane of the light-emitting surface; the optical adhesive layer covers the plane of the light-emitting surface and is filled in the residual gap.
10. An LED display screen, characterized in that, comprises the LED display module of any one of claims 1 to 9.
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