CN113155335A - Two-stage type micro-flying piece impact stress testing device and testing method - Google Patents
Two-stage type micro-flying piece impact stress testing device and testing method Download PDFInfo
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- CN113155335A CN113155335A CN202110176753.8A CN202110176753A CN113155335A CN 113155335 A CN113155335 A CN 113155335A CN 202110176753 A CN202110176753 A CN 202110176753A CN 113155335 A CN113155335 A CN 113155335A
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- G01—MEASURING; TESTING
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- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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Abstract
The invention discloses a two-stage micro-flying piece impact stress testing device and a testing method, wherein the two-stage micro-flying piece impact stress testing device comprises a fixed base, an ignition device is installed on one side of the fixed base, an excitation device, a flying piece target material, a front-stage piezoelectric sensing unit, an acceleration chamber and a rear-stage piezoelectric sensing unit are sequentially installed on the fixed base, a charge conversion unit is installed on one side of the fixed base, and the front-stage piezoelectric sensing unit and the rear-stage piezoelectric sensing unit are both in communication connection with the charge conversion unit. When the micro flyer is punched, the equivalent area of the micro flyer can be accurately obtained by utilizing an electric signal formed by the depolarization effect of the preceding-stage piezoelectric film sensing layer, so that the shape of the micro flyer under the excitation action of the transducer element can be conveniently evaluated, and meanwhile, the impact stress of the micro flyer can be accurately measured; the measurement precision of the rear-stage piezoelectric film sensing layer can be obviously improved by equivalently converting the contact area of the micro flyer through the addition of the front-stage piezoelectric film sensing layer.
Description
Technical Field
The invention belongs to the field of explosion and impact tests, and particularly relates to a two-stage type micro-flying piece impact stress testing device and a testing method.
Background
The impact sheet detonator does not contain sensitive initiating explosive, has the advantages of high safety, high reliability, electromagnetic interference resistance and the like, and can be widely applied to various fields such as intelligent weapons and civil blasting. In the design and manufacturing process of the impact sheet detonator, the impact stress obtained by measuring the micro-flying sheet under the excitation action of the energy conversion elements such as the electric exploding foil and the like is one of the key parameters for evaluating the detonation performance of the micro-flying sheet. At present, the impact stress is mainly measured by acquiring charge output signals of a high-sensitivity piezoelectric film under accelerated impact of a micro flying piece in real time and calculating. In a specific test, the impact stress is determined by the piezoelectric charge output and the impact area of the flyer, and obviously, the shape and the size of the micro flyer and the action area when the micro flyer impacts the piezoelectric film are the key points for measuring the stress. However, in actual measurement, because the size of the micro-flying piece generated by the electric explosion cannot be accurately determined, the sensitive area of the piezoelectric film is often used for equivalent replacement, so that the impact stress of the micro-flying piece obtained by measurement has a large error, and the actual requirement cannot be met.
Disclosure of Invention
The invention mainly aims to provide a two-stage type micro-flying piece impact stress testing device and a testing method, and solves the problem that the existing piezoelectric film micro-flying piece impact stress testing has large errors.
In order to achieve the above object, according to an aspect of the present invention, a two-stage micro-flying piece impact stress testing apparatus is provided, including a fixed base, an ignition device is installed on one side of the fixed base, an excitation device, a flying piece target, a front stage piezoelectric sensing unit, an acceleration chamber, and a rear stage piezoelectric sensing unit are sequentially installed on the fixed base, a charge conversion unit is installed on the other side of the fixed base, the front stage piezoelectric sensing unit and the rear stage piezoelectric sensing unit are both in communication connection with the charge conversion unit, the charge conversion unit is sequentially in communication connection with a charge amplification unit, a multi-channel data acquisition unit, and a data information storage unit, and charge signals from the front stage piezoelectric sensing unit and the rear stage piezoelectric sensing unit are stored in the data information storage unit.
In the above structure, the preceding stage piezoelectric sensing unit has a preceding stage piezoelectric film sensing layer, the preceding stage piezoelectric film sensing layer is integrated on the back surface of the flyer target by multiple solution spin coating to form a whole with the flyer target, and the preceding stage piezoelectric film sensing layer is arranged in parallel on the front end surface of the acceleration chamber.
In the above structure, the preceding stage piezoelectric thin film sensing layer comprises a preceding stage upper electrode layer, a preceding stage piezoelectric thin film layer and a preceding stage lower electrode layer which are integrated by adopting a high-speed spin coating process, and the preceding stage upper electrode layer and the preceding stage lower electrode layer are both formed by spin coating of non-metal conductive ink.
In the above structure, the rear-stage piezoelectric sensing unit has a rear-stage piezoelectric thin film sensing layer, and the rear-stage piezoelectric thin film sensing layer is arranged in parallel on the rear end face of the acceleration chamber.
In the structure, the rear-stage piezoelectric film sensing layer comprises a rear-stage upper packaging layer, a rear-stage upper electrode layer, a rear-stage piezoelectric film layer, a rear-stage lower electrode layer and a rear-stage flexible substrate layer which are sequentially arranged, the rear-stage upper packaging layer and the rear-stage flexible substrate layer are made of thin flexible high polymer film materials, the rear-stage upper electrode layer and the rear-stage lower electrode layer are made of metal sputtering with good conductivity, and the rear-stage piezoelectric film layer is made of flexible high polymer piezoelectric film materials.
In the above structure, the charge conversion unit includes an external capacitor and an external resistor, the charge conversion unit is connected to the front piezoelectric thin film sensing layer by using a front cable, the charge conversion unit is connected to the rear piezoelectric thin film sensing layer by using a rear cable, the resistance of the external resistor is equal to the equivalent resistance of the front cable, and the resistance of the external resistor is equal to the equivalent resistance of the rear cable.
In order to achieve the above object, according to another aspect of the present invention, a two-stage type micro flying piece impact stress testing method includes:
a. starting an ignition device;
b. recording peak value V of charge signal output by preceding stage piezoelectric film sensing layer1maxWhile recording the rise time t of the charge signals1The actual effective area A of the shear micro-flying piece can be obtained by conversion according to the sensing characteristics of the piezoelectric film1The method comprises the following steps:
in the formula, K1The polarization intensity of the preceding piezoelectric film sensing layer;
c. recording the peak value V of another charge signal output by the rear-stage piezoelectric film sensing layer2maxWhile recording the rise time t of the charge signals2；
The average speed v of the micro flying piece in the accelerating chamber can be calculated by the formula (2);
peak impact stress value P of micro-flyermaxThen the following can be calculated:
in the formula, K2The sensitivity coefficient of the rear-stage piezoelectric film sensing layer is obtained; k2Dynamic calibration is carried out through a Hopkinson bar pressure device;
substituting the formula (1) into the formula (3) to obtain the impact stress peak value of the micro-flying chip as follows:
compared with the prior art, the invention has the beneficial effects that:
1. when the micro flyer is punched, the equivalent area of the micro flyer can be accurately obtained by utilizing an electric signal formed by the depolarization effect of the preceding piezoelectric film sensing layer, so that the shape of the micro flyer under the excitation action of the transducer element can be conveniently evaluated, and meanwhile, the impact stress of the micro flyer can be accurately measured;
2. the method comprises the steps that the rising time difference obtained by utilizing a charge signal of a front-stage piezoelectric film sensing layer and a charge signal of a rear-stage piezoelectric film sensing layer is combined with the size of an acceleration chamber, so that the average speed of a micro-flying piece in the acceleration chamber can be obtained while the impact stress of the micro-flying piece is measured;
3. aiming at the preceding stage piezoelectric film sensing layer, the mechanical influence of the preceding stage piezoelectric film sensing layer on the micro flying piece punching can be greatly reduced by adopting the nonmetal conductive ink as the upper electrode layer and the lower electrode layer.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a two-stage type micro-flying piece impact stress testing device of the present invention;
FIG. 2 is a structural composition of a preceding-stage piezoelectric thin film sensing layer;
FIG. 3 is a structural composition of a rear-stage piezoelectric thin film sensing layer;
FIG. 4 is a schematic diagram of a charge conversion circuit;
FIG. 5 is a table of impact stress and charge surface density.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
In order to make the technical solutions of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1-4, a two-stage micro-flying piece impact stress testing device includes a fixing base 1, an ignition device 2 is installed on one side of the fixing base 1, an excitation device 3, a flying piece target 4, a front stage piezoelectric sensing unit 5, an acceleration chamber 6 and a rear stage piezoelectric sensing unit 7 are sequentially installed on the fixing base 1, a charge conversion unit 8 is installed on the other side of the fixing base 1, the front stage piezoelectric sensing unit 5 and the rear stage piezoelectric sensing unit 7 are both in communication connection with the charge conversion unit 8, the charge conversion unit 8 is sequentially in communication connection with a charge amplification unit 9, a multi-channel data acquisition unit 10 and a data information storage unit 11, and charge signals from the front stage piezoelectric sensing unit 5 and the rear stage piezoelectric sensing unit 7 are stored in the data information storage unit 11.
The preceding stage piezoelectric sensing unit 5 is provided with a preceding stage piezoelectric film sensing layer, the preceding stage piezoelectric film sensing layer is integrated on the back surface of the flyer target 4 and forms a whole with the flyer target 4 through multiple solution spin coating, and the preceding stage piezoelectric film sensing layer is arranged on the front end surface of the acceleration chamber 6 in parallel.
The preceding stage piezoelectric film sensing layer comprises a preceding stage upper electrode layer 501, a preceding stage piezoelectric film layer 502 and a preceding stage lower electrode layer 503 which are integrated by adopting a high-speed spin coating process, wherein the preceding stage upper electrode layer 501 and the preceding stage lower electrode layer 503 are both formed by spin coating of nonmetal conductive ink.
The rear-stage piezoelectric sensing unit 7 is provided with a rear-stage piezoelectric film sensing layer, and the rear-stage piezoelectric film sensing layer is arranged on the rear end face of the acceleration chamber 6 in parallel.
The rear-stage piezoelectric film sensing layer comprises a rear-stage upper packaging layer 704, a rear-stage upper electrode layer 701, a rear-stage piezoelectric film layer 702, a rear-stage lower electrode layer 703 and a rear-stage flexible substrate layer 705 which are sequentially arranged, the rear-stage upper packaging layer 704 and the rear-stage flexible substrate layer 705 are made of thin flexible high polymer film materials, the rear-stage upper electrode layer 701 and the rear-stage lower electrode layer 703 are made of metal sputtering with good conductivity, and the rear-stage piezoelectric film layer 702 is made of flexible high polymer piezoelectric film materials.
The charge conversion unit 8 comprises an external capacitor 801 and an external resistor 802, the charge conversion unit is connected with the front piezoelectric film sensing layer by adopting a front cable, the charge conversion unit is connected with the rear piezoelectric film sensing layer by adopting a rear cable, the resistance value of the external resistor 802 is equal to the equivalent resistance of the front cable, and the resistance value of the external resistor 802 is equal to the equivalent resistance of the rear cable.
As shown in fig. 1, a two-stage micro-flying piece impact stress testing method is specifically described in combination with a working principle, and includes:
a. starting an ignition device, and electrically exploding foil to generate impact force;
b. the impact force generates a shearing force through the excitation device, and the shearing force shears and destroys the flyer target material to form a micro flyer with a certain size;
c. the micro flying sheet perforates the front-stage piezoelectric film sensing layer;
d. the front stage piezoelectric film sensing layer outputs a certain charge signal with a peak value of V1maxAt the same time, the rising time t of the charge signal is recordeds1The actual effective area A of the shear micro-flying piece can be obtained by conversion according to the sensing characteristics of the piezoelectric film1The method comprises the following steps:
in the formula, K1The polarization intensity of the preceding piezoelectric film sensing layer;
e. after the micro-flyer is punched into the front piezoelectric film sensing layer, the kinetic energy is further increased through the accelerating chamber with the length of L, and the micro-flyer inertially impacts the rear piezoelectric film sensing layer positioned on the rear end surface of the accelerating chamber, correspondingly, the rear piezoelectric film sensing layer outputs another charge signal, and simultaneously records the charge signalPeak value V of charge signal2maxAnd the rise time t of the charge signals2；
At this time, the average velocity v of the flyer in the acceleration chamber can be calculated by formula (2);
and the peak value P of the impact stress of the micro flyermaxThen the following can be calculated:
in the formula, K2The sensitivity coefficient of the rear-stage piezoelectric film sensing layer is obtained; k2Dynamic calibration is carried out through a Hopkinson bar pressure device;
substituting the formula (1) into the formula (3) to obtain the impact stress peak value of the micro-flying chip as follows:
in fact, the area of the through hole formed by the piezoelectric film before the impact of the micro-flyer is equivalent to the size of the micro-flyer.
As can be seen from fig. 5, the output of the charge areal density of the rear-stage piezoelectric thin film sensing layer is proportional to the loading pressure, and therefore, the impact stress of the flyer can be measured. Meanwhile, the charge surface density is closely related to the contact area of the loading object and the rear-stage piezoelectric film sensing layer in a calibration experiment.
TABLE 1 statistic of sensitivity coefficients of piezoelectric sensing layers with different contact areas
| Area ratio | Sensitivity coefficient (μ C/N) |
| 1 | 7.107 |
| 0.6 | 5.835 |
| 0.36 | 2.814 |
As can be seen from table 1, when the contact area with the loading object is significantly smaller than the sensitive area of the piezoelectric thin film sensing layer of the later stage, that is: when the area ratio is less than 1, the sensitivity K2The measurement accuracy of the rear-stage piezoelectric thin film sensing layer can be obviously improved by equivalently converting the contact area of the micro-flying piece by adding the front-stage piezoelectric thin film sensing layer.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement, component separation or combination and the like made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a little flying piece impact stress testing arrangement of two-stage type, its characterized in that includes unable adjustment base, unable adjustment base's a side-mounting ignition, unable adjustment base is last to install excitation device, flying piece target, preceding stage piezoelectricity perception unit, acceleration chamber and back level piezoelectricity perception unit in proper order, unable adjustment base's opposite side installation charge conversion unit, preceding stage piezoelectricity perception unit with back level piezoelectricity perception unit all with charge conversion unit communication connection, charge conversion unit communication connection has charge amplification unit, multichannel data acquisition unit and data information memory cell in proper order, and the charge signal who comes from preceding stage piezoelectricity perception unit and back level piezoelectricity perception unit is saved to data information memory cell.
2. The apparatus according to claim 1, wherein the pre-stage piezoelectric sensing unit has a pre-stage piezoelectric film sensing layer, the pre-stage piezoelectric film sensing layer is integrated on the back surface of the flyer target by multiple solution spin coating to form a whole with the flyer target, and the pre-stage piezoelectric film sensing layer is arranged in parallel on the front end surface of the acceleration chamber.
3. The two-stage micro-flying-chip impact stress testing device as claimed in claim 2, wherein the front piezoelectric thin film sensing layer comprises a front upper electrode layer, a front piezoelectric thin film layer and a front lower electrode layer which are integrated by a high-speed spin coating process, and the front upper electrode layer and the front lower electrode layer are spin-coated by a non-metal conductive ink.
4. The two-stage micro-flying piece impact stress testing device of claim 2, wherein the rear-stage piezoelectric sensing unit is provided with a rear-stage piezoelectric film sensing layer, and the rear-stage piezoelectric film sensing layer is arranged in parallel on the rear end face of the acceleration chamber.
5. The two-stage micro-flying piece impact stress testing device according to claim 4, wherein the rear-stage piezoelectric film sensing layer comprises a rear-stage upper packaging layer, a rear-stage upper electrode layer, a rear-stage piezoelectric film layer, a rear-stage lower electrode layer and a rear-stage flexible substrate layer which are sequentially arranged, the rear-stage upper packaging layer and the rear-stage flexible substrate layer are made of thin flexible polymer film materials, the rear-stage upper electrode layer and the rear-stage lower electrode layer are made of metal sputtering with good conductivity, and the rear-stage piezoelectric film layer is made of flexible polymer piezoelectric film materials.
6. The two-stage micro-flying chip impact stress testing device according to claim 1, wherein the charge conversion unit comprises an external capacitor and an external resistor, the charge conversion unit is connected with the front piezoelectric thin film sensing layer by adopting a front cable, the charge conversion unit is connected with the rear piezoelectric thin film sensing layer by adopting a rear cable, the resistance value of the external resistor is equal to the equivalent resistance of the front cable, and the resistance value of the external resistor is equal to the equivalent resistance of the rear cable.
7. A two-stage type micro-flying piece impact stress test method, which is characterized in that the test device of any one of claims 1 to 6 is adopted, and the method comprises the following steps:
a. starting an ignition device;
b. recording peak value V of charge signal output by preceding stage piezoelectric film sensing layer1maxWhile recording the rise time t of the charge signals1The actual effective area A of the shear micro-flying piece can be obtained by conversion according to the sensing characteristics of the piezoelectric film1The method comprises the following steps:
in the formula, K1The polarization intensity of the preceding piezoelectric film sensing layer;
c. recording the peak value V of another charge signal output by the rear-stage piezoelectric film sensing layer2maxWhile recording the rise time t of the charge signals2；
The average speed v of the micro flying piece in the accelerating chamber can be calculated by the formula (2);
peak impact stress value P of micro-flyermaxThen the following can be calculated:
in the formula, K2The sensitivity coefficient of the rear-stage piezoelectric film sensing layer is obtained; k2Dynamic calibration is carried out through a Hopkinson bar pressure device;
substituting the formula (1) into the formula (3) to obtain the impact stress peak value of the micro-flying chip as follows:
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57163871A (en) * | 1981-04-02 | 1982-10-08 | Seikosha Co Ltd | Impact value measuring instrument |
| EP1213578A1 (en) * | 2000-12-07 | 2002-06-12 | Semiconductor300 GmbH & Co KG | Apparatus and method for detecting an amount of depolarization of a linearly polarized beam |
| TW517156B (en) * | 2002-06-19 | 2003-01-11 | Univ Nat Taiwan | Accurate piezoelectric impact hammer |
| FR2884605A1 (en) * | 2005-04-18 | 2006-10-20 | Eads Europ Aeronautic Defence | METHOD AND DEVICE FOR MONITORING A STRUCTURE OF AN AIRCRAFT |
| CN101000294A (en) * | 2007-01-18 | 2007-07-18 | 南京航空航天大学 | Investigating method for impact loading spectrum of aircraft laminated structure and its investigating device |
| JP2007212416A (en) * | 2006-02-13 | 2007-08-23 | Kobe Steel Ltd | Impact testing apparatus |
| CN101738488A (en) * | 2009-12-18 | 2010-06-16 | 中国工程物理研究院流体物理研究所 | Device for recovering planar impact of explosive-driven flying sheet |
| CN102778257A (en) * | 2012-07-18 | 2012-11-14 | 中国科学院力学研究所 | Strong laser driven explosion and impact effect test platform |
| CN103411718A (en) * | 2013-08-12 | 2013-11-27 | 江苏大学 | Method for measuring shock pressure of flyer under high strain rate and device thereof |
| CN106706197A (en) * | 2016-11-16 | 2017-05-24 | 哈尔滨工程大学 | Subaqueous explosion pressure measurement device based on improved Hopkinson bar |
| CN106950396A (en) * | 2017-05-08 | 2017-07-14 | 西安交通大学 | A kind of speed-measuring method of Exploding foil initiator driven flyer plates |
| CN206573245U (en) * | 2017-03-24 | 2017-10-20 | 沈阳建筑大学 | A kind of shock measuring system of array PVDF piezoelectric membranes |
| RU2641315C1 (en) * | 2017-01-18 | 2018-01-17 | Олег Савельевич Кочетов | Stand for researching shock loads of vibration insulation systems |
| CN112304349A (en) * | 2020-09-24 | 2021-02-02 | 航天东方红卫星有限公司 | Space debris detection device and method |
-
2021
- 2021-02-07 CN CN202110176753.8A patent/CN113155335B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57163871A (en) * | 1981-04-02 | 1982-10-08 | Seikosha Co Ltd | Impact value measuring instrument |
| EP1213578A1 (en) * | 2000-12-07 | 2002-06-12 | Semiconductor300 GmbH & Co KG | Apparatus and method for detecting an amount of depolarization of a linearly polarized beam |
| TW517156B (en) * | 2002-06-19 | 2003-01-11 | Univ Nat Taiwan | Accurate piezoelectric impact hammer |
| FR2884605A1 (en) * | 2005-04-18 | 2006-10-20 | Eads Europ Aeronautic Defence | METHOD AND DEVICE FOR MONITORING A STRUCTURE OF AN AIRCRAFT |
| JP2007212416A (en) * | 2006-02-13 | 2007-08-23 | Kobe Steel Ltd | Impact testing apparatus |
| CN101000294A (en) * | 2007-01-18 | 2007-07-18 | 南京航空航天大学 | Investigating method for impact loading spectrum of aircraft laminated structure and its investigating device |
| CN101738488A (en) * | 2009-12-18 | 2010-06-16 | 中国工程物理研究院流体物理研究所 | Device for recovering planar impact of explosive-driven flying sheet |
| CN102778257A (en) * | 2012-07-18 | 2012-11-14 | 中国科学院力学研究所 | Strong laser driven explosion and impact effect test platform |
| CN103411718A (en) * | 2013-08-12 | 2013-11-27 | 江苏大学 | Method for measuring shock pressure of flyer under high strain rate and device thereof |
| CN106706197A (en) * | 2016-11-16 | 2017-05-24 | 哈尔滨工程大学 | Subaqueous explosion pressure measurement device based on improved Hopkinson bar |
| RU2641315C1 (en) * | 2017-01-18 | 2018-01-17 | Олег Савельевич Кочетов | Stand for researching shock loads of vibration insulation systems |
| CN206573245U (en) * | 2017-03-24 | 2017-10-20 | 沈阳建筑大学 | A kind of shock measuring system of array PVDF piezoelectric membranes |
| CN106950396A (en) * | 2017-05-08 | 2017-07-14 | 西安交通大学 | A kind of speed-measuring method of Exploding foil initiator driven flyer plates |
| CN112304349A (en) * | 2020-09-24 | 2021-02-02 | 航天东方红卫星有限公司 | Space debris detection device and method |
Non-Patent Citations (2)
| Title |
|---|
| HAN, JING 等: "Highly Sensitive Impact Sensor Based on PVDF-TrFE/Nano-ZnO Composite Thin Film", 《SENSORS》 * |
| 孔凡金 等: "PVDF 薄膜在空间碎片撞击监测中的应用研究", 《仪表技术与传感器》 * |
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