CN111443440A - Optical device structure and manufacturing method thereof - Google Patents
Optical device structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN111443440A CN111443440A CN202010386106.5A CN202010386106A CN111443440A CN 111443440 A CN111443440 A CN 111443440A CN 202010386106 A CN202010386106 A CN 202010386106A CN 111443440 A CN111443440 A CN 111443440A
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- optical device
- circuit board
- printed circuit
- layer
- board material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses an optical device structure and a manufacturing method thereof. In the optical device structure and the manufacturing method thereof provided by the invention, the optical device structure comprises: a housing; the printed circuit board is in a step shape towards one end of the optical device, the step-shaped lower surface faces the optical device, and the top surface of the optical device is lower than that of the printed circuit board; and a metal wire connecting the optical device and the lower surface of the printed wiring board. Therefore, the printed circuit board is made into a structure with a step, the height difference between one end of the printed circuit board and the optical device can be reduced, and even the printed circuit board and the optical device are leveled, so that the metal lead is shorter, and the transmission loss of signals in gold wires is reduced.
Description
Technical Field
The invention relates to the field of display, in particular to an optical device structure and a manufacturing method thereof.
Background
In an optical communication system, an optical module has become a modular unit of the communication system, and along with diversification of communication services and improvement of communication reliability, an intelligent optical transceiver module provides an effective means for realization of a new generation optical fiber communication system. The optical module gradually develops to high speed, miniaturization, hot plug and intellectualization direction on the basis of the basic functions of electro-optical and photoelectric conversion. As optical communication systems are developed to have high speed and high capacity, the complexity of the devices is increasing. Therefore, optical modules have also placed increasing demands on printed wiring boards.
Referring to fig. 1, a schematic structural diagram of an optical device in the prior art is shown. The structure 100 includes: the optical device comprises a shell 104, an optical device 102 and a printed circuit board 101 which are arranged on the shell 104, wherein the metal lead 103 is electrically connected between the optical device 102 and the printed circuit board 101 through a first lead edge pad 1021 and a second lead edge pad 1011 respectively, and the second lead edge pad 1011 is connected with a signal line layer 1012 on the printed circuit board 101.
However, as can be seen from fig. 1, the two connecting pads of the metal wire 103 are not on the same plane, which results in lengthening the metal wire 103 for connecting the optical device 102 and the printed wiring board 101, and thus the electrical signal is severely lost during transmission, and the effective transmission of the electrical signal cannot be verified. At present, many optical module manufacturers adjust the overall structure of the optical device to make the two connection pads in the same horizontal plane. However, the structure has a large requirement on space, and the high-density and diversified design feasibility is reduced to a certain extent.
Disclosure of Invention
The invention aims to provide an optical device structure and a manufacturing method thereof, which can shorten a metal wire, improve the signal transmission speed and reduce the signal loss.
To solve the above technical problem, the present invention provides an optical device structure, including:
a housing;
the optical device and the printed circuit board are arranged on the shell, one end of the printed circuit board, facing the optical device, is in a step shape, the lower surface of the step shape faces the optical device, and the top surface of the optical device is lower than that of the printed circuit board; and
and the metal lead is connected with the optical device and the lower surface of the printed circuit board.
Optionally, for the optical device structure, a first lead edge connecting disc is arranged on the lower surface of the printed circuit board, a second lead edge connecting disc is arranged at the top end of the optical device, and the metal lead is connected with the first lead edge connecting disc and the second lead edge connecting disc.
Optionally, for the optical device structure, the printed circuit board includes a first printed circuit board material layer and a second printed circuit board material layer, and the second printed circuit board material layer exposes a portion of the first printed circuit board material layer, so that one end of the printed circuit board is stepped.
Optionally, for the optical device structure, the first lead edge pad is disposed on the first printed circuit board material layer, and the second printed circuit board material layer covers a part of the first lead edge pad.
Optionally, for the optical device structure, a signal transmission metal layer is disposed on the top surface of the printed circuit board.
Optionally, for the optical device structure, a metal conductor pillar is disposed in the first printed circuit board material layer, and the metal conductor pillar connects the first wire edge pad and the signal transmission metal layer.
The invention also provides a manufacturing method of the optical device structure, which comprises the following steps:
providing a first printed circuit board material layer, wherein a first lead edge connecting disc is arranged on the first printed circuit board material layer;
providing a second printed circuit board material layer on the first printed circuit board material layer and covering the first lead edge connecting disc, wherein a signal transmission metal layer is arranged on the second printed circuit board material layer;
processing the second printed circuit board material layer to form a hole-shaped structure, and exposing the first lead edge connecting disc on the first printed circuit board material layer;
forming a conductive pillar in the hole-like structure;
processing the second printed circuit board material layer to expose part of the first lead edge connecting disc to form a printed circuit board with one stepped end;
providing a housing;
placing the first layer of printed wiring board material on the housing;
arranging an optical device on the shell, wherein the stepped low surface faces the optical device; and
and arranging a metal wire to connect the optical device and the first wire edge connecting disc.
Optionally, for the manufacturing method of the optical device structure, an isolation film is disposed on the first wire edge pad.
Optionally, with respect to the method for manufacturing the optical device structure, the step of forming the conductive pillar in the hole structure includes an electrochemical plating process.
Optionally, for the manufacturing method of the optical device structure, after the conductive pillar is formed in the hole-shaped structure; before processing the second printed circuit board material layer to expose part of the first lead edge connecting disc and forming a printed circuit board with one end in a step shape, the method further comprises the following steps:
and etching the printed circuit board material layer to form a conductive line pattern layer.
In the optical device structure and the manufacturing method thereof provided by the invention, the optical device structure comprises: a housing; the optical device and the printed circuit board are arranged on the shell, one end of the printed circuit board, facing the optical device, is in a step shape, the lower surface of the step shape faces the optical device, and the top surface of the optical device is lower than that of the printed circuit board; and a metal wire connecting the optical device and the lower surface of the printed wiring board. Therefore, the printed circuit board is made into a structure with a step, the height difference between one end of the printed circuit board and the optical device can be reduced, and even the printed circuit board and the optical device are leveled, so that the metal lead is shorter, and the transmission loss of signals in gold wires is reduced.
Drawings
FIG. 1 is a schematic diagram of a prior art structure of a light device;
FIG. 2 is a flow chart of a method for fabricating an optical device structure according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a layer of material forming a printed wiring board in one embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view illustrating etching of a material layer of a printed wiring board according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a second conductive edge pad formed in accordance with an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a signal transmission metal layer formed according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of a housing according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view of a first layer of printed wiring board material disposed on a housing in accordance with an embodiment of the present invention;
fig. 9 is a cross-sectional view of an optical device structure formed in an embodiment of the invention.
Detailed Description
The optical device structure and method of making the same of the present invention will now be described in more detail with reference to the schematic drawings, in which preferred embodiments of the invention are shown, it being understood that one skilled in the art may modify the invention herein described while still achieving the advantageous effects of the invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
In the description that follows, it will be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a housing (or substrate), layer (or film), region, and/or pattern, it can be directly on another layer or substrate, and/or intervening layers may also be present. In addition, it will be understood that when a layer is referred to as being "under" another layer, it can be directly under the other layer, and/or one or more intervening layers may also be present. In addition, references to "on" and "under" layers may be made based on the drawings.
As shown in fig. 2 to 9, an embodiment of the present invention provides an optical device structure, including:
a housing 205;
the optical device 203 and the printed circuit board are arranged on the shell 205, one end of the printed circuit board facing the optical device 203 is in a step shape, the lower surface of the step shape faces the optical device 203, and the top surface of the optical device is lower than that of the printed circuit board; and
and a metal wire 204 connecting the optical device 203 and the lower surface of the printed wiring board.
Therefore, the printed circuit board is made into a structure with a step, the height difference between one end of the printed circuit board and the optical device can be reduced, and even the printed circuit board and the optical device are leveled, so that the metal lead is shorter, and the transmission loss of signals in gold wires is reduced.
The following is a list of preferred embodiments of the optical device structure and the manufacturing method thereof to clearly illustrate the content of the present invention, and it should be understood that the content of the present invention is not limited to the following embodiments, and other modifications by conventional technical means of those skilled in the art are within the scope of the idea of the present invention.
As shown in fig. 2, an embodiment of the present invention provides a method for manufacturing an optical device structure, including the following steps:
step S11, providing a first printed circuit board material layer 2025, wherein a first lead edge pad 2021 is disposed on the first printed circuit board material layer 2025;
step S12, providing a second printed circuit board material layer 2024 on the first printed circuit board material layer 2025 and covering the first lead edge pad 2021, wherein a signal transmission metal layer 2023 is disposed on the second printed circuit board material layer 2024;
step S13, processing the second printed circuit board material layer 2024 to form a hole-shaped structure 207, exposing the first wire edge pad 2021 on the first printed circuit board material layer 2025;
step S14, forming a conductive post 2022 in the hole-like structure 207;
step S15, processing the second printed wiring board material layer 2024 to expose a portion of the first wire edge pad 2021, and forming a printed wiring board with one end being stepped;
step S16, providing the housing 205;
step S17, placing the first layer of printed wiring board material 2025 on the housing 205;
step S18, disposing the optical device 203 on the housing 205, with the stepped lower surface facing the optical device 203; and
in step S19, a metal wire 204 is disposed to connect the optical device 203 and the first wire edge pad 2021.
In step S11, please refer to fig. 3, a first printed circuit board material layer 2025 is provided, and a first wire edge pad 2021 is disposed on the first printed circuit board material layer 2025.
In particular, the formation of the first layer 2025 of printed wiring board material may be accomplished by using the prior art, and may include at least one layer, which will not be described in detail herein.
The first lead edge pad 2021 is mainly made of a metal material, such as a copper material.
Further, in order to prevent adhesion between the first wire edge pad 2021 and other subsequent film layers, an isolation film 206 may be formed on the first wire edge pad 2021.
Referring to step S12, referring to fig. 4, a second pcb material layer 2024 is provided on the first pcb material layer 2025 and covers the first wire edge pad 2021, and a signal transmission metal layer 2023 is disposed on the second pcb material layer 2024.
The first pcb material layer 2024 may be disposed on the first pcb material layer 2025 by pressing, so as to be combined well.
Next, referring to fig. 5, in step S13, the second pcb material layer 2024 is processed to form a hole-shaped structure 207, exposing the first wire edge pad 2021 on the first pcb material layer 2025.
In an embodiment of the invention, the drilling may take the form of machining, for example. As another example, a laser etching process may be selected to form the hole-like structure.
Referring to fig. 6, for step S14, a conductive post 2022 is formed in the hole-like structure 207.
In the embodiment of the present invention, for example, an electrochemical plating process is used, and in addition, other processes such as sputtering and evaporation may be used.
The conductive post 2022 is formed with one end connected to the first wire edge pad 2021 and the other end connected to the signal transmission metal layer 2023, thereby achieving electrical conduction.
In the forming process of the conductive post 2022, the thickness of the signal transmission metal layer 2023 may be increased without using a mask, so that the thickness of the signal transmission metal layer 2023 may be reduced appropriately according to the actual thickness of the signal transmission metal layer 2023.
Then, referring to fig. 6, in step S15, the second printed circuit board material layer 2024 is processed to expose a portion of the first wire edge pad 2021, so as to form a printed circuit board with a stepped end.
Since the first lead edge pad 2021 may be provided with an isolation film, partial peeling of the second printed wiring board material layer 2024 may be simplified, and processing may be performed quickly and efficiently.
The removal of the portion of the second layer of printed wiring board material 2024 may be performed, for example, in the form of machining. Furthermore, the bombardment removal may be performed, for example, by dry etching.
With continued reference to fig. 7, for step S16, housing 205 is provided. In one embodiment, the housing 205 may be a rigid material, such as a glass substrate, a silicon substrate, a metal substrate, or the like. In one embodiment, the housing 205 may also be made of a flexible material, and the material of the housing 205 may be, but is not limited to, acryl, polymethyl methacrylate (PMMA), polyacrylonitrile-butadiene-styrene (ABS), Polyamide (PA), Polyimide (PI), and the like. In this embodiment, the housing 205 is, for example, a metal substrate. The housing 205 of the present invention is not limited to the above examples, and may be made of other materials.
It will be appreciated that in a preferred embodiment, the substrate 1 is pre-treated to remove impurities such as particulates, organics and metal ions.
Referring to fig. 8, for step S17, the first layer of pcb material 2025 is disposed on the housing 205. It will be appreciated that since structures such as the second layer of printed wiring board material 2024 are provided on the first layer of printed wiring board material 2025, these corresponding structures are also provided on the housing 205 along with the first layer of printed wiring board material 2025.
Then, referring to fig. 9, for step S18, the optical device 203 is disposed on the housing 205, and the step-shaped low surface faces the optical device 203; and
step S19, a metal wire 204 is disposed to connect the optical device 203 and the first wire edge pad 2021, specifically, the optical device 203 and the printed circuit board are electrically connected through the first wire edge pad 2021 and the second wire edge pad 2031.
Through the above process, the present invention obtains an optical device structure including:
a housing 205;
the optical device 203 and the printed circuit board are arranged on the shell 205, one end of the printed circuit board, facing the optical device 203, is in a step shape, the lower surface of the step shape faces the optical device 203, and the top surface of the optical device is lower than that of the printed circuit board; and
and a metal wire 204 connecting the optical device 203 and the lower surface of the printed wiring board.
Specifically, as can be seen from fig. 7, the top end of the optical device 203 is provided with a first wire edge pad 2021. A second wire edge pad 2031 is provided on the lower face.
The metal wire 204 connects the first wire edge pad 2021 and the second wire edge pad 2031.
In one embodiment, the metal wires 204 are gold, and materials with high conductivity, such as silver, copper, etc., may be selected.
In one embodiment, the top surface of the printed wiring board is provided with a signal transmission metal layer that enables good interaction with external structures.
In one embodiment, a metal conductor post 2022 is disposed in the printed wiring board, and the metal conductor post 2022 connects the second lead edge pad 2031 and the signal transmission metal layer 2023.
As can be seen from comparing fig. 1 and fig. 7, the present invention realizes that the metal wire is shortened from the pattern of the metal wire 103 in fig. 1 to the pattern of the metal wire 204 in fig. 7, the shortened length is greatly influenced by the stepped groove 206, and the length of the metal wire is a critical parameter for signal transmission, for example, if the depth of the stepped groove 206 is 200 micrometers, the metal wire 204 can be shortened by at least 200 micrometers, which has a decisive influence on signal transmission.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A light device structure, comprising:
a housing;
the optical device and the printed circuit board are arranged on the shell, one end of the printed circuit board, facing the optical device, is in a step shape, the lower surface of the step shape faces the optical device, and the top surface of the optical device is lower than that of the printed circuit board; and
and the metal lead is connected with the optical device and the lower surface of the printed circuit board.
2. The optical device structure as claimed in claim 1, wherein a first lead edge pad is disposed on a lower surface of the printed wiring board, a second lead edge pad is disposed on a top end of the optical device, and the metal lead connects the first lead edge pad and the second lead edge pad.
3. The optical device structure of claim 2, wherein the printed wiring board comprises a first layer of printed wiring board material and a second layer of printed wiring board material, the second layer of printed wiring board material exposing a portion of the first layer of printed wiring board material such that an end of the printed wiring board is stepped.
4. The optical device structure of claim 3 wherein said first wire edge pad is disposed on said first layer of printed wiring board material, said second layer of printed wiring board material covering a portion of said first wire edge pad.
5. The optical device structure of claim 3, wherein the top surface of the printed wiring board is provided with a signal transmitting metal layer.
6. The optical device structure of claim 5, wherein a metal conductor post is disposed in the first layer of printed wiring board material, the metal conductor post connecting the first wire edge pad and the signal carrying metal layer.
7. A method for fabricating an optical device structure, comprising:
providing a first printed circuit board material layer (2025), wherein a first lead edge connecting pad (2021) is arranged on the first printed circuit board material layer;
providing a second printed circuit board material layer (2024) on the first printed circuit board material layer (2025) and covering the first lead edge pad, wherein a signal transmission metal layer (2023) is arranged on the second printed circuit board material layer;
processing the second printed circuit board material layer to form a hole-shaped structure (207) and expose the first lead edge connecting disc on the first printed circuit board material layer;
forming a conductive pillar in the hole-like structure;
processing the second printed circuit board material layer to expose part of the first lead edge connecting disc to form a printed circuit board with one stepped end;
providing a housing;
-placing said first layer of printed wiring board material (2025) on said housing;
arranging an optical device on the shell, wherein the stepped low surface faces the optical device; and
and arranging a metal wire to connect the optical device and the first wire edge connecting disc.
8. The method of fabricating an optical device structure according to claim 7, wherein the first wire edge pad has a spacer film (206) disposed thereon.
9. The method of fabricating a light device structure according to claim 7, wherein the step of forming the conductive pillars in the hole structures comprises an electrochemical plating process.
10. The method of fabricating the optical device structure according to claim 7, wherein after forming the conductive pillar in the hole structure; arranging an optical device on the housing, wherein the stepped lower surface faces the front of the optical device, and the optical device further comprises:
and etching the printed circuit board material layer to form a conductive line pattern layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010386106.5A CN111443440A (en) | 2020-05-09 | 2020-05-09 | Optical device structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010386106.5A CN111443440A (en) | 2020-05-09 | 2020-05-09 | Optical device structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111443440A true CN111443440A (en) | 2020-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010386106.5A Pending CN111443440A (en) | 2020-05-09 | 2020-05-09 | Optical device structure and manufacturing method thereof |
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| CN (1) | CN111443440A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113359248A (en) * | 2021-06-02 | 2021-09-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113534366A (en) * | 2021-08-13 | 2021-10-22 | 亨通洛克利科技有限公司 | High-density CPO silicon optical engine |
-
2020
- 2020-05-09 CN CN202010386106.5A patent/CN111443440A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113359248A (en) * | 2021-06-02 | 2021-09-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113534366A (en) * | 2021-08-13 | 2021-10-22 | 亨通洛克利科技有限公司 | High-density CPO silicon optical engine |
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