CN113188681A - Installation fitting degree testing method and installation fitting degree testing system - Google Patents
Installation fitting degree testing method and installation fitting degree testing system Download PDFInfo
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- CN113188681A CN113188681A CN202110468114.9A CN202110468114A CN113188681A CN 113188681 A CN113188681 A CN 113188681A CN 202110468114 A CN202110468114 A CN 202110468114A CN 113188681 A CN113188681 A CN 113188681A
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- 238000009434 installation Methods 0.000 title claims abstract description 44
- 238000012360 testing method Methods 0.000 title claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 125
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000010998 test method Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005057 refrigeration Methods 0.000 claims description 8
- 238000010583 slow cooling Methods 0.000 claims description 5
- 230000002045 lasting effect Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 30
- 238000010030 laminating Methods 0.000 abstract description 4
- 230000003685 thermal hair damage Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 14
- 230000002159 abnormal effect Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention provides an installation fitting degree test method and an installation fitting degree test system, which are characterized in that a heat source is controlled to continuously generate heat at a first preset power, a heat dissipation plate is heated, a time control cooling source continuously cools at a second preset power, the heat dissipation plate is cooled, the instant temperature T of the heat source is obtained after the first preset time T1 is continued, and whether the fitting degree of the heat source and the heat dissipation plate reaches the standard or not is judged through the instant temperature T. The laminating degree between heat source and the heating panel can be embodied on instant temperature T, and the cold source can cool down the heating panel simultaneously to can be in certain extent with the heat source control, avoid causing the thermal damage to heat source and heating panel. Compared with the prior art, the invention can effectively detect the attaching degree between the heat source and the heat dissipation plate and ensure the safety of the heat source by additionally arranging the cold source and judging the attaching degree between the heat source and the heat dissipation plate through the instant temperature of the heat source.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to an installation fitting degree testing method and an installation fitting degree testing system.
Background
The heat dissipation cooling of present heating element and part generally relies on air-cooled fin or refrigerant, and the cooling method is different but its implementation all relies on heating panel (like aluminum plate) conduction heat dissipation: and the power module component is attached to the heat dissipation aluminum plate and fixed by screws. The effectiveness of the combination of the components and the heat dissipation aluminum plate is greatly influenced by the strength and the verticality of the screw fixation, and the heat dissipation performance of the heat dissipation plate is influenced by the combination degree. At present, force and verticality are only controlled by adopting a torque screwdriver and requiring a production operation method, mounting errors are large, the degree of fitting is influenced, and further the heat dissipation performance is influenced. However, if the installation effect of the product does not meet the design requirement, the heat dissipation cannot reach the design theoretical heat dissipation amount, and the risk of problems during short-time operation (such as factory detection) is low, but when the product is used by a user for a long time, especially during high-load operation, the risk of frequent frequency limitation, frequency reduction and even component burnout can occur.
In the prior art, whether to install in place between power module and the heating panel, to the laminating degree of the two promptly, the result is invisible, little deviation is difficult to measure and control, and if direct measurement extreme temperature rise tests its radiating effect, then can damage components and parts.
Disclosure of Invention
The invention solves the problem of how to effectively detect whether the installation between the power module and the heat dissipation plate achieves the effect, and the components cannot be damaged.
In order to solve the problems, the invention adopts the following technical scheme.
In one aspect, the present invention provides a method for testing a mounting adhesion degree, which is used for measuring an adhesion degree between a heat source and a heat dissipation plate, and includes:
controlling a heat source positioned on one side of the heat dissipation plate to generate heat with first preset power;
controlling a cold source positioned on the other side of the heat dissipation plate to refrigerate at a second preset power;
obtaining the instant temperature T of the heat source after the heat source heats at a first preset power for a first preset time T1;
and judging whether the bonding degree of the heat source and the heat dissipation plate reaches the standard or not according to the instant temperature T.
The invention provides a method for testing installation attaching degree, which is characterized in that during actual measurement, a heat source is controlled to continuously generate heat at a first preset power, a heat dissipation plate is heated, a time control cooling source continuously cools at a second preset power, the heat dissipation plate is cooled, after the first preset time T1 is continued, the instant temperature T of the heat source is obtained, and whether the attaching degree of the heat source and the heat dissipation plate reaches the standard or not is judged according to the size, the variation trend and the like of the instant temperature T. If the laminating degree does not reach standard, the heat that the heat source produced can not in time transmit to the heating panel, will cause the heat source temperature too high, otherwise then can make the heat source temperature can not be too high, and the laminating degree between heat source and the heating panel can be reflected on instant temperature T promptly, and the cold source can cool down the heating panel simultaneously to can be in certain extent with the heat source control, avoid causing the thermal damage to heat source and heating panel. Compared with the prior art, the invention can effectively detect the attaching degree between the heat source and the heat dissipation plate and ensure the safety of the heat source by additionally arranging the cold source and judging the attaching degree between the heat source and the heat dissipation plate through the instant temperature of the heat source.
Further, the step of determining whether the adhesion degree between the heat source and the heat dissipation plate reaches the standard according to the instant temperature T and the temperature change rate δ T includes:
if the instant temperature T is less than or equal to a first threshold temperature Ts1, determining that the bonding degree of the heat source and the heat dissipation plate reaches the standard;
if the instant temperature T is greater than the first threshold temperature Ts1 and less than or equal to a second threshold temperature Ts2, determining whether the bonding degree of the heat source and the heat dissipation plate reaches the standard according to the variation δ T of the instant temperature T within a second preset time T2;
if the instant temperature T is greater than a second threshold temperature Ts2, determining that the attaching degree of the heat source and the heat dissipation plate does not reach the standard;
wherein the second threshold temperature Ts2 is greater than the first threshold temperature Ts 1.
Further, the step of determining whether the adhesion between the heat source and the heat dissipation plate reaches the standard according to the variation δ T of the instant temperature T within a second preset time T2 includes:
if the variation delta T is larger than a preset quantity delta Tn, judging that the attaching degree of the heat source and the heat dissipation plate does not reach the standard;
and if the variation delta T is smaller than or equal to a preset quantity delta Tn, judging that the bonding degree of the heat source and the heat dissipation plate reaches the standard.
Further, the second preset time t2 is 20s-120 s.
Further, the preset quantity delta Tn is-10 ℃ to 0 ℃.
Further, the difference between the second threshold temperature Ts2 and the first threshold temperature Ts1 is between 3 ℃ and 10 ℃.
Further, the step of obtaining the instant temperature T of the heat source after the first preset time T1 includes:
and respectively acquiring the instant temperatures T of a plurality of heat sources after a first preset time T1.
Further, the step of controlling the heat source at one side of the heat dissipation plate to generate heat with a first preset power includes:
and inputting a first preset current to the heat source positioned on one side of the heat dissipation plate so that the heat source generates heat with the first preset power.
Further, before the step of controlling the heat source on one side of the heat dissipation plate to generate heat at the first preset power, the method for testing the installation adhesion degree further includes:
and standing the heat source and the heat dissipation plate in a space with the ambient temperature of the preset temperature Ta for preset slow cooling time t 0.
Further, the first preset power and the second preset power are the same.
Furthermore, the cold source is a semiconductor refrigeration piece.
On the other hand, the invention also provides an installation fitting degree test system which is suitable for the installation fitting degree test method and used for measuring the fitting degree between a heat source and a heat dissipation plate, wherein the installation fitting degree test system comprises a cold source and a controller, the heat source is positioned on one side of the heat dissipation plate, the cold source is positioned on the other side of the heat dissipation plate, and the controller is respectively and electrically connected with the heat source and the cold source;
the controller is used for controlling the heat source to generate heat at a first preset power;
the controller is also used for controlling the cold source to refrigerate at a second preset power;
the controller is further used for obtaining an instant temperature T of the heat source after a first preset time T1, and judging whether the attaching degree of the heat source and the heat dissipation plate reaches the standard or not according to the instant temperature T.
Drawings
FIG. 1 is a block diagram of the steps of a method for testing installation conformity according to the present invention;
FIG. 2 is a control logic block diagram of the installation conformity testing method provided by the present invention;
FIG. 3 is a diagram of the operational state of the installation conformance system provided by the present invention.
Description of reference numerals:
100-installing a fit degree testing system; 110-a controller; 130-a cold source; 200-a heat sink; 300-heat source.
Detailed Description
As disclosed in the background art, in the prior art, the heat dissipation and cooling performance of the heating element is generally tested in cooperation with the whole machine, that is, the test is performed through factory inspection, however, it can only prove that the risk of the air conditioner running a problem in a short time is low, and the heat dissipation performance of the heating element in a long-term or high-load operation is difficult to test.
The inventor researches and discovers that the installation fitting degree between the heat dissipation plate and the heating component is one of important indexes influencing the heat dissipation performance of the heat dissipation plate, and at present, the heating component is usually fixed only by torque screws, namely, the heating component is fixed on the heat dissipation plate by the torque screws, so that the requirement on the installation process is high. However, the fixing by screws has a certain installation error, so that the heating component and the heat dissipation plate cannot be completely attached to each other, and the heat dissipation performance of the heating component is affected. In the prior art, the power module and the heat dissipation plate are mounted in place, namely, the fitting degree of the power module and the heat dissipation plate is invisible, small deviation is difficult to measure and control, and if extreme temperature rise is directly measured to test the heat dissipation effect of the power module and the heat dissipation plate, components can be damaged.
In order to solve the problems, the invention provides a method and a system for testing the installation fitting degree, which can effectively detect the fitting degree between a heating component and a heat dissipation plate so as to detect whether the heating component is installed in place, find abnormal positions in time and prevent defective products from leaving a factory. In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
First embodiment
Referring to fig. 1 to 3 in combination, the present invention provides a method for testing a mounting adhesion degree, which is used for measuring an adhesion degree between a heat source 300 and a heat dissipation plate 200, and has the advantages of good measurement effect, high detection accuracy, capability of effectively detecting the adhesion degree between the heat source 300 and the heat dissipation plate 200, and capability of ensuring safety of a heating element.
The installation fitting degree test method provided by the embodiment is suitable for the installation fitting degree test system 100, the installation fitting degree test system 100 comprises the cold source 130 and the controller 110, before testing, the heat source 300 to be tested and the heat dissipation plate 200 need to be installed in place, the cold source 130 is installed on the surface of one side, far away from the heat source 300, of the heat dissipation plate 200, meanwhile, the heat dissipation plate 200 is further provided with the refrigerant pipe, the refrigerant pipe does not participate in actions in the test process, and therefore processing is omitted in the implementation. The controller 110 controls the operation of the heat source 300 and the cold source 130, obtains the instant temperature of the heat source 300, and determines whether the installation effect between the heat source 300 and the heat dissipation plate 200 reaches the standard according to the instant temperature, and the specific process and principle will be described in detail below.
It should be noted that the method for testing installation conformity degree provided in this embodiment is applied to a structure having a heat dissipation plate 200 in an air conditioner, where the air conditioner may be an indoor unit or an outdoor unit, and the type of the air conditioner is not particularly limited, but all air conditioners that have a heat source 300 and need to perform heat dissipation and cooling through the heat dissipation plate 200 are within the protection scope of the present invention. The heat source 300 in this embodiment refers to a heat generating component in the air conditioner, such as an internal component of an electrical control box, a compressor or a motor. The cold source 130 in this embodiment is a small-sized detachable refrigeration device, and has the advantages of fast refrigeration, small size, and capability of accurately controlling the refrigeration capacity. Preferably, the heat sink 130 in this embodiment is a semiconductor cooling plate, which is attached to a surface of the heat dissipation plate 200, the surface being away from the heat source 300, and is used for cooling the heat dissipation plate 200 to prevent the heat source 300 from being too hot.
The mounting attachment test method will be described in detail below.
The installation fitting degree test method provided by the embodiment comprises the following steps:
s1: the heat source 300 at one side of the heat sink 200 is controlled to generate heat with a first predetermined power.
Specifically, the controller 110 controls the heat source 300 to generate heat at a first preset power, that is, to generate heat at a constant heat generation rate, which may be achieved by inputting a constant current Ia to the heat source 300 or the entire controller 110, and the control principle of the heat source 300 is not specifically described herein.
In this embodiment, before step S1 is executed, the heat sink 130 needs to be assembled on the heat sink 200, the controller 110 is electrically connected to the heat source 300 and the heat sink 130 at the same time, and then the assembled structure (including the heat source 300 and the heat sink 200) is left standing for the preset slow cooling time t0 in the space where the ambient temperature is the preset temperature Ta, so as to ensure that the heat source 300, the heat sink 200, and the heat sink 130 are in the initial state, thereby avoiding the interference caused by the external environment, such as the heat generated on the heat sink 200 during the assembly.
Specifically, the preset temperature Ta needs to be the same as the ambient temperature in the subsequent steps, and the preset slow cooling time t0 needs to be the same as the temperature of the heat source 300, the heat dissipation plate 200, and the cold source 130 to be cooled to be substantially the same as the ambient temperature, for example, the assembled structure is placed in a space with an ambient temperature of 25 ℃ to stand for 20min, and then the constant current Ia is input to the heat source 300. Of course, the ambient temperature and the standing time are only illustrative.
It should be noted that, during actual assembly, the cooling effect of the cooling source 130 on the cooling plate 200 needs to be ensured, and preferably, the cooling source 130 is disposed corresponding to the heat source 300, so that the cooling plate 200 near the heat source 300 can be directly cooled. Preferably, the cold source 130 is uniformly distributed in a cooling manner, and a direct cooling area (i.e., a direct bonding area with the heat dissipation plate 200) of the cold source 130 is larger than a direct heat conduction area (i.e., a direct bonding area between the heat source 300 and the heat dissipation plate 200 in theory) of the heat source 300, so that the heat dissipation plate 200 around the heat source 300 is further ensured to be cooled, and safety of the heat source 300 is guaranteed.
In this embodiment, the heat dissipating plate 200 is an aluminum plate, and the cold source 130 is a semiconductor cooling plate, which can be closely attached to the surface of the heat dissipating plate 200 through a thermally conductive adhesive and electrically connected to the controller 110 through a wire, thereby achieving a controllable cooling effect. The semiconductor refrigerating piece has the advantages of fast refrigeration, small volume, accurate control and the like, and the specific refrigeration principle and the internal structure of the semiconductor refrigerating piece refer to the prior art and are not described in detail herein.
S2: the cool source 130 at the other side of the heat sink 200 is controlled to cool at a second predetermined power.
Specifically, the controller 110 controls the cooling source 130 to refrigerate with the second preset power, that is, refrigerate the heat dissipation plate 200 with the constant cooling efficiency, which may also be implemented by inputting a constant current Ib to the cooling source 130 or the entire controller 110, where the cooling source 130 is a semiconductor cooling plate, and the control principle of the semiconductor cooling plate is not described in detail herein.
In this embodiment, the first preset power and the second preset power are the same, that is, the heat generated by the heat source 300 is the same as the cooling capacity of the cold source 130 in an ideal state, and the temperature of the heat dissipation plate 200 is reduced by the cold source 130, so as to prevent the heat source 300 from being damaged due to an excessively high temperature during abnormal installation. Of course, the first preset power and the second preset power may also be different, for example, the second preset power is slightly larger than the first preset power, so that the cooling capacity is larger than the heating capacity, and the safety is further ensured.
It should be noted that, during actual testing, the front surface of the heat dissipation plate 200 may be provided with a plurality of heat sources 300, the plurality of heat sources 300 are distributed on the heat dissipation plate 200 at intervals, meanwhile, the back surface of the heat dissipation plate 200 may be provided with the same number of cold sources 130, and the cold sources 130 and the heat sources 300 are arranged in a one-to-one correspondence manner, so as to ensure a refrigeration effect and a protection effect on the heat sources 300. Of course, when the size of the heat dissipation plate 200 is smaller, a larger semiconductor cooling plate can be directly used to cover the back surface of the heat dissipation plate 200, so as to achieve uniform cooling. The specific installation structure of the heat sink 130 is not particularly limited, and may be any structure as long as it can ensure that the heat sinks 200 where the plurality of heat sources 300 are located can be cooled simultaneously.
In the present embodiment, the steps S1 and S2 are performed simultaneously, wherein the operation of the heat source 300 and the heat sink 130 can be controlled simultaneously by inputting the same preset current Ia (or Ib) to the controller 110.
S3: the instant temperature T of the heat source 300 after heating at the first preset power for the first preset time T1 is obtained.
Specifically, after the heat source 300 continuously generates heat at the first preset power for the first preset time t1, the instant temperature of the heat source 300 is obtained through the controller 110, wherein the temperature of the heat source 300 can be detected through a built-in temperature sensor thereof and transmitted to the controller 110. Of course, for the heat source 300 without a temperature sensor, a temperature sensor may be additionally provided and electrically connected to the controller 110, so as to transmit an instant temperature signal of the heat source 300 to the controller 110.
In general, in order to ensure reliability, temperature sensors are generally provided in all heat generating components that are the control cores, and for example, components that are partially not provided with temperature sensors may be controlled in conjunction with other components having temperature sensors to increase temperature correlation correction. Or a temperature sensor is separately arranged, and the temperature of the component is directly detected through the temperature sensor. In this embodiment, a heat source 300 with a temperature sensor is used as an example.
After the heat source 300 generates heat for the first preset time t1, the controller 110 obtains an instantaneous temperature signal of the heat source 300, and records the temperature of the heat source 300 in a pulse mode at a later time, for example, every 1s, so as to obtain the temperature variation trend of the heat source 300.
In this embodiment, after the first preset time t1 is reached, the controller 110 may control the heat source 300 to stop releasing heat, i.e., stop inputting the preset current Ia to the heat source 300, so that the heat source 300 stops, and facilitate the subsequent instant temperature measurement. Of course, the heat source 300 may be controlled to release heat continuously, so that the heat source 300 continuously generates heat, and the heat dissipation efficiency of the heat dissipation plate 200 may be detected more accurately.
In this embodiment, since the heat source 300 is provided in plural and the heat sources 300 are provided on the heat sink 200, it is necessary to obtain the instant temperatures T of the heat sources 300 after the first preset time T1. It should be noted that, here, the controller 110 needs to compare the instant temperature of each heat source 300 individually, that is, the determination of the degree of adhesion between each heat source 300 and the heat dissipation plate 200 is independent from each other, and this embodiment may be implemented by a plurality of modules integrated on the controller 110. In other preferred embodiments, the control and determination may be performed by a plurality of controllers 110, respectively.
S4: whether the bonding degree of the heat source 300 and the heat dissipation plate 200 reaches the standard is determined according to the instant temperature T.
Specifically, referring to fig. 2 in combination, after obtaining the instant temperature T of the heat source 300, the controller 110 first needs to execute step S41: it is determined whether the instant temperature T of the heat source 300 is less than or equal to the first threshold temperature Ts 1.
If the instantaneous temperature T is less than or equal to the first threshold temperature Ts1, it is determined that the adhesion between the heat source 300 and the heat sink 200 is satisfactory.
If the instant temperature T is greater than the first threshold temperature Ts1, step S42 is executed: it is determined whether the instant temperature T of the heat source 300 is greater than the second threshold temperature Ts 2.
If the instant temperature T is greater than the second threshold temperature Ts2, the adhesion between the constant heat source 300 and the heat sink 200 does not reach the standard.
If the instant temperature T is greater than the first threshold temperature Ts1 and less than or equal to the second threshold temperature Ts2, step S43 is executed: and judging whether the variation delta T of the temperature T in the second preset time T2 is less than or equal to the preset quantity delta Tn.
If the variation δ T is less than or equal to the preset amount δ Tn, it is determined that the adhesion degree between the heat source 300 and the heat dissipation plate 200 is up to standard.
If the variation δ T is greater than the preset amount δ Tn, it is determined that the fitting degree of the heat source 300 and the heat sink 200 does not reach the standard.
Specifically, step S4 may be performed using the following steps:
if the instant temperature T is less than or equal to a first threshold temperature Ts1, determining that the bonding degree between the heat source 300 and the heat dissipation plate 200 meets the standard;
if the instant temperature T is greater than the first threshold temperature Ts1 and less than or equal to the second threshold temperature Ts2, it is determined whether the adhesion between the heat source 300 and the heat dissipation plate 200 is up to standard according to the variation δ T of the instant temperature T within the second predetermined time T2.
If the instantaneous temperature T is greater than the second threshold temperature Ts2, it is determined that the degree of adhesion between the heat source 300 and the heat sink 200 does not meet the predetermined criterion.
Wherein, the second threshold temperature Ts2 is greater than the first threshold temperature Ts1, and the temperature difference Tc between the second threshold temperature Ts2 and the first threshold temperature Ts1 is 3-10 ℃.
Here, the first threshold temperature Ts1, the second threshold temperature Ts2, and the first preset time t1 are all related to the size of the heat radiating plate 200, the power of the semiconductor cooling fins, the type of the heat generating component, and the like, and can be set autonomously by testing, simulation, and the like in the design stage, and the setting range is wide, which is not exemplified here.
It should be noted that in this embodiment, there are a plurality of heat sources 300, each heat source 300 performs a separate comparison, and when the instant temperature T of all the heat sources 300 is less than or equal to the first threshold temperature Ts1, it indicates that the fitting degree between all the heat sources 300 and the heat dissipation plate 200 is up to standard, and at this time, it indicates that there is no problem in the installation of the heat sources 300, and the product can flow out normally. If the instantaneous temperature T of at least one heat source 300 is greater than the first threshold temperature Ts, the determination of the above-described steps needs to be performed for the abnormal heat source 300. By the method, the abnormal heat source 300 can be accurately and quickly positioned, and the installation effect and the position which is not effectively installed can be quickly detected.
Note that, here, the plurality of heat sources 300 may be the same type of heat generating element or different types of heat generating elements, and when the heat sources 300 are different, the first threshold temperature Ts1 and the second threshold temperature Ts2 may be set for each heat source 300 and individually determined.
In this embodiment, for the case that the instantaneous temperature T is greater than the first threshold temperature Ts1, the difference between the instantaneous temperature T and the first threshold temperature Ts1 at this time may be set as Δ T. If the delta T is less than or equal to Tc, the instant temperature T is in the interval range of the first threshold temperature Ts1 and the second threshold temperature Ts2, and the variation delta T of the instant temperature T needs to be further determined; if Δ T is greater than Tc, it indicates that the instantaneous temperature T is greater than the second threshold temperature Ts2, and the temperature of the heat source 300 is higher at this time, which indicates that the heat dissipation effect of the heat dissipation plate 200 is limited, i.e., that the degree of adhesion between the heat source 300 and the heat dissipation plate 200 does not meet the standard, and the mounting effect is poor.
Specifically, when the instant temperature T falls within the interval range between the first threshold temperature Ts1 and the second threshold temperature Ts2, the instant temperature T2 within the second preset time T2 needs to be obtained, wherein the value range of the second preset time T2 is 20-120s, preferably 30s, that is, the variation δ T of the instant temperature within 30s is obtained.
In actual operation, the variation δ T of the instantaneous temperature T may be set to satisfy the following relationship: δ T-Tk 1-Tk2, where Tk1 and Tk2 are respectively end temperatures of the time period of 30s, i.e., Tk1 is the current instant temperature of the heat source 300, and Tk2 is the instant temperature before the heat source 300.
If the variation δ T is greater than the preset amount δ Tn, it is determined that the fitting degree of the heat source 300 and the heat sink 200 does not reach the standard.
If the variation δ T is less than or equal to the preset amount δ Tn, it is determined that the adhesion degree between the heat source 300 and the heat dissipation plate 200 is up to standard.
Wherein the value range of the preset quantity delta Tn is-10-0 ℃, and is preferably-2 ℃. That is, if δ T is less than or equal to-2 ℃, it indicates that the heat source 300 is in a trend of temperature decrease along with the advance of time, and the rate of decrease is greater than or equal to-2/30 ℃/s, at this time, it can be determined that the attaching degree of the heat source 300 and the heat dissipation plate 200 reaches the standard, the heat dissipation plate 200 still has a considerable heat dissipation capability, and the heat source 300 and the heat dissipation plate 200 are installed in place; if δ T > -2 ℃, it indicates that the heat source 300 is in a tendency of temperature rise or temperature leveling or the rate of decline is too small as time advances, and at this time, it can be determined that the degree of attachment of the heat source 300 to the heat sink 200 does not meet the standard, and at this time, the heat dissipation capability of the heat sink 200 is weak, which may affect the heat dissipation effect of the whole machine, and the installation between the heat source 300 and the heat sink 200 is not in place.
Referring to fig. 2, in the present embodiment, the specific operation process of the above-described mounting fitness test system is as follows:
the assembled heat source 300, cold source 130 and heat dissipation plate 200 are left standing for a preset slow cooling time t0 in a space with an ambient temperature of a preset temperature Ta. Then, the preset current Ia is input to the controller 110 for a first preset time t 1.
After the first preset time T1, it is determined whether the instant temperature T of the heat source 300 is less than or equal to the first threshold temperature Ts 1. If the fitting degree between the heat source 300 and the heat dissipation plate 200 meets the standard, the installation is not problematic, and the product can flow out normally. If not, it is determined that the instant temperature T of the heat source 300 is greater than the first threshold temperature Ts1, and at this time, it is determined whether the instant temperature T of the heat source 300 is greater than the second threshold temperature Ts 2. If the instant temperature T of the heat source 300 is greater than the second threshold temperature Ts2, it indicates that the adhesion between the heat source 300 and the heat dissipation plate 200 does not meet the standard, the installation is abnormal, and the product needs to be repaired.
If the instantaneous temperature T of the heat source 300 is less than or equal to the second threshold temperature Ts2 (the precondition is greater than the first threshold temperature Ts1), it is determined whether the variation δ T of the instantaneous temperature T of the heat source 300 is greater than the preset amount δ Tn. If the variation δ T is greater than the preset amount δ Tn, it is determined that the fitting degree of the heat source 300 and the heat dissipation plate 200 does not reach the standard, the installation is not in place, and the product needs to be maintained. If the variation δ T is less than or equal to the preset amount δ Tn, it is determined that the attachment degree of the heat source 300 and the heat dissipation plate 200 reaches the standard, the heat source is installed in place, and the product flows out normally. For the above judgment principles and specific parameters, reference is made to the above.
Referring to fig. 3, the present embodiment further provides an installation conformity testing system 100, which includes a cold source 130 and a controller 110, and the installation conformity testing system 100 is configured to test a conformity between an installed heat source 300 and a heat dissipation plate 200, specifically, before the test, the cold source 130 is installed on a side surface of the heat dissipation plate 200, which is far from the heat source 300, and corresponds to a position of the heat source 300. The controller 110 is connected with the cold source 130 and the heat source 300 through wires, wherein the controller 110 is used for controlling the heat source 300 to generate heat with a first preset power; the controller 110 is further configured to control the cooling source 130 to cool at a second preset power; the controller 110 is further configured to obtain an instant temperature T of the heat source 300 after the heat source 300 generates heat at the first predetermined power and lasts for a first predetermined time T1, and determine whether the adhesion degree between the heat source 300 and the heat dissipation plate 200 reaches the standard according to the instant temperature T.
Specifically, when the heat source 300 and the cold source 130 are actually controlled, the preset current Ia may be input and the preset current Ia is continued for the first preset time T1, and after the first preset time T1 elapses, the instant temperature T of the heat source 300 is obtained by the temperature sensor of the heat source 300, and whether the adhesion degree between the heat source 300 and the heat dissipation plate 200 reaches the standard is determined according to the instant temperature T, which can be referred to in the foregoing.
In this embodiment, the controller 110 may be an integrated circuit chip having signal processing capability. The controller 110 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; but may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components. The various methods, steps and logic blocks disclosed in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor. The controller 110 may also be any conventional processor or the like.
In summary, in the present embodiment, during actual measurement, the heat source 300 is controlled to continuously generate heat at a first preset power to heat the heat dissipation plate 200, and the cooling source 130 is controlled to continuously cool at a second preset power to cool the heat dissipation plate 200, and after the first preset time T1 is continued, the instant temperature T of the heat source 300 is obtained, and whether the adhesion degree of the heat source 300 and the heat dissipation plate 200 reaches the standard is determined according to the magnitude and the variation trend of the instant temperature T. If the fitting degree does not reach the standard, the heat generated by the heat source 300 is not timely transmitted to the heat dissipation plate 200, which may cause the temperature of the heat source 300 to be too high, otherwise, the temperature of the heat source 300 is not too high, that is, the fitting degree between the heat source 300 and the heat dissipation plate 200 may be reflected on the instant temperature T, and the cold source 130 may cool the heat dissipation plate 200, so as to control the heat source 300 within a certain range, thereby avoiding the heat damage to the heat source 300 and the heat dissipation plate 200.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
1. A mounting fitting degree test method for measuring a fitting degree between a heat source (300) and a heat radiating plate (200), characterized by comprising:
controlling a heat source (300) positioned at one side of the heat dissipation plate (200) to generate heat with a first preset power;
controlling a cold source (130) positioned at the other side of the heat dissipation plate (200) to refrigerate at a second preset power;
acquiring the instant temperature T of the heat source (300) after heating at the first preset power and lasting for a first preset time T1;
and judging whether the bonding degree of the heat source (300) and the heat dissipation plate (200) reaches the standard or not according to the instant temperature T.
2. The method for testing the fitting degree of a heat source (300) and the heat dissipating plate (200) according to claim 1, wherein the step of determining whether the fitting degree of the heat source (300) and the heat dissipating plate (200) meets the standard according to the instant temperature T comprises:
if the instant temperature T is less than or equal to a first threshold temperature Ts1, determining that the bonding degree of the heat source (300) and the heat dissipation plate (200) reaches the standard;
if the instant temperature T is greater than the first threshold temperature Ts1 and less than or equal to a second threshold temperature Ts2, determining whether the bonding degree between the heat source (300) and the heat dissipation plate (200) reaches the standard according to the variation δ T of the instant temperature T within a second preset time T2;
if the instant temperature T is greater than a second threshold temperature Ts2, determining that the attaching degree of the heat source (300) and the heat dissipation plate (200) does not reach the standard;
wherein the second threshold temperature Ts2 is greater than the first threshold temperature Ts 1.
3. The method for testing the attachment degree of a heat source (300) and the heat dissipation plate (200) according to the variation δ T of the instant temperature T within the second predetermined time T2, comprising the steps of:
if the variation delta T is larger than a preset quantity delta Tn, judging that the attaching degree of the heat source (300) and the heat dissipation plate (200) does not reach the standard;
and if the variation delta T is smaller than or equal to a preset quantity delta Tn, judging that the bonding degree of the heat source (300) and the heat dissipation plate (200) reaches the standard.
4. The installation fit degree test method according to claim 3, wherein the second preset time t2 is 20s-120 s.
5. The installation fit degree test method according to claim 4, wherein the preset amount δ Tn is-10 ℃ to 0 ℃.
6. The installation conformity testing method of claim 2, wherein the difference between the second threshold temperature Ts2 and the first threshold temperature Ts1 is between 3 ℃ and 10 ℃.
7. The installation conformity testing method according to claim 2, wherein the heat source (300) is a plurality of heat sources, and the step of obtaining the instant temperature T of the heat source (300) after the first preset time T1 comprises:
the instant temperatures T of a plurality of heat sources (300) after a first preset time T1 are respectively obtained.
8. The method for testing the installation conformity according to claim 1, wherein the step of controlling the heat source (300) on the side of the heat dissipation plate (200) to generate heat with a first preset power comprises: and inputting a first preset current to the heat source (300) positioned on one side of the heat dissipation plate (200) so that the heat source (300) generates heat with the first preset power.
9. The mounting conformity degree test method according to claim 1, wherein, before the step of controlling the heat source (300) on the side of the heat dissipation plate (200) to generate heat at the first preset power, the mounting conformity degree test method further comprises:
and (2) standing the heat source (300) and the heat dissipation plate (200) in a space with the environment temperature of a preset temperature Ta for a preset slow cooling time t 0.
10. The installation conformity testing method of claim 1, wherein the first predetermined power and the second predetermined power are the same.
11. The installation conformity testing method of claim 1, wherein the cold source (130) is a semiconductor refrigeration sheet.
12. A mounting conformity testing system (100) adapted to the mounting conformity testing method according to claim 1 and used for measuring a conformity between a heat source (300) and a heat dissipation plate (200), wherein the mounting conformity testing system (100) comprises a heat source (130) and a controller (110), the heat source (300) is located at one side of the heat dissipation plate (200), the heat source (130) is located at the other side of the heat dissipation plate (200), and the controller (110) is electrically connected with the heat source (300) and the heat source (130), respectively;
wherein the controller (110) is used for controlling the heat source (300) to generate heat with a first preset power;
the controller (110) is further used for controlling the cold source (130) to refrigerate at a second preset power;
the controller (110) is further configured to obtain an instant temperature T of the heat source (300) after the heat source generates heat at the first preset power and lasts for a first preset time T1, and determine whether the adhesion degree between the heat source (300) and the heat dissipation plate (200) reaches a standard according to the instant temperature T.
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Effective date of registration: 20221010 Address after: 315191 No. 1166 Mingguang North Road, Jiangshan Town, Ningbo, Zhejiang, Yinzhou District Applicant after: NINGBO AUX ELECTRIC Co.,Ltd. Applicant after: AUX AIR CONDITIONING LIMITED BY SHARE Ltd. Address before: 315000 No.1166 Mingguang North Road, Jiangshan Town, Yinzhou District, Ningbo City, Zhejiang Province Applicant before: NINGBO AUX ELECTRIC Co.,Ltd. Applicant before: Ningbo Oxfam intelligent commercial air conditioning manufacturing Co.,Ltd. |
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