CN113177382A

CN113177382A - Product and circuit board design method and device thereof, computing equipment and storage medium

Info

Publication number: CN113177382A
Application number: CN202110465815.7A
Authority: CN
Inventors: 苏小燕; 黄茂涵
Original assignee: PAX Computer Technology Shenzhen Co Ltd
Current assignee: PAX Computer Technology Shenzhen Co Ltd
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2021-07-27
Anticipated expiration: 2041-04-28
Also published as: CN113177382B

Abstract

The application is applicable to the technical field of data processing, and provides a product and a circuit board design method, a device, a computing device and a storage medium thereof, wherein the method comprises the following steps: acquiring form information of a product; modifying bill of material data of the layout design of the preset circuit board according to the form information; and outputting the modified bill of material data. The embodiment of the application can simplify material management and can obtain higher output with less input.

Description

Product and circuit board design method and device thereof, computing equipment and storage medium

Technical Field

The application belongs to the technical field of data processing, and particularly relates to a product, a circuit board design method and device thereof, a computing device and a storage medium.

Background

With the continuous development and progress of electronic products, more and more products present diversified and personalized designs, and a series is often developed for the same product, so that the configuration of different products can meet diversified requirements of different customers. Therefore, in actual production, different series can appear in the same product, and the series correspond to different bill of materials, so that the material management is complicated.

Disclosure of Invention

Embodiments of the present application provide a product and a method and an apparatus for designing a circuit board thereof, a computing device and a storage medium, which can simplify material management, obtain higher output with less investment, improve production efficiency and reduce overall production cost.

In a first aspect, an embodiment of the present application provides a method for designing a circuit board of a product, where the method includes:

acquiring form information of a product;

modifying bill of material data of the layout design of the preset circuit board according to the form information;

and outputting the modified bill of material data.

In a possible implementation manner of the first aspect, the bill of material data includes a data processing module, a switching module, an interface, and N functional modules, the form information includes M functional modules of the N functional modules, M is greater than or equal to 0 and less than or equal to N, and M and N are integers;

the connection relationship of each component in the bill of material data in the preset circuit board layout design is as follows: the data processing module, the switching module and the interfaces are sequentially connected, and the interfaces are respectively connected with the N functional modules;

the modifying the bill of material data of the layout design of the preset circuit board according to the form information comprises the following steps:

reserving the M functional modules in the preset bill of materials data, and deleting the rest functional modules;

the method further comprises the following steps:

and setting the switching module to establish data interaction between the data processing module and the M functional modules.

In a possible implementation manner of the first aspect, the bill of material data includes a data processing module, P interfaces, and P functional modules, the form information includes Q functional modules of the P functional modules, Q is greater than or equal to 0 and is less than or equal to P, and Q and P are integers;

the connection relationship of each component in the bill of material data in the preset circuit board layout design is as follows: the data processing module is respectively connected with the P interfaces, and the P interfaces are respectively connected with the P functional modules in a one-to-one correspondence manner;

and reserving the Q functional modules in the bill of material data, and deleting the rest functional modules.

In a possible implementation manner of the first aspect, the interface is a pad, the bill of material data further includes P connectors, and a connection relationship of the P connectors in the preset circuit board layout design is: each of the connectors is connected between one of the interfaces and one of the functional modules;

the modifying the bill of material data of the layout design of the preset circuit board according to the form information further comprises: and reserving Q connecting pieces in the bill of material data, and deleting the remaining connecting pieces.

In a possible implementation manner of the first aspect, the bill of material data includes a data processing module, an interface, and R functional modules, the form information includes one functional module of the R functional modules, and R is an integer;

the connection relationship of each component in the bill of material data in the preset circuit board layout design is as follows: the data processing module is connected with the interfaces, and the interfaces are respectively connected with the R functional modules;

and reserving the functional module in the bill of material data, and deleting the rest functional modules.

In a possible implementation manner of the first aspect, the interface is a pad, the bill of material data further includes N connectors or R connectors, and a connection relationship of the connectors in the preset circuit board layout design is: each connecting piece is connected between the interface and one functional module;

the modifying the bill of material data of the layout design of the preset circuit board according to the form information further comprises: at least one of the connections in the bill of material data is retained and the remaining connections are deleted.

In a second aspect, an embodiment of the present application provides a product, which is implemented according to the circuit board design method of the product of any one of the first aspect.

In a third aspect, an embodiment of the present application provides a circuit board design apparatus, including:

a form information acquiring unit for acquiring form information of a product;

a data modification unit to: modifying bill of material data of the layout design of the preset circuit board according to the form information;

and the data output unit is used for outputting the modified bill of material data.

In a fourth aspect, an embodiment of the present application provides a computing device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor implementing the method of any one of the first aspect when executing the computer program.

In a fifth aspect, embodiments of the present application provide a computer-readable storage medium storing a computer program which, when executed by a processor, implements the method of any one of the first aspects described above.

In a sixth aspect, embodiments of the present application provide a computer program product, which, when run on a terminal device, causes the terminal device to perform the method of any one of the above first aspects.

Compared with the prior art, the embodiment of the application has the beneficial effects that:

according to the acquired form information of the product, the bill of material data of the layout design of the preset circuit board is modified, so that the bill of material data of the product is acquired and output, material management can be simplified, and production efficiency can be improved.

Some possible implementations of embodiments of the present application have the following beneficial effects:

the product comprises a circuit board and a data processing module, wherein the circuit board can be compatible with N functional modules (the interface of the circuit board is used for sharing the N functional modules); the product optionally further comprises a switching module, wherein the switching module is used for connecting the N functional modules to the interface, and the data processing module is connected with the switching module; determining bill of material data of the product according to the form information of the product (the product comprises M functional modules in the N functional modules), wherein the bill of material data comprises the product data of the M functional modules in the product data of the N functional modules, the product data of the circuit board and the product data of the data processing module; therefore, according to the bill of material data, a few circuit boards are designed, a series of diversified and individual products with different functional characteristics can be obtained, the content of the bill of material data corresponding to the products has more same parts, material management can be simplified, higher output can be obtained with less investment, production efficiency can be improved, and the overall production cost can be reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a first product according to a first embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a second product provided in the first embodiment of the present application;

FIG. 3 is a schematic structural diagram of a third product provided in the first embodiment of the present application;

FIG. 4 is a schematic structural diagram of a fourth product provided in the first embodiment of the present application;

FIG. 5 is a flowchart illustrating a method for processing bill of material data of a product according to a first embodiment of the present application;

FIG. 6 is a schematic diagram of a third alternative embodiment of the present disclosure;

FIG. 7 is a schematic diagram of another variation of the first product provided by the first embodiment of the present application;

FIG. 8 is a schematic diagram of a second variation of the second product provided by the first embodiment of the present application;

FIG. 9 is a schematic structural diagram of a first product provided in a second embodiment of the present application;

FIG. 10 is a schematic structural diagram of a second product provided in a second embodiment of the present application;

FIG. 11 is a schematic structural view of a third product provided in accordance with a second embodiment of the present application;

FIG. 12 is a schematic structural view of a fourth product provided in accordance with a second embodiment of the present application;

FIG. 13 is a schematic diagram of a variation of the first product provided by the second embodiment of the present application;

FIG. 14 is a schematic diagram of a second product according to a second embodiment of the present disclosure;

FIG. 15 is a schematic structural diagram of a first product provided by a third embodiment of the present application;

FIG. 16 is a schematic structural diagram of a second product provided in a third embodiment of the present application;

FIG. 17 is a schematic diagram of a variation of the first product provided by the third embodiment of the present application;

FIG. 18 is a schematic diagram of a second product in accordance with a third embodiment of the present application;

FIG. 19 is a schematic diagram illustrating a physical PIN keying product according to an embodiment of the present application;

FIG. 20 is a schematic structural diagram of a variation of a physical key PIN pad product according to an embodiment of the present application;

FIG. 21 is a schematic structural diagram of a touch screen PIN entry product according to an embodiment of the present application;

fig. 22 is a circuit board assembly diagram of a product a according to an embodiment of the present application;

fig. 23 is a circuit board assembly diagram of a product B according to an embodiment of the present application;

fig. 24 is a circuit board assembly diagram of a product C according to an embodiment of the present application;

FIG. 25 is a schematic structural diagram of an apparatus for processing bill of material data of a product according to a fourth embodiment of the present application;

fig. 26 is a schematic structural diagram of a computing device according to an embodiment of the present application.

Detailed Description

In order to make the technical problems, technical solutions and advantages to be solved by the present application more clearly apparent, the present application is further described in detail below with reference to fig. 1 to 26 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to" determining "or" in response to detecting ". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, in the description of the present application and the appended claims, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

First embodiment

The embodiment provides a product and a circuit board design method thereof; the product is an electronic product, and can be a Point of sale (POS) machine, a mainboard, a sound card or a network card, and the like.

Fig. 1 to 4 are schematic structural diagrams of four products provided in this embodiment. The product provided by this embodiment is a circuit board circuit, which corresponds to a predetermined circuit board layout design stored in the storage device at the circuit design stage. The product of the present embodiment (i.e., circuit board circuit) includes a circuit board 1 and a data processing module 2. The circuit board 1 is a support for various electronic components. The circuit board 1 is exemplified by a printed circuit board or a flexible circuit board.

The data processing module 2 is a module capable of realizing functions required by a product. Illustratively, the data processing module 2 is an integrated circuit, such as a central processing unit; the data processing module 2 may also be a discrete component circuit, wherein a discrete component circuit is a circuit that is formed by connecting individual electronic components.

The data processing module 2 is disposed on the circuit board 1. Illustratively, the data processing module 2 is soldered on the surface of the circuit board 1.

The circuit board design method of the product provided by the embodiment can be applied to computing equipment and used for designing the circuit board to obtain the product of the embodiment. The aforementioned computing device may be a server, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, and a Personal Digital Assistant (PDA), and the embodiment of the present application does not set any limit to a specific type of the computing device.

Fig. 5 shows a schematic flow chart of the circuit board design method provided by the present embodiment. The method includes steps a1 through A3.

And step A1, obtaining the form information of the product.

The products provided by the embodiment have different series, and the series correspond to different product forms, namely different forms, so as to meet different user requirements. As mentioned above, the product provided by this embodiment is a circuit board circuit, which corresponds to the predetermined circuit board layout design stored in the storage device in the circuit design stage. The circuit board layout is pre-designed for designing different products.

In this embodiment, the predetermined circuit board layout design includes a circuit board 1, a data processing module 2, a switching module 5, an interface and N functional modules, where N is an integer. In the present embodiment, the circuit board 1 is a compatible circuit board, and can be used for products with different forms.

The form information of the product is determined by the function of the product. The product form information includes a plurality of information, and in this embodiment, the product form information includes: the product comprises M functional modules in the N functional modules, wherein M is more than or equal to 0 and less than or equal to N, and M and N are integers.

The present embodiment is described by taking N equal to 2 as an example, and then the N functional modules are the first functional module 3 and the second functional module 4. The aforementioned one interface is an interface of the circuit board 1, which is the first interface 11. Referring to fig. 1 to 4, the switching module 5 is configured to be connected to one or both of the first functional module 3 and the second functional module 4 through the first interface 11, and the data processing module 2 is configured to be connected to the switching module 5. The switching module 5 is a switching circuit and is controlled by the data processing module 2, and the switching module may be in various forms such as a resistor, a switch, and the like, and is used for selecting module components (such as the first functional module 3 and the second functional module 4) to access the data processing module 2; therefore, the switching module 5 is also configured to establish data interaction between the data processing module 2 and the M functional modules. The connection relationship of each part in the layout design of the preset circuit board is as follows: the data processing module 2, the switching module 5 and the interface 11 are connected in sequence, and the interface is connected with the first functional module 3 and the second functional module 4 respectively.

In the present embodiment, the product includes one, both, or neither of the first functional module 3 and the second functional module 4; that is, the product of the first form includes the first function module 3 and does not include the second function module 4 (M is equal to 1 in this case), the product of the second form includes the second function module 4 and does not include the first function module 3 (M is equal to 1 in this case), the product of the third form includes the first function module 3 and the second function module 4 (M is equal to N is equal to 2 in this case), and the product of the fourth form includes neither the first function module 3 nor the second function module 4 (M is equal to 0 in this case).

In this embodiment, the product form information further includes: the circuit board 1 is provided with a first interface 11, and the first interface 11 can be shared by the first functional module 3 and the second functional module 4. In particular, if the product comprises one of the first functional module 3 and the second functional module 4, the first interface 11 is used by the first functional module 3 or the second functional module 4, such as: the first interface 11 is connected to the first functional module 3, or the first interface 11 is connected to the second functional module 4. If the product includes the first functional module 3 and the second functional module 4, the first interface 11 is connected to both the first functional module 3 and the second functional module 4, and at this time, the first functional module 3 and the second functional module 4 share the first interface 11. If the product does not comprise the first functional module 3 and the second functional module 4, the first interface 11 is idle.

If the product comprises at least one of the first functional module 3 and the second functional module 4, the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, and the other side of the first interface 11 is connected to one or both of the first functional module 3 and the second functional module 4.

There are various ways to obtain the morphological information of the product: the form information of the product can be input by a user, and the computing device receives the form information; or the computing equipment reads the pre-stored form information from the memory of the computing equipment; alternatively, the computing device obtains the morphology information from other devices over a network.

And step A2, modifying the bill of material data of the layout design of the preset circuit board according to the form information of the product.

A bill of materials is a list of all the child assemblies, middleware, parts, and raw materials that make up a parent assembly, including the number of children required for assembly. The parent assembly is the product in this embodiment.

Each part constituting the product corresponds to the product data of each part, and the product data of each part includes, but is not limited to, name, specification, model, quantity, and material. The product data of each component determines the form of the product of the present embodiment.

The layout design of the preset circuit board corresponds to bill of material data, which is preset bill of material data and is stored by the computing device, for example, the memory of the computing device stores the preset bill of material data. The preset bill of material data contains complete product data, is general bill of material data and corresponds to the layout design of the preset circuit board; the preset bill of material data can be used as the bill of material data of the product of the embodiment after being modified.

In this embodiment, the preset bill of material data includes a data processing module 2, a switching module 5, an interface 11 and N functional modules.

After the form information of the product is obtained, the computing equipment modifies the preset bill of material data according to the form information of the product to obtain the bill of material data of the product. Specifically, M function modules in the preset bill of material data are retained, and the remaining function modules are deleted (i.e., the remaining N minus M function modules are deleted). And correspondingly modifying the preset circuit board layout design to obtain the modified circuit board layout design for producing the product.

The preset bill of material data includes product data of the first functional module 3 and product data of the second functional module 4. Then, modifying the preset bill of material data includes: the product data of the first functional module 3 and/or the product data of the second functional module 4 are deleted from the preset bill of materials data. Specifically, the method comprises the following steps:

if the form information of the product indicates that the product comprises the first functional module 3 but not the second functional module 4, deleting the product data of the second functional module 4 from the preset bill of materials data, and keeping the product data of the first functional module 3;

if the form information of the product indicates that the product comprises the second functional module 4 but not the first functional module 3, deleting the product data of the first functional module 3 from the preset bill of materials data, and keeping the product data of the second functional module 4;

if the form information of the product indicates that the product comprises the first functional module 3 and the second functional module 4, keeping the product data of the first functional module 3 and the product data of the second functional module 4 in the preset bill of materials data;

and if the form information of the product indicates that the product does not comprise the first functional module 3 and the second functional module 4, deleting the product data of the first functional module 3 and the product data of the second functional module 4 from the preset bill of materials data.

In this manner, modified bill of material data can be obtained.

And step A3, outputting the modified bill of material data.

After obtaining the modified bill of material data, the computing device outputs the bill of material data, such as sending the bill of material data to other devices or displaying the bill of material data via a screen.

Based on the above, the bill of material data of the product determined in this embodiment includes one, both, or neither of the product data of the first functional module 3 and the product data of the second functional module 4, and the bill of material data further includes the product data of the circuit board 1, the product data of the switching module 5, and the product data of the data processing module 2.

According to the method, the bill of material data of the preset circuit board layout design is modified according to the acquired form information of the product, so that the bill of material data of the product is obtained and output, material management can be simplified, and production efficiency can be improved.

The product of the embodiment comprises a circuit board 1 and a data processing module 2, wherein the circuit board 1 can be compatible with a first functional module and a second functional module (a first interface of the circuit board is used for the first functional module and the second functional module to share); the product optionally further comprises a switching module 5, the switching module 5 is used for connecting one or both of the first functional module 3 and the second functional module 4 to the first interface 11 of the circuit board 1, and the data processing module 2 is connected with the switching module 5; determining bill of material data of the product according to the form information of the product (the product comprises one or both of the first functional module 3 and the second functional module 4 or neither), wherein the bill of material data comprises one or both of the product data of the first functional module 3 and the product data of the second functional module 4 or neither, and the bill of material data further comprises the product data of the circuit board and the product data of the data processing module; therefore, according to the bill of material data, a few circuit boards 1 are designed, a series of diversified and individual products with different functional characteristics can be obtained, the content of the bill of material data corresponding to the products has more same parts, material management can be simplified, higher output can be obtained with less investment, production efficiency can be improved, and the overall production cost can be reduced.

The product of this embodiment corresponds to the bill of material data determined by the method of this embodiment, and the product of this embodiment will be described below.

The first functional module 3 and the second functional module 4 are modules having different functions, such as: the first functional module 3 has a function F1 and the second functional module 4 has a function F2.

The products of this example can be classified into the following four types. Fig. 1 to 4 are schematic diagrams showing results of four products provided in this example.

The first product: referring to fig. 1, if the first product only includes function F1, and the product includes first functional module 3 but not second functional module 4, the product data of second functional module 4 is deleted from the predetermined bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the physical key board, and relevant devices of the touch screen are removed from a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1, a data processing module 2 and a switching module 5. In this case (the product only needs the first functional module 3), the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, the other side of the first interface 11 is connected to the first functional module 3, and the data processing module 2 controls the switching module 5 to switch the switching module 5 to a channel capable of communicating with the first functional module 3.

The second product is: referring to fig. 2, if the second product only includes function F2, and the product includes second functional module 4 but not first functional module 3, the product data of first functional module 3 is deleted from the predetermined bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the touch screen, and then relevant devices of the physical key board are removed from a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1, a data processing module 2 and a switching module 5. In this case (the product only needs the second functional module 4), the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, the other side of the first interface 11 is connected to the second functional module 4, and the data processing module 2 controls the switching module 5 to switch the switching module 5 to a channel capable of communicating with the second functional module 4.

A third product: referring to fig. 3, if the third product includes a function F1 and a function F2, and the product includes the first function module 3 and the second function module 4, the product data of the first function module 3 and the product data of the second function module 4 are kept in the preset bill of materials; illustratively, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and if a product needs the physical key board and the touch screen, related devices of the physical key board and the touch screen are reserved in a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1, a data processing module 2 and a switching module 5. In this case (the product needs the first functional module 3 and the second functional module 4), the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, the other side of the first interface 11 is connected to the first functional module 3 and the second functional module 4, the data processing module 2 controls the switching module 5, so that the switching module 5 is switched to a channel capable of communicating with the first functional module 3 or the second functional module 4, and the module function is selected through the switching module 5.

A fourth product: referring to fig. 4, if the fourth product does not include the function F1 or the function F2, and the product does not include the first functional module 3 and the second functional module 4, the product data of the first functional module 3, the product data of the second functional module 4, and the product data of the switching module 5 are deleted from the preset bill of materials; at this time, the product includes a circuit board 1 and a data processing module 2.

Based on the above, the first functional module 3 and the second functional module 4 share the first interface 11 of the circuit board 1, and by switching the module 5 and determining different bill of material data, different products can share the same circuit board 1, and each required module function is selected.

It should be understood that, taking the first functional module 3 (function F1) and the second functional module 4 (function F2) as examples, an actual product may contain N components (N functions), where N is an integer greater than or equal to 2.

The circuit connection method of the product of this embodiment will be explained below.

The first interface 11 is a pad (hereinafter referred to as a first pad 11). In other embodiments, the first interface 11 may also be a PIN (PIN) interface.

Fig. 6 is a schematic structural diagram of a modification of the third product provided in this embodiment. In the present embodiment, the first functional module 3 and the second functional module 4 share the first pad 11 of the circuit board 1, and the first pad 11 transmits different signals, such as: the first pads 11 transmit a first signal for the first functional module 3 and transmit a second signal for the second functional module 4; the corresponding pads of the first functional module 3 and the second functional module 4 on the circuit board 1 are identical, but the pads will transmit different signals. Referring to fig. 6, in order to transmit the signal sent by the data processing module 2 to the first functional module 3 and the second functional module 4, the signal can be switched by the switching module 5. Since the first interface 11 is a pad, the layout design of the predetermined circuit board of the embodiment further includes N connectors, and the connection relationship of the N connectors in the layout design of the predetermined circuit board is as follows: each connector is connected between one interface (pad) and one functional module. Correspondingly, the bill of material data also includes N connectors.

The morphological information of the aforementioned product further comprises: the product includes M of the N connectors. Accordingly, the step a2 (modifying the bill of material data of the predetermined circuit board layout design according to the morphological information) further includes: and keeping M connecting pieces in the preset bill of materials data, and deleting the rest connecting pieces. In this embodiment, referring to fig. 6, the N connection components are a first connection component 6 and a second connection component 9, the switching module 5 is connected to one end of the first connection component 6 and one end of the second connection component 9 through a first pad 11, the other end of the first connection component 6 is connected to the first functional module 3, and the other end of the first connection component 9 is connected to the second functional module 4. If the first functional module 3 is reserved in the preset bill of materials data and the second functional module 4 is deleted, correspondingly reserving the first connecting piece 6 in the preset bill of materials data and deleting the second connecting piece 9; if the second functional module 4 is reserved in the preset bill of materials data and the first functional module 3 is deleted, correspondingly reserving the second connecting piece 9 in the preset bill of materials data and deleting the first connecting piece 6; if the first functional module 3 and the second functional module 4 are reserved in the preset bill of materials data, correspondingly reserving the first connecting piece 6 and the second connecting piece 9 in the preset bill of materials data; if the first functional module 3 and the second functional module 4 are deleted from the preset bill of material data, the first connecting piece 6 and the second connecting piece 9 are also deleted from the preset bill of material data correspondingly. At the same time, the layout design of the predetermined circuit board is modified accordingly.

The first connector 6 and the second connector 9 are illustrated as connectors, and the first connector 6 may be other signal connectors.

For example, when a physical KEY board (also referred to as a KEY board) is adopted, the switching module 5 opens a channel for transmitting a KEY (KEY) signal to the first bonding pad 11, so as to transmit the KEY signal sent by the data processing module 2 to the first bonding pad 11, and then the first connecting piece 6 connected with the first bonding pad 11 accesses the KEY signal to the physical KEY board (i.e., the first functional module 3); when a screen such as a touch screen (i.e., the second functional module 4) is used, the switching module 5 opens a channel for transmitting a touch screen signal to the first bonding pad 11, so that the touch screen signal transmitted by the data processing module 2 is transmitted to the first bonding pad 11, and then the second connecting part 9 connected to the first bonding pad 11 accesses the key signal to the touch screen (i.e., the second functional module 4), such as a flexible circuit board of the touch screen.

Fig. 7 is a schematic structural diagram of a modification of the first product provided in this embodiment. Fig. 8 is a schematic structural diagram of a modification of the second product provided in this embodiment.

In some other embodiments, referring to fig. 7 and 8, in addition to transmitting the signal sent by the data processing module 2 to the first functional module 3 and the second functional module 4 in a channel switching manner by using the switching module 5, the transmission of the signal to the first functional module 3 and the second functional module 4 may be implemented by two (N) intermediate devices:

in this embodiment, the intermediate device may be a resistor, and the two intermediate devices are the first intermediate device 7 and the second intermediate device 8, respectively.

Referring to fig. 7, when a physical keypad is used, the key signal needs to be accessed, and the first intermediate device 7 (e.g., 0 ohm string resistance) is used, then the bill of material data of the product contains the product data of the first intermediate device 7; illustratively, the data processing module 2 is provided with a physical key interface, the physical key interface of the data processing module 2 is connected to the first bonding pad 11 through the first intermediate device 7 (resistor), and then the key signal is connected to the physical key board through the first connecting member 6 connected to the first bonding pad 11.

Referring to fig. 8, when a touch screen is used, a touch screen signal needs to be accessed, and the second intermediate device 8 (resistor) is used, then the bill of material data of the product contains the product data of the second intermediate device 8; illustratively, the data processing module 2 is provided with a touch screen interface, the touch screen interface of the data processing module 2 is connected to the first pad 11 through the second intermediate device 8, and then the touch screen signal is connected to the touch screen through the first connecting member 6 connected to the first pad 11.

As can be seen from the above, the first connector 6 is used for the first functional module 3 and the second connector 6, which are identical. The bill of material data of the product of the present embodiment includes product data of the first connector 6, product data of the first intermediate device 7, and/or product data of the second intermediate device 8.

Second embodiment

Fig. 9 to 12 are schematic structural diagrams of four products provided in this embodiment.

The present embodiment differs from the first embodiment in that: the preset bill of material data comprises a data processing module 2, P interfaces and P functional modules, the form information comprises Q functional modules in the P functional modules, Q is more than or equal to 0 and less than or equal to P, and Q and P are integers; the connection relationship of each component in the preset bill of material data in the preset circuit board layout design is as follows: the data processing module 2 is respectively connected with P interfaces, and the P interfaces are respectively connected with the P functional modules in a one-to-one correspondence manner.

This embodiment will be described by taking P equal to 2 as an example. The 2 interfaces are then the first interface 11 and the second interface 12 of the circuit board 1, respectively.

Referring to fig. 1 to 4, the circuit board 1 of the first embodiment is provided with a first interface 11; referring to fig. 9 to 12, the circuit board of the present embodiment is provided with a first interface 11 and a second interface 12, where the first interface 11 and the second interface 12 are used for being connected to the first functional module 3 and the second functional module 4, respectively; the data processing module 2 is used for connecting with a first interface 11 and a second interface 12.

The bill of material data of the product determined by the method of the embodiment includes one, both or neither of the product data of the first functional module 3 and the product data of the second functional module 4, and the bill of material data further includes the product data of the circuit board 1 and the product data of the data processing module 2.

The products of this example can be classified into the following four types.

The first product: referring to fig. 9, if the first product only includes function F1, and the product includes first functional module 3 but not second functional module 4, the product data of second functional module 4 is deleted from the predetermined bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the physical key board, and relevant devices of the touch screen are removed from a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only needs the first functional module 3), the data processing module 2 is connected to one side of the first interface 11, and the other side of the first interface 11 is connected to the first functional module 3.

The second product is: referring to fig. 10, if the second product only includes function F2, and the product includes second functional module 4 but not first functional module 3, the product data of first functional module 3 is deleted from the predetermined bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the touch screen, and then relevant devices of the physical key board are removed from a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only needs the second functional module 4), the data processing module 2 is connected to one side of the second interface 12, and the other side of the second interface 12 is connected to the second functional module 4.

A third product: referring to fig. 11, if the third product includes a function F1 and a function F2, and the product includes the first function module 3 and the second function module 4, the product data of the first function module 3 and the product data of the second function module 4 are kept in the preset bill of materials; illustratively, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and if a product needs the physical key board and the touch screen, related devices of the physical key board and the touch screen are reserved in a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product requires a first functional module 3 and a second functional module 4), the data processing module 2 is connected to one side of the first interface 11 and to one side of the second interface 12, the other side of the first interface 11 is connected to the first functional module 3, and the other side of the second interface 12 is connected to the second functional module 4.

A fourth product: referring to fig. 12, if the fourth product does not include the function F1 or the function F2, and the product does not include the first functional module 3 and the second functional module 4, the product data of the first functional module 3, the product data of the second functional module 4, and the product data of the switching module 5 are deleted from the preset bill of materials; at this time, the product includes a circuit board 1 and a data processing module 2.

Based on the above, the first interface 11 and the second interface 12 of the circuit board 1 are independent interfaces, and the first functional module 3 and the second functional module 4 are respectively connected to the two independent interfaces, so that different products can share the same circuit board 1 and select respective required module functions by directly determining different bill of material data.

It should be understood that, taking the first functional module 3 (function F1) and the second functional module 4 (function F2) as examples, an actual product may contain P components (P functions), where P is an integer greater than or equal to 2.

The circuit connection method of the product of this embodiment will be explained below. Fig. 13 is a schematic structural diagram of a modification of the first product provided in this embodiment. Fig. 14 is a schematic structural diagram of a modification of the second product provided in this embodiment.

Referring to fig. 13 and 14, the first interface 11 and the second interface 12 are each a pad (hereinafter referred to as a first pad 11 and a second pad 12). In other embodiments, the first interface 11 and the second interface 12 may also be PIN (PIN) interfaces.

In the present embodiment, referring to fig. 13 and 14, the first functional module 3 uses the first pad 11 of the circuit board 1, the second functional module 4 uses the second pad 12 of the circuit board 1, and the first pad 11 and the second pad 12 are used for transmitting signals independent of each other, and then the pads are independent and the signals transmitted by the pads are also independent. Referring to fig. 13 and fig. 14, in order to transmit the signal sent by the data processing module 2 to the first functional module 3 and the second functional module 4, the preset circuit board layout design of the embodiment further includes P connecting components, and the connection relationship of the P connecting components in the preset circuit board layout design is as follows: each connector is connected between one interface (pad) and one functional module. Correspondingly, the bill of material data also includes P connectors.

The morphological information of the aforementioned product further comprises: the product includes Q of the P connectors. Accordingly, the step a2 (modifying the bill of material data of the predetermined circuit board layout design according to the morphological information) further includes: and keeping Q connecting pieces in the preset bill of materials data, and deleting the remaining connecting pieces. In this embodiment, the P connecting members are the first connecting member 6 and the second connecting member 9, respectively, and the first connecting member 6 and the second connecting member 9 are two independent connecting members; the first pads 11 are connected to the first functional module 3 by first connections 6 and/or the second pads 12 are connected to the second functional module 4 by second connections 9. If the first functional module 3 is reserved in the preset bill of materials data and the second functional module 4 is deleted, correspondingly reserving the first connecting piece 6 in the preset bill of materials data and deleting the second connecting piece 9; if the second functional module 4 is reserved in the preset bill of materials data and the first functional module 3 is deleted, correspondingly reserving the second connecting piece 9 in the preset bill of materials data and deleting the first connecting piece 6; if the first functional module 3 and the second functional module 4 are reserved in the preset bill of materials data, correspondingly reserving the first connecting piece 6 and the second connecting piece 9 in the preset bill of materials data; if the first functional module 3 and the second functional module 4 are deleted from the preset bill of material data, the first connecting piece 6 and the second connecting piece 9 are also deleted from the preset bill of material data correspondingly. At the same time, the layout design of the predetermined circuit board is modified accordingly.

For example, the first connector 6 and the second connector 9 are both connectors, and the first connector 6 and the second connector 9 may also be other signal connectors (such as zebra stripes).

For example, referring to fig. 13, when a physical KEY board (also referred to as a KEY board) is used, a product accesses a KEY (KEY) signal through a first pad 11, specifically, the KEY signal sent by the data processing module 2 is transmitted to the first pad 11, and then the first connecting element 6 connected to the first pad 11 accesses the KEY signal into the physical KEY board (i.e., the first functional module 3); referring to fig. 14, when a screen such as a touch screen (i.e., the second functional module 4) is used, a touch screen signal is accessed through the second pad 12, specifically, the touch screen signal sent by the data processing module 2 is transmitted to the second pad 12, and then the second connector 9 connected to the second pad 12 accesses the key signal to the touch screen (i.e., the second functional module 4), such as to a flexible circuit board of the touch screen.

Third embodiment

Fig. 15 and fig. 16 are schematic structural diagrams of two products provided by this embodiment.

The present embodiment differs from the first embodiment in that: the preset bill of material data comprises a data processing module 2, an interface and R functional modules, the form information of the product comprises one functional module of the R functional modules, and R is an integer; the connection relationship of each part in the bill of material data in the layout design of the preset circuit board is as follows: the data processing module 2 is connected with the interfaces, and the interfaces are respectively connected with the R functional modules; accordingly, since the product morphology information is different, step a2 (modifying the bill of material data of the predetermined circuit board layout design according to the morphology information) includes: and reserving the functional module in the preset bill of materials data, and deleting the rest functional modules.

With reference to fig. 1 to 4, in a first embodiment, the data processing module 2 is configured to be connected to the switching module 5 or to an intermediate device, and the first interface 11 is configured to be shared by the first functional module 3 and the second functional module 4; in the present embodiment, referring to fig. 15 and 16, the product includes one or neither of the first functional module 3 and the second functional module 4, and the first interface 11 is used for connecting with the first functional module 3 or the second functional module 4.

The bill of material data of the product determined by the method of the embodiment includes one or neither of the product data of the first functional module 3 and the product data of the second functional module 4, and the bill of material data further includes the product data of the circuit board 1 and the product data of the data processing module 2.

The products of this embodiment can be classified into the following three types.

The first product: referring to fig. 15, if the first product only includes function F1, and the product includes first functional module 3 but not second functional module 4, the product data of second functional module 4 is deleted from the predetermined bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the physical key board, and relevant devices of the touch screen are removed from a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only needs the first functional module 3), the data processing module 2 is connected to one side of the first interface 11, and the other side of the first interface 11 is connected to the first functional module 3.

The second product is: referring to fig. 16, if the second product only includes function F2, and the product includes second functional module 4 but not first functional module 3, the product data of first functional module 3 is deleted from the predetermined bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the touch screen, and then relevant devices of the physical key board are removed from a preset bill of materials corresponding to the adopted compatible circuit board 1; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only needs the second functional module 4), the data processing module 2 is connected to one side of the first interface 11 and the other side of the first interface 11 is connected to the second functional module 4.

A third product: if the third product does not include the function F1 or the function F2, and the product does not include the first functional module 3 and the second functional module 4, the product data of the first functional module 3, the product data of the second functional module 4, and the product data of the switching module 5 are deleted from the preset bill of materials; at this time, the product includes a circuit board 1 and a data processing module 2.

Based on the above, the interfaces of the different modules (the first functional module 3 and the second functional module 4) are packaged completely and compatibly, and the same circuit board 1 can be shared among different products and the respective required modules can be selected by using the same interface (the first interface 11) and directly determining different bill of material data.

As another example: the module function required by the product is a wireless communication function, the first functional module 3 is a 4G module, and the second functional module 4 is a 3G module. And the 4G module and the 3G module are completely compatible in packaging, so that the bill of material data can be directly replaced, and different functions can be compatible on the same circuit board 1.

It should be understood that, taking the first functional module 3 (function F1) and the second functional module 4 (function F2) as examples, an actual product may contain R components (R functions), where R is an integer greater than or equal to 2.

The circuit connection method of the product of this embodiment will be explained below. Fig. 17 is a schematic structural diagram of a modification of the first product provided in this embodiment. Fig. 18 is a schematic structural diagram of a modification of the second product provided in this embodiment.

In the present embodiment, referring to fig. 17 and 18, the first functional module 3 uses the first pads 11 of the circuit board 1, and the second functional module 4 also uses the first pads 11 of the circuit board 1, but only one of the first functional module 3 and the second functional module 4 exists or neither exists on the same product (for example, only the first functional module 3 exists or only the second functional module 4 exists); for the case that the first functional module 3 or the second functional module 4 exists, the signals transmitted by the first pad 11 are the same, for example, a TAMPER signal that needs to be accessed to the central processing unit (data processing module 2) regardless of whether a physical keypad or a touch screen is used; in this way, the first pads 11 are used for both the first functional module 3 and the second functional module 4, and the signals transmitted by the first pads 11 are identical. In order to transmit the signal sent by the data processing module 2 to the first functional module 3 or the second functional module 4, the preset circuit board layout design of the embodiment further includes R connectors, and the connection relationship of the R connectors in the preset circuit board layout design is as follows: each connector is connected between one interface (pad) and one functional module. Correspondingly, the bill of material data also includes R connectors.

The morphological information of the aforementioned product further comprises: the product includes one of the R connectors. Accordingly, the step a2 (modifying the bill of material data of the predetermined circuit board layout design according to the morphological information) further includes: one connector in the preset bill of materials data is reserved, and the rest connectors are deleted. In the present embodiment, the R connection members are the first connection member 6 and the second connection member 9, respectively. If the first functional module 3 is reserved in the preset bill of materials data and the second functional module 4 is deleted, correspondingly reserving the first connecting piece 6 in the preset bill of materials data and deleting the second connecting piece 9; if the second functional module 4 is reserved in the preset bill of material data and the first functional module 3 is deleted, the second connecting piece 9 is correspondingly reserved in the preset bill of material data and the first connecting piece 6 is deleted. At the same time, the layout design of the predetermined circuit board is modified accordingly. In the present embodiment, the first pad 11 is connected to the first functional module 3 or the second functional module 4 through the first connecting member 6, and it can be seen that the first connecting member 6 is used for both the first functional module 3 and the second functional module 4.

For example, referring to fig. 17, when a physical keypad (also referred to as KEY board) is used, a product accesses a first TAMPER signal through a first pad 11, specifically, the TAMPER signal sent by the data processing module 2 is transmitted to the first pad 11, and then the first connecting element 6 connected to the first pad 11 accesses the TAMPER signal into the physical keypad (i.e., the first functional module 3); referring to fig. 18, when a screen such as a touch screen (i.e., the second functional module 4) is used, the first pad 11 is used to access the TAMPER signal, specifically, the TAMPER signal sent by the data processing module 2 is transmitted to the first pad 11, and then the first connector 6 connected to the first pad 11 is used to access the TAMPER signal to the touch screen (i.e., the second functional module 4), such as a flexible circuit board of the touch screen.

The TMAPER signal of the cpu is preferably transmitted by using the circuit connection method of the third embodiment, but when the number of two signals to the TAMPER or the network requirement is not consistent, the TMAPER signal of the cpu may also be transmitted by using the circuit connection method of the second embodiment. Since the TAMPER signal requires 24h to be valid, it cannot be controlled by the switching module 5 which is not powered down, i.e. it cannot be transmitted by using the circuit connection method of the first embodiment.

The embodiments of the present application will be described below with reference to specific practical applications, taking products (such as POS) with pin (personal identification) as an example. The product for inputting the PIN can be divided into a product for inputting the PIN by physical keys and a product for inputting the PIN by a touch screen. Fig. 19 is a schematic structural diagram of a product for inputting PINs by physical key pressing provided in this embodiment. Fig. 20 is a schematic structural diagram of a modification of the physical key PIN input product provided in this embodiment. Fig. 21 is a schematic structural diagram of a product for inputting PINs through a touch screen according to this embodiment.

The physical key PIN inputting product is provided with a physical key board, and can also be provided with a display screen, a printer, a magnetic stripe card, an Integrated Circuit (IC) card, a communication module and the like.

The product for inputting the PIN through the touch screen is provided with the touch screen (used for inputting the PIN), and can also be provided with a printer, a magnetic stripe card, an IC card, a communication module and the like.

Physical key PIN input products and touch screen PIN input products have large difference of appearance forms, but compatible parts exist in internal structural design, such as: the positions of the screws of the shared circuit board and the circuit board are consistent, and more external functions are overlapped.

Referring to fig. 19, a product for inputting PIN by physical keys uses physical keys to realize PIN input, and uses a circuit board 1 and a physical key board, wherein the physical key board is provided with key module related devices, pads and wires, and other peripherals, and the circuit board 1 is provided with a main chip and other peripheral functional modules. The circuit board 1 is provided with a metal pad (a first interface 11), and the first connecting piece 6 connects the physical key board with the circuit board 1 through the metal pad to realize the conduction of electrical signals. Alternatively, referring to fig. 20, the physical key-in PIN product is provided with a screen which is in signal connection with the circuit board 1 through the first connector 6A.

Referring to fig. 21, a product for inputting PIN on a touch screen uses a touch screen as PIN input, and uses the same circuit board 1 as the product for inputting PIN on the touch screen, wherein the circuit board 1 is provided with a screen interface module and related devices, pads and traces thereof, and in addition, the circuit board 1 is provided with a main chip and other peripheral functional modules. The circuit board 1 is provided with a metal pad (first interface 11), and the first connecting piece 6B is connected with the circuit board 1 through the metal pad to realize electric signal conduction.

It should be understood that the connectors are only examples, and there may be X first connectors 6, first connectors 6A, and Y first connectors 6B, where X and Y are integers equal to or greater than 1. Depending on the actual circuit connection, the first connector 6B may be the same as the first connector 6 or the first connector 6A.

It should be understood that the same signal and different signals may be routed on the same connector at the same time. The following are exemplified:

the key signals of the product for inputting the PIN by the physical keys are accessed to the physical key board from four bonding pads of the first interface 11 of the circuit board 1 through four PINs of the first connecting piece 6, and TAMPER1\2 signals output by the circuit board 1 are accessed to the physical key board from the other two bonding pads of the first interface 11 through two PINs of the first connecting piece 6;

touch screen signals of the product for inputting the PIN through the touch screen are accessed to the screen (for example, a flexible circuit board accessed to the screen) from four pads of the first interface 11 of the circuit board 1 through four PINs of the first connector 6, and the TAMPER1\2 signals output by the circuit board 1 are accessed to the screen from the other two pads of the first interface 11 through two PINs of the first connector 6.

By utilizing the compatible circuit design of the embodiment, the compatible circuit board between different products can be realized, and the compatible circuit board can be one circuit board or a plurality of circuit boards can be combined together.

In the circuit board combination for realizing the product, the following three forms of circuit board combinations may be included:

1) compatible circuit boards, and adopt the identical bill of materials;

2) compatible circuit boards, but with different bill of materials, different functional modules are selected by the circuit form of one or more combinations of the first embodiment, the second embodiment, and the third embodiment;

3) separate circuit boards are used to allow for other individualized (incompatible) functional module designs.

Fig. 22 is a circuit board assembly diagram of a product a according to an embodiment of the present application. Fig. 23 is a circuit board assembly diagram of a product B according to an embodiment of the present application. Fig. 24 is a circuit board assembly diagram of a product C according to an embodiment of the present application.

Example one: referring to fig. 22 and 23, product a and product B both employ compatible circuit board M1 and circuit board M2, but each use a different bill of materials: the circuit board M1 of the product A uses a bill of materials AM1, and the circuit board M2 of the product A uses a bill of materials AM 2; the circuit board M1 of the product B uses a bill of materials BM1, and the circuit board M2 of the product B uses a bill of materials BM 2. In addition, product a and product B also each use separate circuit boards, circuit board S1 and circuit board S2; circuit board S1 for product A uses Bill of Material AS1 and circuit board S2 for product B uses Bill of Material BS 2. Thus, the bill of material data for product A includes bill of material AM1, bill of material AM2, and bill of material AS 1. The bill of material data for product B includes bill of material BM1, bill of material BM2, and bill of material BS 2.

Example two: referring to fig. 23 and 24, product B and product C both use compatible circuit board M1 and circuit board M2, where circuit board M1 uses the same bill of materials and circuit board M2 uses a different bill of materials, specifically: the circuit board M1 of the product B uses a bill of materials BM1, and the circuit board M2 of the product B uses a bill of materials BM 2; product C circuit board M1 also uses bill of materials BM1, but product C circuit board M2 uses bill of materials CM 2. In addition, product B and product C also each use separate circuit boards, circuit board S2 and circuit board S3; circuit board S2 for product B uses the bill of materials BS2 and circuit board S3 for product C uses the bill of materials CS 3. Thus, the bill of material data for product B includes bill of material BM1, bill of material BM2, and bill of material BS 2. The bill of material data for product C includes bill of material BM1, bill of material CM2, and bill of material CS 3.

Embodiments of the application enable: even products with greatly different forms can realize compatible scheme design; such as: although the form difference between a key product (such as a physical key input PIN product) and a full touch screen product (such as a touch screen input PIN product) is great, the same circuit board can be used through the technical scheme of the embodiment of the application; specifically, the key product adopts: circuit board a (corresponding to bill of materials a), physical keypad, and other circuit boards; the touch screen product adopts: circuit board a (corresponding to bill of material B), screen, and other circuit boards. For different products, other circuit boards and their corresponding bills of materials may be identical, or the circuit boards may be identical but the corresponding bills of materials may be different, or the circuit boards and their corresponding bills of materials may be different.

Therefore, by designing a small number of circuit boards, adopting the modes of maximized sharing and combination among a plurality of circuit boards, changing a bill of materials and the like, a series of diversified and personalized products with different functional characteristics can be obtained, higher output can be obtained with less investment, material management is simplified, production efficiency can be improved, and the overall production cost is reduced.

Fourth embodiment

Fig. 25 shows a block diagram of a circuit board design apparatus of a product provided in an embodiment of the present application, corresponding to the method described in the above embodiment, and only shows portions related to the embodiment of the present application for convenience of description.

Referring to fig. 25, the apparatus includes a form information acquisition unit 101, a data modification unit 102, and a data output unit 103.

A form information acquisition unit 101 configured to: and acquiring the form information of the product.

A data modification unit 102 configured to: and modifying the bill of material data of the layout design of the preset circuit board according to the form information.

And the data output unit 103 is used for outputting the modified bill of material data.

Please refer to the above embodiments for the product form information.

It should be noted that, for the information interaction, execution process, and other contents between the above-mentioned devices/units, the specific functions and technical effects thereof are based on the same concept as those of the embodiment of the method of the present application, and specific reference may be made to the part of the embodiment of the method, which is not described herein again.

Fig. 26 is a schematic structural diagram of a computing device according to an embodiment of the present application. As shown in fig. 26, the computing device 26 of this embodiment includes: at least one processor 260 (only one shown in fig. 26), a memory 261, and a computer program 262 stored in memory 261 and executable on at least one processor 260; the steps in any of the various method embodiments described above are implemented when processor 260 executes computer program 262.

The computing device 26 may be a desktop computer, a laptop, a palmtop, a cloud server, or other computing device. The computing device may include, but is not limited to, a processor 260 and a memory 261. Those skilled in the art will appreciate that fig. 26 is merely an example of a computing device and is not intended to be limiting and may include more or fewer components than those shown, or some of the components may be combined, or different components, such as input output devices, network access devices, buses, etc.

The Processor 260 may be a Central Processing Unit (CPU), and the Processor 260 may also be other general purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field-Programmable Gate arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.

The storage 261, in some embodiments, may be an internal storage unit of the computing device 26, such as a hard disk or memory of the computing device. The memory 261, in other embodiments, may also be an external storage device of the computing device, such as a plug-in hard drive provided on the computing device, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and so forth. Further, memory 261 may also include both internal and external storage devices of the computing device. The memory 261 is used for storing an operating system, an application program, a Boot Loader (Boot Loader), data, and other programs, such as program codes of a computer program. The memory 261 may also be used to temporarily store data that has been output or is to be output.

Illustratively, the computer program 262 may be divided into one or more modules/units, which are stored in the memory 261 and executed by the processor 260 to accomplish the present application. One or more of the modules/units may be a series of computer program instruction segments capable of performing specific functions that describe the execution of computer program 262 in computing device 26.

It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules, so as to perform all or part of the functions described above. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

The aforementioned integrated units, if implemented in the form of software functional units and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, all or part of the processes in the methods of the embodiments described above may be implemented by a computer program, which may be stored in a computer-readable storage medium, to instruct related hardware; the computer program may, when being executed by a processor, realize the steps of the respective method embodiments described above. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer readable medium includes: any entity or device capable of carrying computer program code to an apparatus/terminal device, recording medium, computer Memory, Read-Only Memory (ROM), Random-Access Memory (RAM), electrical carrier wave signals, telecommunications signals, and software distribution medium. Such as a usb-disk, a removable hard disk, a magnetic or optical disk, etc. In certain jurisdictions, computer-readable media may not be an electrical carrier signal or a telecommunications signal in accordance with legislative and patent practice.

Embodiments of the present application also provide a computer-readable storage medium, which stores a computer program, and the computer program is implemented to realize the steps of the above method embodiments when executed by a processor.

Embodiments of the present application provide a computer program product, which when run on a terminal device, such as a computer, enables the computer to implement the steps of the above-described method embodiments.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus/device and method may be implemented in other ways. For example, the above-described apparatus/device embodiments are merely illustrative, and for example, the division of the modules or units is only one logical division, and there may be other divisions when actually implemented, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims

1. A method of designing a circuit board of a product, the method comprising:

acquiring form information of a product;

and outputting the modified bill of material data.

2. The circuit board design method of claim 1, wherein the bill of material data includes a data processing module, a switching module, an interface, and N functional modules, the form information includes M functional modules of the N functional modules, M is greater than or equal to 0 and less than or equal to N, and M and N are integers;

the method further comprises the following steps:

3. The circuit board design method of claim 1, wherein the bill of material data includes a data processing module, P interfaces, and P functional modules, the form information includes Q functional modules of the P functional modules, Q is greater than or equal to 0 and less than or equal to P, and Q and P are integers;

4. The circuit board design method of claim 3, wherein the interface is a pad, the bill of material data further comprises P connectors, and the connection relationship of the P connectors in the predetermined circuit board layout design is: each of the connectors is connected between one of the interfaces and one of the functional modules;

5. The circuit board design method of claim 1, wherein the bill of material data includes a data processing module, an interface, and R functional modules, the form information includes one of the R functional modules, R is an integer;

6. The circuit board design method of claim 2 or 5, wherein the interface is a pad, the bill of material data further comprises N connectors or R connectors, and the connection relationship of the connectors in the predetermined circuit board layout design is: each connecting piece is connected between the interface and one functional module;

7. A product characterized by being realized by the circuit board design method of the product according to any one of claims 1 to 6.

8. An apparatus for designing a circuit board of a product, the apparatus comprising:

a form information acquiring unit for acquiring form information of a product;

9. A computing device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor implementing the method of any of claims 1 to 6 when executing the computer program.

10. A computer-readable storage medium, characterized in that the computer-readable storage medium stores a computer program which, when executed by a processor, implements the method of any one of claims 1 to 6.