CN113206029A - Packaging equipment for processing electronic components - Google Patents
Packaging equipment for processing electronic components Download PDFInfo
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- CN113206029A CN113206029A CN202110496144.0A CN202110496144A CN113206029A CN 113206029 A CN113206029 A CN 113206029A CN 202110496144 A CN202110496144 A CN 202110496144A CN 113206029 A CN113206029 A CN 113206029A
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- shell
- feeding
- assembly
- component
- motor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses packaging equipment for processing an electronic component, which comprises a shell assembly, a dust removal assembly and a feeding assembly, wherein the shell assembly is provided with a shell; the shell assembly is used for attaching a chip to the semiconductor frame; wherein the dust removal assembly is used for removing dust in the shell assembly; the feeding assembly is used for automatically feeding the semiconductor frame; the top of the shell component is communicated with the dust removal component, and the feeding component is installed on one side of the shell component. The shell assembly comprises a shell, a glass door, a feeding port, a discharging port and a mechanical arm, wherein the glass door is slidably mounted on one side of the shell. After a worker maintains the mechanical arm or takes out the clamped frame, dust entering the shell due to the opening of the glass door is removed through the dust removal assembly; the semiconductor frame can be automatically fed through the feeding assembly, so that time and labor are saved; the top of the material box is open, so that the semiconductor frame can be conveniently conveyed during automatic feeding.
Description
Technical Field
The invention relates to the technical field of electronic component processing, in particular to packaging equipment for processing an electronic component.
Background
The electronic component includes: the electronic device comprises a resistor, a capacitor, an inductor, a potentiometer, an electronic tube, a radiator, an electromechanical element, a connector, a semiconductor device, an electroacoustic device, a laser device, an electronic display device, a photoelectric device, a sensor, a power supply, a switch, a micro-special motor, an electronic transformer, a relay, a printed circuit board, an integrated circuit, various circuits, piezoelectricity, crystals, quartz, a ceramic magnetic material, a substrate for a printed circuit, a special material for an electronic functional process, an electronic adhesive (tape) product, an electronic chemical material, a component and the like. Among them, a packaging apparatus is required for semiconductor packaging.
During general semiconductor package, when the staff maintained or safeguarded inside, inside external dust got into equipment easily, influenced product quality, simultaneously, during the encapsulation, staff's manual material loading was wasted time and energy. Therefore, a packaging device for processing the electronic components is provided.
Disclosure of Invention
The present invention is directed to a packaging apparatus for processing an electronic component, which solves the above problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme: a packaging device for processing electronic components comprises: the device comprises a shell assembly, a dust removal assembly and a feeding assembly;
the shell assembly is used for attaching a chip to the semiconductor frame;
wherein the dust removal assembly is used for removing dust in the shell assembly;
the feeding assembly is used for automatically feeding the semiconductor frame;
the top of the shell component is communicated with the dust removal component, and the feeding component is installed on one side of the shell component.
By adopting the technical scheme, the second motor and the first motor are controlled by the switch on the control panel, when the mechanical arm in the shell needs to be maintained or the semiconductor frame is clamped, a worker needs to open the glass door, the glass door is closed after the frame is maintained or taken out, and when the first motor is started, the fan blades are driven to rotate, so that dust in the shell is sucked out and discharged through the bent pipe; during the material loading, place semiconductor frame respectively in the backup pad on the magazine, place the magazine on the pan feeding support shell, it stretches out to drive the telescopic shaft through the electric cylinder, and then with the round pin pole card in semiconductor frame's round pin hole, through chain belt transmission semiconductor frame, make it get into the casing, the semiconductor frame at top layer gets into behind the casing, the second motor drives the lead screw and rotates, make the lead screw rebound, and then drive even board and magazine rebound, make the semiconductor frame of next check can be blocked by the round pin pole and drag the inside of casing, repeat the step, send into inside the casing with a plurality of semiconductor frame in proper order.
Preferably, the shell subassembly includes casing, glass door, pan feeding mouth, discharge gate and arm, glass door slidable mounting in one side of casing, the pan feeding mouth set up in one side of casing, the discharge gate set up in the casing is kept away from one side of pan feeding mouth, the arm install in the inboard top of casing.
Through adopting above-mentioned technical scheme, the arm is used for placing the chip on semiconductor frame.
Preferably, control panel is installed to one side of casing, fixedly connected with LED display screen on the control panel, the last switch that installs a plurality of equidistance and distributes of control panel.
Through adopting above-mentioned technical scheme, the switch is used for controlling electric jar, second motor and first motor.
Preferably, the glass door is provided with a handle, and the bottom of the shell is fixedly connected with four uniformly distributed support frames.
Through adopting above-mentioned technical scheme, drag glass door through the handle.
Preferably, the dust removal subassembly includes connecting pipe, support, first motor, pivot, flabellum and return bend, connecting pipe communicate in the top of shell subassembly, connecting pipe the top with the return bend is linked together, support fixed connection in connecting pipe's inside wall, the support keep away from connecting pipe one end with first motor welds mutually, the output shaft of first motor with the pivot welds mutually, the flabellum install in the pivot.
Through adopting above-mentioned technical scheme, dust removal component is used for cleaing away the inside dust of shell subassembly.
Preferably, the filter screen is installed to the inside wall of connecting pipe.
Through adopting above-mentioned technical scheme, the filter screen is used for preventing that external dust from getting into the casing.
Preferably, the feeding assembly comprises a chain belt, an electric cylinder, a feeding supporting shell, a material box, a connecting plate, a second motor, a screw rod, a plate body, a guide rod, a fixing plate and a semiconductor frame, the chain belt is installed on one side of the shell assembly, the electric cylinder is installed on the chain belt, the feeding supporting shell is slidably connected to one side of the shell assembly, the material box is arranged on the feeding supporting shell, the semiconductor frame is arranged on the inner side of the feeding supporting shell, the connecting plate is fixedly connected to the bottom of the feeding supporting shell, the second motor is installed at the bottom of the connecting plate, the screw rod is welded to an output shaft of the second motor, the bottom end of the screw rod is rotatably connected with the plate body, the second motor is fixedly connected with the guide rod, the bottom end of the guide rod is fixedly connected with the plate body, and the screw rod penetrates through the fixing plate and is in threaded connection with the fixing plate, the fixed plate is fixedly connected with one side of the shell assembly, and the guide rod penetrates through the fixed plate and is in sliding connection with the fixed plate.
Through adopting above-mentioned technical scheme, the material loading subassembly is used for automatic feeding semiconductor frame.
Preferably, the output shaft of the electric cylinder is welded with a telescopic shaft, and the bottom end of the telescopic shaft is fixedly connected with a pin rod.
Through adopting above-mentioned technical scheme, the electric jar drives the telescopic shaft and stretches out, and then blocks the round pin pole in semiconductor frame's pinhole, removes through chain belt drive electric jar, transmission semiconductor frame.
Preferably, the side plates are installed on the feeding supporting shell, the bottom plate is installed at the bottom of the feeding supporting shell, and the supporting plate is fixedly connected to the inner side wall of the material box.
Through adopting above-mentioned technical scheme, the bottom plate is used for supporting the magazine.
Preferably, the semiconductor frame is provided with a pin hole, and the pin hole is matched with the pin rod.
Through adopting above-mentioned technical scheme, the round pin pole card is in semiconductor frame's pinhole, moves through chain belt drive electric cylinder, drives semiconductor frame.
Compared with the prior art, the invention has the beneficial effects that:
after a worker maintains the mechanical arm or takes out the clamped frame, dust entering the shell due to the opening of the glass door is removed through the dust removal assembly; the semiconductor frame can be automatically fed through the feeding assembly, so that time and labor are saved; the top of the material box is open, so that the semiconductor frame can be conveniently conveyed during automatic feeding.
Drawings
Fig. 1 is a perspective view of a packaging apparatus for processing an electronic component according to the present invention;
FIG. 2 is a schematic structural diagram of a front view of the packaging apparatus for processing electronic components according to the present invention;
FIG. 3 is an enlarged view of the structure of area A in FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of the structure of the area B in FIG. 2 according to the present invention;
FIG. 5 is a perspective view of a feed support housing in accordance with the present invention;
FIG. 6 is a perspective view of the cartridge of the invention;
fig. 7 is a perspective view of a semiconductor frame of the present invention.
In the figure: 1. a housing assembly; 2. a dust removal assembly; 3. a feeding assembly; 11. a housing; 12. a control panel; 13. an LED display screen; 14. a switch; 15. a glass door; 16. a handle; 17. a feeding port; 18. a discharge port; 19. a support frame; 110. a mechanical arm; 21. connecting pipes; 22. a support; 23. a first motor; 24. a rotating shaft; 25. a fan blade; 26. bending the pipe; 31. a chain belt; 32. an electric cylinder; 33. a telescopic shaft; 34. a pin rod; 35. feeding a supporting shell; 351. a side plate; 352. a base plate; 36. a magazine; 361. a support plate; 37. connecting plates; 38. a second motor; 39. a screw rod; 310. a plate body; 311. a guide bar; 312. a fixing plate; 313. a semiconductor frame; 3131. a pin hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution:
a packaging device for processing electronic components comprises: the shell assembly 1, the dust removal assembly 2 and the feeding assembly 3;
the shell assembly 1 is used for attaching a chip to the semiconductor frame;
wherein, the dust removing component 2 is used for removing dust in the shell component 1;
wherein, the feeding assembly 3 is used for automatically feeding the semiconductor frame 313;
the top of the shell component 1 is communicated with the dust removal component 2, and the feeding component 3 is arranged on one side of the shell component 1.
The shell assembly 1 comprises a shell 11, a glass door 15, a feeding port 17, a discharging port 18 and a mechanical arm 110, wherein the glass door 15 is slidably mounted on one side of the shell 11, the feeding port 17 is arranged on one side of the shell 11, the discharging port 18 is arranged on one side of the shell 11 far away from the feeding port 17, and the mechanical arm 110 is mounted on the top of the inner side of the shell 11. The robot arm 110 is used to place the chip on the semiconductor frame 313. A control panel 12 is installed on one side of the housing 11, an LED display 13 is fixedly connected to the control panel 12, and a plurality of switches 14 are installed on the control panel 12 and are distributed at equal intervals. The switch 14 is used for controlling the electric cylinder 32, the second motor 38 and the first motor 23. The glass door 15 is provided with a handle 16, and the bottom of the shell 11 is fixedly connected with four supporting frames 19 which are uniformly distributed. The glass door is pulled by the handle 16.
The feeding assembly 3 comprises a chain belt 31, an electric cylinder 32, a feeding supporting shell 35, a material box 36, a connecting plate 37, a second motor 38, a screw rod 39, a plate body 310, a guide rod 311, a fixing plate 312 and a semiconductor frame 313, wherein the chain belt 31 is installed on one side of the shell assembly 1, the electric cylinder 32 is installed on the chain belt 31, the feeding supporting shell 35 is connected to one side of the shell assembly 1 in a sliding manner, the material box 36 is arranged on the feeding supporting shell 35, the semiconductor frame 313 is arranged on the inner side of the feeding supporting shell 35, the connecting plate 37 is fixedly connected to the bottom of the feeding supporting shell 35, the second motor 38 is installed at the bottom of the connecting plate 37, the screw rod 39 is welded with an output shaft of the second motor 38, the bottom end of the screw rod 39 is rotatably connected with the plate body 310, the second motor 38 is fixedly connected with the guide rod 311, the bottom end of the guide rod 311 is fixedly connected with the plate body 310, the screw rod 39 penetrates through the fixing plate 312 and is in threaded connection with the fixing plate 312, the fixing plate 312 is fixedly connected with one side of the shell assembly 1, the guide rod 311 penetrates the fixing plate 312 and is slidably connected to the fixing plate 312. The loading assembly 3 is used for automatically loading the semiconductor frame 313. An output shaft of the electric cylinder 32 is welded with an expansion shaft 33, and a pin rod 34 is fixedly connected to the bottom end of the expansion shaft 33. The electric cylinder 32 drives the telescopic shaft 33 to extend, and the pin rod 34 is clamped in the pin hole 3131 of the semiconductor frame 313, and the electric cylinder 32 is driven by the chain belt 31 to move, so that the semiconductor frame 313 is driven. The feeding supporting shell 35 is provided with a side plate 351, the bottom of the feeding supporting shell 35 is provided with a bottom plate 352, and the inner side wall of the material box 36 is fixedly connected with a supporting plate 361. The bottom plate 352 is used to support the magazine 36. The semiconductor frame 313 has a pin hole 3131, and the pin hole 3131 matches with the pin 34. The pin 34 is engaged in the pin hole 3131 of the semiconductor frame 313, and drives the electric cylinder 32 to move by the chain belt 31, thereby driving the semiconductor frame 313.
The structure principle is as follows: the second motor 38 and the first motor 23 are controlled by the switch 14 on the control panel 12, when the mechanical arm 110 in the housing 11 needs to be maintained or the semiconductor frame 313 is clamped, a worker needs to open the glass door 15, and after the frame is maintained or taken out, the glass door 15 is closed, and when the first motor 23 is started, the fan blades 25 are driven to rotate, so that dust in the housing 11 is sucked out and discharged through the bent pipe 26; during feeding, the semiconductor frames 313 are respectively placed on the supporting plates 361 on the material box 36, the material box 36 is placed on the feeding supporting shell 35, the electric cylinder 32 drives the telescopic shaft 33 to extend out, the pin rods 34 are clamped in the pin holes 3131 of the semiconductor frames 313, the chain belt 31 drives the semiconductor frames 313 to enter the shell 11, after the topmost semiconductor frame 313 enters the shell 11, the second motor 38 drives the screw rod 39 to rotate, the screw rod 39 moves upwards, the connecting plate 37 and the material box 36 are driven to move upwards, the semiconductor frames 313 of the next lattice can be clamped by the pin rods 34 and dragged into the shell 11, and the steps are repeated, so that the plurality of semiconductor frames 313 are sequentially fed into the shell 11.
The parts not involved in the present invention are the same as or can be implemented by the prior art. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides an electronic components processing is with encapsulation equipment which characterized in that includes: the device comprises a shell component (1), a dust removal component (2) and a feeding component (3);
the shell assembly (1) is used for attaching a chip to a semiconductor frame;
wherein the dust removal assembly (2) is used for removing dust in the shell assembly (1);
wherein the feeding assembly (3) is used for automatically feeding the semiconductor frame (313);
the top of the shell component (1) is communicated with the dust removal component (2), and the feeding component (3) is installed on one side of the shell component (1).
2. The packaging equipment for processing the electronic component as claimed in claim 1, wherein: shell subassembly (1) includes casing (11), glass door (15), pan feeding mouth (17), discharge gate (18) and arm (110), glass door (15) slidable mounting in one side of casing (11), pan feeding mouth (17) are seted up in one side of casing (11), discharge gate (18) are seted up in casing (11) are kept away from one side of pan feeding mouth (17), arm (110) install in the inboard top of casing (11).
3. The packaging apparatus for electronic component processing according to claim 2, wherein: control panel (12) are installed to one side of casing (11), fixedly connected with LED display screen (13) are gone up in control panel (12), switch (14) that a plurality of equidistance distribute are installed on control panel (12).
4. The packaging apparatus for electronic component processing according to claim 2, wherein: the glass door (15) is provided with a handle (16), and the bottom of the shell (11) is fixedly connected with four uniformly distributed support frames (19).
5. The packaging equipment for processing the electronic component as claimed in claim 1, wherein: dust removal subassembly (2) are including linking pipe (21), support (22), first motor (23), pivot (24), flabellum (25) and return bend (26), link pipe (21) communicate in the top of shell subassembly (1), the top of linking pipe (21) with return bend (26) are linked together, support (22) fixed connection in link the inside wall of pipe (21), support (22) keep away from the one end of linking pipe (21) with first motor (23) welds mutually, the output shaft of first motor (23) with pivot (24) weld mutually, flabellum (25) install in on pivot (24).
6. The packaging equipment for processing the electronic component as claimed in claim 5, wherein: and a filter screen is arranged on the inner side wall of the connecting pipe (21).
7. The packaging equipment for processing the electronic component as claimed in claim 1, wherein: the feeding assembly (3) comprises a chain belt (31), an electric cylinder (32), a feeding supporting shell (35), a material box (36), a connecting plate (37), a second motor (38), a screw rod (39), a plate body (310), a guide rod (311), a fixing plate (312) and a semiconductor frame (313), wherein the chain belt (31) is installed on one side of the shell assembly (1), the electric cylinder (32) is installed on the chain belt (31), the feeding supporting shell (35) is connected to one side of the shell assembly (1) in a sliding mode, the material box (36) is arranged on the feeding supporting shell (35), the semiconductor frame (313) is arranged on the inner side of the feeding supporting shell (35), the connecting plate (37) is fixedly connected to the bottom of the feeding supporting shell (35), the second motor (38) is installed on the bottom of the connecting plate (37), the screw rod (39) is welded with an output shaft of the second motor (38), the bottom of lead screw (39) with plate body (310) rotates to be connected, second motor (38) with guide arm (311) fixed connection, the bottom of guide arm (311) with plate body (310) fixed connection, lead screw (39) run through fixed plate (312) and with fixed plate (312) threaded connection, fixed plate (312) with one side fixed connection of shell subassembly (1), guide arm (311) run through fixed plate (312) and with fixed plate (312) sliding connection.
8. The packaging apparatus for electronic component processing according to claim 7, wherein: an output shaft of the electric cylinder (32) is welded with a telescopic shaft (33), and a pin rod (34) is fixedly connected to the bottom end of the telescopic shaft (33).
9. The packaging apparatus for electronic component processing according to claim 7, wherein: the feeding supporting shell (35) is provided with a side plate (351), the bottom of the feeding supporting shell (35) is provided with a bottom plate (352), and the inner side wall of the material box (36) is fixedly connected with a supporting plate (361).
10. The packaging apparatus for electronic component processing according to claim 8, wherein: the semiconductor frame (313) is provided with a pin hole (3131), and the pin hole (3131) is matched with the pin rod (34).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110496144.0A CN113206029B (en) | 2021-05-07 | 2021-05-07 | Packaging equipment for processing electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110496144.0A CN113206029B (en) | 2021-05-07 | 2021-05-07 | Packaging equipment for processing electronic components |
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| Publication Number | Publication Date |
|---|---|
| CN113206029A true CN113206029A (en) | 2021-08-03 |
| CN113206029B CN113206029B (en) | 2022-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110496144.0A Active CN113206029B (en) | 2021-05-07 | 2021-05-07 | Packaging equipment for processing electronic components |
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| Country | Link |
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| CN (1) | CN113206029B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01239944A (en) * | 1988-03-22 | 1989-09-25 | Toshiba Seiki Kk | Feeding of semiconductor frame |
| US20130287526A1 (en) * | 2012-04-26 | 2013-10-31 | Intevac, Inc. | System architecture for vacuum processing |
| CN104112788A (en) * | 2013-04-16 | 2014-10-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer inserting device |
| CN107086191A (en) * | 2017-04-25 | 2017-08-22 | 无锡明祥电子有限公司 | Lead frame auto loading machine |
| CN210928198U (en) * | 2019-12-12 | 2020-07-03 | 昆山振顺电子科技有限公司 | High-speed paster device of circuit soft board |
-
2021
- 2021-05-07 CN CN202110496144.0A patent/CN113206029B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01239944A (en) * | 1988-03-22 | 1989-09-25 | Toshiba Seiki Kk | Feeding of semiconductor frame |
| US20130287526A1 (en) * | 2012-04-26 | 2013-10-31 | Intevac, Inc. | System architecture for vacuum processing |
| CN104112788A (en) * | 2013-04-16 | 2014-10-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer inserting device |
| CN107086191A (en) * | 2017-04-25 | 2017-08-22 | 无锡明祥电子有限公司 | Lead frame auto loading machine |
| CN210928198U (en) * | 2019-12-12 | 2020-07-03 | 昆山振顺电子科技有限公司 | High-speed paster device of circuit soft board |
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| Publication number | Publication date |
|---|---|
| CN113206029B (en) | 2022-08-12 |
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Effective date of registration: 20220720 Address after: 529500 No.1 Yongguang Road, Yangxi County Industrial Park, Yangjiang City, Guangdong Province (residence declaration) Applicant after: Yangjiang henghao Electronic Technology Co.,Ltd. Address before: 362000 xiani 12, Xiaxi village, Heshi Town, Luojiang District, Quanzhou City, Fujian Province Applicant before: Ni Guoxing |
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