CN113188681B - Installation fit degree testing method and installation fit degree testing system - Google Patents
Installation fit degree testing method and installation fit degree testing system Download PDFInfo
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- CN113188681B CN113188681B CN202110468114.9A CN202110468114A CN113188681B CN 113188681 B CN113188681 B CN 113188681B CN 202110468114 A CN202110468114 A CN 202110468114A CN 113188681 B CN113188681 B CN 113188681B
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- 238000012360 testing method Methods 0.000 title claims abstract description 43
- 238000009434 installation Methods 0.000 title description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 118
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000005057 refrigeration Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000010998 test method Methods 0.000 claims description 7
- 238000010583 slow cooling Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 abstract description 21
- 238000010030 laminating Methods 0.000 abstract description 8
- 230000003685 thermal hair damage Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 14
- 238000001816 cooling Methods 0.000 description 12
- 230000002159 abnormal effect Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a mounting fit degree testing method and a mounting fit degree testing system, which are characterized in that a heat source is controlled to continuously heat at a first preset power to heat a heat dissipation plate, a cold source is controlled to continuously refrigerate at a second preset power to cool the heat dissipation plate, after the first preset power is continuously kept for a time T1, the instant temperature T of the heat source is obtained, and whether the fit degree of the heat source and the heat dissipation plate reaches the standard is judged through the instant temperature T. The laminating degree between heat source and the heating panel can embody on instant temperature T, and the cold source can cool down the heating panel simultaneously to can be with heat source control in a certain limit, avoid causing the thermal damage to heat source and heating panel. Compared with the prior art, the heat source heat radiation device has the advantages that the heat source heat radiation device is additionally provided with the cold source, the bonding degree between the heat source heat radiation device and the heat radiation plate is judged through the instant temperature of the heat source heat radiation plate, the bonding degree between the heat source heat radiation plate and the heat radiation plate can be effectively detected, and the safety of the heat source heat radiation device is ensured.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to a mounting laminating degree testing method and a mounting laminating degree testing system.
Background
At present, the heat dissipation and cooling of the heating element generally depend on air cooling fins or refrigerants, and the cooling modes are different, but the implementation of the heat dissipation device depends on heat dissipation plates (such as aluminum plates) for conducting heat dissipation: the power module component is attached to the heat-dissipating aluminum plate, and the power module component and the heat-dissipating aluminum plate are fixed through screws. The effectiveness of the attachment of the components and the heat-dissipating aluminum plate is greatly influenced by the strength and the verticality of the screw fixation, and the heat-dissipating performance of the heat-dissipating plate is influenced by the attachment degree. At present, the control force and the perpendicularity of a moment screwdriver, a production operation method and the like are required, the installation error is large, the laminating degree is influenced, and then the heat dissipation performance is influenced. If the installation effect does not reach the product with the design requirement, the heat dissipation can not reach the design theoretical heat dissipation capacity, and the risk of a problem caused by short-time operation (such as factory detection) is low, but when a user uses the device for a long time, especially high-load operation, the risk of frequent frequency limiting and frequency reducing and even component burning occurs.
In the prior art, whether the power module and the radiating plate are installed in place or not, namely, the laminating degree of the power module and the radiating plate is invisible, small deviation is difficult to measure and control, and if the extreme temperature rise is directly measured to test the radiating effect, the components are damaged.
Disclosure of Invention
The invention solves the problem of how to effectively detect whether the installation between the power module and the heat dissipation plate achieves the effect or not, and the damage to components is avoided.
In order to solve the problems, the invention adopts the following technical proposal.
In one aspect, the present invention provides a method for testing mounting adhesion, for measuring adhesion between a heat source and a heat dissipation plate, comprising:
controlling a heat source positioned at one side of the heat dissipation plate to emit heat at a first preset power;
controlling a cold source positioned at the other side of the heat radiation plate to refrigerate with a second preset power;
acquiring the instant temperature T of the heat source after heating with the first preset power for a first preset time T1;
judging whether the bonding degree of the heat source and the heat dissipation plate meets the standard or not according to the instant temperature T.
The invention provides a mounting fitting degree testing method, which comprises the steps of controlling a heat source to continuously heat at a first preset power in actual measurement, heating a heat dissipation plate, controlling a cold source to continuously refrigerate at a second preset power, cooling the heat dissipation plate, obtaining the instant temperature T of the heat source after the first preset time T1 is continuously carried out, and judging whether the fitting degree of the heat source and the heat dissipation plate meets the standard or not according to the magnitude, the change trend and the like of the instant temperature T. If the bonding degree does not reach the standard, heat generated by the heat source cannot be timely transferred to the heat dissipation plate, the heat source temperature is too high, otherwise, the heat source temperature cannot be too high, namely the bonding degree between the heat source and the heat dissipation plate can be reflected on the instant temperature T, and meanwhile, the heat dissipation plate can be cooled by the cold source, so that the heat source can be controlled in a certain range, and the heat damage to the heat source and the heat dissipation plate is avoided. Compared with the prior art, the heat source heat radiation device has the advantages that the heat source heat radiation device is additionally provided with the cold source, the bonding degree between the heat source heat radiation device and the heat radiation plate is judged through the instant temperature of the heat source heat radiation plate, the bonding degree between the heat source heat radiation plate and the heat radiation plate can be effectively detected, and the safety of the heat source heat radiation device is ensured.
Further, the step of determining whether the bonding degree of the heat source and the heat dissipation plate meets the standard according to the instant temperature T and the temperature change rate δt includes:
if the instant temperature T is smaller than or equal to the first threshold temperature Ts1, judging that the bonding degree of the heat source and the heat dissipation plate reaches the standard;
if the instant temperature T is greater than the first threshold temperature Ts1 and is less than or equal to the second threshold temperature Ts2, judging whether the bonding degree of the heat source and the heat dissipation plate meets the standard according to the variation delta T of the instant temperature T within a second preset time T2;
if the instant temperature T is larger than the second threshold temperature Ts2, judging that the bonding degree of the heat source and the heat dissipation plate does not reach the standard;
wherein the second threshold temperature Ts2 is greater than the first threshold temperature Ts1.
Further, the step of determining whether the bonding degree between the heat source and the heat dissipation plate meets the standard according to the variation δt of the instant temperature T within the second preset time T2 includes:
if the variation delta T is larger than the preset quantity delta Tn, judging that the bonding degree of the heat source and the heat dissipation plate does not reach the standard;
and if the variation delta T is smaller than or equal to the preset quantity delta Tn, judging that the bonding degree of the heat source and the heat dissipation plate reaches the standard.
Further, the second preset time t2 is 20s-120s.
Further, the preset amount delta Tn is-10-0 ℃.
Further, the difference between the second threshold temperature Ts2 and the first threshold temperature Ts1 is between 3 ℃ and 10 ℃.
Further, the number of heat sources is plural, and the step of obtaining the instant temperature T of the heat source after the first preset time T1 includes:
and respectively acquiring the instant temperatures T of the heat sources after the first preset time T1.
Further, the step of controlling the heat source located at one side of the heat dissipation plate to generate heat with a first preset power includes:
and inputting a first preset current to the heat source positioned at one side of the heat dissipation plate so that the heat source generates heat at the first preset power.
Further, before the step of controlling the heat source located at one side of the heat dissipation plate to generate heat with the first preset power, the mounting fit test method further includes:
and standing the heat source and the heat dissipation plate in a space with the environment temperature being the preset temperature Ta for the preset slow cooling time t0.
Further, the first preset power and the second preset power are the same.
Further, the cold source is a semiconductor refrigerating sheet.
In another aspect, the present invention further provides a mounting fitness test system, which is suitable for the foregoing mounting fitness test method and is used for measuring a fitness between a heat source and a heat dissipation plate, where the mounting fitness test system includes a heat source and a controller, the heat source is located at one side of the heat dissipation plate, the heat source is located at the other side of the heat dissipation plate, and the controller is electrically connected with the heat source and the heat source respectively;
the controller is used for controlling the heat source to emit heat at a first preset power;
the controller is also used for controlling the cold source to refrigerate at a second preset power;
the controller is further used for obtaining the instant temperature T of the heat source after the first preset time T1, and judging whether the bonding degree of the heat source and the heat dissipation plate meets the standard or not according to the instant temperature T.
Drawings
FIG. 1 is a block diagram illustrating steps of a method for testing a mounting fit according to the present invention;
FIG. 2 is a control logic block diagram of the installation fit test method provided by the invention;
FIG. 3 is a diagram of the operational state of the installation compliance system provided by the present invention.
Reference numerals illustrate:
100-installing a fit degree test system; 110-a controller; 130-a cold source; 200-a heat dissipation plate; 300-heat source.
Detailed Description
As disclosed in the background art, in the prior art, the heat dissipation and cooling performance of the heating element is generally tested integrally by matching with a complete machine, namely by factory detection, however, the heat dissipation and cooling performance of the heating element is difficult to test when the heating element is operated for a long time or at a high load, and the risk of running a problem in a short time of the air conditioner is only proved to be low.
The inventor researches and discovers that the installation fit degree between the heat radiation plate and the heat-generating components is one of important indexes affecting the heat radiation performance of the heat radiation plate, and the heat-generating components are usually fixed only through torque screws at present, namely the heat-generating components are fixed on the heat radiation plate through the torque screws, so that the requirement on the installation process is high. However, fixing by the screw has a certain installation error, so that the heat-generating component and the heat-dissipating plate cannot be completely attached, and the heat-dissipating performance of the heat-generating component is affected. In the prior art, whether the power module and the radiating plate are installed in place or not, namely, the bonding degree of the power module and the radiating plate is invisible, small deviation is difficult to measure and control, and if the extreme temperature rise is directly measured to test the radiating effect, the components are damaged.
In order to solve the problems, the invention provides a mounting laminating degree testing method and a mounting laminating degree testing system, which can effectively detect the laminating degree between a heating element and a radiating plate so as to detect whether the heating element is mounted in place or not, discover abnormal positions in time and prevent the problem products from leaving factories. In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
First embodiment
Referring to fig. 1 to 3 in combination, the present invention provides a method for testing the mounting adhesion degree, which is used for measuring the adhesion degree between a heat source 300 and a heat dissipation plate 200, has good measurement effect and high detection precision, can effectively detect the adhesion degree between the heat source 300 and the heat dissipation plate 200, and ensures the safety of heating elements.
The installation fit testing method provided in this embodiment is suitable for an installation fit testing system 100, where the installation fit testing system 100 includes a heat source 300 to be tested and a heat dissipation plate 200 are required to be installed in place before testing, and the heat source 130 is installed on a side surface of the heat dissipation plate 200 away from the heat source 300, and meanwhile, a refrigerant pipe is also installed on the heat dissipation plate 200, and the refrigerant pipe does not participate in the action in the testing process, so that the processing is omitted in this embodiment. The controller 110 controls the heat source 300 and the cold source 130 to operate, and obtains the instant temperature of the heat source 300, and determines whether the installation effect between the heat source 300 and the heat dissipation plate 200 meets the standard or not according to the instant temperature, and the specific process and principle will be described in detail below.
It should be noted that, the method for testing the installation fit provided in this embodiment is applied to a structure having the heat dissipation plate 200 in an air conditioner, where the air conditioner may be an indoor unit or an outdoor unit, and the type of the air conditioner is not particularly limited, and any air conditioner having the heat source 300 and requiring heat dissipation and cooling through the heat dissipation plate 200 is within the protection scope of the present invention. The heat source 300 in this embodiment refers to a heating element in an air conditioner, such as an electronic control box internal device, a compressor, or a motor. The cold source 130 in this embodiment refers to a detachable small-sized refrigeration device, and has the advantages of fast refrigeration, small volume and capability of precisely controlling the refrigerating capacity. Preferably, the cold source 130 in this embodiment is a semiconductor refrigeration sheet, which is attached to a surface of the heat dissipation plate 200, which is far away from the heat source 300, and is used for cooling the heat dissipation plate 200 to prevent the heat source 300 from being too high in temperature.
The following describes the method for testing the fitting degree in detail.
The mounting fitness test method provided in this embodiment includes:
s1: the heat source 300 at one side of the heat dissipation plate 200 is controlled to generate heat at a first preset power.
Specifically, the controller 110 controls the heat source 300 to generate heat at the first preset power, that is, to generate heat at a constant heat generation rate, and here, the control principle of the heat source 300 is not specifically described herein, by inputting the constant current Ia to the heat source 300 or the entire controller 110.
In this embodiment, before step S1 is performed, it is further required to assemble the cold source 130 on the heat dissipation plate 200, electrically connect the controller 110 with the heat source 300 and the cold source 130 at the same time, and then rest the assembled structure (including the heat source 300 and the heat dissipation plate 200) in a space with an ambient temperature of a preset temperature Ta for a preset slow cooling time t0, so as to ensure that the heat source 300, the heat dissipation plate 200 and the cold source 130 are all in an initial state, and avoid interference caused by an external environment, such as heat generated on the heat dissipation plate 200 during assembly.
Specifically, the preset temperature Ta is required to be the same as the ambient temperature in the subsequent step, and the preset slow cooling time t0 is required to ensure that the heat source 300, the heat sink 200, and the cold source 130 are cooled to be substantially identical to the ambient temperature, for example, the assembled structure is placed in a space with the ambient temperature of 25 ℃ for standing for 20min, and then the constant current Ia is input to the heat source 300. Of course, the ambient temperature and rest time herein are merely examples.
In the actual assembly, the cooling effect of the heat sink 130 on the heat sink 200 is ensured, and the heat sink 130 is preferably provided corresponding to the heat source 300, so that the heat sink 200 in the vicinity of the heat source 300 can be directly cooled. Preferably, the heat sink 130 adopts a uniform refrigeration arrangement mode, and the direct refrigeration area of the heat sink 130 (i.e. the direct bonding area with the heat sink 200) is larger than the direct heat conduction area of the heat source 300 (i.e. the direct bonding area of the heat source 300 and the heat sink 200 in theory), so as to further ensure refrigeration of the heat sink 200 around the heat source 300, and ensure safety of the heat source 300.
In this embodiment, the heat dissipation plate 200 is an aluminum plate structure, and the cold source 130 is a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet can be tightly attached to the surface of the heat dissipation plate 200 by a heat-conductive adhesive and electrically connected with the controller 110 by a wire, thereby realizing a controllable refrigeration effect. The semiconductor refrigerating sheet has the advantages of fast refrigerating, small volume, accurate control and the like, and the specific refrigerating principle and the internal structure of the semiconductor refrigerating sheet can be referred to the prior art, and are not repeated here.
S2: the cold source 130 at the other side of the heat dissipation plate 200 is controlled to cool at a second preset power.
Specifically, the controller 110 controls the cold source 130 to perform refrigeration with a second preset power, that is, to perform refrigeration on the heat dissipation plate 200 with constant refrigeration efficiency, which may be achieved by inputting the constant current Ib to the cold source 130 or the whole controller 110, where the cold source 130 is a semiconductor refrigeration sheet, and the control principle of the semiconductor refrigeration sheet is not described in detail herein.
In this embodiment, the first preset power and the second preset power are the same, that is, the heat generated by the heat source 300 in an ideal state is the same as the refrigerating output of the cold source 130, and the temperature of the heat dissipation plate 200 is reduced by the cold source 130, so as to avoid damaging the heat source 300 due to excessively high temperature during abnormal installation. Of course, the first preset power and the second preset power may be different, for example, the second preset power is slightly larger than the first preset power, so that the refrigerating capacity is larger than the heating value, and the safety is further ensured.
It should be noted that, during actual testing, the front surface of the heat dissipation plate 200 may be provided with a plurality of heat sources 300, and the plurality of heat sources 300 are distributed on the heat dissipation plate 200 at intervals, meanwhile, the back surface of the heat dissipation plate 200 may be provided with an equal number of cold sources 130, and the cold sources 130 and the heat sources 300 are arranged in a one-to-one opposite manner, so as to ensure the refrigeration effect and the protection effect on the heat sources 300. Of course, when the size of the heat dissipating plate 200 is small, a large semiconductor cooling plate may be directly used to cover the back of the heat dissipating plate 200, so as to achieve uniform cooling. The specific mounting structure of the heat sink 130 is not particularly limited, as long as it is possible to ensure simultaneous cooling of the heat sinks 200 where the plurality of heat sources 300 are located.
In the present embodiment, step S1 and step S2 are performed simultaneously, wherein the operation of heat source 300 and cold source 130 may be controlled simultaneously by inputting the same preset current Ia (or Ib) to controller 110.
S3: the instant temperature T of the heat source 300 after heating with the first preset power for the first preset time T1 is obtained.
Specifically, after the heat source 300 continuously generates heat at the first preset power for the first preset time t1, the controller 110 obtains the instant temperature of the heat source 300, wherein the temperature of the heat source 300 can be detected by a temperature sensor built in the heat source 300 and transmitted to the controller 110. Of course, for the heat source 300 without the temperature sensor, the temperature sensor may be additionally provided and electrically connected to the controller 110, so as to transmit the instant temperature signal of the heat source 300 to the controller 110.
In general, in order to ensure reliability, a temperature sensor is disposed in each of the heat generating components that are usually used as a control core, for example, a part of the components that do not have a temperature sensor may be controlled in conjunction with other components having a temperature sensor, and temperature-related correction may be added. Or a temperature sensor is arranged independently, and the temperature of the component is directly detected by the temperature sensor. In this embodiment, a heat source 300 with a temperature sensor is taken as an example.
It should be noted that, after the heat source 300 generates heat for the first preset time t1, the controller 110 obtains an instant temperature signal of the heat source 300, and performs pulse recording in a later time, for example, records the temperature of the heat source 300 every 1s, so as to obtain a temperature variation trend of the heat source 300.
In the present embodiment, after the first preset time t1 is reached, the controller 110 may control the heat source 300 to stop releasing heat, i.e. stop inputting the preset current Ia to the heat source 300, so that the heat source 300 stops and the subsequent measurement of the instant temperature is facilitated. Of course, here, the heat release of the heat source 300 can be continuously controlled, so that the heat source 300 continuously generates heat, so as to more accurately detect the heat dissipation efficiency of the heat dissipation plate 200.
In the present embodiment, the number of heat sources 300 is plural, and the plurality of heat sources 300 are disposed on the heat dissipation plate 200, so that the instant temperatures T of the plurality of heat sources 300 after the first preset time T1 need to be obtained respectively. It should be noted that, the controller 110 needs to compare the instant temperature of each heat source 300 separately, that is, the determination of the degree of adhesion between each heat source 300 and the heat dissipation plate 200 is independent, and in this embodiment, the determination may be implemented by a plurality of modules integrated on the controller 110. In other preferred embodiments, the control and determination may be performed by multiple controllers 110, respectively.
S4: and judging whether the bonding degree of the heat source 300 and the heat dissipation plate 200 meets the standard according to the instant temperature T.
Specifically, referring to fig. 2 in combination, after acquiring the instant temperature T of the heat source 300, the controller 110 first needs to perform step S41: it is determined whether the instant temperature T of the heat source 300 is less than or equal to the first threshold temperature Ts1.
If the instant temperature T is less than or equal to the first threshold temperature Ts1, it is determined that the adhesion degree between the heat source 300 and the heat dissipation plate 200 is up to the standard.
If the instant temperature T is greater than the first threshold temperature Ts1, step S42 is needed to be executed: it is determined whether the instant temperature T of the heat source 300 is greater than the second threshold temperature Ts2.
If the instant temperature T is greater than the second threshold temperature Ts2, the adhesion degree between the constant heat source 300 and the heat dissipation plate 200 does not reach the standard.
If the instant temperature T is greater than the first threshold temperature Ts1 and less than or equal to the second threshold temperature Ts2, step S43 is needed to be executed: judging whether the variation delta T of the temperature T in the second preset time T2 is smaller than or equal to a preset quantity delta Tn.
If the variation δt is less than or equal to the preset amount δtn, it is determined that the degree of adhesion between the heat source 300 and the heat dissipation plate 200 is up to standard.
If the variation δt is greater than the preset amount δtn, it is determined that the degree of adhesion between the heat source 300 and the heat dissipation plate 200 does not reach the standard.
Specifically, step S4 may be performed using the following steps:
if the instant temperature T is less than or equal to the first threshold temperature Ts1, determining that the adhesion degree between the heat source 300 and the heat dissipation plate 200 meets the standard;
if the instant temperature T is greater than the first threshold temperature Ts1 and less than or equal to the second threshold temperature Ts2, determining whether the adhesion degree between the heat source 300 and the heat dissipation plate 200 meets the standard according to the variation δt of the instant temperature T within the second preset time T2.
If the instant temperature T is greater than the second threshold temperature Ts2, it is determined that the adhesion degree between the heat source 300 and the heat dissipation plate 200 does not reach the standard.
Wherein the second threshold temperature Ts2 is greater than the first threshold temperature Ts1, and the temperature difference Tc between the second threshold temperature Ts2 and the first threshold temperature Ts1 is 3 ℃ to 10 ℃.
Here, the first threshold temperature Ts1, the second threshold temperature Ts2, and the first preset time t1 are all related to the size of the heat sink 200, the power of the semiconductor refrigeration sheet, the heat generating component, and the like, and may be set autonomously by testing, simulation, and the like in the design stage, and the setting range is wide and is not exemplified here.
It should be further noted that in this embodiment, the number of heat sources 300 is plural, each heat source 300 is compared separately, and when the instant temperature T of all the heat sources 300 is less than or equal to the first threshold temperature Ts1, it is indicated that the degree of adhesion between all the heat sources 300 and the heat dissipation plate 200 is up to the standard, and at this time, it is indicated that there is no problem in installing the heat sources 300, and the product can flow out normally. If the instantaneous temperature T of at least one heat source 300 is greater than the first threshold temperature Ts, the abnormal heat source 300 needs to be determined in the above steps. By the method, the abnormal heat source 300 can be accurately and rapidly positioned, and the installation effect and the position which is not effectively installed can be rapidly detected.
Note that, the plurality of heat sources 300 may be the same type of heat generating component, or may be different types of heat generating component, and when the heat sources 300 are different, the first threshold temperature Ts1 and the second threshold temperature Ts2 may be set for each heat source 300 in a targeted manner, and the determination may be performed individually.
In the present embodiment, for the case where the instantaneous temperature T is greater than the first threshold temperature Ts1, the difference between the instantaneous temperature T at this time and the first threshold temperature Ts1 may be set to Δt. If Δt is less than or equal to Tc, it is indicated that the instant temperature T falls within the interval range of the first threshold temperature Ts1 and the second threshold temperature Ts2, and at this time, it is necessary to further determine the variation δt of the instant temperature T; if Δt is greater than Tc, it indicates that the instant temperature T is greater than the second threshold temperature Ts2, and the temperature of the heat source 300 is higher at this time, which indicates that the heat dissipation effect of the heat dissipation plate 200 is limited, that is, that the degree of adhesion between the heat source 300 and the heat dissipation plate 200 is not up to standard, and that the mounting effect is poor.
Specifically, when the instant temperature T falls within the interval range of the first threshold temperature Ts1 and the second threshold temperature Ts2, the instant temperature T2 within the second preset time T2 needs to be obtained, wherein the value range of the second preset time T2 is 20-120s, preferably 30s, that is, the variation δt of the instant temperature within 30s is obtained.
In actual operation, the amount of change δt of the instantaneous temperature T may be set to satisfy the following relationship: δt=tk1-tk2, where Tk1 and Tk2 are the end temperatures of the time period of 30s, respectively, i.e. Tk1 is the current instantaneous temperature of the heat source 300 and Tk2 is the instantaneous temperature before the heat source 300.
If the variation δt is greater than the preset amount δtn, it is determined that the degree of adhesion between the heat source 300 and the heat dissipation plate 200 does not reach the standard.
If the variation δt is less than or equal to the preset amount δtn, it is determined that the degree of adhesion between the heat source 300 and the heat dissipation plate 200 is up to standard.
Wherein the value range of the preset quantity delta Tn is-10 ℃ to 0 ℃, and is preferably-2 ℃. If δT is less than or equal to-2 ℃, the trend that the temperature of the heat source 300 is reduced along with the time is indicated, the descending speed is greater than or equal to-2/30 ℃/s, at the moment, the bonding degree of the heat source 300 and the heat dissipation plate 200 can be judged to reach the standard, the heat dissipation plate 200 still has equivalent heat dissipation capacity, and the heat source 300 and the heat dissipation plate 200 are installed in place; if δT > -2 ℃, it indicates that, with time, the heat source 300 is in a trend of temperature rise or temperature leveling, or the descending rate is too small, at this time, it may be determined that the bonding degree between the heat source 300 and the heat dissipation plate 200 is not up to standard, at this time, the heat dissipation capability of the heat dissipation plate 200 is weak, and the heat dissipation effect of the whole machine is affected, so that the heat source 300 and the heat dissipation plate 200 are not installed in place.
Referring to fig. 2, in this embodiment, the installation compliance testing system specifically includes the following operation procedures:
the assembled heat source 300, heat sink 130, and heat dissipation plate 200 are left standing for a preset slow cooling time t0 in a space where the ambient temperature is a preset temperature Ta. The controller 110 is then inputted with a preset current Ia for a first preset time t1.
After the first preset time T1 has elapsed, it is necessary to determine whether the instantaneous temperature T of the heat source 300 is less than or equal to the first threshold temperature Ts1. If so, the degree of adhesion between the heat source 300 and the heat dissipation plate 200 reaches the standard, the installation is free from problems, and the product can normally flow out. If not, it is indicated that the instant temperature T of the heat source 300 is greater than the first threshold temperature Ts1, and it is necessary to determine whether the instant temperature T of the heat source 300 is greater than the second threshold temperature Ts2. If the instant temperature T of the heat source 300 is greater than the second threshold temperature Ts2, it indicates that the adhesion degree between the heat source 300 and the heat dissipation plate 200 does not reach the standard, the installation is abnormal, and the product needs to be maintained.
If the instantaneous temperature T of the heat source 300 is less than or equal to the second threshold temperature Ts2 (the precondition is greater than the first threshold temperature Ts 1), it is necessary to determine whether the variation δt of the instantaneous temperature T of the heat source 300 is greater than the preset amount δtn. If the variation δT is greater than the preset amount δTn, it is determined that the degree of adhesion between the heat source 300 and the heat dissipation plate 200 does not reach the standard, and the heat dissipation plate is not installed in place, so that the product needs to be maintained. If the variation δT is smaller than or equal to the preset amount δTn, the degree of adhesion of the heat source 300 and the heat dissipation plate 200 is judged to reach the standard, the heat dissipation plate is installed in place, and the product flows out normally. Reference is made to the foregoing for the principles of judgment and specific parameters.
Referring to fig. 3, the present embodiment further provides a mounting fitness test system 100, which includes a heat sink 130 and a controller 110, where the mounting fitness test system 100 is configured to test the fitness between a mounted heat source 300 and a heat dissipation plate 200, specifically, before testing, the heat sink 130 is mounted on a surface of the heat dissipation plate 200, which is far away from the heat source 300, and corresponds to the position of the heat source 300. The controller 110 is connected with the cold source 130 and the heat source 300 through wires, wherein the controller 110 is used for controlling the heat source 300 to generate heat with a first preset power; the controller 110 is further configured to control the cold source 130 to perform refrigeration with a second preset power; the controller 110 is further configured to obtain an instant temperature T of the heat source 300 after the heat is generated at the first preset power and the first preset time T1 is continued, and determine whether the adhesion degree between the heat source 300 and the heat dissipation plate 200 meets the standard according to the instant temperature T.
Specifically, when actually controlling the heat source 300 and the cold source 130, the control may be performed by inputting a preset current Ia and continuing for a first preset time T1, and after the first preset time T1 elapses, acquiring an instant temperature T of the heat source 300 through a temperature sensor of the heat source 300, and determining whether the adhesion degree between the heat source 300 and the heat dissipation plate 200 meets the standard according to the instant temperature T.
In this embodiment, the controller 110 may be an integrated circuit chip with signal processing capability. The controller 110 may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU for short), a network processor (Network Processor, NP for short), etc.; but also Digital Signal Processors (DSPs), application Specific Integrated Circuits (ASICs), field Programmable Gate Arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The disclosed methods, steps, and logic blocks in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor. The controller 110 may also be any conventional processor or the like.
In summary, the present embodiment provides a method and a system for testing the mounting adhesion degree, which control the heat source 300 to continuously generate heat with a first preset power during actual measurement, heat the heat dissipation plate 200, control the cold source 130 to continuously cool with a second preset power, cool the heat dissipation plate 200, obtain the instant temperature T of the heat source 300 after the first preset time T1 is continuously maintained, and determine whether the adhesion degree of the heat source 300 and the heat dissipation plate 200 meets the standard according to the magnitude and the variation trend of the instant temperature T. If the bonding degree does not reach the standard, the heat generated by the heat source 300 is not timely transferred to the heat dissipation plate 200, so that the temperature of the heat source 300 is too high, otherwise, the temperature of the heat source 300 is not too high, namely, the bonding degree between the heat source 300 and the heat dissipation plate 200 is reflected on the instant temperature T, and meanwhile, the heat dissipation plate 200 can be cooled by the cold source 130, so that the heat source 300 can be controlled within a certain range, and the heat damage to the heat source 300 and the heat dissipation plate 200 is avoided.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (9)
1. A mounting compliance testing method for measuring a compliance between a heat source (300) and a heat dissipation plate (200), the mounting compliance testing method comprising:
controlling a heat source (300) positioned at one side of the heat dissipation plate (200) to emit heat at a first preset power;
controlling a cold source (130) positioned at the other side of the radiating plate (200) to refrigerate with a second preset power, wherein the first preset power is the same as the second preset power;
acquiring the instant temperature T of the heat source (300) after heating at the first preset power for a first preset time T1;
if the instant temperature T is smaller than or equal to a first threshold temperature Ts1, judging that the bonding degree of the heat source (300) and the heat dissipation plate (200) reaches the standard;
if the instant temperature T is greater than the first threshold temperature Ts1 and less than or equal to the second threshold temperature Ts2, determining whether the bonding degree between the heat source (300) and the heat dissipation plate (200) meets the standard according to the variation δt of the instant temperature T within a second preset time T2;
if the instant temperature T is greater than a second threshold temperature Ts2, judging that the bonding degree of the heat source (300) and the heat dissipation plate (200) does not reach the standard;
wherein the second threshold temperature Ts2 is greater than the first threshold temperature Ts1;
and determining whether the bonding degree between the heat source (300) and the heat dissipation plate (200) meets the standard according to the variation δT of the instant temperature T within a second preset time T2, including:
if the variation delta T is larger than the preset quantity delta Tn, judging that the bonding degree of the heat source (300) and the heat dissipation plate (200) does not reach the standard;
and if the variation delta T is smaller than or equal to the preset quantity delta Tn, judging that the bonding degree of the heat source (300) and the heat dissipation plate (200) reaches the standard.
2. The method of claim 1, wherein the second predetermined time t2 is 20s to 120s.
3. The mounting fitness test method of claim 2, wherein the preset amount δtn is-10 ℃ -0 ℃.
4. The mounting fit test method according to claim 1, wherein the difference between the second threshold temperature Ts2 and the first threshold temperature Ts1 is between 3 ℃ and 10 ℃.
5. The method according to claim 1, wherein the number of heat sources (300) is plural, and the step of obtaining the instant temperature T of the heat sources (300) after the first preset time T1 includes:
and respectively acquiring the instant temperatures T of a plurality of heat sources (300) after the first preset time T1.
6. The mounting compliance testing method according to claim 1, wherein the step of controlling the heat source (300) located at the side of the heat radiating plate (200) to generate heat at a first preset power includes:
a first preset current is input to the heat source (300) positioned at one side of the heat radiating plate (200) so that the heat source (300) generates heat at the first preset power.
7. The mounting compliance testing method according to claim 1, wherein before the step of controlling the heat source (300) located at the side of the heat radiating plate (200) to generate heat with the first preset power, the mounting compliance testing method further comprises:
and standing the heat source (300) and the heat dissipation plate (200) in a space with the environment temperature being a preset temperature Ta for a preset slow cooling time t0.
8. The mounting compliance testing method of claim 1, wherein the cold source (130) is a semiconductor refrigeration sheet.
9. A mounting fitness test system (100) adapted for the mounting fitness test method according to claim 1 and used for measuring the fitness between a heat source (300) and a heat sink (200), wherein the mounting fitness test system (100) comprises a heat source (130) and a controller (110), the heat source (300) is located at one side of the heat sink (200), the heat source (130) is located at the other side of the heat sink (200), and the controller (110) is electrically connected with the heat source (300) and the heat sink (130), respectively;
wherein the controller (110) is configured to control the heat source (300) to generate heat at a first preset power;
the controller (110) is further configured to control the cold source (130) to perform refrigeration with a second preset power;
the controller (110) is further configured to obtain an instant temperature T of the heat source (300) after the heat source generates heat at the first preset power and lasts for a first preset time T1, and determine whether the bonding degree of the heat source (300) and the heat dissipation plate (200) meets the standard according to the instant temperature T.
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