CN109449274A - A kind of LED component and its manufacturing method - Google Patents
A kind of LED component and its manufacturing method Download PDFInfo
- Publication number
- CN109449274A CN109449274A CN201811534694.1A CN201811534694A CN109449274A CN 109449274 A CN109449274 A CN 109449274A CN 201811534694 A CN201811534694 A CN 201811534694A CN 109449274 A CN109449274 A CN 109449274A
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- light transmitting
- transmitting cells
- led component
- unit
- light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
The present invention provides a kind of LED component and preparation method thereof, the LED component includes base board unit, luminescence unit, light transmitting cells and lightproof unit；The luminescence unit is fixed on the base board unit, and the light transmitting cells are covered on the luminescence unit periphery；The transmittance section for appearing for the luminescence unit light is preset with outside the light transmitting cells surface, the lightproof unit is covered on the light transmitting cells surface on remaining position in addition to the transmittance section.By the loophole in lightproof unit, the light direction of LED component can be controlled on demand, there is good practicability.The LED component production method utilizes photic zone mold and light shield layer mold, and the light transmitting cells and lightproof unit of multiple LED components are formed in an injection moulding process, and processing efficiency is higher；In the way of cutter cutting, by the way that reasonable setting of the cutter to cutting track, cutting object and depth of cut is arranged, efficiently photic zone, light shield layer and substrate can be separated.
Description
Technical field
The present invention relates to LED component fields, and in particular to arrives a kind of LED component and its manufacturing method.
Background technique
Patent No. CN201310116168.4, name are that the patent of " light-emitting diode encapsulation structure and preparation method thereof " is public
A kind of light-emitting diode encapsulation structure of cloth and preparation method thereof.In specific implementation, light emitting diode described in the patent
The production method of encapsulating structure has the following insufficient:
In the step of light transmission colloid coats luminous original part, each light transmission colloid is discrete setting, is led to
The mode for crossing compression molding is formed, and in actual processing, needs to be pressed and molded using multicarity mould, Multicarity mould
The cost of tool and the acquisition cost of corresponding press are higher, and molding difficulty is larger；
It is formed in the step of transmittance section removing light screening material and exposing light transmission colloid top, the patent is real in a manner of grinding etc.
It is existing, due to the presence of mismachining tolerance, be difficult to accomplish to process each time in accurately light screening material can be removed completely and
Light transmission colloid is not impacted, therefore, during being removed every time to light screening material, is invariably accompanied to light transmission colloid
Cutting, surface forming is second-rate, specifically show as optical path light transmission colloid surface uncontrollability enhance, be unfavorable for
Form the light source of stabilized illumination angle；
In addition, being limited for the light emitting diode construction in the patent by production method, due to light transmission colloid top surface
It is always equal with black glue top surface, cause its light-emitting angle larger.
Therefore, in order to overcome the defect of existing LED component, the LED that a kind of processing technology is simple, light emitting angle is controllable is needed
Device.Correspondingly, being also required to the LED component production method that a kind of processing technology is simple, light emitting angle is controllable.
Summary of the invention
In order to overcome the defect of existing LED, the present invention provides a kind of LED components and preparation method thereof, have processing work
The features such as skill is simple, light emitting angle controllability is strong, light centrality is strong.
Correspondingly, the LED component includes base board unit, luminescence unit, light transmission the present invention provides a kind of LED component
Unit and lightproof unit；
The luminescence unit is fixed on the base board unit, and the light transmitting cells are covered on the luminescence unit periphery；
The light transmitting cells surface includes lightproof area and transmission region；
The lightproof unit is covered on the lightproof area；
An engraved structure, the hollow out are formed between the lightproof unit and the light transmitting cells on the transmission region
Structure is the transmittance section that side is contacted with the light transmitting cells, side is in communication with the outside.
The contact surface of optional embodiment, the light transmitting cells and the transmittance section is plane；Or the light transmitting cells
Contact surface with the transmittance section is the concave surface being recessed to the luminescence unit direction.
Optional embodiment, the transmittance section are arranged in outside the top surface surface of the light transmitting cells, and the transmittance section
With the top surface face of the luminescence unit.
Optional embodiment, transmittance section encirclement annular in shape are arranged in outside the side of the light transmitting cells.
The lateral surface of optional embodiment, the light transmitting cells and the lightproof unit is each perpendicular to the substrate list
Member.
On the outside of at least one of lateral surface of optional embodiment, the light transmitting cells and/or the lightproof unit
Face is not orthogonal to the base board unit.
Optional embodiment, the light transmitting cells are made based on transparent epoxy resin.
Optional embodiment, the lightproof unit are based on black colloid and are made, and the black colloid is in epoxy resin
In be added to black additive.
Correspondingly, the present invention also provides a kind of LED component manufacturing methods, comprising the following steps:
The photic zone of a multiple luminescence unit of covering is formed on the substrate for being provided with multiple luminescence units；
Based on the first cutter along the default cutting track for being parallel to the substrate, photic zone described in ground cutting-up is penetrated, is formed
Multiple light transmitting cells, in the multiple light transmitting cells each light transmitting cells formed along cutting track have it is molding for light shield layer
Runner；
It is covered using predeterminable area of the shading mold to light transmitting cells surface each in the multiple light transmitting cells
Afterwards, the light shield layer for covering all light transmitting cells surfaces is formed based on the runner, the predeterminable area is in the photomask
Transmittance section is formed after tool abjection；
Based on the second cutter along the default cutting track for being parallel to the substrate, substrate described in ground cutting-up is penetrated, or is penetrated
Substrate described in ground cutting-up and corresponding to the light shield layer on substrate cutting-up position, forms LED device described in the above one of them
Part.
Optional embodiment, one covering of the formation on the substrate for being provided with multiple luminescence units is the multiple to shine
The photic zone of unit includes:
The photic zone for covering the multiple luminescence unit is formed with injection molding manner based on photic zone mold.
Optional embodiment, described formed based on photic zone mold with injection molding manner cover the multiple luminescence unit
Photic zone includes:
Based on injection molding manner all luminescence units will be coated by liquefied epoxy resin under the conditions of 135 DEG C~180 DEG C；
Chemical reaction occurs based on epoxy curing agent and the epoxy resin and forms the photic zone.
Optional embodiment is provided on the position of photic zone mold luminescence unit described in face described in
The protrusion in luminescence unit direction；
It is described after forming the photic zone for covering the multiple luminescence unit with injection molding manner based on the photic zone mold
The one side that light transmission layer surface is right against the luminescence unit is towards the concave surface of the luminescence unit.
Optional embodiment, the multiple luminescence unit are arranged as multiple row, the photic zone difference on the substrate
It is molded on the luminescence unit surface of same row.
Optional embodiment, the predeterminable area is arranged on the top surface of the light transmitting cells or the predeterminable area
Setting annular in shape is in the light transmitting cells periphery.
Optional embodiment is penetrated in the default cutting track for being parallel to the substrate based on the first cutter edge
Photic zone described in ground cutting-up, before forming multiple light transmitting cells, based on the substrate bottom surface stick high-temp glue and cross mould mode,
The substrate is fixed on blue film or partial veil.
Optional embodiment, it is described to use a shading mold to light transmitting cells surface each in the multiple light transmitting cells
Predeterminable area covered after, formed based on the runner and cover the light shield layer on all light transmitting cells surfaces and include:
It is covered using predeterminable area of the shading mold to light transmitting cells surface each in the multiple light transmitting cells；
Based on injection molding manner will under the conditions of 135 DEG C~180 DEG C liquefied black epoxy act on the runner and
On the light transmitting cells top surface, the surface outside each light transmitting cells predeterminable area is coated；
Chemical reaction occurs based on epoxy curing agent and black epoxy and forms thermoset products black colloid packet
Overlay on the light shield layer on all light transmitting cells surfaces.
Optional embodiment is penetrated in the default cutting track for being parallel to the substrate based on the second cutter edge
Substrate described in ground cutting-up, or penetrate ground cutting-up described in substrate and corresponding to the light shield layer on substrate cutting-up position before, be based on
High-temp glue is sticked in the substrate bottom surface and crosses the mode moulded, and the substrate is fixed on blue film or partial veil.
In conclusion the LED component of the embodiment of the present invention includes base board unit, luminescence unit, light transmitting cells and shading list
Member can on demand control the light direction of LED component and light-emitting angle by the loophole of hollow design in lightproof unit
System；Needle is provided for the embodiments of the invention LED component, provides a kind of LED component production method accordingly, utilizes photic zone
Mold and light shield layer mold, form the light transmitting cells and lightproof unit of multiple LED components in an injection moulding process, processing efficiency compared with
It is high；In the way of cutter cutting, pass through cutting track, cutting object and the depth of cut to cutter in different procedure of processings
Reasonable setting, cutting separation efficiently is carried out to photic zone, light shield layer and substrate, in practical applications have good processing
Convenience.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 shows the LED component elevational cross-sectional view of the embodiment of the present invention one；
Fig. 2 shows the LED component side view cutaway drawings of the embodiment of the present invention one；
Fig. 3 shows the LED component top view of the embodiment of the present invention one；
Fig. 4 shows the LED component light path principle schematic diagram of the embodiment of the present invention one
Fig. 5 shows the LED component light path principle schematic diagram of the embodiment of the present invention two；
Fig. 6 shows the LED component elevational cross-sectional view of the embodiment of the present invention three；
Fig. 7 shows the LED component side view cutaway drawing of the embodiment of the present invention three；
Fig. 8 shows the LED component production method flow chart of the embodiment of the present invention four；
The processing component that Fig. 9 shows the LED component production method corresponding to the embodiment of the present invention four faces section signal
Figure；
Figure 10 shows the processing component schematic top plan view of the LED component production method corresponding to the embodiment of the present invention four；
The first LED component that Figure 11 shows the embodiment of the present invention eight faces cross section view；
The second LED component that Figure 12 shows the embodiment of the present invention eight faces cross section view；
The third LED component that Figure 13 shows the embodiment of the present invention eight faces cross section view；
Figure 14 shows structure top view when the first LED component of the embodiment of the present invention executes step S101.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 shows the LED component elevational cross-sectional view of the embodiment of the present invention, and Fig. 2 shows the LED devices of the embodiment of the present invention
Part side view cutaway drawing, Fig. 3 show the LED component top view of the embodiment of the present invention, it should be noted that attached drawing Fig. 1 to attached drawing
Fig. 3 is the LED device structure schematic diagram of embodiment one, is only used for pointing out the setting position of associated components in embodiments of the present invention
And the setting principle of associated components, specific LED device structure are introduced below in conjunction with each embodiment.
The embodiment of the invention provides a kind of LED components, including base board unit 101, luminescence unit 102, light transmitting cells 103
With lightproof unit 104.
The base board unit 101 is circuit substrate, for fixing for luminescence unit 102 and realizing for luminescence unit 102
Electrical connection.
The luminescence unit 102 is light emitting diode (LED), and the LED body is fixed on the base board unit 101,
Two electrodes of the LED are connect on the base board unit 101 by bonding line, are electrically connected with the formation of base board unit 101.Specifically
, in embodiments of the present invention, the LED of random color can be selected depending on luminescent color demand, RGB tri- can also be selected according to demand
Color LED.
The light transmitting cells 103 are made using transparent material, have certain protective effect to luminescence unit 102.Specifically
, the bonding line of luminescence unit 102 can be fixed in light transmitting cells 103, and bonding line is prevented surprisingly to be broken；In addition, by pair
The covering of luminescence unit 102 reduces erosion of the external environment to luminescence unit.In specific implementation, light transmitting cells 103 are frequently with ring
Oxygen resin is made, and can also be made of silicone resin, silica gel.It further, can also be in light transmitting cells 103 depending on design requirement
Middle addition fluorescent powder, to realize the display effect of different colours.
In embodiments of the present invention, in order to achieve the purpose that control LED component light-emitting angle, 103 table of light transmitting cells
Face includes lightproof area and transmission region, and the covering of lightproof unit 104 is arranged on the lightproof area.
Specifically, the lightproof unit 104 is made using light screening material, it is covered on the shading region of the light transmitting cells 103
On domain, the light projected to luminescence unit 102 through 103 lightproof area of light transmitting cells is limited.Specifically, light screening material is optional
With black colloid, the black colloid substrate is that black additive is added in epoxy resin, which can be carbon
Powder or other black organic matters, the lightproof unit 104 can form barriering effect to the light that luminescence unit 102 is issued.
After the lightproof unit 104 forms, in the light transmission between the lightproof unit 104 and the light transmitting cells 103
An engraved structure is formed on region；Relative to the lightproof unit 104, lightproof unit described in the engraved structure complete penetration
104, side is contacted with the transmission region on 103 surface of light transmitting cells, and side is in communication with the outside；In embodiments of the present invention,
The engraved structure is named as transmittance section 105.Specifically, the transmittance section 105 is used for for 102 light of luminescence unit through light transmitting cells
It is projected after 103 from the direction of setting.
Optionally, in the LED component of the embodiment of the present invention, visual actual demand is provided on one piece of base board unit 101
More than one luminescence unit 102, more than one luminescence unit 102 be fixed based on a whole light transmitting cells 103 and
Encapsulation, lightproof unit 104 are covered on outside the light transmitting cells 103, and in the corresponding position for corresponding to each luminescence unit 102
On be provided with the more than one transmittance section 105 appeared for light.Specifically, between luminescence unit 102 and corresponding transmittance section
Relative position be determined depending on actual demand.
Correspondingly, multiple luminescence units 102 are in the substrate if having multiple luminescence units 102 in a LED component
Relative position on unit 101 be it is unfixed, visual actual demand is adjusted.
Below for be directed to respectively several typical LED device structures to LED component provided in an embodiment of the present invention and its
Production method is introduced.
Embodiment one:
Fig. 1 shows the LED component elevational cross-sectional view of the embodiment of the present invention, and Fig. 2 shows the LED devices of the embodiment of the present invention
Part side view cutaway drawing, Fig. 3 show the LED component top view of the embodiment of the present invention.The LED component of the embodiment of the present invention includes base
Plate unit 101, light transmitting cells 103, lightproof unit 104 and a luminescence unit 102.
Specifically, base board unit 101 is rectangular configuration, luminescence unit 102 is fixed on the middle part of base board unit 101, light transmission
Unit 103 is covered on the luminescence unit 102, and is connected and fixed with the base board unit 101；Lightproof unit 104 is covered on
103 periphery of light transmitting cells, four sides are respectively perpendicular to base board unit 101, and top surface is parallel with the top surface of base board unit 101；It hides
The top of light transmitting cells 103 is arranged in the transmittance section 105 of light unit 104, opposite with the top surface of luminescence unit 102；Preferably, thoroughly
The top surface face in light portion 105 and the luminescence unit 102.
Fig. 4 shows the LED component light path principle schematic diagram of the embodiment of the present invention.The light warp that luminescence unit 102 issues
Light transmitting cells 103 and the contact surface of transmittance section 105 project, and refraction can be partially generated with the light of the contact surface out of plumb, generate
The light portion of refraction can be by lightproof unit 104 by the lightproof unit inner wall blocking of 105 side of transmittance section, cannot be from light transmission
It is appeared in portion 105.Compared with the existing light-emitting diode encapsulation structure mentioned by the background technique, the top surface of light transmitting cells 103 is high
Degree be lower than lightproof unit 104 apical side height, therefore, some light reflected can by lightproof unit inner wall blocking and nothing
Method appears, and under same loophole size, light light-emitting angle reduces, the enhancing of light centrality, radiation direction enhancing.
Embodiment two:
Fig. 5 shows the LED component light path principle schematic diagram of the embodiment of the present invention.In specific implementation, in order to further add
The contact surface of light transmitting cells and the transmittance section can be designed as towards hair by the centrality of strong light and the light-emitting angle for reducing light
The concave surface 501 of light unit direction recess.The concave surface 501 has certain converging action to the light issued from luminescence unit.
Using the optical path of attached drawing Fig. 4 in embodiment one as reference, converged originally by the light that shading inner wall stops through concave surface 501 in embodiment one
After poly-, it can be appeared from transmittance section, compared with plane is in the top surface of light transmitting cells, under same case, the light that is appeared in transmittance section
Linear light Qiang Geng great, light are more concentrated.
Embodiment three:
Transmittance section is arranged on the top surface of lightproof unit for embodiment one and embodiment two, i.e., goes out light in face luminescence unit
Transmittance section is arranged in the top of the light transmitting cells in face, and the light for issuing luminescence unit can only be appeared from the transmittance section of top surface, real
Now control the purpose of radiation direction.
Specifically, can also be by the way that transmittance section be arranged on the side of lightproof unit.
Fig. 6 shows the LED component elevational cross-sectional view of the embodiment of the present invention, and Fig. 7 shows the LED device of the embodiment of the present invention
Part side view cutaway drawing.Specifically, in the embodiment of the present invention, base board unit 101, luminescence unit 102, light transmitting cells 103 and shading
The setting form of unit 104 is the same as example 1, wherein the transmittance section 605 of lightproof unit 104 is arranged in lightproof unit 104
Side on, optionally, transmittance section 605 it is annular in shape be enclosed in 103 periphery of light transmitting cells, the outer phase with luminescence unit 102
It is right.
The lightproof unit transmittance section of embodiment one is opposite with the top surface of luminescence unit, for by the light of LED component from saturating
It projects the top surface of light unit；The lightproof unit transmittance section of the embodiment of the present invention is opposite with the periphery of luminescence unit, is used for LED device
The light of part is projected from the side of light transmitting cells, and when transmittance section is set as ring-type, which can along the circumferential direction uniformly
It shines.
Example IV:
Fig. 8 shows the LED component production method flow chart of the embodiment of the present invention, and Fig. 9, which is shown, corresponds to the present invention in fact
It applies a processing component for LED component production method and faces diagrammatic cross-section, Figure 10 is shown corresponding to LED device of the embodiment of the present invention
The processing component schematic top plan view of part production method.Since the LED component production method of the embodiment of the present invention is for embodiment
LED component provided by one is introduced, and partial part number is identical as the accompanying drawing number in embodiment one.
Correspondingly, being directed to the LED component of embodiment one, the present invention also provides a kind of LED component production methods, including with
Lower step:
S101: multiple luminescence units 102 are arranged on substrate 901；
Multiple luminescence units 102 and a substrate 901 are introduced, by each of multiple luminescence units 102 luminescence unit 102
It is fixed on the substrate 901 according to the predeterminated position of design, two electrodes of luminescence unit are welded on substrate by bonding line
On predeterminated position on 901 (attached that bonding line is not shown in the figure), the position corresponding with substrate 901 of luminescence unit 102 is made to generate electricity
Connection relationship.For the ease of subsequent cutting operation, optionally, the multiple luminescence unit 102 is evenly arranged in the substrate
On, the setting position of multiple luminescence units 102 is grid-shaped, is cut convenient for the cutter of scribing machine.
S102: the photic zone 903 of all luminescence units 102 of covering is formed；
Optionally, the materials such as epoxy solid resin, silicone resin or silica gel can be selected in light transmission layer material, in the way of injection molding
Form photic zone 903.Specifically, by the injection-moulding devices such as injection molding machine, using photic zone mold 801 by all luminescence units 102
It is enclosed in the injection molding cavity of photic zone mold 801；By high temperature melt solid epoxy resin glue cake, silicone resin can also be used
Or silica gel glue cake, there is solid epoxy in liquid form, is then filled the epoxy resin of liquid by injection molding manner
In the injection molding cavity of photic zone mold 801, the epoxy resin of liquid is made to coat all luminescence units；It is solid eventually by epoxy resin
Agent and epoxy resin chemically react, and form thermoset products light transmission colloid, i.e. photic zone described in the embodiment of the present invention
903。
In specific implementation, in order to reach the characteristics such as mobility, adhesion after epoxy resin liquefaction most preferably, in general,
The condensing temperature of epoxy resin is arranged between 135 DEG C~180 DEG C, and optimum temperature section is 150 DEG C~175 DEG C.
The internal stress generated when in order to remove epoxy resin cure, it is also necessary to by the substrate after the completion of injection molding at high temperature into
Row secondary curing, curing time is 2~5 hours, to improve the reliability of product.
It should be noted that since light transmitting cells are formed by cutting photic zone, in order to reach good light emitting anger
The contact surface of degree control effect, light transmitting cells and transmittance section needs better roughness；In embodiments of the present invention, by
It is on the top surface that light transmitting cells are set in transmittance section, in order to avoid the top surface to light transmitting cells carries out secondary operation, photic zone
Apical side height should be identical as the apical side height of light transmitting cells, i.e., photic zone mold injection molding cavity height need according to light transmission list
The height of member is designed, to obtain the surface roughness of better light transmitting cells Yu transmittance section contact surface.
S103: based on the first cutter along the default cutting track for being parallel to the substrate, penetrating photic zone described in ground cutting-up,
Form multiple light transmitting cells, in the multiple light transmitting cells each light transmitting cells formed along cutting track have for light shield layer at
The runner of type；
Before cutting, it in order to guarantee cut quality, needs to fix the substrate.In embodiments of the present invention, it is arranged one
Cutting platform, the cutting of light transmitting cells are carried out on the Cutting platform.It is first on the Cutting platform in specific implementation
The high temperature resistance diaphragms such as blue film, partial veil are first sticked, high-temp glue is then sticked in substrate bottom surface, are based on substrate by way of crossing and moulding
High-temp glue and high temperature resistance diaphragm form fixation, avoid misplacing in the cutting of light transmitting cells.
Luminescence unit position according to an embodiment of the present invention and required light transmitting cells shape are implemented in the present invention
In example, using high-speed rotating first cutter 802 of slicer, by latticed first cutting track 805 to photic zone 903 into
Row cutting, is divided into multiple light transmitting cells 103 for the photic zone 903.It should be noted that only to photic zone in the step
903 are cut, and the substrate 901 below photic zone, which is appointed, so keeps integral structure.
First cutter 802 has certain thickness, and photic zone 903 is formed by after first cutter 802 cutting
Will form runner between adjacent light transmitting cells 103 in multiple light transmitting cells 103, in subsequent step light shield layer carry out at
Type.
It should be noted that the cutting track of first cutter 802 is set according to required light transmitting cells structure
Meter, in specific implementation adaptations can be carried out according to the different of light transmitting cells structure；On the one hand, according to existing slicer
Motion principle, the first cutter 802 only can be carried out plane motion in operation process, and therefore, the cutting track of the first cutter 802 is answered
Parallel with substrate, i.e. the first cutter need to be maintained at operation in a fixed height plane parallel with the substrate；Another party
Face, since the first cutter 802 needs to carry out penetrating to photic zone ground cutting-up, in order to guarantee that cutting effect, the first cutter 802 should be protected
The operation in a fixed height plane parallel with the substrate is held, to guarantee that the first cutter stable can carry out photic zone
The cutting-up penetrated.
Optionally, the thickness range 0.3mm-0.5mm of first cutter 802.
S104: the light transmission using a light shield layer mold 803 to each light transmitting cells surface in the multiple light transmitting cells 103
After region is covered, the light shield layer 904 for covering all light transmitting cells surface lightproof areas, institute are formed based on the runner
It states and forms transmittance section 105 after the light shield layer mold 803 abjection on transmission region；
Specifically, black colloid can be selected in 904 material of light shield layer, black colloid substrate is epoxy resin, black by adding
Colour additive forms shaded effect such as carbon dust or other black organic matters.Based on using black colloid, the embodiment of the present invention
Injection molding manner molding can be used in light shield layer 904.Specifically, first by the design to light shield layer mold 803, to light transmitting cells table
Face needs reserved transmission region to be covered, and leave a blank then the lightproof area on light transmitting cells surface by solid-state black
Epoxide-resin glue cake liquefies at high temperature, is injected into the inner cavity of light shield layer mold 803 by injection molding manner, is based on High-temperature Liquefaction
Black epoxy act under runner and on the lightproof area of all light transmitting cells 103, coat all light transmitting cells 103
In each light transmitting cells surface lightproof area；It is chemically reacted by epoxy curing agent and black epoxy, from
And thermoset products black colloid is formed, all 103 surface lightproof areas of light transmitting cells are coated on based on black colloid formation
Light shield layer 904.
Since transmission region is covered before light shield layer 904 is molded, after light shield layer mold 803 is deviate from, light shield layer
Between 904 and light transmitting cells 103, it is saturating to form that side is contacted with light transmitting cells, side is in communication with the outside above transmission region
Light portion 105.
It should be noted that since lightproof unit is to cut to be formed by light shield layer 904, in order to guarantee lightproof unit energy
It is enough that good covering effect is formed to the position in the non-transparent portion in light transmitting cells surface, the moulding material of light shield layer 904 in injection molding,
It needs to be filled up completely into the lightproof area of runner and light transmitting cells top surface outside light transmitting cells side.
S105: based on the second cutter along the default cutting track for being parallel to the substrate, light shield layer described in ground cutting-up is penetrated
And substrate, form required LED component.
Before cutting, it in order to guarantee cut quality, needs to fix the substrate.In embodiments of the present invention, it is arranged one
Cutting platform, the cutting of light shield layer, substrate are carried out on the Cutting platform.In specific implementation, in the Cutting platform
On stick the high temperature resistance diaphragms such as blue film, partial veil first, high-temp glue is then sticked in substrate bottom surface, by substrate by way of crossing and moulding
Fixation is formed based on high-temp glue and high temperature resistance diaphragm, avoids misplacing in the cutting of light transmitting cells.
In embodiments of the present invention, to some materials of the light shield layer 904 and the substrate 901 by way of cutting
It is removed.Specifically, in embodiments of the present invention, using high-speed rotating second cutter 804 of slicer, by latticed
Second cutting track 806 simultaneously cuts light shield layer 904 and substrate 901, and light shield layer 904 is divided into shading after cutting
Unit 104, substrate 901 are divided into base board unit 101, each group of divided base board unit 101, light transmitting cells after cutting
103, the combination of luminescence unit 102 and lightproof unit 104 forms a LED component.
It should be noted that due to the lightproof unit lateral surface of embodiment one with the lateral surface of base board unit be it is equal,
Therefore, can be in a cutting track of cutter, while light shield layer and substrate are cut；If lightproof unit lateral surface with
The lateral surface of base board unit is irrelevancy, needs the mode of secondary cut, presses preset cutter track track and depth of cut respectively
Light shield layer and substrate are cut respectively.
Correspondingly, being directed to the encapsulation unit structure and base board unit structure of different LED components, the second cutting track 806
The change of adaptability should be made.
Optionally, the thickness range 0.08mm-0.1mm of the second cutter 804.
In general, the cutter cutting track of the first cutter and the second cutter be it is identical, in order to guarantee each LED component
It is both provided with the lightproof unit of adequate thickness outside, the cutter thickness of the second cutter is smaller than the cutter thickness of the first cutter.
Compared with the production method for the light-emitting diode encapsulation structure being previously mentioned in background technique, the embodiment of the present invention is provided
LED component production method used in mold be single mode cavity mould, injection molding machine pressure requirements are lower；Light transmitting cells and light transmission
The contact surface in portion is made through injection molding, needs not move through the machinings modes such as grinding and forms, surface quality is preferable；Pass through cutter pair
Each unit is separated, and the cutting plane of cutter is non-transparent plane, will not be impacted, be added to the luminous of LED component
Work precision prescribed is lower, and process velocity is very fast, can effectively accelerate the process velocity of LED component, lowers production cost.
Embodiment five:
Compared with embodiment one, the contact surface of the light transmitting cells of embodiment two and the transmittance section is towards luminescence unit direction
The concave surface 501 of recess, rather than plane, in actual processing, procedure of processing is identical as step shown in example IV；Specifically,
On the basis of example IV, in step s 102, according to the actually required shape of light transmitting cells, to hyaline layer mold 801 into
Row design, is arranged on the position that the hyaline layer mold 801 is right against the luminescence unit towards the convex of the luminescence unit
It rises, to form required concave surface 501 in light transmission layer surface after light transmission formable layer；In step S104, accordingly to screening
Photosphere mold 803 is designed, thus the transmittance section 105 needed for being formed.
Embodiment six:
Similarly, it is directed to the LED component that embodiment three is introduced, in order to form the transmittance section for being located at side, light shield layer
Mold 803 needs changed accordingly, using modes such as side core-pulling molds, before shading formable layer to cricoid transmittance section into
Row masking, after making shading formable layer, can there are be located at side the transmittance section appeared for light.
Embodiment seven:
In three kinds of LED device structures that embodiment one to embodiment three provides, only there is a hair in each LED component
Light unit in actual implementation, may can have multiple luminescence units in a LED component, for multiple luminescence units
LED component, according to its luminescence unit quantity, is led to based on the LED component production method that example IV to embodiment six provides
Cutting track of the cutter to photic zone, light shield layer and substrate for crossing change slicer, forms the LED device with multiple luminescence units
Part.
Embodiment eight:
The lateral surface of the LED device structure that embodiment one is introduced to embodiment three, light transmitting cells and lightproof unit hangs down
Directly in base board unit, therefore, in the production process, knife is can be used directly in the LED component that embodiment one to embodiment three is introduced
Tool directly cuts photic zone and light shield layer, is respectively formed corresponding light transmitting cells and lightproof unit.
The first LED component that Figure 11 shows the embodiment of the present invention faces cross section view, and Figure 12 shows implementation of the present invention
Second LED component of example faces cross section view, and the third LED component that Figure 13 shows the embodiment of the present invention faces cross section view.
Correspondingly, the embodiment of the present invention is also provided with a kind of LED component, in the structure basis of embodiment one to embodiment three, by LED
At least one lateral surface in the light transmitting cells 911 of device and the lateral surface of lightproof unit 902 is designed as not vertical with substrate
Structure.
In specific implementation, inclined-plane can be processed by way of tilting cutter, but operation difficulty is larger, fraction defective compared with
Therefore height needs to carry out adaptations in the manufacturing process of such LED component.
Specifically, the side of base board unit is not orthogonal to for 911 periphery of light transmitting cells, example IV step S102's
On the basis of, adaptations are carried out to photic zone mold, substrate list is not orthogonal to light transmitting cells periphery using photic zone mold
The side of member is formed.
Specifically, the side of base board unit is not orthogonal to for 902 periphery of lightproof unit, example IV step S104's
On the basis of, adaptations are carried out to light shield layer mold, substrate list is not orthogonal to lightproof unit periphery using light shield layer mold
The side of member is formed.
Figure 14 shows structure top view when the first LED component of the embodiment of the present invention executes step S101.Specifically, such as
Structure shown in attached drawing Figure 11, the two sides in direction shown in the first LED component attached drawing are inclined-plane, front and back perpendicular to substrate list
Member.In step S101 and step S102, for the molding on inclined-plane and convenient for subsequent cutting, luminescence unit 102 is in substrate
Upper arrangement is multiple row, and photic zone mold needs to cover substrate surface area 1001, and photic zone 903 is made to be covered on same row
On the surface of luminescence unit 102, the photic zone 903 on 102 surface of luminescence unit of different lines does not contact each other；Meanwhile light transmission
Layer mold also needs the inclined-plane for photic zone 903 to carry out adaptability design, realizes the inclined-plane molding of photic zone 903.
Correspondingly, in step s 103, on the basis of the view direction shown in the attached drawing 14, the first cutter only need to be in Figure 14
Shown in transverse path 1002 (track shown in lateral chain-dotted line) photic zone 903 is cut, multiple light transmission lists can be formed
Member；
Correspondingly, likewise, needing to cover substrate surface area 1001, making to hide on the basis of step S104
Photosphere material will not be flow between the light transmitting cells of adjacent two column.Specifically, with substrate surface area phase when light transmission formable layer
Than 1001 width of substrate surface area is smaller in the step, makes light shield layer that can be covered on the side and top of each light transmitting cells
On face.Specifically, in this step, light shield layer is molded over outside the light transmitting cells of same row, any light transmitting cells are covered
Side and top surface (except the predeterminable area of transmittance section).It should be noted that since mold is only between adjacent two column light transmitting cells
Substrate surface area 1001 covered, at this point, be located at same row light transmitting cells on lightproof unit be to be linked together shape
At euphotic, independent use can just be carried out by being cut.
Correspondingly, in step s105, on the basis of the view direction shown in the attached drawing 14, track 1003 is (longitudinal along longitudinal direction
Track shown in chain-dotted line) cutting and transverse path 1002 and longitudinal track 1003 are carried out to substrate and light shield layer progress to substrate
Cutting, can form the first LED component.
In conjunction with the embodiments one to embodiment eight introduction, in conclusion the LED component of the embodiment of the present invention includes substrate list
Member, luminescence unit, light transmitting cells and lightproof unit can on demand go out LED component by the loophole designed on light transmitting cells
Light direction and light-emitting angle are controlled, and have good practicability.Needle is provided for the embodiments of the invention LED component, phase
That answers provides a kind of LED component production method, is formed using photic zone mold and light shield layer mold, in an injection moulding process more
The light transmitting cells and lightproof unit of a LED component, processing efficiency are higher；By cutter cutting in the way of, by cutter not
With the reasonable setting of cutting track, cutting object and depth of cut in procedure of processing, efficiently to photic zone, light shield layer and base
Plate carries out cutting separation, has good processing convenience in practical applications.
It is provided for the embodiments of the invention a kind of LED component and preparation method thereof above to be described in detail, herein
In apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to sides
Assistant solves method and its core concept of the invention；At the same time, for those skilled in the art, think of according to the present invention
Think, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be construed as pair
Limitation of the invention.
Claims (17)
1. a kind of LED component, which is characterized in that the LED component includes base board unit, luminescence unit, light transmitting cells and shading
Unit；
The luminescence unit is fixed on the base board unit, and the light transmitting cells are covered on the luminescence unit periphery；
The light transmitting cells surface includes lightproof area and transmission region；
The lightproof unit is covered on the lightproof area；
An engraved structure, the engraved structure are formed between the lightproof unit and the light transmitting cells on the transmission region
For the transmittance section that side is contacted with the light transmitting cells, side is in communication with the outside.
2. LED component as described in claim 1, which is characterized in that the light transmitting cells and the contact surface of the transmittance section are
Plane；Or the light transmitting cells and the contact surface of the transmittance section are the concave surface being recessed to the luminescence unit direction.
3. LED component as described in claim 1, which is characterized in that the top surface of the light transmitting cells is arranged in the transmittance section
Outside surface, and the top surface face of the transmittance section and the luminescence unit.
4. LED component as described in claim 1, which is characterized in that transmittance section encirclement annular in shape is arranged described
Outside the side of light unit.
5. LED component as described in claim 1, which is characterized in that the lateral surface of the light transmitting cells and the lightproof unit
It is each perpendicular to the base board unit.
6. LED component as described in claim 1, which is characterized in that the outside of the light transmitting cells and/or the lightproof unit
At least one lateral surface in face is not orthogonal to the base board unit.
7. LED component as described in claim 1, which is characterized in that the light transmitting cells are made based on transparent epoxy resin.
8. LED component as described in claim 1, which is characterized in that the lightproof unit is based on black colloid and is made, described black
Coloring agent body is to be added to black additive in the epoxy.
9. a kind of LED component manufacturing method, which comprises the following steps:
The photic zone of a multiple luminescence unit of covering is formed on the substrate for being provided with multiple luminescence units；
Based on the first cutter along the default cutting track for being parallel to the substrate, photic zone described in ground cutting-up is penetrated, is formed multiple
Light transmitting cells, each light transmitting cells are formed along cutting track in the multiple light transmitting cells has for the molding stream of light shield layer
Road；
After being covered using predeterminable area of the shading mold to light transmitting cells surface each in the multiple light transmitting cells, base
The light shield layer for covering all light transmitting cells surfaces is formed in the runner, the predeterminable area is deviate from the shading mold
After form transmittance section；
Based on the second cutter along the default cutting track for being parallel to the substrate, substrate described in ground cutting-up is penetrated, or is drawn with penetrating
It cuts the substrate and corresponding to the light shield layer on substrate cutting-up position, is formed described in claim 1 to 8 one of them
LED component.
10. LED component manufacturing method as claimed in claim 9, which is characterized in that described to be provided with multiple luminescence units
The photic zone that one covers the multiple luminescence unit is formed on substrate includes:
The photic zone for covering the multiple luminescence unit is formed with injection molding manner based on photic zone mold.
11. LED component manufacturing method as claimed in claim 10, which is characterized in that the photic zone mold that is based on is to be molded
Mode, which is formed, to be covered the photic zone of the multiple luminescence unit and includes:
Based on injection molding manner all luminescence units will be coated by liquefied epoxy resin under the conditions of 135 DEG C~180 DEG C；
Chemical reaction occurs based on epoxy curing agent and the epoxy resin and forms the photic zone.
12. LED component manufacturing method as claimed in claim 10, which is characterized in that the photic zone mold is described in the face
The protrusion towards the luminescence unit direction is provided on the position of luminescence unit；
Based on the photic zone mold, after forming the photic zone for covering the multiple luminescence unit with injection molding manner, the light transmission
The one side that layer surface is right against the luminescence unit is towards the concave surface of the luminescence unit.
13. LED component manufacturing method as claimed in claim 9, which is characterized in that the multiple luminescence unit is in the substrate
On be arranged as multiple row, the photic zone is separately formed on the luminescence unit surface for being located at same row.
14. LED component manufacturing method as claimed in claim 9, which is characterized in that the predeterminable area is arranged in the light transmission
On the top surface of unit or setting that the predeterminable area is annular in shape is in the light transmitting cells periphery.
15. LED component manufacturing method as claimed in claim 9, which is characterized in that be parallel on the first cutter edge that is based on
The default cutting track of the substrate penetrates photic zone described in ground cutting-up, before forming multiple light transmitting cells, based in the substrate
Bottom surface sticks high-temp glue and crosses the mode moulded, and the substrate is fixed on blue film or partial veil.
16. the manufacturing method of LED component as claimed in claim 9, which is characterized in that described to use a shading mold to described
After the predeterminable area on each light transmitting cells surface is covered in multiple light transmitting cells, is formed based on the runner and cover all institutes
The light shield layer for stating light transmitting cells surface includes:
It is covered using predeterminable area of the shading mold to light transmitting cells surface each in the multiple light transmitting cells；
Based on injection molding manner liquefied black epoxy the runner and described will be acted under the conditions of 135 DEG C~180 DEG C
On light transmitting cells top surface, the surface outside each light transmitting cells predeterminable area is coated；
It forms thermoset products black colloid based on epoxy curing agent and black epoxy generation chemical reaction and is coated on
The light shield layer on all light transmitting cells surfaces.
17. LED component manufacturing method as claimed in claim 9, which is characterized in that be parallel on the second cutter edge that is based on
The default cutting track of the substrate penetrates substrate described in ground cutting-up, or penetrates substrate described in ground cutting-up and correspond to the base
Before light shield layer on plate cutting-up position, based on sticking high-temp glue in the substrate bottom surface and crossing the mode moulded, the substrate is consolidated
It is scheduled on blue film or partial veil.
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