CN113155335B - Two-stage type micro-flying piece impact stress testing device and testing method - Google Patents

Two-stage type micro-flying piece impact stress testing device and testing method Download PDF

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CN113155335B
CN113155335B CN202110176753.8A CN202110176753A CN113155335B CN 113155335 B CN113155335 B CN 113155335B CN 202110176753 A CN202110176753 A CN 202110176753A CN 113155335 B CN113155335 B CN 113155335B
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piezoelectric film
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赵河明
韩晶
闫守阳
鲁旭涛
彭志凌
张冬梅
张惠芳
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North University of China
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    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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Abstract

The invention discloses a two-stage micro-flying piece impact stress testing device and a testing method, wherein the two-stage micro-flying piece impact stress testing device comprises a fixed base, an ignition device is installed on one side of the fixed base, an excitation device, a flying piece target material, a front-stage piezoelectric sensing unit, an acceleration chamber and a rear-stage piezoelectric sensing unit are sequentially installed on the fixed base, a charge conversion unit is installed on one side of the fixed base, and the front-stage piezoelectric sensing unit and the rear-stage piezoelectric sensing unit are both in communication connection with the charge conversion unit. When the micro flyer is punched, the equivalent area of the micro flyer can be accurately obtained by utilizing an electric signal formed by the depolarization effect of the preceding-stage piezoelectric film sensing layer, so that the shape of the micro flyer under the excitation action of the transducer element can be conveniently evaluated, and meanwhile, the impact stress of the micro flyer can be accurately measured; the measurement precision of the rear-stage piezoelectric film sensing layer can be obviously improved by equivalently converting the contact area of the micro flying piece through adding the front-stage piezoelectric film sensing layer.

Description

Two-stage type micro-flying piece impact stress testing device and testing method
Technical Field
The invention belongs to the field of explosion and impact tests, and particularly relates to a two-stage type micro-flying piece impact stress testing device and a testing method.
Background
The impact sheet detonator does not contain sensitive initiating explosive, has the advantages of high safety, high reliability, electromagnetic interference resistance and the like, and can be widely applied to various fields such as intelligent weapons and civil blasting. In the design and manufacturing process of the impact sheet detonator, the impact stress obtained by measuring the micro-flying sheet under the excitation action of the energy conversion elements such as the electric exploding foil is one of the key parameters for evaluating the initiation performance of the micro-flying sheet. At present, the impact stress is mainly measured by acquiring charge output signals of a high-sensitivity piezoelectric film under accelerated impact of a micro flying piece in real time and calculating. In a specific test, the impact stress is determined by the piezoelectric charge output and the impact area of the flyer, and obviously, the morphological size of the micro flyer and the action area when the micro flyer impacts the piezoelectric film are the key points for measuring the stress. However, in actual measurement, because the size of the micro-flying piece generated by the electric explosion cannot be accurately determined, the sensitive area of the piezoelectric film is often used for equivalent replacement, so that the impact stress of the micro-flying piece obtained by measurement has a large error, and the actual requirement cannot be met.
Disclosure of Invention
The invention mainly aims to provide a two-stage type micro-flying piece impact stress testing device and a testing method, and solves the problem that the existing piezoelectric film micro-flying piece impact stress testing has large errors.
In order to achieve the above object, according to an aspect of the present invention, a two-stage micro-flying piece impact stress testing apparatus is provided, including a fixed base, an ignition device is installed on one side of the fixed base, an excitation device, a flying piece target, a front stage piezoelectric sensing unit, an acceleration chamber, and a rear stage piezoelectric sensing unit are sequentially installed on the fixed base, a charge conversion unit is installed on the other side of the fixed base, the front stage piezoelectric sensing unit and the rear stage piezoelectric sensing unit are both in communication connection with the charge conversion unit, the charge conversion unit is sequentially in communication connection with a charge amplification unit, a multi-channel data acquisition unit, and a data information storage unit, and charge signals from the front stage piezoelectric sensing unit and the rear stage piezoelectric sensing unit are stored in the data information storage unit.
In the above structure, the preceding stage piezoelectric sensing unit has a preceding stage piezoelectric film sensing layer, the preceding stage piezoelectric film sensing layer is integrated on the back surface of the flyer target by multiple solution spin coating to form a whole with the flyer target, and the preceding stage piezoelectric film sensing layer is arranged in parallel on the front end surface of the acceleration chamber.
In the above structure, the preceding stage piezoelectric thin film sensing layer comprises a preceding stage upper electrode layer, a preceding stage piezoelectric thin film layer and a preceding stage lower electrode layer which are integrated by adopting a high-speed spin coating process, and the preceding stage upper electrode layer and the preceding stage lower electrode layer are both formed by spin coating of non-metal conductive ink.
In the above structure, the rear-stage piezoelectric sensing unit has a rear-stage piezoelectric thin film sensing layer, and the rear-stage piezoelectric thin film sensing layer is arranged in parallel on the rear end face of the acceleration chamber.
In the structure, the rear-stage piezoelectric film sensing layer comprises a rear-stage upper packaging layer, a rear-stage upper electrode layer, a rear-stage piezoelectric film layer, a rear-stage lower electrode layer and a rear-stage flexible substrate layer which are sequentially arranged, the rear-stage upper packaging layer and the rear-stage flexible substrate layer are made of thin flexible high polymer film materials, the rear-stage upper electrode layer and the rear-stage lower electrode layer are made of metal sputtering with good conductivity, and the rear-stage piezoelectric film layer is made of flexible high polymer piezoelectric film materials.
In the above structure, the charge conversion unit includes an external capacitor and an external resistor, the charge conversion unit is connected to the front piezoelectric thin film sensing layer by using a front cable, the charge conversion unit is connected to the rear piezoelectric thin film sensing layer by using a rear cable, the resistance of the external resistor is equal to the equivalent resistance of the front cable, and the resistance of the external resistor is equal to the equivalent resistance of the rear cable.
In order to achieve the above object, according to another aspect of the present invention, a two-stage type micro flyer impact stress testing method includes:
a. starting an ignition device;
b. recording peak value V of charge signal output by preceding stage piezoelectric film sensing layer 1max While recording the rise time t of the charge signal s1 The actual effective area A of the shear micro-flying piece can be obtained by conversion according to the sensing characteristics of the piezoelectric film 1 The method comprises the following steps:
Figure GDA0004056723140000031
in the formula, K 1 The polarization intensity of the preceding piezoelectric film sensing layer;
c. recording the peak value V of another charge signal output by the rear-stage piezoelectric film sensing layer 2max While recording the rise time t of the charge signal s2
The average speed v of the micro flying piece in the accelerating chamber can be calculated by the formula (2);
Figure GDA0004056723140000032
peak impact stress value P of micro flyer max Then the following can be calculated:
Figure GDA0004056723140000033
in the formula, K 2 The sensitivity coefficient of a rear-stage piezoelectric film sensing layer; k 2 Dynamic calibration is carried out through a Hopkinson bar pressure device;
substituting the formula (1) into the formula (3) to obtain the impact stress peak value of the micro-flying chip as follows:
Figure GDA0004056723140000034
compared with the prior art, the invention has the beneficial effects that:
1. when the micro flyer is punched, the equivalent area of the micro flyer can be accurately obtained by utilizing an electric signal formed by the depolarization effect of the preceding piezoelectric film sensing layer, so that the shape of the micro flyer under the excitation action of the transducer element can be conveniently evaluated, and meanwhile, the impact stress of the micro flyer can be accurately measured;
2. the method comprises the steps that the rising time difference obtained by utilizing a charge signal of a front-stage piezoelectric film sensing layer and a charge signal of a rear-stage piezoelectric film sensing layer is combined with the size of an acceleration chamber, so that the average speed of a micro-flying piece in the acceleration chamber can be obtained while the impact stress of the micro-flying piece is measured;
3. aiming at the preceding stage piezoelectric film sensing layer, the mechanical influence of the preceding stage piezoelectric film sensing layer on the micro flying piece punching can be greatly reduced by adopting the nonmetal conductive ink as the upper electrode layer and the lower electrode layer.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:
FIG. 1 is a schematic diagram of a two-stage type micro flying piece impact stress testing device of the present invention;
FIG. 2 is a structural composition of a preceding-stage piezoelectric thin film sensing layer;
FIG. 3 is a structural composition of a rear-stage piezoelectric thin film sensing layer;
FIG. 4 is a schematic diagram of a charge conversion circuit;
FIG. 5 is a table of impact stress and charge surface density.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
In order to make those skilled in the art better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1-4, a two-stage micro-flying piece impact stress testing device includes a fixing base 1, an ignition device 2 is installed on one side of the fixing base 1, an excitation device 3, a flying piece target 4, a front stage piezoelectric sensing unit 5, an acceleration chamber 6 and a rear stage piezoelectric sensing unit 7 are sequentially installed on the fixing base 1, a charge conversion unit 8 is installed on the other side of the fixing base 1, the front stage piezoelectric sensing unit 5 and the rear stage piezoelectric sensing unit 7 are both in communication connection with the charge conversion unit 8, the charge conversion unit 8 is sequentially in communication connection with a charge amplification unit 9, a multi-channel data acquisition unit 10 and a data information storage unit 11, and charge signals from the front stage piezoelectric sensing unit 5 and the rear stage piezoelectric sensing unit 7 are stored in the data information storage unit 11.
The preceding stage piezoelectric sensing unit 5 is provided with a preceding stage piezoelectric film sensing layer, the preceding stage piezoelectric film sensing layer is integrated on the back surface of the flyer target 4 and forms a whole with the flyer target 4 through multiple solution spin coating, and the preceding stage piezoelectric film sensing layer is arranged on the front end surface of the acceleration chamber 6 in parallel.
The preceding stage piezoelectric film sensing layer comprises a preceding stage upper electrode layer 501, a preceding stage piezoelectric film layer 502 and a preceding stage lower electrode layer 503 which are integrated by adopting a high-speed spin coating process, wherein the preceding stage upper electrode layer 501 and the preceding stage lower electrode layer 503 are both formed by spin coating of nonmetal conductive ink.
The rear-stage piezoelectric sensing unit 7 is provided with a rear-stage piezoelectric film sensing layer, and the rear-stage piezoelectric film sensing layer is arranged on the rear end face of the acceleration chamber 6 in parallel.
The rear-stage piezoelectric film sensing layer comprises a rear-stage upper packaging layer 704, a rear-stage upper electrode layer 701, a rear-stage piezoelectric film layer 702, a rear-stage lower electrode layer 703 and a rear-stage flexible substrate layer 705 which are sequentially arranged, the rear-stage upper packaging layer 704 and the rear-stage flexible substrate layer 705 are both made of thin flexible high polymer film materials, the rear-stage upper electrode layer 701 and the rear-stage lower electrode layer 703 are both formed by sputtering of metal with good conductivity, and the rear-stage piezoelectric film layer 702 is made of flexible high polymer piezoelectric film materials.
The charge conversion unit 8 comprises an external capacitor 801 and an external resistor 802, the charge conversion unit adopts a front-stage cable to be connected with the front-stage piezoelectric film sensing layer, the charge conversion unit adopts a rear-stage cable to be connected with the rear-stage piezoelectric film sensing layer, the resistance of the external resistor 802 is equal to the equivalent resistance of the front-stage cable, and the resistance of the external resistor 802 is equal to the equivalent resistance of the rear-stage cable.
As shown in fig. 1, a two-stage micro-flying piece impact stress testing method is specifically described in combination with a working principle, and includes:
a. starting an ignition device, and electrically exploding foil to generate impact force;
b. the impact force generates a shearing force through the excitation device, and the shearing force shears and destroys the flyer target material to form a micro flyer with a certain size;
c. the micro flying piece perforates the front-stage piezoelectric film sensing layer;
d. the preceding stage piezoelectric film sensing layer outputs a certain charge signal with a peak value of V 1max At the same time, the rising time t of the charge signal is recorded s1 The actual effective area A of the shear micro-flying piece can be obtained by conversion according to the sensing characteristics of the piezoelectric film 1 The method comprises the following steps:
Figure GDA0004056723140000061
in the formula, K 1 The polarization intensity of the preceding piezoelectric film sensing layer;
e. after the micro-flyer is punched into the front piezoelectric film sensing layer, the kinetic energy is further increased through the accelerating chamber with the length of L, and the micro-flyer inertially impacts the rear piezoelectric film sensing layer positioned on the rear end surface of the accelerating chamber, correspondingly, the rear piezoelectric film sensing layer outputs another charge signal, and simultaneously records the peak value V of the charge signal 2max And the rise time t of the charge signal s2
At this time, the average speed v of the micro flyer in the acceleration chamber can be calculated by formula (2);
Figure GDA0004056723140000062
and the peak value P of the impact stress of the micro flyer max Then the following can be calculated:
Figure GDA0004056723140000063
in the formula, K 2 The sensitivity coefficient of a rear-stage piezoelectric film sensing layer; k is 2 Dynamic calibration is carried out through a Hopkinson bar pressure device;
substituting the formula (1) into the formula (3) to obtain the impact stress peak value of the micro-flying chip as follows:
Figure GDA0004056723140000071
in fact, the area of the through hole formed by the piezoelectric film before the micro-flyer impacts is equivalent to the size of the micro-flyer.
As can be seen from fig. 5, the output of the charge areal density of the rear-stage piezoelectric thin film sensing layer is proportional to the loading pressure, and therefore, the impact stress of the flyer can be measured. Meanwhile, the charge surface density is closely related to the contact area of the loading object and the rear-stage piezoelectric film sensing layer in a calibration experiment.
TABLE 1 statistic of sensitivity coefficients of piezoelectric sensing layers with different contact areas
Area ratio Sensitivity coefficient (uC/N)
1 7.107
0.6 5.835
0.36 2.814
As can be seen from table 1, when the contact area with the loading object is significantly smaller than the sensitive area of the piezoelectric thin film sensing layer of the later stage, that is: when the area ratio is less than 1, the sensitivity K 2 The measurement accuracy of the rear-stage piezoelectric thin film sensing layer can be obviously improved by equivalently converting the contact area of the micro-flying piece by adding the front-stage piezoelectric thin film sensing layer.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement, component separation or combination, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. The two-stage micro-flying piece impact stress testing device is characterized by comprising a fixed base, wherein an ignition device is installed on one side of the fixed base, an excitation device, a flying piece target material, a front-stage piezoelectric sensing unit, an acceleration chamber and a rear-stage piezoelectric sensing unit are sequentially installed on the fixed base, a charge conversion unit is installed on the other side of the fixed base, the front-stage piezoelectric sensing unit and the rear-stage piezoelectric sensing unit are both in communication connection with the charge conversion unit, the charge conversion unit is sequentially in communication connection with a charge amplification unit, a multi-channel data acquisition unit and a data information storage unit, and charge signals from the front-stage piezoelectric sensing unit and the rear-stage piezoelectric sensing unit are stored in a data information storage unit;
the front-stage piezoelectric sensing unit is provided with a front-stage piezoelectric film sensing layer, the front-stage piezoelectric film sensing layer is integrated on the back surface of the flyer target through multiple solution spin coating and forms a whole with the flyer target, and the front-stage piezoelectric film sensing layer is arranged on the front end surface of the acceleration chamber in parallel; the front-stage piezoelectric film sensing layer comprises a front-stage upper electrode layer, a front-stage piezoelectric film layer and a front-stage lower electrode layer which are integrated by adopting a high-speed spin coating process, and the front-stage upper electrode layer and the front-stage lower electrode layer are formed by spin coating of nonmetal conductive ink.
2. The two-stage micro flying piece impact stress testing device according to claim 1, wherein the rear-stage piezoelectric sensing unit is provided with a rear-stage piezoelectric film sensing layer, and the rear-stage piezoelectric film sensing layer is arranged on the rear end face of the acceleration chamber in parallel.
3. The two-stage micro-flying piece impact stress testing device according to claim 2, wherein the rear-stage piezoelectric film sensing layer comprises a rear-stage upper packaging layer, a rear-stage upper electrode layer, a rear-stage piezoelectric film layer, a rear-stage lower electrode layer and a rear-stage flexible substrate layer which are sequentially arranged, the rear-stage upper packaging layer and the rear-stage flexible substrate layer are both made of thin flexible polymer film materials, the rear-stage upper electrode layer and the rear-stage lower electrode layer are both made of metal with good conductivity through sputtering, and the rear-stage piezoelectric film layer is made of flexible polymer piezoelectric film materials.
4. The two-stage micro-flying chip impact stress testing device according to claim 2, wherein the charge conversion unit comprises an external capacitor and an external resistor, the charge conversion unit is connected with the front piezoelectric thin film sensing layer by adopting a front cable, the charge conversion unit is connected with the rear piezoelectric thin film sensing layer by adopting a rear cable, the resistance value of the external resistor is equal to the equivalent resistance of the front cable, and the resistance value of the external resistor is equal to the equivalent resistance of the rear cable.
5. A two-stage type micro-flying piece impact stress testing method is characterized in that the testing device of any one of claims 1 to 4 is adopted, and the method comprises the following steps:
a. starting an ignition device;
b. recording peak value V of charge signal output by preceding stage piezoelectric film sensing layer 1max While recording the rise time t of the charge signal s1 The actual effective area A of the shearing micro flying piece can be obtained by conversion according to the sensing characteristics of the piezoelectric film 1 The method comprises the following steps:
Figure FDA0004056723130000011
in the formula, K 1 The polarization intensity of the preceding piezoelectric film sensing layer;
c. recording back-stage piezoelectric filmPeak value V of another charge signal output by sensing layer 2max While recording the rise time t of the charge signal s2
The average speed v of the micro flyer in the accelerating chamber can be calculated by the formula (2);
Figure FDA0004056723130000012
wherein L is the length of the acceleration chamber;
peak impact stress value P of micro-flyer max Then the following can be calculated:
Figure FDA0004056723130000013
in the formula, K 2 The sensitivity coefficient of the rear-stage piezoelectric film sensing layer is obtained; k 2 Dynamic calibration is carried out through a Hopkinson bar pressure device;
substituting the formula (1) into the formula (3) to obtain the impact stress peak value of the micro-flying chip as follows:
Figure FDA0004056723130000021
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