CN113328245A - Ultra-wideband expandable millimeter wave antenna unit and antenna array - Google Patents

Ultra-wideband expandable millimeter wave antenna unit and antenna array Download PDF

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Publication number
CN113328245A
CN113328245A CN202110751097.XA CN202110751097A CN113328245A CN 113328245 A CN113328245 A CN 113328245A CN 202110751097 A CN202110751097 A CN 202110751097A CN 113328245 A CN113328245 A CN 113328245A
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CN
China
Prior art keywords
ground plane
transmission line
plane
millimeter wave
ultra
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Pending
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CN202110751097.XA
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Chinese (zh)
Inventor
张超
王彦杰
王凌云
邹毅
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Shenzhen Huajie Zhitong Technology Co ltd
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Shenzhen Huajie Zhitong Technology Co ltd
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Priority to CN202110751097.XA priority Critical patent/CN113328245A/en
Publication of CN113328245A publication Critical patent/CN113328245A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0006Particular feeding systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0006Particular feeding systems
    • H01Q21/0075Stripline fed arrays

Abstract

The invention discloses an ultra wide band expandable millimeter wave antenna unit, which comprises: the first ground plane and the second ground plane are positioned on two sides of the coplanar feed transmission line, the microstrip transmission line and the coplanar feed transmission line extend outwards from one side far away from the first ground plane and the second ground plane, the first ground plane is connected with the third ground plane through a first via hole, the second ground plane is connected with the third ground plane through a second via hole, the third ground plane is provided with a notch, a projection area of the notch on the first plane covers one end of the microstrip transmission line far away from the coplanar feed transmission line, the main radiation unit is positioned on the other side, opposite to the first plane, of the third ground plane, and a projection area of the main radiation unit on the third ground plane covers the notch area. The millimeter wave antenna unit can achieve higher gain by expanding and forming an antenna array.

Description

Ultra-wideband expandable millimeter wave antenna unit and antenna array
Technical Field
The invention relates to the technical field of antennas, in particular to an ultra wide band expandable millimeter wave antenna unit and an antenna array.
Background
In recent years, with the rapid development of wireless communication technology, various electronic devices are popularized and used, and millimeter wave gesture recognition radars and millimeter wave vehicle-mounted radars are popularized and used, so that people also put higher demands on the quality of wireless communication. The communication frequency band needs to be continuously developed to wide frequency and high frequency, the research on the high-frequency broadband antenna is promoted, and the millimeter wave antenna has the advantages of short wavelength, high transmission speed, good propagation characteristic and the like, so that the millimeter wave antenna enters the visual field of most people.
The traditional millimeter wave antenna is generally realized by adopting a waveguide structure, compared with a planar patch antenna, the waveguide structure is relatively complex and expensive, and is not beneficial to integration, so that the research on the miniaturized millimeter wave microstrip antenna is inevitable and necessary. In a millimeter wave wireless communication system, an antenna is an energy conversion device for transmitting and receiving signals, and the performance of the antenna seriously affects the performance and other characteristics of the wireless communication system. The waveguide slot antenna commonly used in the modern radar system is slotted on a waveguide to form a radiation slot array to improve the radiation performance, but the antenna has larger volume and is not beneficial to system integration and miniaturization, the requirement in actual production and processing is higher and higher, the slot width of the waveguide slot antenna is generally smaller than 1mm, the depth and the inclination angle are different, and meanwhile, the antenna array has compact structure, so that various technical problems need to be overcome by the processing and assembling process, and the cost is greatly increased.
If the traditional microstrip patch antenna structure is adopted, although the microstrip patch antenna has the advantages of simple structure realization, low cost and the like, the impedance bandwidth of the conventional microstrip patch antenna is very narrow (about 5 percent), and the requirement of a millimeter wave frequency band on the broadband is difficult to meet, particularly in the frequency bands of 60G, 77G and above. The conventional microstrip line fed millimeter wave antenna has the defects of large microstrip line radiation loss, large dispersion, poor separation between a feeder line and a radiation unit, large influence of substrate thickness on characteristic impedance and the like.
Disclosure of Invention
In view of the above problems, the present invention provides a millimeter wave antenna unit having an ultra-wide impedance bandwidth, low manufacturing cost, and a simple structure.
The application discloses millimeter wave antenna unit can be extended to ultra wide band includes:
the antenna comprises a first ground plane, a second ground plane, a coplanar feed transmission line and a microstrip transmission line, wherein the first ground plane and the second ground plane are respectively positioned at two sides of the coplanar feed transmission line;
a third ground plane located in a second plane parallel to the first plane, the first ground plane and the third ground plane being connected by a column of first via holes close to the coplanar feeding transmission line, the second ground plane and the third ground plane being connected by a column of second via holes close to the coplanar feeding transmission line, the third ground plane having a slot thereon, a projection area of the slot on the first plane covering an end of the microstrip transmission line away from the coplanar feeding transmission line;
and the main radiating element is positioned on the other side of the third ground plane relative to the first plane, and a projection area of the main radiating element on the third ground plane covers the slot.
Preferably, the main radiating unit is formed by stacking a plurality of metal patches, and a dielectric substrate is arranged between the metal patches of adjacent layers.
Preferably, the multilayer metal patches are respectively positioned on the plane where each copper-clad layer of the printed circuit board is positioned.
Preferably, the main radiation unit comprises 4 layers of metal patches.
Preferably, each metal patch is rectangular, circular, trapezoidal or triangular in shape.
Preferably, in the column of first vias and the column of second vias, a hole pitch between two adjacent vias in each column is smaller than 1/4 wavelengths of the operating frequency.
Preferably, a dielectric substrate is disposed between the first ground plane and the third ground plane, and a dielectric substrate is disposed between the third ground plane and the main radiating element.
Preferably, the shape of the slot is rectangular, H-shaped, F-shaped or U-shaped.
Preferably, the first plane and the second plane are planes where copper clad layers of the printed circuit board are located respectively.
The application also discloses an antenna array, which comprises the antenna array formed by the plurality of millimeter wave antenna units.
Compared with the prior art, the invention adopts the grounded coplanar waveguide structure for feeding, has the advantages of low loss, small dispersion, good isolation, small influence of substrate thickness on characteristic impedance and the like, simultaneously adopts the microstrip line gap coupling feed structure and the multilayer patch coupling radiation structure, not only can effectively expand the bandwidth of the antenna, but also can obtain better directional characteristic, can design a directional millimeter wave antenna with ultra-wideband, low cost and easy integration and production processing, and the relative bandwidth of the antenna unit in a high-frequency millimeter wave frequency band can reach more than 30%. The antenna units can form an antenna array through array expansion, and antenna gain is further improved.
The dielectric substrate and the radiation patch of the antenna adopt a multilayer design and are suitable for being processed on a PCB multilayer board. The grounded coplanar waveguide is used for feeding, the grounded coplanar waveguide transmission line can be realized only by using the metalized through hole, blind holes are not needed to be used for the transmission line and the ground of the antenna, and the difficulty and higher cost of blind hole processing are avoided. The whole structure is easy to process by using a PCB, and can be widely applied to the design of millimeter wave antenna units and millimeter wave array antennas. In practical use, impedance matching bandwidth exceeding 25GHz can be realized by designing variables such as material and thickness of the dielectric substrate, shape and size of a patch, shape and size of a slotted slot on a ground plane, length of a microstrip line and the like, relative bandwidth reaches more than 30%, the ultra-wideband directional millimeter wave antenna unit is suitable for PCB processing, and the ultra-wideband directional millimeter wave antenna unit has the advantages of ultra-wideband, planarization, low cost, easiness in mass production and the like, and can achieve higher gain by expanding and forming an antenna array. Has high practical value.
Drawings
Fig. 1 is a schematic top view of a top surface of an ultra-wideband expandable millimeter wave antenna unit structure according to the present invention.
Fig. 2 is a schematic top view of a bottom surface of a structure of an ultra-wideband expandable millimeter wave antenna unit according to the present invention.
Fig. 3 is a schematic side view of a structure of an ultra-wideband expandable millimeter wave antenna unit according to the present invention.
Fig. 4 is a schematic side plan 3D view of a structure according to an embodiment of the invention.
Fig. 5 is a side bottom 3D schematic view of a structure according to an embodiment of the invention.
Fig. 6 is a graph of the impedance bandwidth of S11 according to one embodiment of the present invention.
Fig. 7 is an antenna 2D pattern at 62GHz in accordance with one embodiment of the present invention.
Fig. 8 is an antenna 3D pattern at 62GHz in accordance with one embodiment of the present invention.
Fig. 9 is an antenna 2D pattern at 79GHz in accordance with an embodiment of the invention.
Fig. 10 is an antenna 3D pattern at 79GHz according to an embodiment of the invention.
Detailed Description
The following describes the embodiments of the present invention with reference to the drawings of the specification, so that the technical solutions and the advantages thereof are more clear and clear. The embodiments described below are exemplary only, and are not to be construed as limiting the invention by referring to the figures.
It should be noted that in the description of the present invention, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., it is indicated that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention. In the description of the present invention, the numerical values of length, width, thickness, etc. are only for describing the present invention and simplifying the description, and should not be construed as limiting the specific protection scope of the present invention.
In the present invention, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a feature defined as "first," "second," etc., may explicitly or implicitly include one or more of that feature, and in the description of the invention, "at least" means one or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Referring to fig. 1 and 2, an embodiment of the present application discloses an ultra-wideband expandable millimeter wave antenna unit. The antenna unit of this embodiment includes a first ground plane 1, a second ground plane 2, a coplanar feeding transmission line 4, a microstrip transmission line 5, a third ground plane 3, a slot 9, a metalized via 6 connecting the first ground plane 1 and the third ground plane 3, a metalized via 7 connecting the second ground plane 2 and the third ground plane 3, and a main radiating element 8 of a multi-layer metal patch. The antenna unit has a six-layer structure.
The first plane and the second plane are respectively planes where copper-clad layers of the printed circuit board are located. The plane of each layer of patch in the main radiation unit 8 is also the plane of the copper-clad layer of the printed circuit board. In this example, the copper thickness of all the copper-clad layers was 1.4mil or 1 oz.
In the first plane, the first ground plane 1 and the second ground plane 2 are located on both sides of the coplanar feed transmission line 4, respectively. In this embodiment, the first ground plane 1, the second ground plane 2 and the coplanar feeding transmission line 4 are located on the same copper-clad layer, i.e. the first plane, in the PCB, the coplanar feeding transmission line 4 is connected to the inner conductor of the feeding connector, and the first ground plane 1 and the second ground plane 2 are connected to the outer conductor of the feeding connector. The coplanar transmission line 4 has a line width of 7.87mil and a distance of 8mil from the first ground plane 1 and the second ground plane 2 on both sides. Through simulation calculation, the transmission line impedance of the line width dimension in the working frequency band of the antenna and under the condition of the dielectric substrate is 50 ohms, and good matching can be achieved.
Furthermore, the microstrip transmission line 5 and the coplanar feeding transmission line 4 are connected with the coplanar feeding transmission line 4 on the same copper-clad layer, i.e. the first plane, in the PCB board, the microstrip transmission line 5 is connected with the coplanar feeding transmission line 4 and extends to the side away from the first ground plane 1 and the second ground plane 2, and the line width of the microstrip transmission line 5 is 7.87 mil. The line width of the transmission line is consistent with that of the grounded coplanar transmission line.
In the second plane, the third ground plane 3 has a slot 9 and a main radiating element 8, and the projection area of the slot 9 on the first plane covers one end of the microstrip transmission line 5 far away from the coplanar feed transmission line 4. The slot 9 of the third ground plane 3 is formed by cutting a slot in the copper-clad metal layer on which the third ground plane 3 is located, and in one embodiment, the slot 9 is rectangular, and the length of the rectangle is 0.8mm and the width of the rectangle is 0.42 mm. The length of the projection area of the slot 9 on the first plane is perpendicular to the extending direction of the microstrip transmission line and is larger than the width of the microstrip transmission line, and the slot 9 and the microstrip transmission line 5 form a slot coupling structure. The radiation element 8 is located on the other side of the third ground plane 3 relative to the first plane, and the projection area of the main radiation element 8 on the third ground plane 3 covers the slot 9.
In other embodiments, the shape of the slot is not limited to rectangular, but may be other shapes such as U-shape, H-shape, F-shape, etc. The number of the slots is not limited to one or more. The above should be regarded as a variant of the present invention, and all such variants are included in the scope of protection of the present invention.
Referring to fig. 2 and 3, the first ground plane 1 is connected to the third ground plane 3 through a column of first vias 6 adjacent to the coplanar feeding transmission line, the second ground plane 2 is connected to the third ground plane 3 through a column of second vias 7 adjacent to the coplanar feeding transmission line, and a dielectric substrate 31 is disposed between the first plane 1 and the second plane 2. The dielectric substrate 31 was made of RO4350B, and had a dielectric constant of 3.48, a loss tangent of 0.0037, and a thickness of 4 mils (mil). The hole pitch between adjacent first vias 6 and adjacent second vias 7 in a column of first vias 6 and a column of second vias 7 is less than 1/4 wavelengths of the operating frequency. In one embodiment, the metalized vias 6 and 7 have a diameter of 5.9 mils and a pitch of 18 mils between adjacent vias in each column.
The main radiating unit 8 is formed by stacking a plurality of metal patches, and a dielectric substrate is arranged between the metal patches of adjacent layers. The multilayer metal patch main radiating element 8 comprises a first patch 21, a second patch 22, a third patch 23, a fourth patch 24, … and an Nth patch 2N. A dielectric substrate 41 is arranged between the first patch 21 and the second patch 22, a dielectric substrate 42 is arranged between the second patch 22 and the third patch 23, dielectric substrates 43 and … are arranged between the third patch 23 and the fourth patch 24, and a dielectric substrate 4(N-1) is arranged between the N-1 th patch and the N-2N. The multi-layer patch main radiating element 8 is positioned on the other side of the third ground plane 3 opposite to the microstrip transmission line 5, and a dielectric substrate 32 is arranged between the first patch 21 and the third ground plane 3; the projection area of the multi-layer patch main radiating element 8 on the third ground plane 3 needs to cover the slot 9 area on the third ground plane. The main radiating element 8 and the slot 9 form a slot coupling structure.
As shown in fig. 4 and 5, the main radiating element 8 of the present embodiment may include four metal patches, which are designed to overlap in equal area projection, and are a first patch 21, a second patch 22, a third patch 23, and a fourth patch 23, respectively, in order from inside to outside in a direction perpendicular to the second plane, with the third ground plane 3, where each patch is rectangular, and the length of the patch is 1.65mm, and the width of the patch is 0.81 mm. A layer of dielectric substrates 41, 42 and 43 is arranged between the first patch 21 and the second patch 22, between the second patch 22 and the third patch 23 and between the third patch 23 and the fourth patch 24, the substrates 41, 42 and 43 are made of RO4350B, the dielectric constant is 3.48, the loss tangent is 0.0037 and the thickness is 4 mil. The main radiating element 8 of the multilayer patch is positioned on the other side of the third ground plane 3 opposite to the microstrip transmission line 5, a dielectric substrate 32 is arranged between the first patch 21 and the third ground plane 3, the material of the dielectric substrate 32 is RO4350B, the dielectric constant is 3.48, the loss tangent is 0.0037, and the thickness is 4 mil. The projection area of the multi-layer patch main radiating element 8 on the third ground plane 3 needs to cover the notch 9 area on the third ground plane. The first patch, the second patch, the third patch, and the fourth patch in the multi-layer patch main radiating unit 8 in this embodiment constitute a coupling structure.
In other embodiments, for the multilayer patch in the ultra-wideband expandable millimeter wave antenna unit, the shape of the patch is not limited to a rectangle, and may be other shapes such as a circle, a trapezoid, a triangle, or other variations of these shapes. The size of each layer of the multilayer patch is not limited to be completely uniform, i.e., the projections are completely coincident, or may be graded, i.e., the projection areas are not coincident. The above should be regarded as a variant of the present invention, and all such variants are included in the scope of protection of the present invention.
In this embodiment, the first ground plane 1, the second ground plane 2, the row of metalized vias 6 connecting the first ground plane 1 and the third ground plane 3, the row of metalized vias 7 connecting the second ground plane 2 and the third ground plane 3, the coplanar feeding transmission line 4 and the dielectric substrate 31 together form a grounded coplanar waveguide structure for transmitting a fed radio frequency signal. The embodiment has the advantages of small loss, low coupling degree, low radiation leakage and the like, and can reduce the influence of the feeder line on an antenna directional pattern and gain.
Fig. 6 is a graph of the impedance bandwidth of antenna S11 for one embodiment. As can be seen from the figure, the-10 dB impedance bandwidth can reach 26.4GHz from 56.4GHz to 82.8GHz, the relative bandwidth can reach 38%, and the ultra-wideband antenna belongs to. The two typical application frequency bands of the millimeter wave frequency bands 60G and 77G/79G can be completely covered.
Fig. 7 is the 2D pattern at 62GHz in this embodiment, and fig. 8 is the 3D pattern at 62GHz in this embodiment, and the maximum gain of the antenna at this frequency point is 7.2 dB.
Fig. 9 is the 2D pattern at 79GHz in this embodiment, and fig. 10 is the 3D pattern at 79GHz in this embodiment, and the maximum gain of the antenna at this frequency point is 7.7 dB.
When the antenna unit is actually debugged, the resonance frequency and the impedance bandwidth of the antenna can be adjusted by adjusting the size of the multilayer patch. The impedance bandwidth of the antenna can be adjusted by adjusting the size, the position and the shape of the slot and the length of the microstrip line. The resonant frequency and the impedance bandwidth of the antenna unit can be adjusted by changing the materials and the thicknesses of the media of different layers and the thickness of the copper-clad layer. The impedance bandwidth and gain of the antenna can be fine tuned by increasing or decreasing the number of layers of the patch. The gain and the directivity of the antenna can be improved by adding the metal reflecting back plate on one side of the microstrip line. The antenna gain can be improved by adding parasitics around the top patch.
Further, the present application also discloses an antenna array, which includes an antenna array composed of a plurality of millimeter wave antenna units as described above.
In summary, the antenna of the embodiment is an ultra wide band expandable millimeter wave multilayer patch antenna which can be processed by using a PCB multilayer board technology, the antenna unit has the characteristics of ultra wide impedance bandwidth, low processing cost and simple structure, and the antenna gain can be further improved by forming an antenna array through array expansion. Has high practical value.
Having described preferred embodiments of the invention, further alterations and modifications may be effected to these embodiments by those skilled in the art once apprised of the basic inventive concept, and it is therefore intended that the appended claims be interpreted to include preferred embodiments and all such alterations and modifications as fall within the scope of the invention. Various modifications and variations of the present invention may be made by those skilled in the art without departing from the spirit and scope of the present invention, and it is intended that the present invention also include the modifications and variations of the present invention provided they come within the scope of the appended claims and their equivalents.

Claims (10)

1. An ultra-wideband expandable millimeter wave antenna unit, comprising:
the antenna comprises a first ground plane (1), a second ground plane (2), a coplanar feed transmission line (4) and a microstrip transmission line (5), wherein the first ground plane (1) and the second ground plane (2) are respectively positioned at two sides of the coplanar feed transmission line (4), and the microstrip transmission line (5) is connected with the coplanar feed transmission line (4) and extends to one side far away from the first ground plane (1) and the second ground plane (2);
a third ground plane (3) located in a second plane parallel to the first plane, the first ground plane (1) and the third ground plane (3) are connected through a column of first via holes (6) close to the coplanar feeding transmission line (4), the second ground plane (2) and the third ground plane (3) are connected through a column of second via holes (7) close to the coplanar feeding transmission line (4), the third ground plane (3) is provided with a notch (9), and a projection area of the notch (9) on the first plane covers one end of the microstrip transmission line (5) far away from the coplanar feeding transmission line (4);
a main radiating element (8) located on the other side of the third ground plane (3) relative to the first plane, wherein the projection area of the main radiating element (8) on the third ground plane (3) covers the slot (8).
2. The ultra-wideband expandable millimeter wave antenna unit according to claim 1, wherein the main radiating element (8) is formed by stacking a plurality of metal patches (21, 22, 23, 24), with a dielectric substrate (41, 42, 43) between adjacent metal patches.
3. The ultra-wideband expandable millimeter wave antenna unit according to claim 2, wherein the plurality of metal patches (21, 22, 23, 24) are respectively located at the plane of each copper clad layer of the printed circuit board.
4. The ultra-wideband expandable millimeter-wave antenna unit according to claim 2, characterized in that the main radiating element (8) comprises 4 layers of metal patches (21, 22, 23, 24).
5. The ultra-wideband expandable millimeter wave antenna unit according to claim 2, wherein each metal patch (21, 22, 23, 24) is rectangular, circular, trapezoidal or triangular in shape.
6. The ultra-wideband expandable millimeter-wave antenna unit according to claim 1, wherein the hole pitch between two adjacent via holes in each column of the column of first via holes (6) and the column of second via holes (7) is smaller than 1/4 wavelengths of the operating frequency.
7. The ultra-wideband expandable millimeter wave antenna unit according to claim 1, characterized in that a dielectric substrate (31) is arranged between the first ground plane (1) and the second ground plane (2) and the third ground plane (3), and a dielectric substrate (32) is arranged between the third ground plane (3) and the main radiating element (8).
8. The ultra-wideband expandable millimeter wave antenna unit according to claim 1, characterized in that the slot (9) is rectangular, H-shaped, F-shaped or U-shaped.
9. The ultra-wideband expandable millimeter wave antenna unit according to claim 1, wherein the first plane and the second plane are planes on which copper clad layers of a printed circuit board are located, respectively.
10. An antenna array comprising an antenna array of a plurality of millimeter wave antenna elements according to any of claims 1 to 9.
CN202110751097.XA 2021-07-01 2021-07-01 Ultra-wideband expandable millimeter wave antenna unit and antenna array Pending CN113328245A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114284736A (en) * 2021-12-31 2022-04-05 厦门大学 Millimeter-wave wide-band high-gain dual-polarization magnetoelectric dipole filter antenna

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114284736A (en) * 2021-12-31 2022-04-05 厦门大学 Millimeter-wave wide-band high-gain dual-polarization magnetoelectric dipole filter antenna
CN114284736B (en) * 2021-12-31 2023-02-10 厦门大学 Millimeter-wave wide-band high-gain dual-polarization magnetoelectric dipole filter antenna

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