CN113161705B - Radio frequency adapter plate and radio frequency adapter implementation method - Google Patents
Radio frequency adapter plate and radio frequency adapter implementation method Download PDFInfo
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- CN113161705B CN113161705B CN202110652550.1A CN202110652550A CN113161705B CN 113161705 B CN113161705 B CN 113161705B CN 202110652550 A CN202110652550 A CN 202110652550A CN 113161705 B CN113161705 B CN 113161705B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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Abstract
The invention provides a radio frequency adapter plate and a radio frequency adapter implementation method, wherein the radio frequency adapter plate comprises: the circuit board is provided with a first non-metalized via hole, a second non-metalized via hole and a third metalized via hole; the first probe is positioned on one surface of the circuit board and is vertically inserted into the first non-metallized through hole; the second probe is positioned on the other surface of the circuit board and is vertically inserted into the second non-metallized through hole; the first air cavity is arranged on the other side of the circuit board, a first microstrip line is arranged in the first air cavity, one end of the first microstrip line is connected with a first probe which penetrates through the first non-metalized via hole through a gold belt, and the other end of the first microstrip line is connected with a third metalized via hole; and the second air cavity is arranged on one surface of the circuit board, a second microstrip line is arranged in the second air cavity, one end of the second microstrip line is connected with a second probe which penetrates through the second non-metalized via hole through a gold belt, and the other end of the second microstrip line is connected with a third metalized via hole. The limited space layout is utilized, the switching volume is reduced, the high-power environment can be adapted, and standing waves and insertion loss are superior to those of a coaxial or multilayer board mode.
Description
Technical Field
The present invention relates to radio frequency communication technologies, and in particular, to a radio frequency adapter board and a radio frequency adapter implementation method.
Background
In the phased array radar system, the array arrangement mode of the antenna array surface units is different from the TR component mode; in order to meet the performance index of the antenna array surface, the distance between the antenna array surface units is larger; in order to save the cost of the TR assemblies, the spacing between the TR assemblies is smaller. Therefore, the antenna array and the TR module cannot be directly connected to each other, and a patch cord is required to be used for patch interconnection between the antenna array and the TR module.
The existing common solutions are of two types, one is that the radio frequency coaxial cable is adopted for interconnection, but the occupied space is large, the assembly is complex and the cost is high; secondly, the circuit board is switched through a plurality of layers of circuit boards, the circuit board is generally switched through a plurality of layers of boards, and the interconnection between the strip line and the connector is realized through an electric welding mode; however, the multi-layer board scheme has high cost, the electric welding process is easy to age for a long time, welding spots are easy to lose effectiveness in a high-power environment, and the requirements of high power, miniaturization and low cost of the phased array radar cannot be met.
Disclosure of Invention
In order to solve the defects of the related prior art, the invention provides the radio frequency adapter plate and the radio frequency switching implementation method, the double-panel design is adopted, switching is implemented through the via holes, the air cavities above and below the via holes, the microstrip lines and the gold strips, the switching path space is provided, the heat dissipation performance of the adapter plate can be improved, signals are received from the antenna and output to the TR component after switching, and the radio frequency adapter plate can be adapted to a high-power environment for use.
In order to realize the purpose of the invention, the following scheme is adopted:
a radio frequency interposer, comprising:
the circuit board is provided with a through third metalized via hole, and the third metalized via hole is positioned between the first nonmetal via hole and the second nonmetal via hole;
the first probe is positioned on one surface of the circuit board and is vertically inserted into the first non-metallized through hole, a first medium is arranged at the first non-metallized through hole, and the first probe is wrapped by the first medium;
the second probe is positioned on the other side of the circuit board and is vertically inserted into the second non-metallized through hole, a second medium is arranged at the second non-metallized through hole, and the second probe is wrapped by the second medium;
the first air cavity is arranged on the other side of the circuit board, one end of the first air cavity covers the first non-metalized via hole, the other end of the first air cavity covers the third metalized via hole, a first microstrip line is arranged in the first air cavity, one end of the first microstrip line is connected with a first probe penetrating through the first non-metalized via hole through a gold strip, and the other end of the first microstrip line is connected with the third metalized via hole;
and the second air cavity is arranged on one surface of the circuit board, one end of the second air cavity covers the second non-metalized via hole, the other end of the second air cavity covers the third metalized via hole, a second microstrip line is arranged in the second air cavity, one end of the second microstrip line is connected with a second probe which penetrates through the second non-metalized via hole through a gold strip, and the other end of the second microstrip line is connected with the third metalized via hole.
Furthermore, a circle of metalized grounding holes which are arranged at intervals and penetrate through the two surfaces are formed in the edge of the circuit board, and the metalized grounding holes are located in the peripheral areas of the first air cavity and the second air cavity. The first microstrip line is arranged on the other side of the circuit board, the second microstrip line is arranged on one side of the circuit board, both sides of the circuit board are provided with grounding covering layers, the grounding covering layers cover the metalized grounding holes, and the inner side edges of the grounding covering layers have preset intervals with the first microstrip line, the second microstrip line, the first nonmetal via hole, the second nonmetal via hole and the third metalized via hole.
Furthermore, the circuit board is the U type, first probe and the cooperation of first non-metallization via hole, and the cooperation of second probe and the non-metallization via hole of second.
Further, first probe and second probe all include joint portion and the somatic part of being connected with the joint portion, have spacing portion between joint portion and the somatic part, and first non-metallization via hole is worn to locate by the joint portion of first probe, and the non-metallization via hole of second is worn to locate by the joint portion of second probe, is equipped with the barb structure on the somatic part, and first medium and second medium all have the depressed area that matches with the barb structure. The barb structure comprises a frustum formed on the peripheral side of the body part, and the inclined surface of the frustum is provided with at least one tangent plane parallel to the axis of the body part.
A radio frequency switching implementation method comprises the following steps:
providing a circuit board, wherein one end of the circuit board is provided with a first non-metallized through hole in a penetrating way, the other end of the circuit board is provided with a second non-metallized through hole in a penetrating way, and a third metallized through hole is arranged between the first non-metallized through hole and the second non-metallized through hole in a penetrating way on the circuit board;
providing a first probe, vertically inserting the first probe into the first non-metalized via hole from one surface of the circuit board, and arranging a first medium at the first non-metalized via hole to enable the first medium to wrap the first probe;
providing a second probe, vertically inserting the second probe into the second non-metalized via hole from the other surface of the circuit board, and arranging a second medium at the second non-metalized via hole to enable the second medium to wrap the second probe;
providing a first microstrip line, arranging the first microstrip line on the other side of the circuit board, enabling one end of the first microstrip line to be connected with a first probe penetrating through the first non-metalized via hole through a gold strip, and enabling the other end of the first microstrip line to be connected with a third metalized via hole;
providing a first air cavity, arranging the first air cavity above the first microstrip line, enabling the first microstrip line to be accommodated in the first air cavity, enabling one end of the first air cavity to cover the first non-metalized via hole and enabling the other end of the first air cavity to cover the third metalized via hole;
providing a second microstrip line, arranging the second microstrip line on one surface of the circuit board, enabling one end of the second microstrip line to be connected with a second probe penetrating through the second non-metalized via hole through a gold strip, and enabling the other end of the second microstrip line to be connected with a third metalized via hole;
providing a second air cavity, arranging the second air cavity above the second microstrip line, enabling the second microstrip line to be accommodated in the second air cavity, enabling one end of the second air cavity to cover the second non-metalized via hole and enabling the other end of the second air cavity to cover the third metalized via hole;
arranging a circle of metalized grounding holes which are arranged at intervals and penetrate through two surfaces at the edge of the circuit board, wherein the metalized grounding holes are positioned in the peripheral areas of the first air cavity and the second air cavity;
and the two sides of the circuit board are respectively provided with a grounding covering layer, so that the grounding covering layers cover the metalized grounding holes, and the inner side edges of the grounding covering layers have preset intervals with the first microstrip line, the second microstrip line, the first nonmetal via hole, the second nonmetal via hole and the third metalized via hole.
The invention has the beneficial effects that:
1. the double-panel design is adopted, the switching is realized through the via holes, the air cavities on the upper surface and the lower surface, the microstrip line and the gold strip, the signals are received from the antenna and output to the TR component after being switched, the limited space layout is effectively utilized, and compared with a coaxial or multi-layer board mode, the switching volume is greatly reduced;
2. according to the actual connection positions of the first probe and the second probe with the antenna and the TR component respectively, the shapes of the circuit boards can be adjusted to match the connection positions of the first probe and the second probe of each adapter plate, and meanwhile, the switching length can be reasonably controlled according to a required switching path to realize phase matching; particularly, when a plurality of radio frequency adapter plates are simultaneously distributed, the phase consistency of a plurality of adapter channels can be ensured through the control of the shape and the path distance of the circuit board;
3. the first probe is positioned on one side of the circuit board, the first air cavity corresponding to the first probe and the first microstrip line are positioned on the other side of the circuit board, the second probe is positioned on the other side of the circuit board, the second air cavity corresponding to the second probe and the second microstrip line are positioned on the one side of the circuit board, the upper and lower separation layout is effectively carried out, the two interfaces are separately arranged, and meanwhile, the needed switching path and channel are provided through the microstrip line, the air cavity and the via hole, so that the volume of the whole radio frequency adapter plate is controllable to be smaller than that of the traditional coaxial and multilayer plate mode;
4. the switching path channel is arranged in a microstrip line and air cavity mode, so that the switching path space is provided, the heat dissipation performance of the switching board can be improved, the switching board can be adapted to a high-power environment for use, and the high-power transmission with the average power exceeding 150W can be borne;
5. the first probe and the second probe are conveniently connected with the via hole through structural design and are provided with limiting parts, the limiting parts are limited on the surface of the circuit board after assembly, and meanwhile, the barb structures are matched with the first medium and the second medium, so that the stability of the first probe and the second probe after assembly is improved, and the probes are prevented from being loosened;
6. the radio frequency adapter plate realizes the adapter layout in a mode of smaller volume compared with the traditional coaxial or multilayer plate, standing waves in a frequency range of 2.7 GHz-3.5 GHz are less than 1.05, the insertion loss is less than-0.08 dB, and the radio frequency adapter plate is obviously superior to the connection mode of the traditional multilayer plate or coaxial cable.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a front view of an overall structure of a radio frequency interposer according to an embodiment of the present application.
Fig. 2 is a back view of an overall structure of the radio frequency interposer according to the embodiment of the present application.
Fig. 3 is a front view of an internal structure of the rf interposer according to an embodiment of the present application.
Fig. 4 is a back view of an internal structure of the rf interposer according to an embodiment of the present application.
Fig. 5 is a front view of a circuit board of the rf interposer according to an embodiment of the present application.
Fig. 6 is an enlarged view of a portion a of fig. 5.
Fig. 7 is a rear perspective view of a circuit board of the rf interposer according to an embodiment of the present application.
Fig. 8 is an enlarged view of a portion B of fig. 7.
Fig. 9 is a schematic structural diagram of a first probe and a second probe according to an embodiment of the present application.
Fig. 10 is an enlarged view of the portion C in fig. 9.
Fig. 11 is a graph of standing wave versus frequency for the rf interposer of the present application.
Fig. 12 is a graph of insertion loss versus frequency of the rf interposer according to the embodiment of the present application.
Reference numerals: the circuit board comprises a circuit board 1, a first non-metalized via hole 11, a second non-metalized via hole 12, a third metalized via hole 13, a metalized ground hole 14, a ground covering layer 15, a first probe 21, a joint part 211, a limiting part 212, a body part 213, a barb structure 214, a tangent plane 215, a second probe 22, a first medium 31, a second medium 32, a first air cavity 41, a second air cavity 42, a first microstrip line 51, a second microstrip line 52 and a gold strip 6.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
In one aspect of the embodiments of the present application, a radio frequency switch is provided, as shown in fig. 1 to 8, including: circuit board 1, first probe 21, second probe 22, first air cavity 41, second air cavity 42, etc.
One end of the circuit board 1 is provided with a first non-metallized via hole 11 which is through, the other end of the circuit board is provided with a second non-metallized via hole 12 which is through, a third metallized via hole 13 which is through is arranged on the circuit board 1, and the third metallized via hole 13 is positioned between the first non-metallized via hole 11 and the second non-metallized via hole 12.
The first probe 21 is positioned on one surface of the circuit board 1 and is vertically inserted into the first non-metalized via hole 11, a first medium 31 is arranged at the first non-metalized via hole 11, and the first probe 21 is wrapped by the first medium 31; the second probe 22 is located on the other side of the circuit board 1, and is vertically inserted into the second non-metalized via hole 12, a second medium 32 is disposed at the second non-metalized via hole 12, and the second probe 22 is wrapped by the second medium 32.
The first air cavity 41 is arranged on the other side of the circuit board 1, one end of the first air cavity covers the first non-metalized via hole 11, the other end of the first air cavity covers the third metalized via hole 13, a first microstrip line 51 is arranged in the first air cavity 41, one end of the first microstrip line 51 is connected with the first probe 21 which penetrates through the first non-metalized via hole 11 through a gold strip 6, and the other end of the first microstrip line 51 is connected with the third metalized via hole 13; the second air cavity 42 is arranged on one side of the circuit board 1, one end of the second air cavity covers the second non-metalized via hole 12, the other end of the second air cavity covers the third metalized via hole 13, a second microstrip line 52 is arranged in the second air cavity 42, one end of the second microstrip line 52 is connected with the second probe 22 penetrating through the second non-metalized via hole 12 through a gold strip 6, and the other end of the second microstrip line 52 is connected with the third metalized via hole 13.
The edge of the circuit board 1 is provided with a circle of metalized ground holes 14 which are arranged at intervals and penetrate through two surfaces, and the metalized ground holes 14 are positioned in the peripheral areas of the first air cavity 41 and the second air cavity 42. The first microstrip line 51 is arranged on the other side of the circuit board 1, the second microstrip line 52 is arranged on one side of the circuit board 1, the grounding covering layers 15 are arranged on the two sides of the circuit board 1, the grounding covering layers 15 cover the metalized grounding holes 14, and the inner edge of the grounding covering layers 15 has a preset distance with the first microstrip line 51, the second microstrip line 52, the first nonmetal via hole 11, the second nonmetal via hole 12 and the third metalized via hole 13.
Through this kind of mode setting structure, effectively separated the overall arrangement from top to bottom to and two interfaces separate the overall arrangement, provide required switching path and passageway through microstrip line, air chamber, via hole simultaneously, make the volume of whole radio frequency keysets controllable to be littleer than traditional coaxial mode, the cost is lower than the multiply wood.
Connect the antenna through first probe 21 and receive the signal, be connected the signal with first microstrip line 51 through gold strap 6, transmit to the first microstrip line 51 other end in first air cavity 41, pass through the second microstrip line 52 of third metallized via hole 13 transition to the circuit board 1 another side, transmit to the second microstrip line 52 other end in second air cavity 42, transmit to second probe 22 through gold strap 6 to the TR subassembly that is connected with second probe 22.
In this example, the circuit board 1 is U-shaped, or may be in other shapes, and the path lengths at the two ends of the circuit board 1 are set according to the requirement of phase matching.
As one specific embodiment, the first probe 21 is matched with the first non-metalized via 11, and the second probe 22 is matched with the second non-metalized via 12.
As one of the preferred embodiments, as shown in fig. 9 and 10, each of the first probe 21 and the second probe 22 includes a joint portion 211 and a body portion 213 connected to the joint portion 211, a position-limiting portion 212 is provided between the joint portion 211 and the body portion 213, the joint portion 211 of the first probe 21 is inserted into the first non-metalized via hole 11, the joint portion 211 of the second probe 22 is inserted into the second non-metalized via hole 12, a barb structure 214 is provided on the body portion 213, and each of the first medium 31 and the second medium 32 has a recessed area matching with the barb structure 214. Through the structure, the first probe 21 and the second probe 22 are assembled and stabilized, the assembly stability can be improved, and the first probe 21 and the second probe 22 are prevented from loosening, shifting and the like to influence the switching. Preferably, on this basis, the barb structure 214 includes a frustum formed on the periphery of the main body 213, and the inclined surface of the frustum has at least one tangent plane 215 parallel to the axis of the main body 213, so as to not only limit the position thereof, but also avoid the generation of a rotation position, improve the structural stability of the switching implementation, and facilitate the concave matching with the first medium 31 and the second medium 32 to form the stabilizing effect of the first probe 21 and the second probe 22.
The curve of the standing wave with frequency according to the present example is shown in fig. 11, where the abscissa is frequency (Freq [ GHz ]), and the ordinate is standing wave (VSWR), where m2 and m1 correspond to the frequency band range of 2.70GHz to 3.50GHz, and it can be seen that the standing wave is between 1.0384 and 1.0213 in this interval. The curve of the insertion loss with frequency of this example is shown in fig. 12, where the abscissa is frequency (Freq [ GHz ]), the ordinate is insertion loss dB (S (2,1)), which is abbreviated as insertion loss, and in the figure, the distance between m2 and m1 corresponds to the frequency band range of 2.70GHz to 3.50GHz, and it can be seen that the insertion loss in this interval is between-0.0670 and-0.0789. In the switching mode of the embodiment, within the frequency band range of 2.70 GHz-3.50 GHz, the standing wave is less than 1.05, the insertion loss is less than-0.08 dB, and the result is obviously superior to that of the traditional connection mode of a multilayer board or a coaxial cable.
In another aspect of the embodiments of the present application, a method for implementing radio frequency switching is provided, as shown in fig. 1 to 10, including the following steps:
providing a circuit board 1, wherein one end of the circuit board is provided with a first non-metallized via hole 11 in a penetrating way, the other end of the circuit board is provided with a second non-metallized via hole 12 in a penetrating way, and a third metallized via hole 13 is arranged between the first non-metallized via hole 11 and the second non-metallized via hole 12 in the circuit board 1 in a penetrating way;
providing a first probe 21, vertically inserting the first probe 21 from one surface of the circuit board 1 into the first non-metalized via hole 11, and arranging a first medium 31 at the first non-metalized via hole 11, so that the first probe 21 is wrapped by the first medium 31;
providing a second probe 22, vertically inserting the second probe 22 into the second non-metalized via hole 12 from the other surface of the circuit board 1, and arranging a second medium 32 at the second non-metalized via hole 12, so that the second probe 22 is wrapped by the second medium 32;
providing a first microstrip line 51, disposing the first microstrip line on the other side of the circuit board 1, connecting one end of the first microstrip line to the first probe 21 passing through the first non-metalized via hole 11 through the gold strip 6, and connecting the other end of the first microstrip line to the third metalized via hole 13;
providing a first air cavity 41, and arranging the first air cavity 41 above the first microstrip line 51, so that the first microstrip line 51 is accommodated in the first air cavity 41, and one end of the first air cavity 41 covers the first non-metalized via hole 11, and the other end covers the third metalized via hole 13;
providing a second microstrip line 52, disposing the second microstrip line on one side of the circuit board 1, connecting one end of the second microstrip line to the second probe 22 passing through the second non-metalized via hole 12 through the gold strip 6, and connecting the other end of the second microstrip line to the third metalized via hole 13;
providing a second air cavity 42, and arranging the second air cavity above the second microstrip line 52, so that the second microstrip line 52 is accommodated in the second air cavity 42, and one end of the second air cavity 42 covers the second non-metalized via hole 12, and the other end covers the third metalized via hole 13;
arranging a circle of metalized ground holes 14 which are arranged at intervals and penetrate through two surfaces at the edge of the circuit board 1, wherein the metalized ground holes 14 are positioned in the peripheral areas of the first air cavity 41 and the second air cavity 42;
the two sides of the circuit board 1 are respectively provided with a grounding covering layer 15, so that the grounding covering layer 15 covers the metalized grounding hole 14, and the inner edge of the grounding covering layer 15 has a preset distance with the first microstrip line 51, the second microstrip line 52, the first nonmetal via hole 11, the second nonmetal via hole 12 and the third metalized via hole 13.
After the radio frequency switching is realized, the antenna is connected through the first probe 21 to receive signals, the signals are connected with the first microstrip line 51 through the gold band 6, the signals are transmitted to the other end of the first microstrip line 51 in the first air cavity 41, the signals are transited to the second microstrip line 52 on the other surface of the circuit board 1 through the third metalized via hole 13, the signals are transmitted to the other end of the second microstrip line 52 in the second air cavity 42, the signals are transmitted to the second probe 22 through the gold band 6, and the signals are transmitted to the TR component connected with the second probe 22.
According to the actual connection positions of the first probe 21 and the second probe 22 with the antenna and the TR component respectively, the shape of the circuit board 1 can be adjusted, and the switching length can be reasonably controlled according to a required switching path so as to realize phase matching; especially, when a plurality of radio frequency adapter plates are simultaneously arranged, the phase consistency of a plurality of adapter channels can be ensured through the shape and path distance control of the circuit board 1.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (3)
1. A radio frequency interposer, comprising:
the circuit board (1) is U-shaped, one end of the circuit board is provided with a first non-metallized through hole (11) which is through, the other end of the circuit board is provided with a second non-metallized through hole (12) which is through, a third metallized through hole (13) which is through is arranged on the circuit board (1), and the third metallized through hole (13) is positioned between the first non-metallized through hole (11) and the second non-metallized through hole (12);
the first probe (21) is positioned on one surface of the circuit board (1) and is vertically inserted into the first non-metallized via hole (11), a first medium (31) is arranged at the first non-metallized via hole (11), and the first probe (21) is wrapped by the first medium (31);
the second probe (22) is positioned on the other surface of the circuit board (1) and is vertically inserted into the second non-metalized via hole (12), a second medium (32) is arranged at the second non-metalized via hole (12), and the second probe (22) is wrapped by the second medium (32);
the first air cavity (41) is arranged on the other side of the circuit board (1), one end of the first air cavity covers the first non-metalized through hole (11), the other end of the first air cavity covers the third metalized through hole (13), a first microstrip line (51) is arranged in the first air cavity (41), one end of the first microstrip line (51) is connected with a first probe (21) penetrating through the first non-metalized through hole (11) through a gold strip (6), and the other end of the first microstrip line is connected with the third metalized through hole (13);
the second air cavity (42) is arranged on one surface of the circuit board (1), one end of the second air cavity covers the second non-metalized via hole (12), the other end of the second air cavity covers the third metalized via hole (13), a second microstrip line (52) is arranged in the second air cavity (42), one end of the second microstrip line (52) is connected with a second probe (22) penetrating through the second non-metalized via hole (12) through a gold strip (6), and the other end of the second microstrip line (52) is connected with the third metalized via hole (13);
a circle of metalized grounding holes (14) which are arranged at intervals and penetrate through two surfaces are formed in the edge of the circuit board (1), and the metalized grounding holes (14) are located in the peripheral areas of the first air cavity (41) and the second air cavity (42);
the first microstrip line (51) is arranged on the other side of the circuit board (1), the second microstrip line (52) is arranged on one side of the circuit board (1), the two sides of the circuit board (1) are respectively provided with a grounding covering layer (15), the grounding covering layer (15) covers the metalized grounding hole (14), and the inner side edge of the grounding covering layer (15) and the first microstrip line (51), the second microstrip line (52), the first non-metalized via hole (11), the second non-metalized via hole (12) and the third metalized via hole (13) have preset intervals;
first probe (21) and second probe (22) all include joint portion (211) and body portion (213) be connected with joint portion (211), spacing portion (212) have between joint portion (211) and body portion (213), first non-metallization via hole (11) are worn to locate by joint portion (211) of first probe (21), second non-metallization via hole (12) are worn to locate by joint of second probe (22), be equipped with barb structure (214) on body portion (213), first medium (31) and second medium (32) all have the depressed area that matches with barb structure (214), barb structure (214) are including forming in the frustum of body portion (213) week side, the inclined plane of frustum has at least one tangent plane (215) parallel with body portion (213) axis.
2. The radio frequency interposer of claim 1 wherein: the first probe (21) is matched with the first non-metallized through hole (11), and the second probe (22) is matched with the second non-metallized through hole (12).
3. A radio frequency switching implementation method is characterized by comprising the following steps:
providing a U-shaped circuit board (1), wherein one end of the U-shaped circuit board is provided with a first non-metallized via hole (11) in a penetrating way, the other end of the U-shaped circuit board is provided with a second non-metallized via hole (12) in a penetrating way, and a third metallized via hole (13) is arranged between the first non-metallized via hole (11) and the second non-metallized via hole (12) on the circuit board (1) in a penetrating way;
providing a first probe (21), vertically inserting the first probe into the first non-metallized through hole (11) from one surface of the circuit board (1), and arranging a first medium (31) at the first non-metallized through hole (11) to enable the first medium (31) to wrap the first probe (21);
providing a second probe (22), vertically inserting the second probe into the second non-metalized via hole (12) from the other surface of the circuit board (1), and arranging a second medium (32) at the second non-metalized via hole (12) to enable the second medium (32) to wrap the second probe (22);
providing a first microstrip line (51), arranging the first microstrip line on the other surface of the circuit board (1), enabling one end of the first microstrip line to be connected with a first probe (21) penetrating through the first non-metalized via hole (11) through a gold strip (6), and enabling the other end of the first microstrip line to be connected with a third metalized via hole (13);
providing a first air cavity (41), arranging the first air cavity above the first microstrip line (51), enabling the first microstrip line (51) to be accommodated in the first air cavity (41), and enabling one end of the first air cavity (41) to cover the first non-metalized via hole (11) and the other end of the first air cavity to cover the third metalized via hole (13);
providing a second microstrip line (52), arranging the second microstrip line on one surface of the circuit board (1), enabling one end of the second microstrip line to be connected with a second probe (22) penetrating through the second non-metalized via hole (12) through a gold strip (6), and enabling the other end of the second microstrip line to be connected with a third metalized via hole (13);
providing a second air cavity (42), arranging the second air cavity above the second microstrip line (52), enabling the second microstrip line (52) to be accommodated in the second air cavity (42), and enabling one end of the second air cavity (42) to cover the second non-metalized via hole (12) and the other end of the second air cavity to cover the third metalized via hole (13);
arranging a circle of metalized grounding holes (14) which are arranged at intervals and penetrate through two surfaces at the edge of the circuit board (1), wherein the metalized grounding holes (14) are positioned in the peripheral areas of the first air cavity (41) and the second air cavity (42);
the two sides of the circuit board (1) are respectively provided with a grounding covering layer (15), the grounding covering layers (15) cover the metalized grounding holes (14), and the inner side edges of the grounding covering layers (15) have preset intervals with the first microstrip line (51), the second microstrip line (52), the first non-metalized via hole (11), the second non-metalized via hole (12) and the third metalized via hole (13);
wherein, first probe (21) and second probe (22) all include joint portion (211) and body portion (213) be connected with joint portion (211), spacing portion (212) have between joint portion (211) and body portion (213), first non-metallized via hole (11) are worn to locate by joint portion (211) of first probe (21), second non-metallized via hole (12) are worn to locate by joint portion (211) of second probe (22), be equipped with barb structure (214) on body portion (213), first medium (31) and second medium (32) all have the depressed area that matches with barb structure (214), barb structure (214) are including forming the frustum of this body portion (213) week side, the inclined plane of frustum has at least one tangent plane (215) parallel with this body portion (213) axis.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110652550.1A CN113161705B (en) | 2021-06-11 | 2021-06-11 | Radio frequency adapter plate and radio frequency adapter implementation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110652550.1A CN113161705B (en) | 2021-06-11 | 2021-06-11 | Radio frequency adapter plate and radio frequency adapter implementation method |
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| CN113161705A CN113161705A (en) | 2021-07-23 |
| CN113161705B true CN113161705B (en) | 2022-02-18 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107681240A (en) * | 2016-08-02 | 2018-02-09 | 北京遥感设备研究所 | A kind of coaxial microband conversion equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786802A (en) * | 1993-09-14 | 1995-03-31 | Toshiba Corp | High frequency circuit |
| JP2005094445A (en) * | 2003-09-18 | 2005-04-07 | Tdk Corp | Transmission line |
| CN102621470B (en) * | 2012-03-31 | 2014-06-11 | 中国电子科技集团公司第十三研究所 | Method for testing performance of semiconductor microwave power chip packaging shell |
| CN105024126B (en) * | 2015-06-23 | 2018-05-01 | 西安空间无线电技术研究所 | A kind of vertical-type is coaxial-microstrip transitions circuit |
| CN106532212B (en) * | 2016-12-28 | 2021-09-14 | 成都雷电微力科技股份有限公司 | Radio frequency vertical transition structure based on ceramic microstrip line |
| CN111987401A (en) * | 2020-08-14 | 2020-11-24 | 电子科技大学 | Ridge waveguide to microstrip line ultra wide band transition structure based on quartz probe |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107681240A (en) * | 2016-08-02 | 2018-02-09 | 北京遥感设备研究所 | A kind of coaxial microband conversion equipment |
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