CN113177382B

CN113177382B - Product, circuit board design method and device thereof, computing equipment and storage medium

Info

Publication number: CN113177382B
Application number: CN202110465815.7A
Authority: CN
Inventors: 苏小燕; 黄茂涵
Original assignee: PAX Computer Technology Shenzhen Co Ltd
Current assignee: PAX Computer Technology Shenzhen Co Ltd
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2024-01-26
Anticipated expiration: 2041-04-28
Also published as: CN113177382A

Abstract

The application is applicable to the technical field of data processing, and provides a product and a circuit board design method, a device, computing equipment and a storage medium thereof, wherein the method comprises the following steps: obtaining form information of a product; modifying bill of materials data of a preset circuit board layout design according to the form information; and outputting the modified bill of materials data. The embodiment of the application can simplify material management and can obtain higher output with less investment.

Description

Product, circuit board design method and device thereof, computing equipment and storage medium

Technical Field

The application belongs to the technical field of data processing, and particularly relates to a product, a circuit board design method, a circuit board design device, computing equipment and a storage medium thereof.

Background

Along with the continuous development and progress of electronic products, more and more products are designed in a multi-element and personalized way, a series of products are often introduced aiming at the same product, and the configuration of different products can meet the multi-element demands of different customers. Thus, in actual production, the same product will have different series, and these series correspond to different bill of materials, so that material management is complicated.

Disclosure of Invention

The embodiment of the application provides a product, a circuit board design method, a device, a computing device and a storage medium thereof, which can simplify material management, can obtain higher output with less investment, can improve production efficiency and reduce overall production cost.

In a first aspect, embodiments of the present application provide a circuit board design method for a product, the method comprising:

obtaining form information of a product;

modifying bill of materials data of a preset circuit board layout design according to the form information;

and outputting the modified bill of materials data.

In a possible implementation manner of the first aspect, the bill of materials data includes a data processing module, a switching module, an interface and N functional modules, the form information includes M functional modules in the N functional modules, M is greater than or equal to 0 and less than or equal to N, and M and N are integers;

the connection relation of each component in the bill of materials data in the preset circuit board layout design is as follows: the data processing module, the switching module and the interface are sequentially connected, and the interface is respectively connected with the N functional modules;

the modifying the bill of materials data of the preset circuit board layout design according to the form information comprises the following steps:

Reserving the M functional modules in the preset bill of materials data, and deleting the remaining functional modules;

the method further comprises the steps of:

and setting the switching module to establish data interaction between the data processing module and the M functional modules.

In a possible implementation manner of the first aspect, the bill of materials data includes a data processing module, P interfaces and P functional modules, the form information includes Q functional modules in the P functional modules, Q is greater than or equal to 0 and less than or equal to P, and Q and P are integers;

the connection relation of each component in the bill of materials data in the preset circuit board layout design is as follows: the data processing modules are respectively connected with the P interfaces, and the P interfaces are respectively connected with the P functional modules in a one-to-one correspondence manner;

and reserving the Q functional modules in the bill of materials data, and deleting the rest functional modules.

In a possible implementation manner of the first aspect, the interface is a pad, the bill of materials data further includes P connectors, and a connection relationship of the P connectors in the preset circuit board layout design is: each of the connectors is connected between one of the interfaces and one of the functional modules;

The modifying the bill of materials data of the preset circuit board layout design according to the form information further comprises: and reserving Q connectors in the bill of materials data, and deleting the rest connectors.

In a possible implementation manner of the first aspect, the bill of materials data includes a data processing module, an interface, and R functional modules, the form information includes one functional module of the R functional modules, and R is an integer;

the connection relation of each component in the bill of materials data in the preset circuit board layout design is as follows: the data processing module is connected with the interfaces, and the interfaces are respectively connected with the R functional modules;

and reserving the one functional module in the bill of materials data, and deleting the rest functional modules.

In a possible implementation manner of the first aspect, the interface is a pad, the bill of materials data further includes N connectors or R connectors, and a connection relationship of the connectors in the preset circuit board layout design is: each connecting piece is connected between the interface and one of the functional modules;

The modifying the bill of materials data of the preset circuit board layout design according to the form information further comprises: at least one of the connectors in the bill of materials data is reserved, and the remaining connectors are omitted.

In a second aspect, embodiments of the present application provide a product implemented according to the circuit board design method of the product of any one of the first aspects.

In a third aspect, embodiments of the present application provide a circuit board design apparatus, the apparatus comprising:

the morphological information acquisition unit is used for acquiring morphological information of the product;

a data modification unit configured to: modifying bill of materials data of a preset circuit board layout design according to the form information;

and the data output unit is used for outputting the modified bill of materials data.

In a fourth aspect, embodiments of the present application provide a computing device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor implementing the method of any one of the first aspects when executing the computer program.

In a fifth aspect, embodiments of the present application provide a computer readable storage medium storing a computer program which, when executed by a processor, implements the method of any one of the first aspects above.

In a sixth aspect, embodiments of the present application provide a computer program product for, when run on a terminal device, causing the terminal device to perform the method of any one of the first aspects.

Compared with the prior art, the embodiment of the application has the beneficial effects that:

and modifying bill of materials data of a preset circuit board layout design according to the obtained form information of the product, so as to obtain and output the bill of materials data of the product, simplify material management and improve production efficiency.

Some possible implementations of embodiments of the present application have the following benefits:

the product comprises a circuit board and a data processing module, wherein the circuit board can be compatible with N functional modules (an interface of the circuit board is used for sharing by the N functional modules); the product optionally further comprises a switching module, wherein the switching module is used for connecting the N functional modules to the interface, and the data processing module is connected with the switching module; determining bill of materials data of the product according to form information of the product (the product comprises M functional modules in N functional modules), wherein the bill of materials data comprises product data of the M functional modules in the product data of the N functional modules, product data of a circuit board and product data of a data processing module; therefore, according to the bill of materials data, fewer circuit boards are designed, a series of diversified individual products with different functional characteristics can be obtained, the contents of the bill of materials data corresponding to the products have more identical parts, the bill of materials data can be simplified, higher output can be obtained with less investment, the production efficiency can be improved, and the overall production cost can be reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic structural view of a first product provided in a first embodiment of the present application;

FIG. 2 is a schematic structural view of a second product provided in the first embodiment of the present application;

FIG. 3 is a schematic structural view of a third product provided in the first embodiment of the present application;

FIG. 4 is a schematic structural view of a fourth product provided in the first embodiment of the present application;

FIG. 5 is a flow chart of a bill of materials data processing method for providing a product according to a first embodiment of the present application;

FIG. 6 is a schematic structural view of a variation of the third product provided in the first embodiment of the present application;

FIG. 7 is a schematic view of another variation of the first product provided by the first embodiment of the present application;

FIG. 8 is a schematic structural view of a variation of the second product provided in the first embodiment of the present application;

FIG. 9 is a schematic view of a first product provided in a second embodiment of the present application;

FIG. 10 is a schematic structural view of a second product provided in a second embodiment of the present application;

FIG. 11 is a schematic structural view of a third product provided in a second embodiment of the present application;

FIG. 12 is a schematic structural view of a fourth product provided in accordance with a second embodiment of the present application;

FIG. 13 is a schematic view of a variation of the first product provided in accordance with the second embodiment of the present application;

FIG. 14 is a schematic view of a variation of the second product provided in the second embodiment of the present application;

FIG. 15 is a schematic view of the structure of a first product provided in a third embodiment of the present application;

FIG. 16 is a schematic view of a second product provided in a third embodiment of the present application;

FIG. 17 is a schematic view of a variation of the first product provided in the third embodiment of the present application;

FIG. 18 is a schematic view of a variation of the second product provided in the third embodiment of the present application;

fig. 19 is a schematic structural diagram of a physical key PIN-through product according to an embodiment of the present application;

fig. 20 is a schematic structural diagram of a modification of the physical key PIN-through product according to an embodiment of the present application;

Fig. 21 is a schematic structural diagram of a product for inputting PIN through a touch screen according to an embodiment of the present application;

FIG. 22 is a schematic diagram of a circuit board assembly of product A according to one embodiment of the present application;

FIG. 23 is a schematic diagram of a circuit board assembly of product B according to an embodiment of the present application;

FIG. 24 is a schematic diagram of a circuit board assembly of product C according to an embodiment of the present application;

fig. 25 is a schematic diagram of a bill of materials data processing apparatus for a product according to a fourth embodiment of the present application;

FIG. 26 is a schematic diagram of a computing device according to an embodiment of the present application.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clear, the present application is further described in detail below with reference to fig. 1 to 26 and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system configurations, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

It should be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should also be understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

As used in this specification and the appended claims, the term "if" may be interpreted as "when..once" or "in response to a determination" or "in response to detection" depending on the context. Similarly, the phrase "if a determination" or "if a [ described condition or event ] is detected" may be interpreted in the context of meaning "upon determination" or "in response to determination" or "upon detection of a [ described condition or event ]" or "in response to detection of a [ described condition or event ]".

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like in the description of the present application and in the claims, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

First embodiment

The embodiment provides a product and a circuit board design method thereof; the product is an electronic product, and can be a POS (Point of sale) machine, a main board, a sound card or a network card.

Fig. 1 to 4 are schematic structural views of four products according to the present embodiment. The product provided in this embodiment is a circuit board circuit, which corresponds to a preset circuit board layout stored in the memory device during the circuit design stage. The product of this embodiment (i.e. the circuit board circuitry) comprises a circuit board 1 and a data processing module 2. The circuit board 1 is a support for various electronic components. The circuit board 1 is, for example, a printed circuit board or a flexible circuit board.

The data processing module 2 is a module capable of realizing the functions required by the product. By way of example, the data processing module 2 is an integrated circuit, such as a central processing unit; the data processing module 2 may also be a discrete component circuit, where a discrete component circuit is a circuit that connects individual electronic components together.

The data processing module 2 is disposed on the circuit board 1. The data processing module 2 is soldered, for example, to the surface of the circuit board 1.

The circuit board design method of the product provided by the embodiment can be applied to a computing device and used for designing the circuit board to obtain the product of the embodiment. The aforementioned computing devices may be servers, notebook computers, ultra-mobile personal computer (UMPC), netbooks, and personal digital assistants (personal digital assistant, PDA), and embodiments of the present application are not limited in any way to the particular type of computing device.

Fig. 5 shows a schematic flowchart of a circuit board design method provided in the present embodiment. The method comprises the steps of A1 to A3.

And A1, obtaining form information of the product.

The products provided by the embodiment have different series, and the series correspond to different product forms, namely different forms, so as to meet different user requirements. As described above, the product provided in this embodiment is a circuit board circuit, which corresponds to a predetermined circuit board layout stored in the memory device in the circuit design stage. The preset circuit board layout design is used for designing different products.

In this embodiment, the preset circuit board layout design includes a circuit board 1, a data processing module 2, a switching module 5, an interface, and N functional modules, where N is an integer. In the present embodiment, the circuit board 1 is a compatible circuit board, and can be used for products with different forms.

The morphological information of the product is determined by the function of the product. The form information of the product includes a plurality of information, and in this embodiment, the form information of the product includes: the product comprises M functional modules in N functional modules, M is more than or equal to 0 and less than or equal to N, and M and N are integers.

In the present embodiment, N is equal to 2, and then the N functional modules are the first functional module 3 and the second functional module 4. The aforementioned one interface is the interface of the circuit board 1, which is the first interface 11. Referring to fig. 1 to 4, the switching module 5 is configured to be connected to one or both of the first functional module 3 and the second functional module 4 through the first interface 11, and the data processing module 2 is configured to be connected to the switching module 5. The switching module 5 is a switching circuit, and is controlled by the data processing module 2, and the switching module can be in various forms of resistance, a switch and the like and is used for selecting module components (such as the first functional module 3 and the second functional module 4) to be connected with the data processing module 2; therefore, the switching module 5 is also arranged to establish data interactions between the data processing module 2 and the aforementioned M functional modules. The connection relation of each component in the preset circuit board layout design is as follows: the data processing module 2, the switching module 5 and the interface 11 are connected in sequence, and the interface is respectively connected with the first functional module 3 and the second functional module 4.

In the present embodiment, the product includes one, both, or none of the first and second functional modules 3, 4; that is, the first form of product includes the first functional module 3 and does not include the second functional module 4 (where M is equal to 1), the second form of product includes the second functional module 4 and does not include the first functional module 3 (where M is equal to 1), the third form of product includes the first functional module 3 and the second functional module 4 (where M is equal to 2), and the fourth form of product includes neither the first functional module 3 nor the second functional module 4 (where M is equal to 0).

In this embodiment, the morphological information of the product further includes: the circuit board 1 is provided with a first interface 11, the first interface 11 being common to the first functional module 3 and the second functional module 4. Specifically, if the product includes one of the first functional module 3 and the second functional module 4, the first interface 11 is used by the first functional module 3 or the second functional module 4, such as: the first interface 11 is connected to the first functional module 3 or the first interface 11 is connected to the second functional module 4. If the product comprises a first functional module 3 and a second functional module 4, the first interface 11 is connected to both the first functional module 3 and the second functional module 4, and at this time, the first interface 11 is shared by the first functional module 3 and the second functional module 4. If the product does not comprise the first functional module 3 and the second functional module 4, the first interface 11 is idle.

If the product comprises at least one of the first functional module 3 and the second functional module 4, the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, and the other side of the first interface 11 is connected to one or both of the first functional module 3 and the second functional module 4.

There are various ways to obtain the form information of the product: the form information of the product can be input by a user, and the computing device receives the form information; or the computing device reads the pre-stored form information from the memory of the computing device; alternatively, the computing device obtains the morphology information from other devices over a network.

And A2, modifying bill of materials data of a preset circuit board layout design according to the form information of the product.

The bill of materials is a list of all sub-assemblies, middleware, parts, and raw materials that make up the parent assembly, including the number of sub-items required for assembly. The parent assembly is the product in this embodiment.

The individual components comprising the product correspond to the product data for the individual components including, but not limited to, name, specification, model number, quantity, material. The product data of the individual components determines the morphology of the product of this embodiment.

The preset circuit board layout design corresponds to bill of materials data, the bill of materials data is preset bill of materials data, and the bill of materials data is stored by the computing device, for example, a memory of the computing device stores the preset bill of materials data. The preset bill of materials data contains complete product data, is universal bill of materials data and corresponds to the preset circuit board layout design; the modified preset bill of materials data can be used as the bill of materials data of the product of the embodiment.

In this embodiment, the preset bill of materials data includes a data processing module 2, a switching module 5, an interface 11, and N functional modules.

After the form information of the product is obtained, the computing equipment modifies the preset bill of materials data according to the form information of the product to obtain the bill of materials data of the product. Specifically, M function modules in the preset bill of materials data are reserved, and the remaining function modules are deleted (i.e., the remaining N minus M function modules are deleted). Meanwhile, the preset circuit board layout design is modified accordingly, so that the modified circuit board layout design is obtained and used for producing products.

The preset bill of materials data includes the product data of the first functional module 3 and the product data of the second functional module 4. Then, modifying the preset bill of materials data includes: the product data of the first functional module 3 and/or the product data of the second functional module 4 are deleted from the preset bill of materials data. Specifically:

If the form information of the product indicates that the product comprises the first functional module 3 and does not comprise the second functional module 4, deleting the product data of the second functional module 4 from the preset bill of materials data, and reserving the product data of the first functional module 3;

if the form information of the product indicates that the product comprises the second functional module 4 and does not comprise the first functional module 3, deleting the product data of the first functional module 3 from the preset bill of materials data, and reserving the product data of the second functional module 4;

if the form information of the product indicates that the product comprises a first functional module 3 and a second functional module 4, reserving product data of the first functional module 3 and product data of the second functional module 4 in preset bill of materials data;

if the form information of the product indicates that the product does not include the first function module 3 and the second function module 4, the product data of the first function module 3 and the product data of the second function module 4 are deleted from the preset bill of materials data.

Thus, modified bill of materials data can be obtained.

And step A3, outputting the modified bill of materials data.

After the modified bill of materials data is obtained, the computing device outputs the bill of materials data, such as sending the bill of materials data to other devices or displaying the bill of materials data through a screen.

Based on the above, the bill of materials data of the product determined in the present embodiment includes one, both or none of the product data of the first functional module 3 and the product data of the second functional module 4, and also includes the product data of the circuit board 1, the product data of the switching module 5, and the product data of the data processing module 2.

According to the above, the bill of materials data of the preset circuit board layout design is modified according to the obtained form information of the product, so that the bill of materials data of the product is obtained and output, the material management can be simplified, and the production efficiency can be improved.

The product of the embodiment comprises a circuit board 1 and a data processing module 2, wherein the circuit board 1 is compatible with a first functional module and a second functional module (a first interface of the circuit board is used for sharing the first functional module and the second functional module); the foregoing product optionally further comprises a switching module 5, where the switching module 5 is configured to connect one or both of the first functional module 3 and the second functional module 4 to the first interface 11 of the circuit board 1, and the data processing module 2 is connected to the switching module 5; determining bill of materials data of the product according to the form information of the product (the product comprises one, two or none of the first functional module 3 and the second functional module 4), wherein the bill of materials data comprises one, two or none of the product data of the first functional module 3 and the product data of the second functional module 4, and the bill of materials data further comprises the product data of the circuit board and the product data of the data processing module; therefore, according to the bill of materials data, fewer circuit boards 1 are designed, a series of diversified individual products with different functional characteristics can be obtained, the contents of the bill of materials data corresponding to the products have more identical parts, the bill of materials data can be simplified, higher output can be obtained with less investment, the production efficiency can be improved, and the overall production cost can be reduced.

The product of this embodiment corresponds to bill of materials data determined by the method of this embodiment, and the product of this embodiment will be described below.

The first functional module 3 and the second functional module 4 are modules having different functions, such as: the first functional module 3 has a function F1 and the second functional module 4 has a function F2.

The products of the present embodiment can be classified into the following four types. Fig. 1 to 4 are schematic diagrams showing the results of the four products provided in this example.

First product: referring to fig. 1, a first product including only the function F1, which includes the first function module 3 but not the second function module 4, the product data of the second function module 4 is deleted from the above-mentioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the physical key board, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the touch screen are removed; of course, the product also comprises a circuit board 1, a data processing module 2 and a switching module 5. In this case (the product only requires the first functional module 3), the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, the other side of the first interface 11 is connected to the first functional module 3, and the data processing module 2 controls the switching module 5 such that the switching module 5 is switched to a channel which can communicate with the first functional module 3.

The second product: referring to fig. 2, the second product contains only the function F2, and the product contains the second function module 4 but does not contain the first function module 3, and then the product data of the first function module 3 is deleted from the above-mentioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the touch screen, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the physical key board are removed; of course, the product also comprises a circuit board 1, a data processing module 2 and a switching module 5. In this case (the product only requires the second functional module 4), the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, the other side of the first interface 11 is connected to the second functional module 4, and the data processing module 2 controls the switching module 5 such that the switching module 5 is switched to a channel which can communicate with the second functional module 4.

Third product: referring to fig. 3, a third product including functions F1 and F2 includes the first and second functional modules 3 and 4, and then the product data of the first functional module 3 and the product data of the second functional module 4 are maintained in the aforementioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product needs the physical key board and the touch screen, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the physical key board and the touch screen are reserved; of course, the product also comprises a circuit board 1, a data processing module 2 and a switching module 5. In this case (the product requires a first functional module 3 and a second functional module 4), the data processing module 2 is connected to one side of the switching module 5, the other side of the switching module 5 is connected to one side of the first interface 11, the other side of the first interface 11 is connected to the first functional module 3 and the second functional module 4, the data processing module 2 controls the switching module 5 such that the switching module 5 is switched to a channel capable of communicating with the first functional module 3 or the second functional module 4, and selection of a module function is performed by the switching module 5.

Fourth product: referring to fig. 4, the fourth product contains neither the function F1 nor the function F2, and the product contains neither the first function module 3 nor the second function module 4, and then the product data of the first function module 3, the product data of the second function module 4, and the product data of the switching module 5 are deleted from the aforementioned preset bill of materials; at this time, the product includes a circuit board 1 and a data processing module 2.

Based on the above, the first functional module 3 and the second functional module 4 share the first interface 11 of the circuit board 1, and the same circuit board 1 can be shared between different products by the switching module 5 and determining different bill of materials data, so as to select the respective required module functions.

It should be understood that, taking the first functional module 3 (function F1) and the second functional module 4 (function F2) as examples herein, an actual product may contain N components (N functions), where N is an integer of 2 or more.

The circuit connection method of the product of this embodiment will be described below.

The first interface 11 is a pad (hereinafter referred to as a first pad 11). In other embodiments, the first interface 11 may also be a PIN (PIN) interface.

Fig. 6 is a schematic structural view of a modification of the third product provided in the present embodiment. In the present embodiment, the first functional module 3 and the second functional module 4 share the first pad 11 of the circuit board 1, and the first pad 11 transmits different signals, such as: the first pad 11 transmits a first signal for the first functional module 3 and a second signal for the second functional module 4; the corresponding pads of the first functional module 3 and the second functional module 4 on the circuit board 1 are identical, but the pads will transmit different signals. Referring to fig. 6, in order to transfer signals sent from the data processing module 2 to the first functional module 3 and the second functional module 4, switching of the signals may be implemented by the switching module 5. Since the first interface 11 is a pad, the preset circuit board layout design of the present embodiment further includes N connection elements, where the connection relationship between the N connection elements in the preset circuit board layout design is: each of the connectors is connected between one of the interfaces (pads) and one of the functional modules. Correspondingly, the bill of materials data also comprises N connecting pieces.

The morphological information of the aforementioned product further comprises: the product includes M of the N connectors. Correspondingly, the step A2 (modifying the bill of materials data of the preset circuit board layout design according to the form information) further includes: m connectors in the preset bill of materials data are reserved, and the rest connectors are eliminated. In this embodiment, referring to fig. 6, n connectors are a first connector 6 and a second connector 9, respectively, the switching module 5 connects one end of the first connector 6 and one end of the second connector 9 through a first bonding pad 11, the other end of the first connector 6 is connected to the first functional module 3, and the other end of the first connector 9 is connected to the second functional module 4. If the first functional module 3 is reserved in the preset bill of materials data and the second functional module 4 is deleted, the first connecting piece 6 is reserved in the preset bill of materials data correspondingly, and the second connecting piece 9 is deleted; if the second functional module 4 is reserved in the preset bill of materials data and the first functional module 3 is deleted, the second connecting piece 9 is reserved in the preset bill of materials data correspondingly, and the first connecting piece 6 is deleted; if the first functional module 3 and the second functional module 4 are reserved in the preset bill of materials data, the first connecting piece 6 and the second connecting piece 9 are reserved in the preset bill of materials data correspondingly; if the first functional module 3 and the second functional module 4 are deleted from the predetermined bill of materials data, the first connection 6 and the second connection 9 are deleted from the predetermined bill of materials data accordingly. And simultaneously, correspondingly modifying the preset circuit board layout design.

The first connection 6 and the second connection 9 are, for example, connectors, but the first connection 6 may also be other signal connections.

For example, when a physical KEY board (also referred to as a KEY board) is adopted, the switching module 5 opens a channel for transmitting a KEY (KEY) signal to the first pad 11, so as to transmit the KEY signal sent by the data processing module 2 to the first pad 11, and then the first connecting piece 6 connected with the first pad 11 accesses the KEY signal to the physical KEY board (i.e. the first functional module 3); when a screen such as a touch screen (i.e. the second functional module 4) is adopted, the switching module 5 opens a channel for transmitting a touch screen signal to the first bonding pad 11, so as to transmit the touch screen signal sent by the data processing module 2 to the first bonding pad 11, and then the second connecting piece 9 connected with the first bonding pad 11 is used for connecting a key signal to the touch screen (i.e. the second functional module 4), such as a flexible circuit board connected to the touch screen.

Fig. 7 is a schematic structural view of a modification of the first product provided in the present embodiment. Fig. 8 is a schematic structural view of a modification of the second product provided in the present embodiment.

In other embodiments, referring to fig. 7 and 8, in addition to the transmission of the signals sent by the data processing module 2 to the first functional module 3 and the second functional module 4 in a channel-switching manner by using the switching module 5, the transmission of the signals to the first functional module 3 and the second functional module 4, respectively, may be implemented by two (N) intermediate devices:

In this embodiment, the intermediate devices may be resistors, and the two intermediate devices are a first intermediate device 7 and a second intermediate device 8, respectively.

Referring to fig. 7, when a physical key pad is used, a key signal is required to be accessed, and a first intermediate device 7 (for example, a string resistor of 0 ohm) is used, and then bill of materials data of a product contains product data of the first intermediate device 7; the data processing module 2 is for example provided with a physical key interface, which physical key interface of the data processing module 2 is connected to the first bonding pad 11 via the first intermediate device 7 (resistor), and then to the physical key pad via the first connection 6 connected to the first bonding pad 11.

Referring to fig. 8, when a touch screen is used, a touch screen signal is required to be accessed, and a second intermediate device 8 (resistor) is used, and then bill of materials data of a product contains product data of the second intermediate device 8; the data processing module 2 is provided with a touch screen interface, which is connected to the first bonding pad 11 via the second intermediate device 8, and then connected to the touch screen via the first connecting piece 6 connected to the first bonding pad 11.

Based on the above, the first and second functional modules 3 and 4 use identical connectors, and the first connector 6 is used. The bill of materials data of the product of the present embodiment includes the product data of the first connection 6, the product data of the first intermediate device 7, and/or the product data of the second intermediate device 8.

Second embodiment

Fig. 9 to 12 are schematic structural views of four products provided in the present embodiment.

The present embodiment differs from the first embodiment in that: the preset bill of materials data comprise a data processing module 2, P interfaces and P functional modules, the form information comprises Q functional modules in the P functional modules, Q is more than or equal to 0 and less than or equal to P, and both Q and P are integers; the connection relation of each component in the preset bill of materials data in the preset circuit board layout design is as follows: the data processing module 2 is respectively connected with P interfaces, and the P interfaces are respectively connected with P functional modules in a one-to-one correspondence manner.

This embodiment will be described by taking P equal to 2 as an example. Then the 2 interfaces are the first 11 and the second 12 interface of the circuit board 1, respectively.

Referring to fig. 1 to 4, the circuit board 1 of the first embodiment is provided with a first interface 11; referring to fig. 9 to 12, the circuit board of the present embodiment is provided with a first interface 11 and a second interface 12, and the first interface 11 and the second interface 12 are used for respectively connecting with the first functional module 3 and the second functional module 4; the data processing module 2 is arranged to be connected to a first interface 11 and a second interface 12.

The bill of materials data of the product determined by the method of the present embodiment includes one, both or none of the product data of the first functional module 3 and the product data of the second functional module 4, and the bill of materials data further includes the product data of the circuit board 1 and the product data of the data processing module 2.

The products of the present embodiment can be classified into the following four types.

First product: referring to fig. 9, the first product contains only the function F1, and the product contains the first function module 3 but not the second function module 4, and then the product data of the second function module 4 is deleted from the above-mentioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the physical key board, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the touch screen are removed; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only requires the first functional module 3), the data processing module 2 is connected to one side of the first interface 11, and the other side of the first interface 11 is connected to the first functional module 3.

The second product: referring to fig. 10, the second product contains only the function F2, and the product contains the second function module 4 but does not contain the first function module 3, and then the product data of the first function module 3 is deleted from the above-mentioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the touch screen, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the physical key board are removed; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only requires the second functional module 4), the data processing module 2 is connected to one side of the second interface 12, and the other side of the second interface 12 is connected to the second functional module 4.

Third product: referring to fig. 11, a third product including functions F1 and F2 includes the first and second functional modules 3 and 4, and then the product data of the first functional module 3 and the product data of the second functional module 4 are maintained in the aforementioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product needs the physical key board and the touch screen, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the physical key board and the touch screen are reserved; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product requires a first functional module 3 and a second functional module 4), the data processing module 2 is connected to one side of the first interface 11 and to one side of the second interface 12, the other side of the first interface 11 is connected to the first functional module 3 and the other side of the second interface 12 is connected to the second functional module 4.

Fourth product: referring to fig. 12, the fourth product contains neither the function F1 nor the function F2, and the product contains neither the first function module 3 nor the second function module 4, and then the product data of the first function module 3, the product data of the second function module 4, and the product data of the switching module 5 are deleted from the aforementioned preset bill of materials; at this time, the product includes a circuit board 1 and a data processing module 2.

Based on the above, the first interface 11 and the second interface 12 of the circuit board 1 are independent interfaces, and the first functional module 3 and the second functional module 4 are connected with the two independent interfaces, so that the same circuit board 1 can be shared between different products directly by determining different bill of materials data, and the respective required module functions can be selected.

It should be understood that taking the first functional module 3 (function F1) and the second functional module 4 (function F2) as examples herein, an actual product may contain P parts (P functions), where P is an integer of 2 or more.

The circuit connection method of the product of this embodiment will be described below. Fig. 13 is a schematic view of a modification of the first product provided in the present embodiment. Fig. 14 is a schematic view of a modification of the second product provided in this embodiment.

Referring to fig. 13 and 14, the first interface 11 and the second interface 12 are each a pad (hereinafter referred to as a first pad 11 and a second pad 12). In other embodiments, the first interface 11 and the second interface 12 may also be PIN (PIN) interfaces.

In the present embodiment, referring to fig. 13 and 14, the first functional module 3 uses the first pad 11 of the circuit board 1, the second functional module 4 uses the second pad 12 of the circuit board 1, and the first pad 11 and the second pad 12 are used to transmit mutually independent signals, respectively, so that the pads are independent and the signals transmitted by the pads are also independent. Referring to fig. 13 and 14, in order to transmit signals sent by the data processing module 2 to the first functional module 3 and the second functional module 4, the preset circuit board layout design of the present embodiment further includes P connectors, where connection relationships of the P connectors in the preset circuit board layout design are as follows: each of the connectors is connected between one of the interfaces (pads) and one of the functional modules. Correspondingly, the bill of materials data also comprises P connecting pieces.

The morphological information of the aforementioned product further comprises: the product includes Q of the P connectors. Correspondingly, the step A2 (modifying the bill of materials data of the preset circuit board layout design according to the form information) further includes: q connectors in the preset bill of materials data are reserved, and the rest connectors are eliminated. In the present embodiment, the P connectors are a first connector 6 and a second connector 9, respectively, and the first connector 6 and the second connector 9 are two independent connectors; the first bonding pad 11 is connected to the first functional module 3 via the first connection 6 and/or the second bonding pad 12 is connected to the second functional module 4 via the second connection 9. If the first functional module 3 is reserved in the preset bill of materials data and the second functional module 4 is deleted, the first connecting piece 6 is reserved in the preset bill of materials data correspondingly, and the second connecting piece 9 is deleted; if the second functional module 4 is reserved in the preset bill of materials data and the first functional module 3 is deleted, the second connecting piece 9 is reserved in the preset bill of materials data correspondingly, and the first connecting piece 6 is deleted; if the first functional module 3 and the second functional module 4 are reserved in the preset bill of materials data, the first connecting piece 6 and the second connecting piece 9 are reserved in the preset bill of materials data correspondingly; if the first functional module 3 and the second functional module 4 are deleted from the predetermined bill of materials data, the first connection 6 and the second connection 9 are deleted from the predetermined bill of materials data accordingly. And simultaneously, correspondingly modifying the preset circuit board layout design.

The first connector 6 and the second connector 9 are connectors, and the first connector 6 and the second connector 9 may be other signal connectors (such as zebra stripes).

For example, referring to fig. 13, when a physical KEY board (also referred to as a KEY board) is used, a product accesses a KEY (KEY) signal through the first pad 11, specifically, a KEY signal sent by the data processing module 2 is transmitted to the first pad 11, and then the first connector 6 connected to the first pad 11 accesses the KEY signal to the physical KEY board (i.e., the first functional module 3); referring to fig. 14, when a screen such as a touch screen (i.e., the second functional module 4) is used, a touch screen signal is accessed through the second pad 12, specifically, the touch screen signal sent by the data processing module 2 is transmitted to the second pad 12, and then a key signal is accessed to the touch screen (i.e., the second functional module 4) through the second connector 9 connected to the second pad 12, such as a flexible circuit board of the touch screen.

Third embodiment

Fig. 15 and 16 are schematic structural views of two products provided in this embodiment.

The present embodiment differs from the first embodiment in that: the preset bill of materials data comprise a data processing module 2, an interface and R functional modules, the form information of the product comprises one functional module of the R functional modules, and R is an integer; the connection relation of each component in the bill of materials data in the preset circuit board layout design is as follows: the data processing module 2 is connected with the interfaces, and the interfaces are respectively connected with R functional modules; accordingly, since the form information of the products is different, step A2 (modifying the bill of materials data of the preset circuit board layout design according to the form information) includes: the one functional module in the preset bill of materials data is reserved, and the rest functional modules are eliminated.

Referring to fig. 1 to 4, in a first embodiment, the data processing module 2 is used to connect with the switching module 5 or with an intermediate device, and the first interface 11 is used to be shared by the first functional module 3 and the second functional module 4; in the present embodiment, referring to fig. 15 and 16, the product includes one of the first functional module 3 and the second functional module 4, or neither of them, and the first interface 11 is used to connect with the first functional module 3 or the second functional module 4.

The bill of materials data of the product determined by the method of the present embodiment includes one of the product data of the first functional module 3 and the product data of the second functional module 4, or neither of them, and also includes the product data of the circuit board 1 and the product data of the data processing module 2.

The products of the present embodiment can be classified into the following three types.

First product: referring to fig. 15, the first product contains only the function F1, and the product contains the first function module 3 but not the second function module 4, and then the product data of the second function module 4 is deleted from the above-mentioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the physical key board, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the touch screen are removed; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only requires the first functional module 3), the data processing module 2 is connected to one side of the first interface 11, and the other side of the first interface 11 is connected to the first functional module 3.

The second product: referring to fig. 16, the second product contains only the function F2, and the product contains the second function module 4 but does not contain the first function module 3, and then the product data of the first function module 3 is deleted from the above-mentioned preset bill of materials; for example, the first functional module 3 is a physical key board, the second functional module 4 is a touch screen, and the product only needs the touch screen, so that in a preset bill of materials corresponding to the adopted compatible circuit board 1, relevant devices of the physical key board are removed; of course, the product also comprises a circuit board 1 and a data processing module 2. In this case (the product only requires the second functional module 4), the data processing module 2 is connected to one side of the first interface 11, and the other side of the first interface 11 is connected to the second functional module 4.

Third product: the third product contains neither the function F1 nor the function F2, and the product contains neither the first function module 3 nor the second function module 4, and then the product data of the first function module 3, the product data of the second function module 4, and the product data of the switching module 5 are deleted from the foregoing preset bill of materials; at this time, the product includes a circuit board 1 and a data processing module 2.

Based on the above, it can be known that the interface packages of the different modules (the first functional module 3 and the second functional module 4) are completely compatible, and the same interface (the first interface 11) is used, so that the same circuit board 1 can be shared between different products directly through determining different bill of materials data, and the respective required modules are selected.

As another example: the module functions required by the product are wireless communication functions, the first functional module 3 is a 4G module, and the second functional module 4 is a 3G module. And the 4G module and the 3G module are completely compatible in packaging, so that bill of materials data can be directly replaced, and different functions are compatible on the same circuit board 1.

It should be understood that, taking the first functional module 3 (function F1) and the second functional module 4 (function F2) as examples herein, an actual product may contain R parts (R functions), where R is an integer of 2 or more.

The circuit connection method of the product of this embodiment will be described below. Fig. 17 is a schematic view of a modification of the first product provided in the present embodiment. Fig. 18 is a schematic structural view of a modification of the second product provided in the present embodiment.

In the present embodiment, referring to fig. 17 and 18, the first functional module 3 uses the first pad 11 of the circuit board 1, and the second functional module 4 also uses the first pad 11 of the circuit board 1, but only one or neither of the first functional module 3 and the second functional module 4 is present on the same product (e.g., only the first functional module 3 or only the second functional module 4 is present); for the case where the first functional module 3 or the second functional module 4 is present, the signals transmitted by the first pads 11 are identical, for example, the tamer signal of the central processor (data processing module 2) needs to be accessed whether a physical keypad or a touch screen is used; thus, the first functional module 3 and the second functional module 4 both use the first pad 11, and the signals transmitted by the first pad 11 are identical. In order to transmit the signal sent by the data processing module 2 to the first functional module 3 or the second functional module 4, the preset circuit board layout design of the present embodiment further includes R connection pieces, where the connection relationship of the R connection pieces in the preset circuit board layout design is as follows: each of the connectors is connected between one of the interfaces (pads) and one of the functional modules. Correspondingly, the bill of materials data also comprises R connecting pieces.

The morphological information of the aforementioned product further comprises: the product includes one of the R connectors. Correspondingly, the step A2 (modifying the bill of materials data of the preset circuit board layout design according to the form information) further includes: one connector in the preset bill of materials data is reserved, and the rest connectors are omitted. In the present embodiment, the R connection members are the first connection member 6 and the second connection member 9, respectively. If the first functional module 3 is reserved in the preset bill of materials data and the second functional module 4 is deleted, the first connecting piece 6 is reserved in the preset bill of materials data correspondingly, and the second connecting piece 9 is deleted; if the second functional module 4 is reserved in the preset bill of materials data and the first functional module 3 is deleted, the second connecting piece 9 is reserved in the preset bill of materials data correspondingly, and the first connecting piece 6 is deleted. And simultaneously, correspondingly modifying the preset circuit board layout design. In the present embodiment, the first bonding pad 11 is connected to the first functional module 3 or the second functional module 4 through the first connection member 6, and it can be seen that both the first functional module 3 and the second functional module 4 use the first connection member 6.

For example, referring to fig. 17, when a physical keypad (which may also be referred to as a KEY board) is used, a product accesses a first tamer signal through the first pad 11, specifically, a tamer signal sent from the data processing module 2 is transmitted to the first pad 11, and then the tamer signal is accessed to the physical keypad (i.e., the first functional module 3) through the first connector 6 connected to the first pad 11; referring to fig. 18, when a screen such as a touch screen (i.e., the second functional module 4) is used, a tamer signal is accessed through the first pad 11, specifically, the tamer signal sent from the data processing module 2 is transmitted to the first pad 11, and then the tamer signal is accessed to the touch screen (i.e., the second functional module 4) by the first connector 6 connected to the first pad 11, such as a flexible circuit board of the touch screen.

The TMAPER signal of the cpu is preferably transmitted by the circuit connection method of the third embodiment, but when the number of the two signals to the tamer or the network requirements are inconsistent, the circuit connection method of the second embodiment may also be used for transmission. Since the tamer signal is asserted for 24 hours, it cannot be controlled by the switching module 5 that is disabled by power down, i.e. cannot be transmitted by the circuit connection of the first embodiment.

Embodiments of the present application will be described with particular reference to actual applications, taking products such as POS machine(s) of PIN (Personal Identification) as an example. The products for inputting PIN can be divided into products for inputting PIN by physical keys and products for inputting PIN by touch screens. Fig. 19 is a schematic structural diagram of a physical key PIN-through product according to the present embodiment. Fig. 20 is a schematic structural diagram of a modification of the physical key PIN-through product provided in this embodiment. Fig. 21 is a schematic structural diagram of a product for inputting PIN through a touch screen according to the present embodiment.

The physical key PIN-inputting product is provided with a physical key board, and also can be provided with a display screen, a printer, a magnetic stripe card, an IC (Integrated Circuit ) card, a communication module and the like.

The product for inputting PIN by touch screen is provided with a touch screen (used for inputting PIN), and a printer, a magnetic stripe card, an IC card, a communication module and the like can be selected.

The physical key PIN-transmitting product and the touch screen PIN-transmitting product have large appearance form difference, but compatible parts exist in the internal structural design, such as: the shared circuit board and the screw positions of the circuit board are consistent, and the peripheral functions are overlapped more.

Referring to fig. 19, the physical key PIN inputting product implements PIN input using physical keys, using a circuit board 1 and a physical key sheet, wherein the physical key sheet is provided with key module related devices, pads and wirings, and other peripherals, and the circuit board 1 is provided with a main chip and other peripheral function modules. The circuit board 1 is provided with a metal pad (a first interface 11), and the first connecting piece 6 connects the physical key board with the circuit board 1 through the metal pad to realize electric signal conduction. Alternatively, referring to fig. 20, the physical key PIN-transmitting product is provided with a screen which is signal-connected with the circuit board 1 through the first connector 6A.

Referring to fig. 21, the product of the touch screen PIN input uses the touch screen as PIN input and the same circuit board 1 as the product of the touch screen PIN input, wherein the circuit board 1 is provided with a screen interface module and related devices, pads and wires, and in addition, the circuit board 1 is provided with a main chip and other peripheral function modules. The circuit board 1 is provided with a metal pad (first interface 11), and the first connecting member 6B is connected with the circuit board 1 through the metal pad to realize electrical signal conduction.

It should be understood that the connectors are only examples herein, and that there may actually be X first connectors 6, first connectors 6A, and Y first connectors 6B, where X and Y are integers of 1 or more. Depending on the actual circuit connection, the first connector 6B may be identical to the first connector 6 or the first connector 6A.

It should be appreciated that the same signal and different signals may be carried on the same connector at the same time. Example:

the key signals of the product of the physical key PIN transmission are connected to the physical key board from four bonding pads of the first interface 11 of the circuit board 1 through four PINs of the first connecting piece 6, and TAMPER 1/2 signals output by the circuit board 1 are connected to the physical key board from the other two bonding pads of the first interface 11 through two PINs of the first connecting piece 6;

touch screen signals of products for inputting PIN through touch screen are accessed to a screen (such as a flexible circuit board accessed to the screen) through four PINs of the first connecting piece 6 from four bonding pads of the first interface 11 of the circuit board 1, and TAMPER 1/2 signals output by the circuit board 1 are accessed to the screen through two other bonding pads of the first interface 11 and two PINs of the first connecting piece 6.

With the compatible circuit design of the embodiment, compatible circuit boards among different products can be realized, and the compatible circuit boards can be one circuit board or a plurality of circuit boards can be combined together.

In a circuit board combination for realizing the product, the following three forms of circuit board combinations can be included:

1) Compatible circuit boards, and consistent bill of materials are adopted;

2) Compatible circuit boards, but with different bill of materials, different functional modules are selected by the circuit form of one or more combinations of the first, second, and third embodiments;

3) A separate circuit board is employed to employ other personalized (incompatible) functional module designs.

Fig. 22 is a schematic diagram of circuit board assembly of a product a according to an embodiment of the present application. Fig. 23 is a schematic circuit board assembly diagram of a product B according to an embodiment of the present application. Fig. 24 is a schematic diagram of circuit board assembly of a product C according to an embodiment of the present application.

Example one: referring to fig. 22 and 23, both products a and B employ compatible circuit boards M1 and M2, but products a and B each use a different bill of materials: the circuit board M1 of the product A uses a bill of materials AM1, and the circuit board M2 of the product A uses a bill of materials AM2; the bill of materials BM1 is used for the circuit board M1 of the product B, and the bill of materials BM2 is used for the circuit board M2 of the product B. In addition, the product A and the product B also respectively use independent circuit boards, namely a circuit board S1 and a circuit board S2; the bill of materials AS1 is used for the circuit board S1 of the product a, and the bill of materials BS2 is used for the circuit board S2 of the product B. Thus, the bill of materials data of the product a includes the bill of materials AM1, the bill of materials AM2, and the bill of materials AS1. The bill of materials data of the product B includes a bill of materials BM1, a bill of materials BM2, and a bill of materials BS2.

Example two: referring to fig. 23 and 24, both the product B and the product C employ compatible circuit boards M1 and M2, wherein the circuit boards M1 use the same bill of materials, and the circuit boards M2 use different bill of materials, specifically: the circuit board M1 of the product B uses a bill of materials BM1, and the circuit board M2 of the product B uses a bill of materials BM2; the bill of materials BM1 is also used for the circuit board M1 of the product C, but the bill of materials CM2 is used for the circuit board M2 of the product C. In addition, the product B and the product C also respectively use independent circuit boards, namely a circuit board S2 and a circuit board S3; the bill of materials BS2 is used for the circuit board S2 of the product B, and the bill of materials CS3 is used for the circuit board S3 of the product C. Thus, the bill of materials data of the product B includes the bill of materials BM1, the bill of materials BM2, and the bill of materials BS2. The bill of materials data of the product C includes a bill of materials BM1, a bill of materials CM2, and a bill of materials CS3.

Embodiments of the present application enable: even products with very different forms can realize compatible scheme design; such as: the key products (such as products for physical key PIN transmission) and the full touch screen products (such as products for touch screen PIN transmission) can realize the use of the same circuit board through the technical scheme of the embodiment of the application although the form difference is huge; specifically, the key product adopts: circuit board a (corresponding bill of materials a), physical key pad, and other circuit boards; the touch screen product adopts: circuit board a (corresponding to bill of materials B), screen, and other circuit boards. For different products, the other circuit boards and their corresponding bill of materials may be identical, or the circuit boards may be identical but the corresponding bill of materials may be different, or the circuit boards and their corresponding bill of materials may be different.

Therefore, a series of diversified individual products with different functional characteristics can be obtained by designing a small number of circuit boards, adopting the modes of maximized sharing and combination among a plurality of circuit boards, changing a bill of materials and the like, higher output can be obtained with less investment, material management is simplified, production efficiency can be improved, and overall production cost is reduced.

Fourth embodiment

Corresponding to the method described in the above embodiments, fig. 25 shows a block diagram of a circuit board design apparatus of a product provided in the embodiments of the present application, and only a portion related to the embodiments of the present application is shown for convenience of explanation.

Referring to fig. 25, the apparatus includes a morphological information acquisition unit 101, a data modification unit 102, and a data output unit 103.

A morphological information acquisition unit 101 for: and obtaining the form information of the product.

A data modification unit 102 for: and modifying bill of materials data of the preset circuit board layout design according to the form information.

And a data output unit 103, configured to output the modified bill of materials data.

Wherein, the form information of the product is referred to the above embodiment.

It should be noted that, because the content of information interaction and execution process between the above devices/units is based on the same concept as the method embodiment of the present application, specific functions and technical effects thereof may be referred to in the method embodiment section, and will not be described herein again.

Fig. 26 is a schematic structural diagram of a computing device according to an embodiment of the present application. As shown in fig. 26, the computing device 26 of this embodiment includes: at least one processor 260 (only one shown in fig. 26), a memory 261, and a computer program 262 stored in the memory 261 and executable on the at least one processor 260; the steps of any of the various method embodiments described above are implemented by processor 260 when executing computer program 262.

Computing device 26 may be a desktop computer, a notebook computer, a palm top computer, a cloud server, or the like. The computing device may include, but is not limited to, a processor 260 and a memory 261. It will be appreciated by those skilled in the art that fig. 26 is merely an example of a computing device and is not intended to be limiting, and may include more or fewer components than shown, or may combine certain components, or different components, e.g., may also include input and output devices, network access devices, buses, etc.

The processor 260 may be a central processing unit (Central Processing Unit, CPU), and the processor 260 may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific data processing modules (Application Specific Integrated Circuit, ASIC), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.

Memory 261 may in some embodiments be an internal storage unit of computing device 26, such as a hard disk or memory of the computing device. Memory 261 may in other embodiments also be an external storage device of the computing device, such as a plug-in hard disk provided on the computing device, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash Card (Flash Card), etc. Further, memory 261 may also include both internal storage units and external storage devices of the computing device. The memory 261 is used for storing an operating system, application programs, boot Loader (Boot Loader), data, and other programs and the like, such as program codes of computer programs and the like. The memory 261 may also be used to temporarily store data that has been output or is to be output.

By way of example, the computer program 262 may be partitioned into one or more modules/units that are stored in the memory 261 and executed by the processor 260 to complete the present application. One or more of the modules/units may be a series of computer program instruction segments capable of performing particular functions to describe the execution of the computer program 262 in the computing device 26.

It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic of each process, and should not limit the implementation process of the embodiment of the present application in any way.

It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.

The aforementioned integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the present application implements all or part of the flow in the above-described embodiment method, which may be accomplished by a computer program to instruct related hardware, where the computer program may be stored in a computer readable storage medium; which, when executed by a processor, performs the steps of the various method embodiments described above. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, executable files or in some intermediate form, etc. The computer readable medium includes: any entity or device capable of carrying computer program code to an apparatus/terminal device, recording medium, computer Memory, read-Only Memory (ROM), random access Memory (RAM, random Access Memory), electrical carrier signals, telecommunications signals, and software distribution media. Such as a U-disk, removable hard disk, magnetic or optical disk, etc. In some jurisdictions, computer readable media may not be electrical carrier signals and telecommunications signals in accordance with legislation and patent practice.

Embodiments of the present application also provide a computer readable storage medium storing a computer program which, when executed by a processor, implements steps that may be implemented in the various method embodiments described above.

Embodiments of the present application provide a computer program product enabling a computer to carry out the steps of the various method embodiments described above when the computer program product is run on a terminal device, such as a computer.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus/device and method may be implemented in other manners. For example, the apparatus/device embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.

The units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

The above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.

Claims

1. A circuit board design method for an electronic product, the method comprising:

obtaining form information of a product;

outputting the modified bill of materials data;

the bill of materials data comprise a data processing module, a switching module, an interface and N functional modules, wherein the form information comprises M functional modules in the N functional modules, M is more than or equal to 0 and less than or equal to N, M and N are integers, and the interface is a bonding pad;

and reserving the M functional modules in the bill of materials data of the preset circuit board layout design, and deleting the rest functional modules.

2. The circuit board design method of claim 1, further comprising:

3. A circuit board design method for an electronic product, the method comprising:

obtaining form information of a product;

outputting the modified bill of materials data;

the bill of materials data comprise a data processing module, P interfaces and P functional modules, the form information comprises Q functional modules in the P functional modules, Q is more than or equal to 0 and less than or equal to P, Q and P are integers, and the interfaces are bonding pads;

4. The circuit board design method according to claim 3, wherein the bill of materials data further includes P connectors, and the connection relationship of the P connectors in the preset circuit board layout design is: each of the connectors is connected between one of the interfaces and one of the functional modules;

5. A circuit board design method for an electronic product, the method comprising:

obtaining form information of a product;

outputting the modified bill of materials data;

the bill of materials data comprises a data processing module, an interface and R functional modules, wherein the form information comprises one functional module of the R functional modules, R is an integer, and the interface is a bonding pad;

6. The circuit board design method according to claim 1 or 5, wherein the bill of materials data further includes N connectors or R connectors, and the connection relationship of the connectors in the preset circuit board layout design is: each connecting piece is connected between the interface and one of the functional modules;

7. An electronic product characterized in that the circuit board design method of the product according to any one of claims 1 to 6 is implemented.

8. A circuit board design apparatus for a product, the apparatus comprising:

the data output unit is used for outputting the modified bill of materials data;

the system comprises a data processing module, a switching module, an interface and N functional modules, wherein the interface is a bonding pad, the form information comprises M functional modules in the N functional modules, M is more than or equal to 0 and less than or equal to N, M and N are integers, and the connection relation of each component in the system in the design of the preset circuit board layout is as follows: the data processing module, the switching module and the interface are sequentially connected, and the interface is respectively connected with the N functional modules; the modifying the bill of materials data of the preset circuit board layout design according to the form information comprises the following steps: and reserving the M functional modules in the bill of materials data of the preset circuit board layout design, and deleting the rest functional modules.

9. A computing device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor implementing the method of any of claims 1 to 6 when the computer program is executed.

10. A computer readable storage medium, characterized in that the computer readable storage medium stores a computer program which, when executed by a processor, implements the method according to any of claims 1 to 6.