CN113161371A - 显示面板 - Google Patents

显示面板 Download PDF

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CN113161371A
CN113161371A CN202110226186.2A CN202110226186A CN113161371A CN 113161371 A CN113161371 A CN 113161371A CN 202110226186 A CN202110226186 A CN 202110226186A CN 113161371 A CN113161371 A CN 113161371A
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protective layer
display panel
layer
disposed
area
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CN113161371B (zh
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游魁华
梁在训
黄威
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202110226186.2A priority Critical patent/CN113161371B/zh
Priority to US17/285,058 priority patent/US11895904B2/en
Priority to PCT/CN2021/080430 priority patent/WO2022183521A1/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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    • B32LAYERED PRODUCTS
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    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32LAYERED PRODUCTS
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    • B32LAYERED PRODUCTS
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Abstract

本申请实施例公开了一种显示面板,在显示面板中,第一背板设置在端子区;柔性基板包括设置在端子区的第一部分,第一部分设置在第一背板上;加固层的部分设置在柔性基板上且位于端子区;第一保护层设置在第一部分上,第一保护层与加固层分隔设置;第二保护层设置在第一保护层上,第二保护层与加固层相连。本申请在端子区中,将第一保护层和第二保护层设置在柔性基板上,且第二保护层与加固层相连,起到降低端子区翘曲和柔性基板上的金属走线断裂的风险。

Description

显示面板
技术领域
本申请涉及显示技术领域,具体涉及一种显示面板。
背景技术
在对现有技术的研究和实践过程中,本申请的发明人发现,随着柔性显示技术的发展,产品尺寸越来越大,伴随而来的是显示模组的端子区尺寸逐渐变大。端子区尺寸越大,在弯折的过程中,端子区的边缘越容易翘曲,甚至导致金属走线断裂。
发明内容
本申请实施例提供一种显示面板,可以降低端子区翘曲和该区域的金属走线断裂的风险。
本申请实施例提供一种显示面板,其包括显示区、弯折区和端子区,所述弯折区设置在所述显示区和所述端子区之间,所述显示面板包括:
第一背板,所述第一背板设置在所述端子区;
柔性基板,所述柔性基板包括设置在所述端子区的第一部分,所述第一部分设置在所述第一背板上;
加固层,所述加固层的部分设置在所述柔性基板上且位于所述端子区;
第一保护层,所述第一保护层设置在所述第一部分上,所述第一保护层与所述加固层分隔设置;以及
第二保护层,所述第二保护层设置在所述第一保护层上,所述第二保护层与所述加固层相连。
可选的,在本申请的一些实施例中,所述第二保护层连接于所述加固层的部分的边界位于所述端子区。
可选的,在本申请的一些实施例中,所述第一保护层的厚度大于所述第二保护层的厚度。
可选的,在本申请的一些实施例中,所述第一保护层的厚度等于所述加固层的厚度。
可选的,在本申请的一些实施例中,所述第一保护层的弹性模量小于所述第二保护层的弹性模量。
可选的,在本申请的一些实施例中,所述加固层的表面、所述第一保护层的表面和所述第二保护层的表面界定形成一空间。
可选的,在本申请的一些实施例中,所述第一保护层和所述第二保护层为一体成型结构。
可选的,在本申请的一些实施例中,所述显示面板还包括电路板,所述电路板设置在所述第一部分上;所述第一保护层开设有开口,所述开口贯穿所述第一保护层和所述第二保护层;
所述电路板的部分设置在所述开口内。
可选的,在本申请的一些实施例中,所述第一保护层到所述加固层的距离介于0.2毫米至0.5毫米之间。
可选的,在本申请的一些实施例中,所述显示面板包括连接在所述显示区和所述弯折区之间的过渡区,所述显示面板还包括第二背板和显示部;所述柔性基板还包括依次连接于所述第一部分的第二部分和第三部分,所述第二部分设置在所述过渡区和所述弯折区,所述第三部分设置在所述显示区;
所述第三部分设置在所述第二背板上,所述显示部设置在所述第三部分上;所述加固层设置在所述柔性基板上并自所述过渡区延伸至所述端子区。
本申请实施例的显示面板在端子区的部分中,将第一保护层和第二保护层设置在柔性基板上,且第二保护层与加固层相连,起到降低端子区翘曲和柔性基板上的金属走线断裂的风险。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的显示面板的俯视结构示意图;
图2是本申请实施例提供的显示面板处于平展状态的结构示意图;
图3是图2中Q部分的放大图;
图4是本申请实施例提供的显示面板处于弯折状态的结构示意图。
需要说明的是,图2也是图1中沿着AA’线的剖视结构示意图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。此外,应当理解的是,此处所描述的具体实施方式仅用于说明和解释本申请,并不用于限制本申请。在本申请中,在未作相反说明的情况下,使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下,具体为附图中的图面方向;而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种显示面板,下文进行详细说明。需要说明的是,本实施例的显示面板可以是有机发光二极管(Organic Light Emitting Diode,OLED)显示面板、量子点发光二极管(Quantum Dot Light Emitting Diodes,QLED)显示面板等。本申请实施例的显示面板还可以是Mini-LED显示面板或Micro-LED显示面板。本实施例仅以显示面板为OLED显示面板为例进行说明,但并不限于此。
请参照图1-图4,图1是本申请实施例提供的显示面板的俯视结构示意图;图2是本申请实施例提供的显示面板处于平展状态的结构示意图;图3是图2中Q部分的放大图;图4是本申请实施例提供的显示面板处于弯折状态的结构示意图。
本申请实施例提供一种显示面板100,其包括依次相连的显示区AA、过渡区GD、弯折区BD和端子区PD。弯折区BD设置在显示区AA和端子区PD之间。显示面板100包括第一背板11、第二背板12、柔性基板13、金属走线14、绝缘层15、显示部16、加固层17、第一保护层18、第二保护层19和电路板110。柔性基板13包括依次相连的第一部分131、第二部分132和第三部分133。第一部分131设置在端子区PD。第二部分132设置在弯折区BD和过渡区GD。第三部分133设置在显示区AA。其中,第一部分131、第二部分132和第三部分133可以是一体成型结构。
在显示面板100的显示区AA中,依次层叠设置有第二背板12、柔性基板13的第三部分133和显示部16。显示部16包括驱动电路结构层、发光器件层和封装层;驱动电路结构层包括薄膜晶体管。发光器件层包括阳极、发光层和阴极。由于驱动电路结构层和发光器件层是现有技术,此处不再赘述。
在显示面板100的过渡区GD中,依次层叠设置有第二背板12上的柔性基板13的第二部分132、金属走线14、绝缘层15和加固层17的部分。金属走线14电连接于显示部16和电路板110。
在显示面板100的弯折区BD中,依次层叠设置有柔性基板13的第二部分132、金属走线14、绝缘层15和加固层17。金属走线14电连接于显示部16和电路板110。
在显示面板100的端子区PD中,依次层叠设置有第一背板11、柔性基板13的第一部分131、金属走线14的部分、绝缘层15的部分、第一保护层18和第二保护层19。另外电路板110也设置在柔性基板13上;具体的,电路板110设置在绝缘层15上。加固层17的部分设置在绝缘层15上。其中绝缘层15上开设有裸露导电垫的开孔151,以便电路板110与导电垫电性连接。导电垫电连接于金属走线14。
具体的,第一背板11设置在端子区PD。柔性基板13包括设置在端子区PD的第一部分131。第一部分131设置在第一背板11上。
加固层17设置在柔性基板13上且位于端子区PD。
第一保护层18设置在第一部分131上。第一保护层18与加固层17分隔设置。第二保护层19设置在第一保护层18上。第二保护层19与加固层17相连。
本申请实施例的显示面板100在端子区PD中,将第一保护层18和第二保护层19设置在柔性基板13上,且第二保护层19与加固层17相连,起到降低端子区PD翘曲和柔性基板13上的金属走线14断裂的风险。
具体的,在柔性基板13上设置第一保护层18和第二保护层19,以提高显示面板100在端子区PD的挺性,进而降低显示面板100在端子段PD发生翘曲的风险,同时也起到保护金属走线14的作用。
可选的,第一保护层18和第二保护层19的弹性模量均大于第一背板11的弹性模块,以抑制第一背板11发生翘曲,进而降低显示面板100在端子区PD发生翘曲的风险。
在本实施例中,加固层17的表面17a、第一保护层18的表面18a和第二保护层19的表面19a界定形成一空间K。当显示面板100处于弯折状态时,第一背板11的端部和柔性基板13会相互挤压,使得端子区PD靠近弯折区BD的部分受到较大的应力作用,由于空间K处于弯折区BD的附近,因此空间K起到释放应力的作用。
在一些实施例中,空间K内填充有柔性材料,以降低第二保护层19的悬空部分出现断裂和分离的风险。
另外,将第一保护层18和加固层17分隔设置,可避免第一保护层18贴合在加固层17上,进而避免影响第二保护层19对加固层17的贴附效果。
可选的,第一保护层18到加固层17的距离d介于0.2毫米至0.5毫米之间。可选的,距离d可以是0.2毫米、0.3毫米、0.4毫米和0.5毫米。
在本实施例的显示面板100中,第二保护层19连接于加固层17的部分的边界位于端子区PD。具体的,第二保护层19连接于加固层17的部分的边界位于所述第一背板11的外轮廓线之内,该设置避免第二保护层19延伸至弯折区BD,避免影响显示面板100的弯折效果。
在本实施例的显示面板100中,第一保护层18的厚度等于加固层17的厚度。这样的设置便于将第二保护层19贴合在加固层17上。
在一些实施例中,第一保护层18的厚度也可以小于或大于加固层17的厚度。
在本实施例的显示面板100中,第一保护层18的厚度小于第二保护层19的厚度。由于第一保护层18未能完全覆盖金属走线14,使得未被覆盖的金属走线14的部分的保护性相对较弱,因此将第二保护层19设置得较厚,可提高第二保护层19对金属走线14对应于空间K处的部分的保护效果。
在一些实施例中,第一保护层18的厚度也可以大于第二保护层19的厚度。由于第二保护层19的厚度较薄,第二保护层19的柔性更好,因此第二保护层19可轻易地贴合在加固层17的曲面上,可提高第二保护层19贴合加固层17的紧固性,降低二者因显示面板100弯折而分离的风险。
在本实施例中的显示面板100中,第一保护层18的厚度介于50微米至80微米之间,比如第一保护层18的厚度可以是50微米、60微米、70微米和80微米。第二保护层19的厚度介于50微米至100微米之间,比如第二保护层19的厚度可以是50微米、60微米、70微米、80微米、90微米和100微米。
在本实施例的显示面板100中,第一保护层18的弹性模量小于第二保护层19的弹性模量。由于第一保护层18未能完全覆盖金属走线14,使得未被覆盖的金属走线14的部分的保护性相对较弱,因此可通过选择弹性模量较大的第二保护层19以增加第二保护层19的刚性,进而提高第二保护层19对金属走线14对应于空间K处的部分的保护效果。
在本实施例的显示面板100中,第一保护层18和第二保护层19的材质相同,且第一保护层18和第二保护层19为一体成型结构。该设置有利于提高第一保护层18和第二保护层19连接的稳定性,以及提高第一保护层18和第二保护层19贴合到绝缘层15和加固层17上的效率以及达到简化制程工艺的效果。
可选的,第一保护层18和第二保护层19的材质可以是聚对苯二甲酸乙二醇酯(PET)或聚酰亚胺(PI)等材料。
在一些实施例中,第一保护层18和第二保护层19也可以是两个独立的膜层。第一保护层18和第二保护层19的材质也可以不同。
可选的,加固层17的材料为可固化材料,比如紫外线固化胶、硅胶或硅酮胶等。
在本实施例的显示面板100中,电路板110设置在第一部分131上。第一保护层18开设有开口181。开口181贯穿第一保护层18和第二保护层19。电路板110的部分设置在开口181内。开口181的设置以避位电路板110,提高电路板110的组装效率,以及节省组装空间。
可选的,开口181的孔壁到电路板110边缘的距离L小于1毫米,比如距离L可以是0.1毫米、0.2毫米、0.3毫米、0.4毫米、0.5毫米、0.6毫米、0.7毫米、0.8毫米和0.9毫米。
可选的,电路板110可以是柔性电路板或印刷电路板。
本申请实施例的显示面板在端子区的部分中,将第一保护层和第二保护层设置在柔性基板上,且第二保护层与加固层相连,起到降低端子区翘曲和柔性基板的金属走线断裂的风险。
以上对本申请实施例所提供的一种显示面板进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。

Claims (10)

1.一种显示面板,其包括显示区、弯折区和端子区,所述弯折区设置在所述显示区和所述端子区之间,其特征在于,所述显示面板包括:
第一背板,所述第一背板设置在所述端子区;
柔性基板,所述柔性基板包括设置在所述端子区的第一部分,所述第一部分设置在所述第一背板上;
加固层,所述加固层的部分设置在所述柔性基板上且位于所述端子区;
第一保护层,所述第一保护层设置在所述第一部分上,所述第一保护层与所述加固层分隔设置;以及
第二保护层,所述第二保护层设置在所述第一保护层上,所述第二保护层与所述加固层相连。
2.根据权利要求1所述的显示面板,其特征在于,所述第二保护层连接于所述加固层的部分的边界位于所述端子区。
3.根据权利要求1所述的显示面板,其特征在于,所述第一保护层的厚度大于所述第二保护层的厚度。
4.根据权利要求3所述的显示面板,其特征在于,所述第一保护层的厚度等于所述加固层的厚度。
5.根据权利要求3所述的显示面板,其特征在于,所述第一保护层的弹性模量小于所述第二保护层的弹性模量。
6.根据权利要求1所述的显示面板,其特征在于,所述加固层的表面、所述第一保护层的表面和所述第二保护层的表面界定形成一空间。
7.根据权利要求1所述的显示面板,其特征在于,所述第一保护层和所述第二保护层为一体成型结构。
8.根据权利要求1所述的显示面板,其特征在于,所述显示面板还包括电路板,所述电路板设置在所述第一部分上;所述第一保护层开设有开口,所述开口贯穿所述第一保护层和所述第二保护层;
所述电路板的部分设置在所述开口内。
9.根据权利要求1所述的显示面板,其特征在于,所述第一保护层到所述加固层的距离介于0.2毫米至0.5毫米之间。
10.根据权利要求1所述的显示面板,其特征在于,所述显示面板包括连接在所述显示区和所述弯折区之间的过渡区,所述显示面板还包括第二背板和显示部;所述柔性基板还包括依次连接于所述第一部分的第二部分和第三部分,所述第二部分设置在所述过渡区和所述弯折区,所述第三部分设置在所述显示区;
所述第三部分设置在所述第二背板上,所述显示部设置在所述第三部分上;所述加固层设置在所述柔性基板上并自所述过渡区延伸至所述端子区。
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