CN218395096U - Full-automatic dispensing and laminating machine for electronic component processing - Google Patents
Full-automatic dispensing and laminating machine for electronic component processing Download PDFInfo
- Publication number
- CN218395096U CN218395096U CN202222454279.3U CN202222454279U CN218395096U CN 218395096 U CN218395096 U CN 218395096U CN 202222454279 U CN202222454279 U CN 202222454279U CN 218395096 U CN218395096 U CN 218395096U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- push rod
- box
- electric push
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010030 laminating Methods 0.000 title claims abstract description 22
- 239000000428 dust Substances 0.000 claims abstract description 52
- 239000003292 glue Substances 0.000 claims abstract description 22
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 abstract description 7
- 238000004026 adhesive bonding Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 2
- 241001232346 Gymnosperma glutinosum Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Landscapes
- Coating Apparatus (AREA)
Abstract
The utility model discloses a full-automatic point gluing and laminating machine for electronic component processing, which comprises a working box, wherein a conveyer belt is arranged in the working box, a first electric push rod is arranged at the inner top of the working box, a guide cylinder is fixedly connected with the output end of the first electric push rod, a dispensing head is fixedly connected with the lower surface of the guide cylinder, a second electric push rod is fixedly connected with the inner top of the working box and positioned at the left side of the first electric push rod, and a laminating adsorption device is fixedly connected with the output end of the second electric push rod; the dust removing mechanism is arranged at the inner top of the working box and on the right side of the first electric push rod and comprises a third electric push rod, and an output end of the third electric push rod is fixedly connected with a mounting plate. Through the structure, the dust can be treated at the position of the electronic element needing glue dispensing and laminating by utilizing the dust collection head, the phenomenon that the dust affects the gluing degree of glue to fall off can be avoided, and the practicability of the device is improved.
Description
Technical Field
The utility model relates to an electronic component point glues laminating technical field, in particular to full-automatic point gluing laminating machine of electronic component processing.
Background
Electronic components are components of electronic components and small machines and instruments, and the electronic components are usually composed of a plurality of parts, can be commonly used in similar products, often refer to some parts of industries such as electric appliances, radios, instruments and the like, are general names of electronic devices such as capacitors, transistors, hairsprings, spiral springs and the like, are commonly provided with diodes and the like, and glue dispensing and bonding equipment is often used in the production of the electronic components.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve one of the technical problem that exists among the prior art at least, provide a full-automatic point gluing laminating machine of electronic component processing, can utilize the dust absorption head to carry out the dust to the electronic component's that needs the point to glue the laminating position and handle, can avoid the dust to influence the phenomenon that the degree of adhesion of gluing takes place to drop, improve the device's practicality.
The utility model also provides a have above-mentioned full-automatic point gum laminating machine of electronic component processing, including the work box, the inside of work box is provided with the conveyer belt, the interior top of work box is provided with electric putter one, the output fixedly connected with draft tube of electric putter one, the lower surface fixedly connected with point gum head of draft tube, the interior top of work box and the left side that is located electric putter one fixedly connected with electric putter two, the output fixedly connected with laminating adsorption equipment of electric putter two; the utility model discloses a dust collection box, including work box, electric putter one, deashing mechanism, telescopic hose, electric putter three, the inner top of work box and the right side that is located electric putter one are provided with deashing mechanism, deashing mechanism includes electric putter three, electric putter three's output fixedly connected with mounting panel, the medial surface fixedly connected with dust absorption head of mounting panel, the top fixedly connected with telescopic hose of dust absorption head, telescopic hose keeps away from the one end fixedly connected with connecting pipe of dust absorption head. The dust collecting head can be used for carrying out dust treatment on the part of the electronic element needing glue dispensing and laminating, the phenomenon that the dust influences the adhesive degree of glue to fall off can be avoided, and the practicability of the device is improved.
According to the full-automatic dispensing and laminating machine for processing the electronic element, the upper surface of the working box is fixedly connected with a box body, and the box body is communicated with the guide cylinder through a hose. The glue in the box body can conveniently flow into the guide shell.
According to a full-automatic point gluing laminating machine of electronic component processing, deashing mechanism still includes the collecting box, the last fixed surface of collecting box is connected with the suction fan, the mounting groove has been seted up at the interior top of collecting box, the medial surface fixedly connected with filter screen of mounting groove. The blockage of the suction fan caused by dust can be avoided.
According to the full-automatic electronic component processing glue dispensing and laminating machine, the collecting box is installed on the upper surface of the working box and located on the right side of the box body, and the input end of the suction fan is communicated with the installing groove.
According to the full-automatic electronic component processing glue dispensing and pasting machine, one end, far away from the telescopic hose, of the connecting pipe penetrates through the working box and is communicated with the collecting box. The dust absorbed by the dust absorption head can be conveniently conveyed into the collection box.
According to the full-automatic electronic component processing glue dispensing and pasting machine, the electric push rod III is installed at the inner top of the working box and is located on the right side of the electric push rod I. The ash removal treatment is conveniently carried out on the electronic element to be glued and attached.
According to the full-automatic electronic component processing dispensing and laminating machine, the electronic component is placed on the upper surface of the conveying belt and sequentially passes through the dust collection head, the dispensing head and the laminating adsorption device.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples;
fig. 1 is an overall structure diagram of the full-automatic dispensing and bonding machine for electronic component processing of the present invention;
FIG. 2 is an internal structure view of a working box of the full-automatic electronic component processing dispenser of the present invention;
fig. 3 is a front view of the full-automatic dispensing and pasting machine for electronic component processing of the present invention;
fig. 4 is an enlarged view of a portion a in fig. 2.
Illustration of the drawings:
1. a work box; 2. a conveyor belt; 3. a first electric push rod; 4. a draft tube; 5. dispensing a glue head; 6. a second electric push rod; 7. attaching an adsorption device; 8. a box body; 9. a dust removal mechanism;
91. a collection box; 92. a suction fan; 93. mounting grooves; 94. a filter screen; 95. an electric push rod III; 96. mounting a plate; 97. a dust collection head; 98. a flexible hose; 99. and (4) connecting the pipes.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
Referring to fig. 1-4, the embodiment of the utility model provides an electronic component processing full-automatic point glues laminating machine, it includes work box 1, work box 1's last fixed surface is connected with box 8, box 8 is linked together with draft tube 4 through the hose, it flows into in draft tube 4 to be convenient for glue in the box 8, work box 1's inside is provided with conveyer belt 2, electronic component places in conveyer belt 2's upper surface, and pass through dust absorption head 97 in proper order, point glues head 5 and laminating adsorption equipment 7, work box 1's interior top is provided with electric putter one 3, electric putter one 3's output end fixedly connected with draft tube 4, draft tube 4's lower fixed surface is connected with point glues head 5, work box 1's interior top just is located electric putter one 3's left side fixedly connected with electric putter two 6, electric putter two 6's output end fixedly connected with laminating adsorption equipment 7.
The dust cleaning mechanism 9 is arranged on the inner top of the working box 1 and on the right side of the electric push rod I3, the dust cleaning mechanism 9 comprises an electric push rod III 95, the electric push rod III 95 is installed on the inner top of the working box 1 and on the right side of the electric push rod I3, dust cleaning treatment is convenient to be carried out on electronic components to be glued and laminated, an output end of the electric push rod III 95 is fixedly connected with a mounting plate 96, the inner side face of the mounting plate 96 is fixedly connected with a dust suction head 97, the top end of the dust suction head 97 is fixedly connected with an expansion hose 98, one end, far away from the dust suction head 97, of the expansion hose 98 is fixedly connected with a connecting pipe 99, one end, far away from the expansion hose 98, of the connecting pipe 99 penetrates through the working box 1 and is communicated with the collecting box 91, dust absorbed by the dust suction head 97 is convenient to be conveyed into the collecting box 91, the dust cleaning mechanism 9 further comprises a collecting box 91, the rear side of the collecting box 91 is provided with a box door, dust in the box is convenient to be treated, the dust in the box, the collecting box 91 is installed on the upper surface of the working box 1 and is arranged on the right side of the box 8, the input end of the suction fan 92 is communicated with the mounting groove 93, the collecting box 91, the collecting box 92, the dust suction fan 92, the upper surface of the collecting box 91 is fixedly connected with the collecting box 92, the collecting box 93, the collecting box 91, the collecting box 93 is fixedly connected with the mounting groove 93, the dust suction fan 92, the mounting groove 93, and the dust suction fan 92, the dust suction fan 92 can be prevented from the dust suction fan 92, and the dust suction screen 92, and blocking of the dust suction fan 92 can be avoided, and blocking of the dust suction fan 92, the dust suction fan 92.
The working principle is as follows: when the dust collector is used, an electronic component is conveyed into the working box 1 through the conveying belt 2, the electric push rod III 95 drives the mounting plate 96 to descend, so that the dust collection head 97 is positioned at a part of the electronic component needing glue dispensing, the suction fan 92 is started through an external power supply, dust is absorbed through the dust collection head 97, and the absorbed dust is sucked into the collection box 91 through the telescopic hose 98 and the connecting pipe 99;
electronic component that the dust absorption finishes moves to the below of dispensing head 5 through conveyer belt 2, starts electric putter one 3 through external power supply and drives dispensing head 5 and descend and make it be in electronic component's top, then glues it, and rethread conveyer belt 2 moves electronic component to the below of laminating adsorption equipment 7, and the substrate that will laminate pastes on electronic component can.
In this embodiment, the whole operation process can be controlled by a computer, and PLC and the like are added to realize automatic operation control, and in each operation link, signal feedback can be performed by setting a sensor to realize sequential execution of steps, which are conventional knowledge of the current automatic control, and are not repeated in this embodiment.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (7)
1. The full-automatic glue dispensing and laminating machine for processing the electronic elements is characterized by comprising a working box (1), wherein a conveying belt (2) is arranged inside the working box (1), a first electric push rod (3) is arranged at the inner top of the working box (1), the output end of the first electric push rod (3) is fixedly connected with a guide cylinder (4), the lower surface of the guide cylinder (4) is fixedly connected with a glue dispensing head (5), a second electric push rod (6) is fixedly connected with the inner top of the working box (1) and is positioned on the left side of the first electric push rod (3), and the output end of the second electric push rod (6) is fixedly connected with a laminating and adsorbing device (7);
the utility model discloses a dust collection box, including work box (1), inner top and the right side that is located electric putter (3) are provided with deashing mechanism (9), deashing mechanism (9) are including electric putter three (95), the output fixedly connected with mounting panel (96) of electric putter three (95), the medial surface fixedly connected with dust absorption head (97) of mounting panel (96), the top fixedly connected with bellows (98) of dust absorption head (97), one end fixedly connected with connecting pipe (99) of dust absorption head (97) are kept away from in bellows (98).
2. The full-automatic electronic component processing glue dispensing and adhering machine according to claim 1, wherein a box body (8) is fixedly connected to the upper surface of the working box (1), and the box body (8) is communicated with the guide cylinder (4) through a hose.
3. The full-automatic electronic component processing glue dispensing and adhering machine according to claim 1, wherein the ash removing mechanism (9) further comprises a collection box (91), the upper surface of the collection box (91) is fixedly connected with a suction fan (92), the inner top of the collection box (91) is provided with a mounting groove (93), and the inner side surface of the mounting groove (93) is fixedly connected with a filter screen (94).
4. The machine according to claim 3, wherein the collection box (91) is mounted on the upper surface of the work box (1) and is located on the right side of the box body (8), and the input end of the suction fan (92) is communicated with the mounting groove (93).
5. The machine according to claim 1, wherein the end of the connecting pipe (99) far away from the flexible hose (98) passes through the work box (1) and is connected to the collecting box (91).
6. The machine according to claim 1, wherein the third electric push rod (95) is mounted on the inner top of the working box (1) and is located on the right side of the first electric push rod (3).
7. The full-automatic dispensing and pasting machine for electronic component processing according to claim 1, wherein the electronic components are placed on the upper surface of the conveyor belt (2) and sequentially pass through the dust suction head (97), the dispensing head (5) and the pasting and adsorbing device (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222454279.3U CN218395096U (en) | 2022-09-16 | 2022-09-16 | Full-automatic dispensing and laminating machine for electronic component processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222454279.3U CN218395096U (en) | 2022-09-16 | 2022-09-16 | Full-automatic dispensing and laminating machine for electronic component processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218395096U true CN218395096U (en) | 2023-01-31 |
Family
ID=85031598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222454279.3U Expired - Fee Related CN218395096U (en) | 2022-09-16 | 2022-09-16 | Full-automatic dispensing and laminating machine for electronic component processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218395096U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116273718A (en) * | 2023-05-16 | 2023-06-23 | 金华市创捷电子有限公司 | Equipment and process for producing thermosensitive crystal |
-
2022
- 2022-09-16 CN CN202222454279.3U patent/CN218395096U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116273718A (en) * | 2023-05-16 | 2023-06-23 | 金华市创捷电子有限公司 | Equipment and process for producing thermosensitive crystal |
| CN116273718B (en) * | 2023-05-16 | 2023-10-10 | 金华市创捷电子有限公司 | Equipment and process for producing thermosensitive crystal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112770530B (en) | Automatic chip mounter for electronic components | |
| CN218395096U (en) | Full-automatic dispensing and laminating machine for electronic component processing | |
| CN101485244B (en) | ACF attachment device and ACF attachment method | |
| CN205628462U (en) | Dispensing and laminating machine | |
| CN102315133A (en) | Conveying system for integrated circuit chip loader framework | |
| CN216747962U (en) | Semiconductor photoelectronic device testing device with clamping function | |
| CN108394581A (en) | A kind of automatic coating mounted box transfer matic | |
| CN110137129A (en) | A kind of coring piece machine | |
| CN212370665U (en) | Cleaning equipment for processing of electronic factory accessories | |
| CN216804463U (en) | Automatic heat conducting film mounting machine for metal shielding cover | |
| CN215030610U (en) | Novel high-speed high-precision plane die bonder equipment | |
| CN210617456U (en) | Automatic handbag barrel making machine | |
| CN215038127U (en) | High accurate perforating device of circuit board | |
| CN213201324U (en) | Raw materials conveyor is used in new material processing | |
| CN210647390U (en) | PCB face cleaning device | |
| CN219612490U (en) | Dispensing and sticking machine for LED circuit board | |
| CN208739471U (en) | From defeated formula chip mounter | |
| CN218595500U (en) | Material conveying mechanism of laminating machine | |
| CN208086778U (en) | A kind of engaging support mechanism | |
| CN209572330U (en) | A kind of chip mounter for avoiding chip from being trapped in glue groove | |
| CN107826374A (en) | A kind of device for labeling for electronic component processing | |
| CN218451109U (en) | Wafer paster device for integrated circuit processing | |
| CN212190234U (en) | PCBA production is with high-efficient belt cleaning device | |
| CN219615951U (en) | Dispensing and laminating machine | |
| CN213152767U (en) | High-speed composite chip mounter feeding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230131 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |