CN104597387A - Semiconductor chilling plate parameter testing device and multi-parameter measuring method - Google Patents
Semiconductor chilling plate parameter testing device and multi-parameter measuring method Download PDFInfo
- Publication number
- CN104597387A CN104597387A CN201510035472.5A CN201510035472A CN104597387A CN 104597387 A CN104597387 A CN 104597387A CN 201510035472 A CN201510035472 A CN 201510035472A CN 104597387 A CN104597387 A CN 104597387A
- Authority
- CN
- China
- Prior art keywords
- chilling plate
- semiconductor chilling
- module
- temperature
- stationary fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a semiconductor chilling plate parameter testing device. The semiconductor chilling plate parameter testing device comprises a cooling fan, a copper radiator, a sample fixing clamp, a fixing guide rail, a ball screw, a mobile sliding platform, a pressure aluminum block, a control box, a temperature measuring module, a voltage measuring module, a pressure detection module, a motor driving module and a stepping motor; the copper radiator is connected with the sample fixing clamp; the ball screw which is for the mobile sliding platform is installed inside the mobile sliding platform; the stepping motor drives the ball screw through the motor driving module; the pressure aluminum block is fixed on the lateral side of the mobile sliding platform which is opposite to the sample fixing clamp; the copper radiator is connected with the temperature measuring module; the pressure aluminum block is connected with a pressure detection quantity module. According to the semiconductor chilling plate parameter testing device, costs of a semiconductor device are reduced and a plurality of parameters can be measured due to the brand new measuring method and a corresponding structural design.
Description
Technical field
The present invention relates to thermoelectric material field tests, be specifically related to a kind of proving installation and measuring method of semiconductor chilling plate.
Background technology
Semiconductor chilling plate is the energy transducer manufactured based on Seebeck effect and paltie effect, electric energy can be converted into heat energy.The advantages such as it has pollution-free, noiselessness, and the life-span is long, along with the enhancing of mankind's environmental consciousness, the range of application of semiconductor chilling plate is also increasing.Figure of merit Z weighs semiconductor chilling plate refrigerating efficiency parameter the most intuitively.N is the logarithm of all thermocouples in semiconductor chilling plate, the logarithm deficiency of thermocouple can affect the refrigeration of cooling piece, the refrigerating efficiency ε of semiconductor chilling plate under identical temperature different pressures is the important parameter weighing semiconductor chilling plate workmanship, and colory semiconductor chilling plate is at setting pressure 0.002N/m
2~ 0.0085N/m
2between time refrigerating efficiency higher, and it is not too large to fluctuate, and cooling piece poor quality brings unnecessary trouble by giving the installation of cooling piece, and the product produced does not have consistance.Accurately, measure above three parameters of semiconductor chilling plate easily to the product quality improving semiconductor chilling plate, and to the selection needing to use the manufacturer of semiconductor chilling plate convenient and correct, buying semiconductor chilling plate has very important using value.As " thermoelectric material tester " disclosed a kind of thermoelectric material tester that patent publication No. is CN102004123 A, comprise worktable and be located at the casing on worktable, conductivity measuring apparatus and thermoelectromotive force measurement mechanism, the front panel of casing is embedded with low-resistance meter, voltage measurement table and temperature display watch, the current output terminal of low-resistance meter, voltage input end and conductivity measuring apparatus electrical connection, thermoelectromotive force measurement mechanism is provided with electrical heating elements and temperature sensor, electrical heating elements and the power module electrical connection be located in casing, temperature sensor and temperature display watch electrical connection, voltage measurement table and the electrical connection of thermoelectromotive force measurement mechanism.Above-mentioned thermoelectric material tester only measures Seebeck coefficient and conductivity, and Seebeck coefficient and conductivity test method loaded down with trivial details, make complicated.
Comprehensively above-mentioned, there is the space of improving further in existing semiconductor chilling plate multi-parameters test device.
Summary of the invention
Technical matters to be solved by this invention a kind ofly provides brand-new method of testing, thus record the semiconductor chilling plate proving installation of many kinds of parameters.
The present invention solves the problems of the technologies described above adopted technical scheme:
A kind of semiconductor chilling plate parameter measuring apparatus, comprise radiator fan, copper radiator, sample stationary fixture, fixed guide, ball screw, Mobile Slide, pressure aluminium block, temperature-measuring module, voltage measurement module, it is characterized in that: also comprise a pressure measuring module, motor drive module, stepper motor, described copper radiator is connected with described sample stationary fixture, described radiator fan, sample stationary fixture is installed on fixed guide, the corresponding other end of described sample stationary fixture is provided with a Mobile Slide, one is provided with for the ball screw of Mobile Slide in described Mobile Slide, described stepper motor drives described ball-screw by described motor drive module, described pressure aluminium block is fixed on the Mobile Slide side relative with described sample stationary fixture, described copper radiator is connected with described temperature-measuring module, described pressure aluminium block is connected with described pressure measuring module, described voltage measurement module is positioned on sample stationary fixture.
The first, semiconductor chilling plate to be measured is fixed on described sample stationary fixture, drives cooling piece by semiconductor chilling plate driver module (17), by described voltage measurement module, obtain the resistive voltage V at refrigerator two ends
rwith Sai Beike voltage Vs, described temperature-measuring module is measured respectively and is obtained semiconductor chilling plate cold junction temperature T and hot-side temperature T
0;
The second, by above-mentioned parameters obtained V
r, Vs and T be updated to
thus obtain the figure of merit Z needing measurement;
3rd, by motor drive module Driving Stepping Motor, drive ball-screw, promote pressure aluminium block, thus apply different pressures to semiconductor chilling plate to be measured, described temperature-measuring module is measured respectively and is obtained semiconductor chilling plate cold junction temperature T and hot-side temperature T simultaneously
0, by the T gathered, T
0, the Z recorded with second step substitutes into
obtain the refrigerating efficiency ε of the semiconductor chilling plate under each pressure;
4th, record the cold junction temperature T under the maximum refrigerating efficiency of semiconductor chilling plate and hot-side temperature T
0be updated to computing formula
thus obtain single operating voltage V0 to thermocouple, wherein
s is the Seebeck coefficient of semiconductor refrigerating sheet material;
5th, will single operating voltage V to thermocouple of gained be calculated
0with the total voltage V=V recorded
r+ Vs is updated to formula
thus obtain the logarithm N of thermocouple.
Compared with prior art, the invention has the advantages that: this is owing to adopting brand-new measuring method and carrying out corresponding structural design, thus reduce the cost of semiconductor device and measure many kinds of parameters.
Accompanying drawing explanation
Fig. 1 is semiconductor chilling plate parameter measuring apparatus structural representation;
Fig. 2 is that semiconductor chilling plate proving installation controls schematic diagram;
Fig. 3 is the curve map of measuring voltage and response time relation.
Embodiment
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
A kind of semiconductor chilling plate parameter measuring apparatus as shown in Figure 1, comprise radiator fan 1, copper radiator 2, sample stationary fixture 3, fixed guide 4, ball screw 5, Mobile Slide 6, pressure aluminium block 7, stepper motor 10, control enclosure 11, temperature-measuring module 13, voltage measurement module 14, pressure measuring module 15, motor drive module 16, semiconductor chilling plate driver module 17, control enclosure 11, described control enclosure 11 is positioned at fixed guide 4 right-hand member, described copper radiator 2 is connected with described sample stationary fixture 3, described radiator fan 1, sample stationary fixture 3 is installed on fixed guide 4, the corresponding other end of described sample stationary fixture 3 is provided with a Mobile Slide 6, one is provided with for the ball screw 5 of Mobile Slide in described Mobile Slide 6, described stepper motor 10 drives described ball-screw 5 by described motor drive module 16, described pressure aluminium block 7 is fixed on Mobile Slide 6 side relative with described sample stationary fixture 3, described copper radiator 2 is connected with temperature-measuring module 13, described pressure aluminium block 7 is connected with described pressure measuring module 15, described voltage measurement module 14 is positioned on sample stationary fixture 3, described semiconductor chilling plate driver module 17 is for driving semiconductor chilling plate work.
Semiconductor chilling plate proving installation as shown in Figure 2 controls schematic diagram, voltage measurement module 14, temperature-measuring module 13, pressure measuring module 15, motor drive module 16, semiconductor chilling plate driver module 17 is connected respectively in above-mentioned control box, and described control enclosure is communicated with host computer 19 by RS232, and host computer by measured Signal aspects out.
The semiconductor chilling plate Multi-parameter Measurement Method adopted is as follows:
The first, semiconductor chilling plate to be measured is fixed on described sample stationary fixture 3, drives cooling piece by semiconductor chilling plate driver module 17, by described voltage measurement module 14, obtain the resistive voltage V at refrigerator two ends
rwith Sai Beike voltage Vs, described temperature-measuring module 13 is measured respectively and is obtained semiconductor chilling plate cold junction temperature T and hot-side temperature T
0;
The second, by above-mentioned parameters obtained V
r, Vs and T be updated to
thus obtain the figure of merit Z needing measurement;
3rd, by motor drive module 16 Driving Stepping Motor 10, drive ball-screw 5, promote pressure and apply aluminium block 7, thus different pressures is applied to semiconductor chilling plate to be measured, described temperature-measuring module 13 is measured respectively and is obtained semiconductor chilling plate cold junction temperature T and hot-side temperature T simultaneously
0, by the T gathered, T
0, the Z recorded with second step substitutes into
obtain the refrigerating efficiency ε of the semiconductor chilling plate under each pressure.
4th, record the cold junction temperature T under the maximum refrigerating efficiency of semiconductor chilling plate and hot-side temperature T
0be updated to computing formula
thus obtain single operating voltage v to thermocouple
0, wherein
s is the Seebeck coefficient of semiconductor refrigerating sheet material;
5th, will single operating voltage V to thermocouple of gained be calculated
0with the total voltage V=V recorded
r+ Vs is updated to formula
thus obtain the logarithm N of thermocouple.
The curve map of voltage as shown in Figure 3 and response time relation, the voltage at the two ends of semiconductor chilling plate is Sai Beike voltage V
swith device resistance voltage V
rsum.Match Bake voltage V
s=S Δ T (t), wherein S is Seebeck coefficient, and during t=0, the temperature difference is zero, V
s=0; Along with the increase of the temperature difference, V
sincrease, when the temperature difference rises to maximal value Δ T
maxtime, V
salso reach and remain stable.V
r=IR, I are strength of current, and R is device resistance.Resistive voltage reaches stationary value instantaneously in energising.So the magnitude of voltage at semiconductor chilling plate two ends can be expressed as:
V(t，I)＝IR+SΔT(t)
Semiconductor chilling plate driver module 17 drives semiconductor chilling plate, and drive current is the electric current of 1/50 of maximum temperature difference corresponding current, and voltage measurement module 14 successively can measure V
rand V
svalue.
Claims (2)
1. a semiconductor chilling plate parameter measuring apparatus, comprise radiator fan (1), copper radiator (2), sample stationary fixture (3), fixed guide (4), ball screw (5), Mobile Slide (6), pressure aluminium block (7), temperature-measuring module (13), voltage measurement module (14), it is characterized in that: also comprise a pressure measuring module (15), motor drive module (16), stepper motor (10), described copper radiator (2) is connected with described sample stationary fixture (3), described radiator fan (1), sample stationary fixture (3) is installed on fixed guide (4), the other end that described sample stationary fixture (3) is corresponding is provided with a Mobile Slide (6), one is provided with for the ball screw (5) of Mobile Slide in described Mobile Slide (6), described stepper motor (10) drives described ball-screw (5) by described motor drive module (16), described pressure aluminium block (7) is fixed on Mobile Slide (6) side relative with described sample stationary fixture (3), described copper radiator (2) is connected with described temperature-measuring module (13), described pressure aluminium block (7) is connected with described pressure measuring module (15), described voltage measurement module (14) is positioned on sample stationary fixture (3).
2. apply a semiconductor chilling plate Multi-parameter Measurement Method as claimed in claim 1, it is characterized in that:
First, semiconductor chilling plate to be measured is fixed on described sample stationary fixture (3), drive cooling piece by semiconductor chilling plate driver module (17), by described voltage measurement module (14), obtain the resistive voltage V at refrigerator two ends
rwith Sai Beike voltage Vs, described temperature-measuring module (13) is measured respectively and is obtained semiconductor chilling plate cold junction temperature T and hot-side temperature T
0;
The second, by above-mentioned parameters obtained V
r, Vs and T be updated to
thus obtain the figure of merit Z needing measurement;
3rd, by motor drive module (16) Driving Stepping Motor (10), drive ball-screw (5), promote pressure aluminium block (7), thus different pressures is applied to semiconductor chilling plate to be measured, described temperature-measuring module (13) is measured respectively and is obtained semiconductor chilling plate cold junction temperature T and hot-side temperature T simultaneously
0, by the T gathered, T
0, the Z recorded with second step substitutes into
obtain the refrigerating efficiency ε of the semiconductor chilling plate under each pressure;
4th, record the cold junction temperature T under the maximum refrigerating efficiency of semiconductor chilling plate and hot-side temperature T
0be updated to computing formula
thus obtain single operating voltage V to thermocouple
0, wherein
s is the Seebeck coefficient of semiconductor refrigerating sheet material;
5th, will single operating voltage V to thermocouple of gained be calculated
0with the total voltage V=V recorded
r+ Vs is updated to formula
thus obtain the logarithm N of thermocouple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510035472.5A CN104597387B (en) | 2015-01-23 | 2015-01-23 | A kind of semiconductor chilling plate parameter test device and Multi-parameter Measurement Method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510035472.5A CN104597387B (en) | 2015-01-23 | 2015-01-23 | A kind of semiconductor chilling plate parameter test device and Multi-parameter Measurement Method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104597387A true CN104597387A (en) | 2015-05-06 |
| CN104597387B CN104597387B (en) | 2017-11-17 |
Family
ID=53123297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510035472.5A Active CN104597387B (en) | 2015-01-23 | 2015-01-23 | A kind of semiconductor chilling plate parameter test device and Multi-parameter Measurement Method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104597387B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108279342A (en) * | 2018-01-18 | 2018-07-13 | 肇庆市众自动化设备有限公司 | A kind of different voltage performance test system of element |
| CN109444605A (en) * | 2018-12-14 | 2019-03-08 | 厦门市百岗电气有限公司 | A kind of the on-line monitoring circuit and monitoring method of semiconductor chilling plate |
| CN110220937A (en) * | 2019-06-14 | 2019-09-10 | 华中科技大学 | A kind of thermoelectric refrigerating module life-span prediction method and device |
| CN110375870A (en) * | 2019-08-28 | 2019-10-25 | 青岛大学 | Surface temperature measurement method based on thermoelectric effect |
| CN113030686A (en) * | 2021-05-27 | 2021-06-25 | 武汉乾希科技有限公司 | Test apparatus and test method for semiconductor refrigerators |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101285788A (en) * | 2008-05-20 | 2008-10-15 | 中山大学 | Pyroelectric material measuring apparatus |
| JP2011060911A (en) * | 2009-09-08 | 2011-03-24 | Toshiba Corp | Wafer test device |
| CN102004123A (en) * | 2010-10-25 | 2011-04-06 | 常山县万谷电子科技有限公司 | Thermoelectric material tester |
| CN103196947A (en) * | 2013-04-01 | 2013-07-10 | 上海理工大学 | Thermoelectric performance measuring device and measuring method of thermoelectric refrigeration chip |
| CN103472087A (en) * | 2013-03-15 | 2013-12-25 | 深圳市彩煌实业发展有限公司 | Thermoelectric material Seebeck coefficient measuring apparatus and method thereof |
| CN103675017A (en) * | 2012-09-12 | 2014-03-26 | 北京中建建筑科学研究院有限公司 | Testing device and method for thermal conductivity coefficient of material |
| CN104076265A (en) * | 2014-06-15 | 2014-10-01 | 北京工业大学 | Method and device for rapidly measuring electrical parameter temperature variation coefficient of semiconductor device |
-
2015
- 2015-01-23 CN CN201510035472.5A patent/CN104597387B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101285788A (en) * | 2008-05-20 | 2008-10-15 | 中山大学 | Pyroelectric material measuring apparatus |
| JP2011060911A (en) * | 2009-09-08 | 2011-03-24 | Toshiba Corp | Wafer test device |
| CN102004123A (en) * | 2010-10-25 | 2011-04-06 | 常山县万谷电子科技有限公司 | Thermoelectric material tester |
| CN103675017A (en) * | 2012-09-12 | 2014-03-26 | 北京中建建筑科学研究院有限公司 | Testing device and method for thermal conductivity coefficient of material |
| CN103472087A (en) * | 2013-03-15 | 2013-12-25 | 深圳市彩煌实业发展有限公司 | Thermoelectric material Seebeck coefficient measuring apparatus and method thereof |
| CN103196947A (en) * | 2013-04-01 | 2013-07-10 | 上海理工大学 | Thermoelectric performance measuring device and measuring method of thermoelectric refrigeration chip |
| CN104076265A (en) * | 2014-06-15 | 2014-10-01 | 北京工业大学 | Method and device for rapidly measuring electrical parameter temperature variation coefficient of semiconductor device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108279342A (en) * | 2018-01-18 | 2018-07-13 | 肇庆市众自动化设备有限公司 | A kind of different voltage performance test system of element |
| CN108279342B (en) * | 2018-01-18 | 2021-07-23 | 肇庆市众一自动化设备有限公司 | Different voltage performance test system of component |
| CN109444605A (en) * | 2018-12-14 | 2019-03-08 | 厦门市百岗电气有限公司 | A kind of the on-line monitoring circuit and monitoring method of semiconductor chilling plate |
| CN110220937A (en) * | 2019-06-14 | 2019-09-10 | 华中科技大学 | A kind of thermoelectric refrigerating module life-span prediction method and device |
| CN110220937B (en) * | 2019-06-14 | 2020-11-24 | 华中科技大学 | Method and device for predicting service life of thermoelectric refrigeration module |
| CN110375870A (en) * | 2019-08-28 | 2019-10-25 | 青岛大学 | Surface temperature measurement method based on thermoelectric effect |
| CN110375870B (en) * | 2019-08-28 | 2020-10-09 | 青岛大学 | Surface temperature measuring method based on thermoelectric effect |
| CN113030686A (en) * | 2021-05-27 | 2021-06-25 | 武汉乾希科技有限公司 | Test apparatus and test method for semiconductor refrigerators |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104597387B (en) | 2017-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104597387A (en) | Semiconductor chilling plate parameter testing device and multi-parameter measuring method | |
| CN101285788B (en) | Pyroelectric material measuring apparatus | |
| CN103162856B (en) | A kind of contactless great power LED method for testing junction temperature | |
| CN201673133U (en) | Heat transfer coefficient detector of building retaining structure | |
| CN109406573B (en) | Testing device and testing method for testing heat conductivity of heat-conducting silica gel pad | |
| CN103323284B (en) | A kind of thermoelectric cooling device for measuring properties and method thereof | |
| CN103196947A (en) | Thermoelectric performance measuring device and measuring method of thermoelectric refrigeration chip | |
| CN103823170B (en) | Novel method for measuring thermal resistance of power-type LED integration module | |
| CN203365163U (en) | Thermoelectricity refrigeration performance measuring device | |
| CN114544699B (en) | Method for testing thermal resistance and thermal conductivity coefficient of material | |
| Hejtmánek et al. | Test system for thermoelectric modules and materials | |
| CN104122469B (en) | Method for increasing measured seebeck coefficient accuracy of thermoelectric material | |
| CN104006983A (en) | Intelligent test system for heat resistance of CPU radiator and test method of intelligent test system | |
| CN107329507A (en) | A kind of thermostatic control system | |
| CN203502369U (en) | Temperature regulation capacity test device for phase-change material textile | |
| CN108459191A (en) | A kind of Portable thermal potential detector | |
| CN215599052U (en) | Protection heat flat plate heat conduction instrument for measuring medium temperature | |
| CN105116008A (en) | System component based on accomplishing measurement of heat conductivity coefficients of to-be-test samples with different thicknesses | |
| CN104914299A (en) | Comparison heat measuring device for measuring loss of magnetic element and measurement method thereof | |
| CN206235899U (en) | Solar cell temperature control tests base station | |
| JP2014139558A (en) | Heating test device | |
| CN203758634U (en) | Cold face temperature uniformity testing apparatus for thermoelectric refrigeration components | |
| CN213600368U (en) | Device for polarity reverse installation test of semiconductor refrigerator | |
| CN108760807A (en) | A kind of Cabinet heat transfer coefficient test system and method | |
| CN207231807U (en) | A kind of test platform of SVG heat-pipe radiators characteristic |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |