CN113173798A - 用于气浮轴承的多孔陶瓷及其制备方法和应用 - Google Patents

用于气浮轴承的多孔陶瓷及其制备方法和应用 Download PDF

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CN113173798A
CN113173798A CN202110284468.8A CN202110284468A CN113173798A CN 113173798 A CN113173798 A CN 113173798A CN 202110284468 A CN202110284468 A CN 202110284468A CN 113173798 A CN113173798 A CN 113173798A
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ceramic
porous ceramic
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朱孔军
杜建周
金栋平
石峰
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Nanjing University of Aeronautics and Astronautics
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Nanjing University of Aeronautics and Astronautics
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Abstract

本发明公开了一种用于气浮轴承的多孔陶瓷及其制备方法和应用，属于多孔陶瓷材料技术领域。所述方法包括步骤如下：按如下质量份配比称取10~20份碳化硅、10~20份相增强料、3~5份烧结助剂、40~50份粘结剂和5~10份造孔剂混合均匀，在60~80℃下反应3~4 h后得到陶瓷浆料；将所述陶瓷浆料冷冻干燥后得到陶瓷粉体；将所述陶瓷粉体热压成型得到陶瓷素坯；将所述陶瓷素坯烧结得到所述多孔陶瓷；其中，所述相增强料为纳米氧化锆、氧化锆晶须和莫来石晶须中的一种或几种。本发明制得的多孔陶瓷兼具有良好的渗透性和力学性能，在气浮轴承中具有良好的应用。

Description

用于气浮轴承的多孔陶瓷及其制备方法和应用
技术领域
本发明属于多孔陶瓷材料技术领域，具体涉及一种用于气浮轴承的多孔陶瓷及其制备方法和应用。
背景技术
气浮轴承也叫气体轴承，是用气体作为润滑剂的滑动轴承。正常工作时，轴和轴承表面完全由气膜所隔开，凭借气膜中压力的变化来支承轴和外力负荷。由于空气比油粘滞性小，耐高温，无污染，因而气浮轴承可用于高速机器、仪器及放射性装置中，但其负荷能力比油低。
由于气体的粘度低和可压缩性，使气浮轴承存在着承载能力小、刚度低等问题，如设计不当容易引起不稳定等缺点。随着多孔材料的出现，这些问题正逐渐得到解决。目前应用于气浮轴承的的多孔材料主要有：多孔质青铜和多孔质不锈钢。多孔材料的渗透率是决定气浮轴承性能的主要因素，但是因为青铜和不锈钢材料硬度小，用机械加工的方法会产生磨削碎屑，堵塞多孔材料表面的孔隙，降低多孔材料的渗透率，从而影响气浮轴承的性能。
多孔陶瓷材料是以刚玉砂、碳化硅、堇青石等优质原料为主料，经过成型和特殊高温烧结工艺制备的一种具有高气孔率的材料，具有耐高温、高压，抗酸、碱和有机介质腐蚀，良好的生物惰性、可控的孔结构及高的开口孔隙率、使用寿命长、产品再生性能好等优点。因此，使用多孔陶瓷替代青铜和不锈钢等多孔质材料，成为提升轴承性能的重要方向。而设计合适的孔结构是兼顾多孔陶瓷的渗透性和力学性能的主要难点。
发明内容
解决的技术问题：针对上述技术问题，本发明提供了一种用于气浮轴承的多孔陶瓷及其制备方法和应用，该多孔陶瓷兼具有良好的渗透性和力学性能，在气浮轴承中具有良好的应用。
技术方案：一种多孔陶瓷的制备方法，所述方法包括步骤如下：按如下质量份配比称取10～20份碳化硅、10～20份相增强料、3～5份烧结助剂、40～50份粘结剂和5～10份造孔剂混合均匀，在60～80℃下反应3～4h后得到陶瓷浆料；将所述陶瓷浆料冷冻干燥后得到陶瓷粉体；将所述陶瓷粉体热压成型得到陶瓷素坯；将所述陶瓷素坯烧结得到所述多孔陶瓷；其中，所述相增强料为纳米氧化锆、氧化锆晶须和莫来石晶须中的一种或几种。
优选的，所述烧结助剂为氧化钠、氧化钙、氧化镁、氧化锆和氧化铝中的一种或几种。
优选的，所述粘结剂为聚丙烯、聚乙烯醇、硬脂酸或邻苯二甲酸二丁酯。
优选的，所述造孔剂为蔗糖、淀粉、石墨和木屑中的一种或几种。
优选的，所述碳化硅的平均粒径为10～15μm，所述造孔剂的平均粒径为4～6μm。
优选的，所述冷冻干燥的温度为-30～-10℃，时间为15～20h。
优选的，所述热压成型的步骤为：在还原气氛或真空条件下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度2～3h。
优选的，所述烧结的步骤为：在惰性气氛下，以1～5℃/min升温至300～500℃，保温2～3h，再以2～3℃/min升温至1100～1200℃，保温3～4h。
由上述方法制备得到的多孔陶瓷。
所述多孔陶瓷在制备气浮轴承中的应用。
有益效果：本发明通过加入相增强料与碳化硅协同增韧，同时晶须还具有阻碍陶瓷孔裂纹扩展的作用，从而可以改善多孔陶瓷的强度和硬度，并使其具有较好的耐磨性能，不仅有利于提高其使用寿命，而且还能减少多孔陶瓷机械加工时产生的磨削碎屑量，减少孔隙被堵塞而造成的多孔陶瓷的渗透率降低的问题。采用冷冻干燥可以减少常温下粉体的团聚，使陶瓷粉体能够更好地分散均匀，结合热压步骤，可以得到具有较高的孔隙率的多孔陶瓷。本发明通过先预烧的两段式烧结方法，可以有效提高多孔陶瓷的强度。
具体实施方式
下面结合具体实施例对本发明作进一步描述。
实施例1
一种多孔陶瓷的制备方法，所述方法包括步骤如下：
取100g碳化硅、100g纳米氧化锆、15g氧化钙、10g氧化铝、10g氧化镁、400g聚丙烯和50g蔗糖颗粒，其中碳化硅的平均粒径为10μm，造孔剂蔗糖粒子的平均粒径为5μm。将上述原料通过球磨混合均匀，然后在60～80℃下反应3h后得到陶瓷浆料。将所述陶瓷浆料在-30℃下冷冻干燥15h后得到陶瓷粉体。在还原气氛下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度2h得到陶瓷素坯。将所述陶瓷素坯在惰性气氛下，以1～5℃/min升温至300～500℃，保温3h，再以2～3℃/min升温至1100～1200℃，保温3h得到所述多孔陶瓷。
实施例2
取150g碳化硅、100g纳米氧化锆、100g氧化锆晶须、10g氧化钠、15g氧化铝、15g氧化镁、400g聚乙烯醇和100g木屑，其中碳化硅的平均粒径为12μm，造孔剂木屑的平均粒径为6μm。将上述原料通过球磨混合均匀，然后在60～80℃下反应4h后得到陶瓷浆料。将所述陶瓷浆料在-20℃下冷冻干燥18h后得到陶瓷粉体。在还原气氛下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度3h得到陶瓷素坯。将所述陶瓷素坯在真空条件下，以1～5℃/min升温至300～500℃，保温3h，再以2～3℃/min升温至1100～1200℃，保温3h得到所述多孔陶瓷。
实施例3
取200g碳化硅、150g莫来石晶须、20g氧化铝、30g氧化锆、300g邻苯二甲酸二丁酯和60g石墨，其中碳化硅的平均粒径为15μm，造孔剂石墨的平均粒径为5μm。将上述原料通过球磨混合均匀，然后在60～80℃下反应3h后得到陶瓷浆料。将所述陶瓷浆料在-25℃下冷冻干燥15h后得到陶瓷粉体。在还原气氛下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度2h得到陶瓷素坯。将所述陶瓷素坯在真空条件下，以1～5℃/min升温至300～500℃，保温2h，再以2～3℃/min升温至1100～1200℃，保温4h得到所述多孔陶瓷。
实施例4
取120g碳化硅、100g莫来石晶须、100g氧化锆晶须、20g氧化铝、10g氧化钙、400g聚乙烯醇和80g淀粉，其中碳化硅的平均粒径为10μm，造孔剂淀粉的平均粒径为4μm。将上述原料通过球磨混合均匀，然后在60～80℃下反应4h后得到陶瓷浆料。将所述陶瓷浆料在-10℃下冷冻干燥20h后得到陶瓷粉体。在真空条件下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度2h得到陶瓷素坯。将所述陶瓷素坯在真空条件下，以1～5℃/min升温至300～500℃，保温3h，再以2～3℃/min升温至1100～1200℃，保温4h得到所述多孔陶瓷。
实施例5
取180g碳化硅、50g纳米氧化锆、120g氧化锆晶须、30g氧化镁、300g硬脂酸和60g石墨，其中碳化硅的平均粒径为12μm，造孔剂石墨的平均粒径为6μm。将上述原料通过球磨混合均匀，然后在60～80℃下反应3h后得到陶瓷浆料。将所述陶瓷浆料在-15℃下冷冻干燥16h后得到陶瓷粉体。在真空条件下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度3h得到陶瓷素坯。将所述陶瓷素坯在真空条件下，以1～5℃/min升温至300～500℃，保温2h，再以2～3℃/min升温至1100～1200℃，保温3h得到所述多孔陶瓷。
实施例6
取200g碳化硅、200g氧化锆晶须、30g氧化镁、10g氧化铝、500g聚丙烯和100g石墨，其中碳化硅的平均粒径为15μm，造孔剂石墨的平均粒径为6μm。将上述原料通过球磨混合均匀，然后在60～80℃下反应4h后得到陶瓷浆料。将所述陶瓷浆料在-20℃下冷冻干燥18h后得到陶瓷粉体。在真空条件下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度2h得到陶瓷素坯。将所述陶瓷素坯在真空条件下，以1～5℃/min升温至300～500℃，保温2h，再以2～3℃/min升温至1100～1200℃，保温3h得到所述多孔陶瓷。
实施例7
取200g碳化硅、200g纳米氧化锆、30g氧化镁、10g氧化铝、500g聚丙烯和100g石墨，其中碳化硅的平均粒径为14μm，造孔剂石墨的平均粒径为5μm。将上述原料通过球磨混合均匀，然后在60～80℃下反应4h后得到陶瓷浆料。将所述陶瓷浆料在-30℃下冷冻干燥15h后得到陶瓷粉体。在真空条件下，将所述陶瓷粉体填充于热压模具中，保持10～20MPa压力和300～450℃温度3h得到陶瓷素坯。将所述陶瓷素坯在真空条件下，以1～5℃/min升温至300～500℃，保温2h，再以2～3℃/min升温至1100～1200℃，保温3h得到所述多孔陶瓷。
根据GBT1966-1996多孔陶瓷显气孔率、容重试验分别测试上述实施例的多孔陶瓷的显气孔率；根据GB/T 1969-1996多孔陶瓷渗透率试验方法分别测试上述实施例的多孔陶瓷的渗透率；根据GB/T 1965-1996多孔陶瓷弯曲强度试验方法分别测试上述实施例的多孔陶瓷的弯曲强度；根据JC/T 2345-2015精细陶瓷常温耐磨性试验方法分别测试上述实施例的多孔陶瓷的耐磨性能；根据GBT 16534-1996工程陶瓷维氏硬度试验方法分别测试上述实施例的多孔陶瓷的硬度。具体测试结果如下表所示：
Figure BDA0002979874110000041
由上述检测结果可知，本发明制备得到的多孔陶瓷具有良好的渗透性和力学性能，因此可以在制备气浮轴承中具有良好的应用。

Claims (10)

1.一种多孔陶瓷的制备方法，其特征在于，所述方法包括步骤如下：按如下质量份配比称取10~20份碳化硅、10~20份相增强料、3~5份烧结助剂、40~50份粘结剂和5~10份造孔剂混合均匀，在60~80 ℃下反应3~4 h后得到陶瓷浆料；将所述陶瓷浆料冷冻干燥后得到陶瓷粉体；将所述陶瓷粉体热压成型得到陶瓷素坯；将所述陶瓷素坯烧结得到所述多孔陶瓷；其中，所述相增强料为纳米氧化锆、氧化锆晶须和莫来石晶须中的一种或几种。
2.根据权利要求1所述的一种多孔陶瓷的制备方法，其特征在于，所述烧结助剂为氧化钠、氧化钙、氧化镁、氧化锆和氧化铝中的一种或几种。
3.根据权利要求1所述的一种多孔陶瓷的制备方法，其特征在于，所述粘结剂为聚丙烯、聚乙烯醇、硬脂酸或邻苯二甲酸二丁酯。
4.根据权利要求1所述的一种多孔陶瓷的制备方法，其特征在于，所述造孔剂为蔗糖、淀粉、石墨和木屑中的一种或几种。
5.根据权利要求1所述的一种多孔陶瓷的制备方法，其特征在于，所述碳化硅的平均粒径为10~15μm，所述造孔剂的平均粒径为4~6μm。
6.根据权利要求1所述的一种多孔陶瓷的制备方法，其特征在于，所述冷冻干燥的温度为-30~-10 ℃，时间为15~20 h。
7.根据权利要求1所述的一种多孔陶瓷的制备方法，其特征在于，所述热压成型的步骤为：在还原气氛或真空条件下，将所述陶瓷粉体填充于热压模具中，保持10~20 MPa压力和300~450 ℃温度2~3 h。
8.根据权利要求1所述的一种多孔陶瓷的制备方法，其特征在于，所述烧结的步骤为：在惰性气氛下，以1~5 ℃/min升温至300~500 ℃，保温2~3 h，再以2~3 ℃/min升温至1100~1200 ℃，保温3~4 h。
9.权利要求1~8任意一项所述方法制备得到的多孔陶瓷。
10.权利要求9所述的一种多孔陶瓷在制备气浮轴承中的应用。
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