CN113131711A - VCM spring plate and manufacturing method thereof - Google Patents
VCM spring plate and manufacturing method thereof Download PDFInfo
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- CN113131711A CN113131711A CN202110310294.8A CN202110310294A CN113131711A CN 113131711 A CN113131711 A CN 113131711A CN 202110310294 A CN202110310294 A CN 202110310294A CN 113131711 A CN113131711 A CN 113131711A
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- dry film
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
Abstract
A VCM shell fragment and its preparation method, the preparation method includes: forming a first dry film on a substrate, and patterning the first dry film to form a first groove; forming a first conductive layer in the first groove; forming a second dry film on the first dry film and the first conductive layer, and patterning the second dry film to form a second groove; forming a second conductive layer in the second groove; wherein the first recess and the second recess are at least partially in communication such that the first conductive layer and the second conductive layer are at least partially connected. By the addition process on the substrate, etching is not needed, the process is simple, the material utilization rate is high, the defect caused by instability of the etching process can be avoided, the first conducting layer is formed in the first groove, the second conducting layer is formed in the second groove, the first conducting layer and the second conducting layer of the adjacent VCM elastic pieces do not need to be connected, and a single VCM elastic piece can be directly obtained after forming.
Description
Technical Field
The invention belongs to the technical field of voice coil motors, and particularly relates to a VCM elastic sheet and a manufacturing method thereof.
Background
A Voice Coil Motor (VCM), which is originally used for a speaker to generate vibration and sound, is used for driving a lens to move to generate an auto-focus imaging module. The basic principle is that the coil and the lens barrel are fixed together, a magnetic field formed by the magnet and the iron shell penetrates through the coil, and when current passes through the coil, an ampere force is generated to enable the lens barrel to move with the lens back and forth.
The spring plate is an important part of the VCM and is used for controlling the lens to move, the traditional process for manufacturing the spring plate adopts a subtractive half-etching technology, firstly, a copper coiled material is taken, double-sided film pressing, exposure, development and etching are sequentially carried out on the copper coiled material, and the spring plate is manufactured through etching or half-etching.
The conventional subtraction scheme has the following disadvantages:
1. the manufacturing process is complex, and the material utilization rate is low;
2. the semi-etching is adopted to control the thickness of copper, and the problems of etching through, continuous etching, copper adhesion, uneven circuit and the like can occur due to unstable etching process;
3. the single elastic sheet cannot be directly manufactured, and each elastic sheet can be separated only by punching in the later period.
Disclosure of Invention
The invention aims to provide a VCM elastic sheet and a manufacturing method thereof, which have the advantages of simple manufacturing process, higher material utilization rate, capability of avoiding the problem of unstable etching manufacturing process and capability of directly manufacturing a single VCM elastic sheet.
In order to realize the purpose of the invention, the invention provides the following technical scheme:
in a first aspect, the present invention provides a method for manufacturing a VCM spring, the method comprising: forming a first dry film on a substrate, and patterning the first dry film to form a first groove; forming a first conductive layer in the first groove; forming a second dry film on the first dry film and the first conductive layer, and patterning the second dry film to form a second groove; forming a second conductive layer in the second groove; wherein the first and second recesses are at least partially in communication such that the first and second conductive layers are at least partially connected.
By the addition process on the substrate, etching is not needed, the process is simple, the material utilization rate is high, the defect caused by instability of the etching process can be avoided, the first conducting layer is formed in the first groove, the second conducting layer is formed in the second groove, the first conducting layer and the second conducting layer of the adjacent VCM elastic pieces do not need to be connected, and a single VCM elastic piece can be directly obtained after forming.
In one embodiment, the manufacturing method further comprises: and removing the first dry film and the second dry film, and separating the first dry film and the substrate to obtain the VCM elastic sheet. Through at first conducting layer and second conducting layer shaping back, get rid of first dry film, second dry film and base plate to can obtain the VCM shell fragment of a plurality of separations, for the die-cut separation among the prior art, not only technology is comparatively simple, but also avoided defects such as burr, flash and damage probably appear, the reliability is higher.
In one embodiment, the forming a first dry film on a substrate, patterning the first dry film to form a first recess, includes: exposing and developing the first dry film to form the first groove. The first groove is formed by exposing and developing the first dry film, so that the depth of the first groove is controlled to control the thickness of the first conductive layer, and the VCM elastic sheet with the required thickness is obtained.
In one embodiment, the exposing and developing the first dry film to form the first groove includes: and exposing the first dry film by adopting a half-tone mask plate so as to form the first groove with a plurality of depths after development. Through adopting half tone mask version to expose first dry film, because half tone mask version has the different region of a plurality of luminosities, can distinguish the exposure parameter that first dry film corresponds each region to obtain the first recess that has a plurality of depths, be favorable to making the VCM shell fragment that the thickness is uneven.
In one embodiment, the substrate is made of an optical adhesive, and the removing the first dry film and the second dry film and the separating the first dry film from the substrate include: freezing the substrate to a failure temperature to cause the substrate to fail adhesively, the substrate being separated from the first dry film. The substrate is enabled to be adhesive-failure by freezing the substrate, so that the substrate is separated from the first dry film without being adhered, the process is simpler, the substrate can be recycled, and the manufacturing cost can be reduced.
In one embodiment, the failure temperature is less than or equal to-80 ℃. By setting the failure temperature to be lower than or equal to-80 ℃, the substrate of the optical cement material has higher degree of adhesive failure and shorter required time, the disassembling effect is better, and the efficiency is favorably improved.
In one embodiment, the removing the first dry film and the second dry film and separating the first dry film and the substrate comprises: and dissolving the first dry film and the second dry film by adopting a film stripping liquid. The first dry film and the second dry film are removed through the film stripping liquid, the process is simple, and the efficiency is high.
In one embodiment, the first conductive layer is flush with a surface of the first dry film facing away from the substrate, and the second conductive layer is flush with a surface of the second dry film facing away from the first dry film. Through the arrangement, the size precision of the VCM elastic sheet is guaranteed.
In one embodiment, the first dry film is a positive photoresist and the second dry film is a negative photoresist; or, the first dry film is a negative photoresist, and the second dry film is a positive photoresist. Through setting up first dry film and second dry film for the different photoresist of looks nature to before forming the second conducting layer, can utilize exposure development to form the second recess and keep the transition layer on the second dry film, avoid the second recess to run through to lead to the local thickness of second conducting layer too big and influence the yield in the first dry film.
In one embodiment, the first dry film and the second dry film are exposed with different light intensity and light time, and/or the first dry film and the second dry film are developed with different developer concentration and developing time. Through the illumination intensity and the illumination time of control exposure, and/or, the developer solution solubility and the development time of development to before forming the second conducting layer, can utilize exposure development to form the second recess and remain the transition layer on the second dry film, avoid the second recess to run through to leading to the local thickness of second conducting layer too big and influence the yield in the first dry film.
In a second aspect, the invention further provides a VCM spring plate, and the VCM spring plate is manufactured by the manufacturing method provided by the invention. The VCM elastic sheet manufactured by the manufacturing method provided by the invention is simple to manufacture, does not need etching, is low in cost, and can avoid the problem of unstable etching process. Meanwhile, the adjacent VCM elastic sheets do not need to be punched and separated, so that the VCM elastic sheets do not have defects such as burrs caused by punching, and the quality is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a VCM elastic piece according to an embodiment of the present invention;
fig. 2 to 11 are schematic structural diagrams corresponding to steps in the VCM elastic sheet manufacturing process according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1 to 9, an embodiment of the invention provides a manufacturing method of a VCM elastic sheet, the manufacturing method includes:
s101: forming a first dry film 20 on a substrate 10, and patterning the first dry film 20 to form a first groove 201;
s102: forming a first conductive layer 30 in the first groove 201;
s103: forming a second dry film 40 on the first dry film 20 and the first conductive layer 30, and patterning the second dry film 40 to form a second groove 401;
s104: the second conductive layer 50 is formed in the second groove 401.
Wherein the first recess 201 and the second recess 401 are at least partially in communication, such that the first conductive layer 30 and the second conductive layer 50 are at least partially connected. It can be understood that the first groove 201 and the second groove 401 are at least partially communicated, so that the second conductive layer 50 is at least partially formed on the first conductive layer 30, which is beneficial to forming the VCM elastic sheet with uneven thickness.
Specifically, the substrate 10 may be selected from glass, resin, and the like. The material of the first conductive layer 30 and the second conductive layer 50 can be selected from conductive metals such as gold, silver, and copper, and both the first conductive layer 30 and the second conductive layer 50 can be formed in the first groove 201 and the second groove 401 by electroplating. It is understood that, in this embodiment, the entirety of the first conductive layer 30 and the second conductive layer 50 is the VCM elastic sheet. In other embodiments, if the shape of the VCM elastic sheet is more complicated, a third dry film (not shown) may be formed on the second dry film 40 and the second conductive layer 50, a third groove may be formed on the third dry film, a third conductive layer (not shown) may be formed in the third groove, the first conductive layer 30, the second conductive layer 50, and the third conductive layer may be integrally formed into the VCM elastic sheet, and so on, a fourth conductive layer, a fifth conductive layer, and so on may be moved.
It can be understood that, by filling the first groove 201 with a metal material to form the first conductive layer 30 and filling the second groove 401 with a metal material to form the second conductive layer 50, since etching is not required, there is naturally no problem that etching through, etching is not continuous, copper adhesion, uneven wiring, and the like are not stable, which easily results. Meanwhile, the first groove 201 is filled with the first conductive layer 30, and the second groove 401 is filled with the second conductive layer 50 (formed by electroplating filling in this embodiment), so that the adjacent VCM spring pieces can be arranged at intervals by setting the shapes of the first groove 201 and the second groove 401, that is, the adjacent VCM spring pieces have no connection relationship, and a single VCM spring piece can be obtained as long as the VCM spring piece is taken out after molding. In the prior art, because the VCM elastic sheet is formed by etching the copper coil, the adjacent VCM elastic sheets are generally connected by the reinforcing ribs for the convenience of processing and the prevention of local tilting of the copper coil. And after a plurality of VCM shell fragments shaping, need separate a plurality of VCM shell fragments through die-cut mode, bring burr, drape over one's shoulders cutting edge of a knife or a sword and damage scheduling problem easily like this, the reliability is lower.
By performing the addition process on the substrate 10, since etching is not required, the process is simple and has a high material utilization rate, and the defect caused by unstable etching process can be avoided, and the first conductive layer 30 is formed by filling the first groove 201 and the second conductive layer 50 is formed by filling the second groove 401, the first conductive layer 30 and the second conductive layer 50 of adjacent VCM elastic pieces do not need to be connected, and a single VCM elastic piece can be directly obtained after molding.
In one embodiment, referring to fig. 1 and fig. 9 to 11, the manufacturing method further includes:
s105: the first dry film 20 and the second dry film 40 are removed, and the first dry film 20 and the substrate 10 are separated, thereby obtaining a VCM leaf spring.
Through at first conducting layer 30 and the shaping back of second conducting layer 50, get rid of first dry film 20, second dry film 40 and base plate 10 to can obtain the VCM shell fragment of a plurality of separations, for the die-cut separation among the prior art, not only the technology is comparatively simple, but also avoided burr, flash and damage etc. probably defect, the reliability is higher.
In one embodiment, referring to fig. 3 and 4, S101: forming a first dry film 20 on a substrate 10, patterning the first dry film 20 to form a first groove 201, including:
s1011: the first dry film 20 is exposed and developed to form a first groove 201.
Specifically, the first dry film 20 is a positive photoresist or a negative photoresist. It will be appreciated that the exposure and development process is easier to control the thickness of the features and the cost of the process is lower than unstable etching. The first groove 201 is formed by exposing and developing the first dry film 20, so that the depth of the first groove 201 is controlled to control the thickness of the first conductive layer 30, thereby obtaining the VCM elastic sheet with a required thickness.
In one embodiment, referring to fig. 3 and 4, S1011: exposing and developing the first dry film 20 to form a first groove 201, including:
s10111: the first dry film 20 is exposed using a half-tone mask 60 to form a first groove 201 having a plurality of depths after development.
Through adopting halftone mask version 60 to expose first dry film 20, because halftone mask version 60 has the different region of a plurality of luminosities, can distinguish the exposure parameter that first dry film 20 corresponds each region to can obtain the first recess 201 that has a plurality of depths after the exposure, be favorable to making the uneven VCM shell fragment of thickness. It can be understood that, in the present embodiment, the halftone mask 60 includes a light-transmitting area 601, a light-shielding area 602, and a half-light-shielding area 603, where the light-transmitting area 601 can be passed through by most or all light rays, and light rays irradiate an area of the first dry film 20 corresponding to the light-transmitting area 601, and the light-shielding area 602 can absorb most or all light rays, so that no light rays irradiate an area of the first dry film 20 corresponding to the light-shielding area 602, and the half-light-shielding area 603 can absorb part of light rays, so that only part of light rays irradiate an area of the first dry film 20 corresponding to the half-light-shielding. In this embodiment, the first dry film 20 is a negative photoresist, and under the irradiation of light, the first dry film 20 is mainly cross-linked, that is, no groove is formed in the region of the first dry film 20 corresponding to the light-transmitting region 601, a groove with a larger depth is formed in the region corresponding to the light-shielding region 602, and a groove with a shallower depth is formed in the region corresponding to the half-light-shielding region 603, so as to obtain the first groove 201 with multiple depths, so as to form the first conductive layer 30 with different thicknesses by subsequent filling. In other embodiments, the first dry film 20 can also be a positive photoresist, i.e., the first dry film 20 is mainly degraded under light irradiation.
In this embodiment, in step S103, the second grooves 401 are formed on the second dry film 40 by exposure and development, the mask used for exposure is the common mask 70, and the depth of the formed second grooves 401 is uniform. In other embodiments, the halftone mask 60 in step S10111 may also be used in step S103 according to the VCM spring shape.
In one embodiment, referring to fig. 9 and 10, the substrate 10 is made of an optical adhesive;
s105: removing the first dry film 20 and the second dry film 40, and separating the first dry film 20 and the substrate 10, including:
s1051: the substrate 10 is frozen to a failure temperature so that the substrate 10 is adhesively failed and the substrate 10 is separated from the first dry film 20.
It is understood that the Optical Clear Adhesive (OCA) has an Adhesive property effective over a range of temperatures, and when the temperature is outside this range, the Adhesive property of the OCA is partially or completely lost. By utilizing the characteristic, the substrate 10 is enabled to be adhesive failure by freezing the substrate 10, so that the substrate 10 and the first dry film 20 are separated without being glued, the process is simpler, the substrate 10 can be conveniently recycled, and the manufacturing cost can be reduced.
In one embodiment, referring to FIGS. 10 and 11, the failure temperature is less than or equal to-80 ℃. By setting the failure temperature to be lower than or equal to-80 ℃, the substrate 10 made of the optical cement material has higher degree of adhesive failure and shorter required time, has better disassembling effect and is beneficial to improving the efficiency.
In one embodiment, referring to fig. 9 and 10, S105: removing the first dry film 20 and the second dry film 40, and separating the first dry film 20 and the substrate 10, including:
s1052: and dissolving the first dry film and the second dry film by adopting a film stripping liquid.
Specifically, the stripping solution is an alkali solution with strong alkalinity, and can quickly dissolve the exposed dry film, so that the first dry film and the second dry film after exposure are stripped. The first dry film 20 and the second dry film 40 are removed by the membrane stripping liquid, so that the process is simple and the efficiency is high.
In one embodiment, referring to fig. 9, the first conductive layer 30 is flush with the surface of the first dry film 20 opposite to the substrate 10, and the second conductive layer 50 is flush with the surface of the second dry film 40 opposite to the first dry film 20. Through the arrangement, the size precision of the VCM elastic sheet is guaranteed.
In one embodiment, referring to fig. 7 and 8, the first dry film 20 is a positive photoresist and the second dry film 40 is a negative photoresist; or, the first dry film 20 is a negative photoresist and the second dry film 40 is a positive photoresist. It will be appreciated that the negative tone photoresist and the positive tone photoresist are exposed and developed with the same reticle and the patterns reversed. For example, the second dry film 40 is a positive photoresist, and the first dry film 20 is a negative photoresist, so that when the second dry film 40 is exposed and developed, the second dry film 40 is degraded in a developing solution, and the first dry film 20 undergoes a cross-linking reaction and is not dissolved in the developing solution, so that the second dry film 40 is removed and the first dry film 20 is remained.
By arranging the first dry film 20 and the second dry film 40 as photoresists with different phases, before the second conductive layer 50 is formed, the second groove 401 can be formed on the second dry film 40 by exposure and development to retain a transition layer, so that the problem that the second groove 401 penetrates into the first dry film 20 to cause overlarge local thickness of the second conductive layer 50 to influence the yield is avoided.
In one embodiment, referring to fig. 7 and 8, the first dry film 20 and the second dry film 40 are exposed with different light intensity and time, and/or the first dry film 20 and the second dry film 40 are developed with different developer concentration and time. Specifically, the illumination intensity and the illumination time required for exposing the second dry film 40 may be set to be less than the illumination intensity and the illumination time required for exposing the first dry film 20, so that the first dry film 20 is not degraded in the developer when the exposure and development are performed with the illumination intensity and the illumination time required for exposing the second dry film 40. Likewise, the concentration of the developing solution and the developing time required for developing the second dry film 40 may be set to be less than the concentration of the developing solution and the developing time required for developing the first dry film 20, so that the first dry film 20 is not degraded in the developing solution when the exposure developing is performed at the concentration of the developing solution and the developing time required for developing the second dry film 40. Both of the above-mentioned two means can be used simultaneously or only one of them can be used to achieve the purpose of removing the second dry film 40 separately. By controlling the illumination intensity and illumination time of the exposure and/or the developing solution solubility and developing time of the development, before the second conductive layer 50 is formed, the second groove 401 can be formed on the second dry film 40 by utilizing the exposure and development to retain the transition layer, so that the problem that the yield is influenced by the overlarge local thickness of the second conductive layer 50 caused by the fact that the second groove 401 penetrates into the first dry film 20 is avoided.
The embodiment of the invention also provides the VCM spring plate which is preferably applied to products and modules with the camera shooting function, such as cameras, smart phones, tablet computers, camera modules and the like. The VCM elastic sheet is manufactured by the manufacturing method provided by the invention. The VCM elastic sheet manufactured by the manufacturing method provided by the invention is simple to manufacture, does not need etching, is low in cost, and can avoid the problem of unstable etching process. Meanwhile, the adjacent VCM elastic sheets do not need to be punched and separated, so that the VCM elastic sheets do not have defects such as burrs caused by punching, and the quality is better.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A manufacturing method of a VCM elastic sheet is characterized by comprising the following steps:
forming a first dry film on a substrate, and patterning the first dry film to form a first groove;
forming a first conductive layer in the first groove;
forming a second dry film on the first dry film and the first conductive layer, and patterning the second dry film to form a second groove;
forming a second conductive layer in the second groove;
wherein the first and second recesses are at least partially in communication such that the first and second conductive layers are at least partially connected.
2. The method of claim 1, wherein the forming a first dry film on a substrate and patterning the first dry film to form a first recess comprises:
exposing and developing the first dry film to form the first groove.
3. The method of claim 2, wherein the exposing and developing the first dry film to form the first recess comprises:
and exposing the first dry film by adopting a half-tone mask plate so as to form the first groove with a plurality of depths after development.
4. The method of manufacturing of claim 1, further comprising:
and removing the first dry film and the second dry film, and separating the first dry film and the substrate to obtain the VCM elastic sheet.
5. The method according to claim 4, wherein the substrate is made of an optical adhesive, and the removing the first dry film and the second dry film and the separating the first dry film from the substrate comprise:
freezing the substrate to a failure temperature to cause the substrate to fail adhesively, the substrate being separated from the first dry film.
6. The method of claim 5, wherein the failure temperature is less than or equal to-80 ℃.
7. The method of claim 4, wherein the removing the first dry film and the second dry film and separating the first dry film and the substrate comprises:
and dissolving the first dry film and the second dry film by adopting a film stripping liquid.
8. The method according to claim 1, wherein the first conductive layer is flush with a surface of the first dry film facing away from the substrate, and the second conductive layer is flush with a surface of the second dry film facing away from the first dry film.
9. The method of claim 1, wherein the first dry film is a positive photoresist and the second dry film is a negative photoresist; or, the first dry film is a negative photoresist, and the second dry film is a positive photoresist.
10. A VCM spring, characterized in that, said VCM spring is made by the method according to any of claims 1 to 9.
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100002489A (en) * | 2008-06-30 | 2010-01-07 | 한국산업기술대학교산학협력단 | Testing apparatus of load and testing method using the same |
| US20130069272A1 (en) * | 2011-09-16 | 2013-03-21 | Yasuaki Ootera | Method of manufacturing mold and method of manufacturing magnetic recording medium |
| CN103765555A (en) * | 2011-07-21 | 2014-04-30 | 株式会社尼康 | Exposure device, exposure method, method for manufacturing device, program and recording medium |
| US20150206547A1 (en) * | 2014-01-17 | 2015-07-23 | Kabushiki Kaisha Toshiba | Perpendicular magnetic recording medium, method of manufacturing the same, and magnetic recording/reproduction apparatus |
| CN104952786A (en) * | 2014-03-25 | 2015-09-30 | 中芯国际集成电路制造(上海)有限公司 | Electric interconnection structure and formation method thereof |
| CN105116685A (en) * | 2015-09-24 | 2015-12-02 | 京东方科技集团股份有限公司 | Making method of photoresist pattern, color filter and display device |
| CN105842994A (en) * | 2010-09-07 | 2016-08-10 | 株式会社尼康 | Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method |
| CN207069873U (en) * | 2017-07-25 | 2018-03-02 | 昆山弗莱吉电子科技有限公司 | A kind of anti-oxidant VCM shell fragments |
| CN109348105A (en) * | 2018-10-30 | 2019-02-15 | 维沃移动通信（杭州）有限公司 | Camera module and mobile terminal |
| CN111090222A (en) * | 2020-02-24 | 2020-05-01 | 昆山弗莱吉电子科技有限公司 | Efficient preparation method of VCM elastic sheet |
| CN111712056A (en) * | 2020-06-02 | 2020-09-25 | 湖南维胜科技有限公司 | VCM elastic sheet and processing method thereof |
-
2021
- 2021-03-23 CN CN202110310294.8A patent/CN113131711A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100002489A (en) * | 2008-06-30 | 2010-01-07 | 한국산업기술대학교산학협력단 | Testing apparatus of load and testing method using the same |
| CN105842994A (en) * | 2010-09-07 | 2016-08-10 | 株式会社尼康 | Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method |
| CN103765555A (en) * | 2011-07-21 | 2014-04-30 | 株式会社尼康 | Exposure device, exposure method, method for manufacturing device, program and recording medium |
| US20130069272A1 (en) * | 2011-09-16 | 2013-03-21 | Yasuaki Ootera | Method of manufacturing mold and method of manufacturing magnetic recording medium |
| US20150206547A1 (en) * | 2014-01-17 | 2015-07-23 | Kabushiki Kaisha Toshiba | Perpendicular magnetic recording medium, method of manufacturing the same, and magnetic recording/reproduction apparatus |
| CN104952786A (en) * | 2014-03-25 | 2015-09-30 | 中芯国际集成电路制造(上海)有限公司 | Electric interconnection structure and formation method thereof |
| CN105116685A (en) * | 2015-09-24 | 2015-12-02 | 京东方科技集团股份有限公司 | Making method of photoresist pattern, color filter and display device |
| CN207069873U (en) * | 2017-07-25 | 2018-03-02 | 昆山弗莱吉电子科技有限公司 | A kind of anti-oxidant VCM shell fragments |
| CN109348105A (en) * | 2018-10-30 | 2019-02-15 | 维沃移动通信（杭州）有限公司 | Camera module and mobile terminal |
| CN111090222A (en) * | 2020-02-24 | 2020-05-01 | 昆山弗莱吉电子科技有限公司 | Efficient preparation method of VCM elastic sheet |
| CN111712056A (en) * | 2020-06-02 | 2020-09-25 | 湖南维胜科技有限公司 | VCM elastic sheet and processing method thereof |
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