CN113131109A - W-band E-surface waveguide dual-passband filter - Google Patents
W-band E-surface waveguide dual-passband filter Download PDFInfo
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- H01P1/20—Frequency-selective devices, e.g. filters
Abstract
The invention relates to the field of filters, in particular to a W-band E-surface waveguide dual-passband filter which comprises a lower cavity and an upper cavity, wherein the upper part of the lower cavity is connected with the lower part of the upper cavity, the upper surface of the lower cavity is provided with a groove, a medium substrate is arranged in the groove, the medium substrate sequentially comprises a lower grounding layer, a medium and a metal foil layer from bottom to top, and the metal foil layer is provided with a miniaturized linear type resonance unit, a uniform impedance resonance unit and an upper grounding layer. The invention has the advantages that the dielectric substrate provided with the miniaturized linear type resonance unit and the uniform impedance resonance unit is arranged in the lower cavity and the upper cavity, so that the size and the design complexity of the filter can be reduced. The W-band multi-channel system has the advantages of simple structure, simple design, excellent performance and good design freedom, can achieve the design purpose by reasonably adjusting the size of each parameter according to different application requirements, and can be widely applied to various fields of W-band multi-channel systems.
Description
Technical Field
The invention relates to the field of filters, in particular to a W-band E-surface waveguide dual-passband filter.
Background
In recent years, with the rapid development of military and civil wireless communication technology, the spectrum resources have become more and more intense, and the military and civil wireless system capable of being compatible with a plurality of communication standards and integrating a plurality of functions has received the focus of attention and research of researchers. Millimeter waves, particularly W-band electromagnetic waves, have been widely used in systems such as communication, imaging, radar and guidance, electronic countermeasure, remote sensing and the like due to the characteristics of abundant spectrum resources, short wavelength, narrow beam and the like. The millimeter wave filter plays an important role as a frequency selecting device in millimeter wave system applications, and its main function is to select and filter signal frequencies, even if the desired signal frequency is effectively transmitted in the channel, and the undesired signal frequency is effectively attenuated or suppressed in the channel, so as to avoid causing interference to the desired signal frequency. With the development and application of millimeter wave military radar systems in electronic countermeasure technology, emerging millimeter wave military radar systems have been developed from simple single-channel systems to dual-channel systems; the most direct means is that a dual-band device is adopted from the radio frequency front end to the terminal, but the design period, the volume, the complexity, the cost and the like of the whole system are greatly improved inevitably. In order to solve the problem, researchers adopt a dual-passband filter to perform frequency selection processing on the front end, so that the function of multiple channels of the front end is ensured, and the requirements on multiple passbands of other devices of the front end, such as an amplifier, an antenna, a power divider and the like, are reduced. Therefore, millimeter wave dual-band filters are continuously gaining the focus of research and attention of researchers as key components of multi-channel radar systems.
With the rapid development of modern military and civil radar systems, greater challenges and more severe requirements are provided for factors such as the performance, the size, the cost and the like of a millimeter wave multi-passband filter. The waveguide multi-passband filter is widely applied to research of the W-band multi-passband filter due to the advantages of high Q value, low loss, large power capacity and the like. However, the traditional waveguide filter has the defects of large volume, heavy weight and the like; to overcome these drawbacks, in 2016, a W-band multi-passband E-plane waveguide filter based on multi-path coupling was proposed. The filter is a typical multipath coupled E-plane waveguide filter, and although the function of a multi-pass band is realized, the selectivity between channels is poor, and the filter is large in size, high in loss and poor in reflection coefficient. The large size, high loss and poor selectivity are the common problems of the traditional W-band E-surface waveguide dual-band filter. However, with the rapid development of wireless communication technology, after the requirements of space systems such as modern satellite communication and weaponry on the volume and weight of the waveguide multi-passband filter are more severe, the E-surface metal film waveguide dual-passband filter based on multipath coupling cannot completely meet the requirements of the existing satellite communication and weaponry. In a modern W-band multi-band communication system, a W-band E-surface waveguide dual-band filter which is simple in structure, small in size, high in selectivity and easy to process is urgently required.
Disclosure of Invention
The invention aims to solve the technical problems that the existing W-band dual-passband filter has the defects of large volume, complex design, large loss and poor selectivity, and provides a W-band E-surface waveguide dual-passband filter which is small in volume, simple in structure, flexible in design, small in loss and good in selectivity.
The invention relates to a W-band E-surface waveguide dual-passband filter which comprises a lower cavity and an upper cavity, wherein the upper part of the lower cavity is connected with the lower part of the upper cavity, a groove is formed in the upper surface of the lower cavity, a dielectric substrate is arranged in the groove, a metal foil layer is arranged on the upper part of the dielectric substrate, a lower grounding layer is arranged on the lower part of the dielectric substrate, the metal foil layer is provided with a miniaturized linear type resonance unit, an upper grounding layer and a uniform impedance resonance unit, and the lower grounding layer is connected with the upper grounding layer through the lower cavity and the upper cavity.
Further, the miniaturized linear type resonance unit is provided with five transverse rectangular metal foil strips and three longitudinal rectangular metal foil strips, the five transverse rectangular metal foil strips are respectively a first transverse rectangular metal foil strip, a second transverse rectangular metal foil strip, a third transverse rectangular metal foil strip, a fourth transverse rectangular metal foil strip and a fifth transverse rectangular metal foil strip, the three longitudinal rectangular metal foil strips are respectively a first longitudinal rectangular metal foil strip, a second longitudinal rectangular metal foil strip and a third longitudinal rectangular metal foil strip, the first longitudinal rectangular metal foil strip and the third longitudinal rectangular metal foil strip are respectively connected with two ends of the third transverse rectangular metal foil strip, the second longitudinal rectangular metal foil strip is respectively connected with the first transverse rectangular metal foil strip, the second transverse rectangular metal foil strip, the third transverse rectangular metal foil strip, the fourth transverse rectangular metal foil strip and the fifth transverse rectangular metal foil strip, and the first transverse rectangular metal foil strip and the fifth transverse rectangular metal foil strip are longitudinally paired with the third transverse rectangular metal foil strip The scale is that the second transverse rectangular metal foil strip and the fourth transverse rectangular metal foil strip are longitudinally symmetrical with respect to the third transverse rectangular metal foil strip, and the first longitudinal rectangular metal foil strip and the third longitudinal rectangular metal foil strip are transversely symmetrical with respect to the second longitudinal rectangular metal foil strip.
Further, the uniform impedance resonance unit has a first rectangular metal foil strip and a second rectangular metal foil strip which are longitudinal.
Further, the upper ground layer has a first upper ground layer and a second upper ground layer in the lateral direction, the miniaturized linear resonant unit and the uniform impedance resonant unit are located between the first upper ground layer and the second upper ground layer, and the first upper ground layer and the second upper ground layer are laterally symmetrical with respect to the third lateral rectangular metal foil strip.
Furthermore, the miniaturized linear type resonance unit is located between the first rectangular metal foil strip and the second rectangular metal foil strip of the uniform impedance resonance unit, and the first rectangular metal foil strip and the second rectangular metal foil strip of the uniform impedance resonance unit are longitudinally symmetrical relative to the second longitudinal rectangular metal foil strip.
Furthermore, the lower grounding layer is provided with a first lower grounding layer and a second lower grounding layer which are transverse, and the first lower grounding layer and the second lower grounding layer are respectively positioned at two sides in the groove.
Further, the groove has a first groove and a second groove.
Furthermore, a lower air cavity is formed in the upper surface of the lower cavity, an upper air cavity is correspondingly formed in the lower surface of the upper cavity, and the lower air cavity is communicated with the groove.
Furthermore, the dielectric substrate is inserted into a groove formed in the lower cavity and forms a W-band E-surface waveguide dual-band filter together with the upper cavity, the structural center of the W-band E-surface waveguide dual-band filter is an original point, the short edge of the dielectric substrate is an x-axis, the long edge of the dielectric substrate is a y-axis, a z-axis is determined according to a right-hand rule, the structure of the W-band E-surface waveguide dual-band filter is symmetrical about the y-axis, the dielectric substrate is symmetrical left and right about the x-axis and symmetrical up and down about the y-axis, the miniaturized linear resonant unit is symmetrical left and right about the x-axis and symmetrical up and down about the y-axis, and the uniform impedance resonant unit is symmetrical.
The invention has the advantages that the dielectric substrate provided with the miniaturized linear type resonance unit and the uniform impedance resonance unit is arranged in the lower cavity and the upper cavity, so that the volume of the W-waveband E-surface waveguide dual-band filter can be reduced, the design complexity and the loss of the W-waveband E-surface waveguide dual-band filter can be reduced, and the selectivity of the W-waveband E-surface waveguide dual-band filter can be improved. The invention has simple structure, simple and flexible design and excellent performance, has good design freedom, can achieve the design purpose by reasonably adjusting the parameter sizes of the miniaturized linear type resonance unit and the uniform impedance resonance unit according to the requirements of different applications, and can be widely applied to various fields of W-band multi-channel communication systems.
Drawings
FIG. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of a metal foil layer structure of the present invention;
FIG. 3 is a schematic view of a lower sub-layer configuration of the present invention;
FIG. 4 is a schematic view of the lower chamber structure of the present invention;
FIG. 5 is a schematic view of the upper chamber structure of the present invention;
FIG. 6 is a schematic structural view of the upper and lower chambers of the present invention after combination;
FIG. 7 is a simulation model of the present invention in an electromagnetic simulation software HFSS;
fig. 8 is a schematic diagram of the variation of the transmission coefficient (S21) with the Frequency (Frequency) of the first rectangular metal foil strip and the second rectangular metal foil strip of the uniform impedance resonance unit in different lengths after the miniaturized linear resonance unit is removed;
FIG. 9 is a schematic diagram of the variation of transmission coefficients (S11 and S21) with Frequency (Frequency) after removing the uniform impedance resonance unit according to the present invention;
fig. 10 is a schematic diagram of the variation of the transmission coefficient (S21) with the Frequency (Frequency) of the first transverse rectangular metal foil strip and the third transverse rectangular metal foil strip of the miniaturized linear type resonance unit in different lengths after the uniform impedance resonance unit is removed;
FIG. 11 is the final simulation result of the invention using HFSS electromagnetic simulation software.
In the figure, 1, a metal foil layer 2, a dielectric substrate 3, a lower ground layer 31, a first lower ground layer 32, a second lower ground layer 4, a lower cavity 41, a screw hole 42, a screw hole 43, a screw hole 44, a screw hole 45, a first groove 46, a second groove 47, a pin hole 48, a pin hole 49, a lower air cavity 410, a first empty hole 411, a first pin hole 412, a second pin hole 5, an upper cavity 51, a screw hole 52, a screw hole 53, a screw hole 54, a screw hole 55, a pin hole 56, a pin hole 57, a lower air cavity 58, a second empty hole 59, a third pin hole 510, a fourth pin hole 7, a miniaturized linear resonant unit 71, a first transverse rectangular metal foil strip 72, a second transverse rectangular metal foil strip 73, a third transverse rectangular metal foil strip 74, a fourth transverse rectangular metal foil strip 75, a third transverse rectangular metal foil strip, Fifth horizontal rectangular metal foil strip 76, first vertical rectangular metal foil strip 77, second vertical rectangular metal foil strip 78, third vertical rectangular metal foil strip 8, upper ground layer 81, first upper ground layer 82, second upper ground layer 9, uniform impedance resonance unit 91, first rectangular metal foil strip 92, second rectangular metal foil strip.
Detailed Description
As shown in fig. 1 to 7, a W-band E-plane waveguide dual-passband filter includes a lower cavity 4 and an upper cavity 5, an upper portion of the lower cavity 4 is connected to a lower portion of the upper cavity 5, a groove is formed in an upper surface of the lower cavity 4, a dielectric substrate 2 is disposed in the groove, a metal foil layer 1 is disposed on an upper portion of the dielectric substrate 2, a lower ground layer 3 is disposed on a lower portion of the dielectric substrate 2, the metal foil layer 1 includes a miniaturized linear resonant unit 7, an upper ground layer 8 and a uniform impedance resonant unit 9, and the lower ground layer 3 is connected to the upper ground layer 8 through the lower cavity 4 and the upper cavity 5. The dielectric substrate 2 is a Rogers5880 substrate having a thickness of 0.127 mm. The dielectric substrate 2 is inserted into a groove formed in the lower cavity 4 and forms a W-band E-surface waveguide dual-band filter together with the upper cavity 5; the center of the W-band E-plane waveguide dual-passband filter structure is an origin, the short side of the dielectric substrate 2 is an x-axis, the long side of the dielectric substrate 2 is a y-axis, a z-axis is determined according to a right-hand rule, the W-band E-plane waveguide dual-passband filter structure is symmetrical about the y-axis, the dielectric substrate 2 is symmetrical left and right about the x-axis and symmetrical up and down about the y-axis, the miniaturized linear resonant unit 7 is symmetrical left and right about the x-axis and symmetrical up and down about the y-axis, and the uniform impedance resonant unit 9 is symmetrical left and right about the x. The structure arranges the medium substrate 2 provided with the miniaturized linear type resonance unit 7 and the uniform impedance resonance unit 9 in the lower cavity 4 and the upper cavity 5, so that the volume of the W-band E-surface waveguide dual-band filter can be reduced, the design complexity and the loss of the W-band E-surface waveguide dual-band filter can be reduced, and the selectivity of the W-band E-surface waveguide dual-band filter can be improved. The lower cavity 4 and the upper cavity 5 provided with the uniform impedance resonance unit 9 form a metal shielding box of the waveguide filter, and play a role of a low-pass filter. The design method has the advantages of simple structure, simple and flexible design, excellent performance and good design freedom, can achieve the design purpose by reasonably adjusting the parameter sizes of the miniaturized linear type resonance unit and the uniform impedance resonance unit according to different application requirements, and can be widely applied to various fields of W-band multi-channel communication systems. The lower cavity 4 and the upper cavity 5 are made of copper, and the surfaces of the lower cavity and the upper cavity are plated with gold.
The miniaturized linear type resonance unit 7 is provided with five transverse rectangular metal foil strips and three longitudinal rectangular metal foil strips, wherein the five transverse rectangular metal foil strips are respectively a first transverse rectangular metal foil strip 71, a second transverse rectangular metal foil strip 72, a third transverse rectangular metal foil strip 73, a fourth transverse rectangular metal foil strip 74 and a fifth transverse rectangular metal foil strip 75, the three longitudinal rectangular metal foil strips are respectively a first longitudinal rectangular metal foil strip 76, a second longitudinal rectangular metal foil strip 77 and a third longitudinal rectangular metal foil strip 78, the first longitudinal rectangular metal foil strip 76 and the third longitudinal rectangular metal foil strip 78 are respectively connected with two ends of the third transverse rectangular metal foil strip 73, the second longitudinal rectangular metal foil strip 77 is respectively connected with the first transverse rectangular metal foil strip 71, the second transverse rectangular metal foil strip 72, the third transverse rectangular metal foil strip 73, the fourth transverse rectangular metal foil strip 74 and the fifth transverse rectangular metal foil strip 75, the first horizontal rectangular metal foil strip 71 and the fifth horizontal rectangular metal foil strip 75 are longitudinally symmetrical with respect to the third horizontal rectangular metal foil strip 73, the second horizontal rectangular metal foil strip 72 and the fourth horizontal rectangular metal foil strip 74 are longitudinally symmetrical with respect to the third horizontal rectangular metal foil strip 73, and the first vertical rectangular metal foil strip 76 and the third vertical rectangular metal foil strip 78 are transversely symmetrical with respect to the second vertical rectangular metal foil strip 77. The first transverse rectangular metal foil strip 71 and the fifth transverse rectangular metal foil strip 75 of the miniaturized linear type resonance unit 7 are 0.96mm in length along the x axis, 0.1mm in width along the y axis and 0.017mm in thickness along the z axis; the first transverse rectangular metal foil strip 71, the fifth transverse rectangular metal foil strip 75 and the third transverse rectangular metal foil strip 73 are spaced by 0.3mm along the x-axis; the second 72 and fourth 74 transverse rectangular metal foil strips are 1.2mm long along the x-axis, 0.1mm wide along the y-axis, and 0.017mm thick along the z-axis; the distance between the second transverse rectangular metal foil strip 72, the fourth transverse rectangular metal foil strip 74 and the third transverse rectangular metal foil strip 73 along the x axis is 0.1 mm; the third transverse rectangular metal foil strip 73 has a length along the x-axis of 1.4mm, a width along the y-axis of 0.1mm, and a thickness along the z-axis of 0.017 mm; the first longitudinal rectangular metal foil strip 76 and the third longitudinal rectangular metal foil strip 78 are 1mm in length, 0.1mm in width, and 0.017mm in thickness along the z-axis; the length of the second longitudinal rectangular metal foil strip 77 is 0.94mm, the width is 0.1mm, and the thickness along the z-axis is 0.017 mm; the distance between the miniaturized linear type resonance unit 7 and the upper grounding layer 8 is 0.135mm along the x axis and 0.5mm along the y axis; after the uniform impedance resonance unit 9 is removed, the dielectric substrate 2 is placed in the lower cavity 4 and the upper cavity 5, the variation of the transmission coefficients (S11 and S21) along with the Frequency (Frequency) in the simulation software HFSS is shown in FIG. 9, and the simulation result shows that after the dielectric substrate 2 with the uniform impedance resonance unit 9 removed is placed in the lower cavity 4 and the upper cavity 5, a first pass band can be generated in the full band (75-110GHz) of the W waveband and two transmission zeros can be generated in the upper stop band difference of the pass band; the lengths and the widths of the first transverse rectangular metal foil strip 71, the second transverse rectangular metal foil strip 72, the third transverse rectangular metal foil strip 73, the fourth transverse rectangular metal foil strip 74, the fifth transverse rectangular metal foil strip 75, the first longitudinal rectangular metal foil strip 76, the second longitudinal rectangular metal foil strip 77 and the third longitudinal rectangular metal foil strip 78 of the miniaturized linear type resonance unit 7 can be changed, so that the resonance frequencies of two transmission zeros of the stop band on the first pass band can be changed, wherein the length of the first 71 and fifth 75 transverse rectangular metal foil strips along the x-axis is varied, the variation of the transmission coefficient (S21) with Frequency (Frequency) in the HFSS is shown in fig. 10, and it can be seen from the simulation result that the lengths of the first transverse rectangular metal foil strip 71 and the fifth transverse rectangular metal foil strip 75 along the x-axis are longer, and the bandwidth of the first pass band is narrower, i.e. the resonant frequencies of the two transmission zeros of the stop band on the first pass band are shifted to lower frequencies. As can be easily seen from fig. 9 and 10, the miniaturized linear resonant unit proposed by the present invention is not only simple and compact in structure, but also low in processing difficulty and very flexible in design.
The uniform impedance resonance unit 9 has a first rectangular metal foil strip 91 and a second rectangular metal foil strip 92 in the longitudinal direction; a first rectangular metal foil strip 91 and a second rectangular metal foil strip 92 were printed on a Rogers5880 substrate having a thickness of 0.127mm, a thickness of 0.017mm, a length along the x-axis of 1mm, and a width along the y-axis of 0.2 mm. After the miniaturized linear resonant unit 7 is removed, the dielectric substrate 2 is placed in the lower cavity 4 and the upper cavity 5, and the length of the first rectangular metal foil strip 91 and the second rectangular metal foil strip 92 along the x axis is changed, so that the change of the transmission coefficient (S21) in the simulation software HFSS along with the Frequency (Frequency) is shown in FIG. 8; from the simulation results, the dielectric substrate 2 without the miniaturized linear resonant unit 7 is arranged in the lower cavity 4 and the upper cavity 5, and then the effect of a low-pass filter is achieved in the frequency range of W wave band (75-110 GHz); the lengths of the first rectangular metal foil strip 91 and the second rectangular metal foil strip 92 along the x-axis become longer, and the two transmission zeros of the upper stop band move to the low frequency. In order to reduce the volume of a compact and high-selectivity W-band E-plane waveguide dual-passband filter, the uniform impedance resonance unit 9 provided by the invention is designed on two sides of the miniaturized linear resonance unit 7, the uniform impedance resonance unit 9 is bilaterally symmetrical about the second longitudinal rectangular metal foil strip 77 along the x axis, namely, the first rectangular metal foil strip 91 and the second rectangular metal foil strip 92 of the uniform impedance resonance unit 9 are longitudinally symmetrical about the second longitudinal rectangular metal foil strip 77. Therefore, the size of the W-band E-surface waveguide dual-band filter with compactness and high selectivity can be reduced from the design structure, the uniform impedance resonance unit 9 and the linear miniaturized multimode resonance unit 7 are mutually coupled, the coupling between the two resonance units can realize the generation of the second pass band of the W-band E-surface waveguide dual-band filter, and further the size of the W-band E-surface waveguide dual-band filter is favorably reduced.
The upper ground layer 8 has a first upper ground layer 81 and a second upper ground layer 82 which are transverse, the first upper ground layer 81 and the second upper ground layer 82 are both metal foil strips, the width along the x axis is 0.68mm, the length along the y axis is 3.2mm, and the thickness along the z axis is 0.017 mm. The miniaturized linear type resonance unit 7 and the uniform impedance resonance unit 9 are located between the first upper ground layer 81 and the second upper ground layer 82. The first upper ground layer 81 and the second upper ground layer 82 are vertically symmetrical about the third transverse rectangular metal foil strip 73 along the y-axis, which is designed to better ensure that the dielectric substrate 2 is in good contact with the upper cavity 5 through the ground layer 8.
The lower ground layer 3 has a first lower ground layer 31 and a second lower ground layer 32, which are laterally arranged, and the first lower ground layer 31 and the second lower ground layer 32 are respectively arranged at two sides of the groove. The first lower ground layer 31 and the second lower ground layer 32 may be both metal foil strips, and the first lower ground layer 31 and the second lower ground layer 32 are printed on the dielectric substrate 2; the first lower ground layer 31 and the second lower ground layer 32 have a width of 0.68mm along the x-axis, a length of 3.2mm along the y-axis, and a thickness of 0.017mm along the z-axis; the design can better ensure that the dielectric substrate 2 is in good contact with the lower cavity 4 through the lower grounding layer.
The grooves have a first groove 45 and a second groove 46. The first groove 45 and the second groove 46 have a width of 0.7mm along the x-axis, a length of 3.22mm along the y-axis, and a depth of 0.15mm along the z-axis; this arrangement enables the dielectric substrate 2 to be better fitted in the first recess 45 and the second recess 46. If the depth along the z-axis is too deep, the medium 2 is not fixed well and moves up and down in the groove; if the depth along the z-axis is too shallow, the upper cavity 5 and the lower cavity are caused to press the medium base 2 when being fixed, so that the medium base plate 2 is deformed, and the performance of the W-band E-plane waveguide dual-band filter is affected.
The upper surface of the lower cavity 4 is provided with a lower air cavity 49, the lower surface of the upper cavity 5 is correspondingly provided with an upper air cavity 57, and the lower air cavity 49 is communicated with the groove. The lower air chambers 49 and 57 have a width along the x-axis of 1.27mm, a length along the y-axis of 13mm, and a depth along the z-axis of 1.27 mm; the lower air cavity 49 and the lower air cavity 57 together form a standard W-band rectangular waveguide resonator, and the input and output ports are standard rectangular waveguide ports WR10(a is 1.27mm, and b is 2.54 mm).
And a plurality of connecting holes are respectively formed in the lower cavity 4 and the upper cavity 5, and connecting pieces are correspondingly arranged in the connecting holes. The connecting holes can be screw holes, pin holes and the like, and the connecting pieces can be screws, pins and the like. In the figures, reference numerals 41, 42, 43, 44, 51, 52, 53 and 54 are all screw holes, and screws are correspondingly arranged in the screw holes. 47. 48, 55) and 56 are pin holes, and pins are correspondingly arranged in the pin holes. The diameters of the pin holes are all 1.65mm, and the diameters of the screw holes are all 2 mm.
In order to facilitate the connection between the lower cavity 4 and the upper cavity 5 with other devices, the lower cavity 4 is respectively provided with a first pin hole 411, a second pin hole 412 and a first hollow hole 410, and the upper cavity 5 is respectively provided with a third pin hole 59, a fourth pin hole 510 and a second hollow hole 58. The diameters of the pin holes are all 1.65mm, and the diameters of the empty holes are all 3 mm.
The diameters of the pin holes are all 1.65mm, the diameters of the screw holes are all 2mm, and the diameters of the empty holes are all 3 mm.
The dielectric substrate 2 has a length of 2.67mm along the x-axis and a length of 3.2mm along the y-axis.
The length of the upper cavity 5 and the length of the lower cavity 4 along the x axis are both 19mm, the length of the upper cavity along the y axis are both 13mm, and the length of the lower cavity along the z axis are both 9.5 mm.
In order to achieve the compactness of the structure of the W-band E-plane waveguide dual-passband filter, the miniaturized linear resonant unit 7 is arranged between a first rectangular metal foil strip 91 and a second rectangular metal foil strip 92 in the longitudinal direction of the uniform impedance resonant unit 9; the distance between the miniaturized linear type resonance unit 7 and the first rectangular metal foil strip 91 and the distance between the miniaturized linear type resonance unit and the second rectangular metal foil strip 92 along the x axis are both 0.1 mm. The lengths of the first transverse rectangular metal foil strip 71 and the fifth transverse rectangular metal foil strip 75 of the miniaturized linear type resonance unit along the x axis are 0.96mm, the width along the y axis is 0.1mm, and the thickness along the z axis is 0.017 mm; the first transverse rectangular metal foil strip 71, the fifth transverse rectangular metal foil strip 75 and the third transverse rectangular metal foil strip 73 are spaced by 0.3mm along the x-axis; the second 72 and fourth 74 transverse rectangular metal foil strips are 1.2mm long along the x-axis, 0.1mm wide along the y-axis, and 0.017mm thick along the z-axis; the distance between the second transverse rectangular metal foil strip 72, the fourth transverse rectangular metal foil strip 74 and the third transverse rectangular metal foil strip 73 along the x axis is 0.1 mm; the third transverse rectangular metal foil strip 73 has a length along the x-axis of 1.4mm, a width along the y-axis of 0.1mm, and a thickness along the z-axis of 0.017 mm; the first longitudinal rectangular metal foil strip 76 and the third longitudinal rectangular metal foil strip 78 are 1mm in length, 0.1mm in width, and 0.017mm in thickness along the z-axis; the length of the second longitudinal rectangular metal foil strip 77 is 0.94mm, the width is 0.1mm, and the thickness along the z-axis is 0.017 mm; the distance of the miniaturized linear resonant unit 7 from the upper ground layer 8 is 0.135mm along the x-axis and 0.5mm along the y-axis.
The sizes are determined according to the design and machining precision design by combining the actual circuit application theory and the simulation result, so that the design accuracy is ensured, and the feasibility of actual machining is also ensured.
The first groove 45 and the second groove 46 are each 0.72mm long along the x-axis, 13mm long along the y-axis, and 0.15mm deep along the z-axis.
The simulation result of the final W-band E-plane waveguide dual-passband filter in the simulation software HFSS is shown in fig. 11.
The invention has simple structure, simple and flexible design and excellent performance. The novel miniaturized linear type resonance unit and the uniform impedance resonance unit are used in the design of the W-waveband E-surface waveguide dual-band filter structure, so that the size of the W-waveband E-surface waveguide dual-band filter in practical application is reduced, the design complexity and the loss of the W-waveband E-surface waveguide dual-band filter are reduced, and the selectivity of the W-waveband E-surface waveguide dual-band filter is improved. The filter structure has good design freedom, and can achieve the design purpose by reasonably adjusting the parameter sizes of the miniaturized linear type resonance unit and the uniform impedance resonance unit according to different application requirements, so that the filter structure is easily popularized to the application of a W-band multichannel system.
Claims (9)
- W wave band E face waveguide dual passband filter, its characterized in that: including cavity (4) and last cavity (5) down, the upper portion of lower cavity (4) and the sub-unit connection of last cavity (5), the recess is seted up to the upper surface of lower cavity (4), set up medium base plate (2) in the recess, medium base plate (2) upper portion sets up metal foil layer (1), stratum (3) under medium base plate (2) lower part sets up, metal foil layer (1) have miniaturized linear type resonance unit (7), go up ground plane (8) and even impedance resonance unit (9), it is connected with last ground plane (8) through cavity (4) and last cavity (5) down to go up stratum (3).
- 2. The W-band E-plane waveguide dual bandpass filter of claim 1, wherein: the miniaturized linear type resonance unit (7) is provided with five transverse rectangular metal foil strips and three longitudinal rectangular metal foil strips, the five transverse rectangular metal foil strips are respectively a first transverse rectangular metal foil strip (71), a second transverse rectangular metal foil strip (72), a third transverse rectangular metal foil strip (73), a fourth transverse rectangular metal foil strip (74) and a fifth transverse rectangular metal foil strip (75), the three longitudinal rectangular metal foil strips are respectively a first longitudinal rectangular metal foil strip (76), a second longitudinal rectangular metal foil strip (77) and a third longitudinal rectangular metal foil strip (78), the first longitudinal rectangular metal foil strip (76) and the third longitudinal rectangular metal foil strip (78) are respectively connected with two ends of the third transverse rectangular metal foil strip (73), the second longitudinal rectangular metal foil strip (77) is respectively connected with the first transverse rectangular metal foil strip (71), the second transverse rectangular metal foil strip (72), The third transverse rectangular metal foil strip (73), the fourth transverse rectangular metal foil strip (74) and the fifth transverse rectangular metal foil strip (75) are connected, the first transverse rectangular metal foil strip (71) and the fifth transverse rectangular metal foil strip (75) are longitudinally symmetrical with respect to the third transverse rectangular metal foil strip (73), the second transverse rectangular metal foil strip (72) and the fourth transverse rectangular metal foil strip (74) are longitudinally symmetrical with respect to the third transverse rectangular metal foil strip (73), and the first longitudinal rectangular metal foil strip (76) and the third longitudinal rectangular metal foil strip (78) are transversely symmetrical with respect to the second longitudinal rectangular metal foil strip (77).
- 3. The W-band E-plane waveguide dual bandpass filter of claim 1, wherein: the uniform impedance resonance unit (9) is provided with a first rectangular metal foil strip (91) and a second rectangular metal foil strip (92) which are longitudinal.
- 4. The W-band E-plane waveguide dual bandpass filter of claim 1, wherein: the upper grounding layer (8) is provided with a first upper grounding layer (81) and a second upper grounding layer (82) which are transverse, the miniaturized linear type resonance unit (7) and the uniform impedance resonance unit (9) are positioned between the first upper grounding layer (81) and the second upper grounding layer (82), and the first upper grounding layer (81) and the second upper grounding layer (82) are symmetrical along the transverse direction relative to the third transverse rectangular metal foil strip (73).
- 5. The W-band E-plane waveguide dual bandpass filter of claim 1, wherein: the miniaturized linear type resonance unit (7) is located between the first rectangular metal foil strip (91) and the second rectangular metal foil strip (92), and the first rectangular metal foil strip (91) and the second rectangular metal foil strip (92) are longitudinally symmetrical with respect to the second longitudinal rectangular metal foil strip (77).
- 6. The W-band E-plane waveguide dual bandpass filter of claim 1, wherein: the lower grounding layer (3) is provided with a first transverse lower grounding layer (31) and a second transverse lower grounding layer (32), and the first lower grounding layer (31) and the second lower grounding layer (32) are respectively positioned on two sides in the groove.
- 7. The W-band E-plane waveguide dual bandpass filter of claim 1, wherein: the groove is provided with a first groove (45) and a second groove (46).
- 8. The W-band E-plane waveguide dual bandpass filter of claim 1, wherein: the upper surface of the lower cavity (4) is provided with a lower air cavity (49), the lower surface of the upper cavity (5) is correspondingly provided with an upper air cavity (57), and the lower air cavity (49) is communicated with the groove.
- 9. The W-band E-plane waveguide dual bandpass filter of any one of claims 1-8, wherein: the dielectric substrate (2) is inserted into a groove formed in the lower cavity (4) and forms a W-band E-surface waveguide dual-band filter together with the upper cavity (5). The center of the W-band E-plane waveguide dual-passband filter structure is an origin, the short side of the dielectric substrate 2 is an x-axis, the long side of the dielectric substrate (2) is a y-axis, a z-axis is determined according to a right-hand rule, the W-band E-plane waveguide dual-passband filter structure is symmetrical about the y-axis, the dielectric substrate (2) is symmetrical left and right about the x-axis and is symmetrical up and down about the y-axis, the miniaturized linear resonant unit (7) is symmetrical left and right about the x-axis and is symmetrical up and down about the y-axis, and the uniform impedance resonant unit (9) is symmetrical left and right about.
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