CN113130696B - 基于量子限制斯塔克效应的光开关 - Google Patents
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Abstract
一种基于量子限制斯塔克效应的光开关,其特征在于,在石英衬底上刻蚀交叉指型电极,交叉电极之间沉积有序取向的II‑VI族半导体纳米片(NPLs)层,其中主要通过液‑液界面自组装,控制油酸/二甘醇(OA/DEG)溶液中油酸的比例,使得纳米片面朝下,两侧边缘分别朝向正负电极,从而增强量子限制斯塔克效应,实现光开关的高对比度。本发明是基于量子限制斯塔克效应的全光开关,设计原理清晰,结构简单,偏振无依赖,高开关比,实现高性能光开关。
Description
技术领域
本发明属于光电开关技术领域,尤其是一种基于量子限制斯塔克效应的光开关。
背景技术
信息互联网时代的飞速发展,对光通信技术的信息存储、传输速率、可靠性提出了更高的要求。光开关作为集成光学系统基本单元器件之一,在芯片内的信息互连、数据远距离传输、网络之间的光信号交换等领域发挥十分重要的作用。此外,光开关还是实现光子计算机和量子计算机的基石,它的性能往往决定了整个系统性能的上限。因此,实现具有高速率、低功耗、高对比度、小尺寸等特性的高性能光开关至关重要。目前,这些光开关大多采用电光控制的光开关,网络中的各个节点频繁的光/电和电/光转换,存在串话、高损耗、传输速率受限等缺点。实现全光开关,即光控开光,是实现全光信号处理技术,突破“电子瓶颈”的重要基本单元器件,在通讯网络中具有很大的价值应用。
随着工业生产对于器件集成度需求的提升,以普通三维材料为基础的器件已经难以达到应用要求,低维半导体器件的兴起将有望解决这个问题。许多低维半导体纳米材料由于特殊的空间结构,能级分布在特定波段发生显著的非线性光学变化,从而广泛应用于非线性光学领域。准零维量子点材料、准一维纳米线材料和二维纳米材料都存在一系列丰富的相关特性。其中,量子限制斯塔克效应的物理起源是在外电场的作用下,量子阱结构中电子-空穴之间的库仑力相互作用形成内建电场,在内外电场共同作用下,导致能带结构的畸变,吸收边移动等现象。基于量子限制斯塔克效应的量子点非线性光开关行为,具有皮秒量级的开关时间,并且不受输入光信号的偏振模式影响。但是基于量子点的全光开关,对于光的滤波效果不显著,光开关比不大,可靠性降低。
发明内容
本发明要解决的技术问题是现有量子点光开关的缺点和不足,提出了一种基于量子限制斯塔克效应的光开关。该光开关为纳米片,开关调制深度优于基于量子点的光开关的调制深度,且具有高开关比、偏振无依赖、结构简单等特性。
本发明的一种基于量子限制斯塔克效应的光开关的制备方法,其特征在于,具体包括如下步骤:
步骤1,在石英衬底上刻蚀交叉指型电极;
对石英衬底烘烤脱水,在石英衬底上涂光刻胶,用掩膜版挡住衬底进行曝光、显影,用高真空镀膜机镀镀多金属膜;清洗掉光刻胶得到周期性的电极结构,即交叉指型电极,交叉指型电极的两侧有金属线引出端,用于连接外部电压的正负极。
步骤2,在交叉电极之间沉积有序取向的II-VI族半导体纳米片(NPLs)层,所述II-VI族半导体纳米片为CdSe/CdS纳米片,且为核/壳异质结构的CdSe/CdS纳米片。
进一步的,步骤2中核/壳异质结构的CdSe/CdS纳米片的制备过过程如下:
步骤2.1,CdSe核纳米片的制备;
Se前驱体的制备:粉和十八烯加入玻璃瓶中;用聚四氟乙烯塞封口密封,超声后得到Se粉悬浊液体。
Cd前驱体的制备:氧化镉、油酸和十八烯加入三口烧瓶;磁力搅拌的条件下,通入氩气进行鼓泡除气,升温至240℃,直至溶液从浑浊变成无色透明,再降温至60℃;将透明前驱体溶液转移至玻璃取样瓶中,用聚四氟乙烯塞封口密封,通入氩气除气。
S前驱体的制备:辛硫醇和十八烯加入玻璃取样瓶;用聚四氟乙烯塞封口密封,通入氩气除气,摇晃使充分混合。
将氧化镉、十四酸、十八烯加入三口烧瓶;磁力搅拌的条件下,通入氩气进行鼓泡除气,在110℃温度下除气30min;继续升温至285℃,直至溶液无色透明,再降温至90℃;注入Se前驱体溶液,再次除气;升温至195℃时,加入醋酸镉;继续升温至240℃,反应得到CdSe核纳米片;快速降至室温,当温度降至180℃时注入油酸;用正己烷-乙醇混合溶液离心提纯,最后将沉淀分散在正己烷中。
步骤2.2,CdSe/CdS核/壳纳米片的制备
取CdSe纳米片、Cd前驱体溶液和十八烯加入三口烧瓶;磁力搅拌的条件下,通入氩气鼓泡除气,室温除气40min;升温至80℃继续除气20min;在氩气保护下,设置300℃升温;温度升至180℃时,注入油胺。同时,硫前驱通过注射泵开始注入,速度为3mL h-1;前驱体注入完成后,保持在300℃退火10min;冷却至室温,在温度降至240℃时加入正己烷,降温至180℃时加入油酸;用甲醇进行原位提纯两次,去除溶液中过多的十八烯;加入正己烷-乙醇混合溶液离心提纯,将制备好的CdSe/CdS核/壳纳米片分散在正己烷中。
进一步的,步骤2中在交叉电极之间沉积有序取向的II-VI族半导体纳米片(NPLs)层,具体为:
1)在聚四氟乙烯井内放置上交叉电极作为基板;
2)将油酸/二甘醇(OA/DEG)溶液加入井中,然后加入CdSe/CdS核/壳纳米片正己烷溶液;
3)用玻璃培养皿覆盖聚四氟乙烯井以减慢正己烷蒸发的速度;
4)己烷溶剂完全蒸发后,缓慢排出二甘醇DEG,使自组装膜沉积在基质上,纳米片面朝下,两侧边缘分别朝向正负电极。
有益效果:基于量子限制斯塔克效应,通过控制CdSe/CdS核/壳纳米片有序取向,实现高性能的全光开关。胶体半导体纳米片具有与量子阱类似的电子结构,且其光学性能可以在核/壳异质结构中进一步提升。控制纳米片有序取向,让纳米片面朝下,其中两侧边缘分别朝向正负电极,在外电场的作用下,荧光光谱相较于量子点的光谱移动红移的更多,此时对于输入光信号的自然展宽,在实现“关”这个功能下,透过率大大降低,从而实现了高对比度的光开关。本发明是基于量子限制斯塔克效应的全光开关,设计原理清晰,结构简单,偏振无依赖,高开关比,对于低维材料的非线性光学特性在光学元器件,光通信领域具有重要意义。
附图说明
图1为本发明的器件电极结构图。
图2为聚四氟乙烯井图。
其中1、交叉指型电极;2、CdSe/CdS纳米片;3、聚四氟乙烯井中。
具体实施方式
本发明的一种基于量子限制斯塔克效应的光开关的制备方法,具体包括如下步骤:
步骤1,在石英衬底上刻蚀交叉指型电极1,电极间距在几个微米量级;具体为:
对石英衬底以150~200℃烘烤的温度脱水烘烤,在石英衬底上涂一层负性su8光刻胶,厚度约为2μm;软烤,去除光刻胶中的大部分溶剂并使胶的曝光特性固定,软烤温度是90~100℃,时间为10min;用掩膜版挡住衬底进行曝光;曝光后烘烤,激活曝光后的光刻胶化学性能,温度为90℃,时间为5min;显影,浸泡在浓度为5%的NaOH溶液,通过控制浸泡时间控制显影程度;硬烤,在真空或干燥氮气的气氛中,以150~200℃烘烤,去除残余显影液和蒸馏水;用高真空镀膜机镀上一层厚度为2μm的Au;用丙酮等光刻胶清洗液浸泡已镀Au的石英片,去除su-8及其上面的Au得到周期性的电极结构,即交叉指型电极1,交叉指型电极1的两侧有金属线引出端,用于连接外部电压的正负极,如图1所示。
步骤2,在交叉电极之间沉积有序取向的II-VI族半导体纳米片(NPLs)层,所述II-VI族半导体纳米片为CdSe/CdS纳米片2,且为核/壳异质结构,具体为包括如下步骤:
步骤2.1,CdSe核纳米片(4MLs)的制备
Se前驱体的制备:180mg Se粉和15mL十八烯加入20mL玻璃瓶;用聚四氟乙烯塞封口密封,超声30min,得到Se粉悬浊液体。
Cd前驱体的制备:0.51364g氧化镉、2.51g油酸和40mL十八烯加入100mL三口烧瓶;磁力搅拌的条件下,通入氩气进行鼓泡除气,在80℃温度下除气30min;升温至240℃,直至溶液从浑浊变成无色透明,再降温至60℃;将透明前驱体溶液转移至40mL的玻璃取样瓶中,用聚四氟乙烯塞封口密封,通入氩气除气10分钟。
S前驱体的制备:252μL辛硫醇和36mL十八烯加入40mL的玻璃取样瓶;用聚四氟乙烯塞封口密封,通入氩气除气10min;摇晃10min使充分混合。
将70mg氧化镉、340mg十四酸、28mL十八烯加入100mL三口烧瓶;磁力搅拌的条件下,通入氩气进行鼓泡除气,在110℃温度下除气30min;继续升温至285℃,直至溶液无色透明,再降温至90℃;注入2mL的Se前驱体溶液,再次除气;升温至195℃时,加入160mg醋酸镉;继续升温至240℃,反应10min,得到CdSe核纳米片;快速降至室温,当温度降至180℃时注入1mL油酸;将原溶液分成两管,用20mL正己烷-乙醇混合溶液(3:1)离心提纯,最后将制成的CdSe核纳米片分散在正己烷中。
步骤2.2,CdSe/CdS核/壳纳米片的制备
取上述一半CdSe纳米片、2.15mLCd前驱体溶液和3mL十八烯加入50mL三口烧瓶;磁力搅拌的条件下,通入氩气鼓泡除气,室温除气40min;升温至80℃继续除气20min;在氩气保护下,设置300℃升温;温度升至180℃时,注入1mL油胺。同时,硫前驱通过注射泵开始注入,速度为3mL h-1;前驱体注入完成后,保持在300℃退火10min;用湿毛巾冷却至室温,在温度降至240℃时加入5mL正己烷,降温至180℃时加入1mL油酸;用甲醇进行原位提纯两次,去除溶液中过多的十八烯;加入正己烷-乙醇混合溶液离心提纯,将制备好的CdSe/CdS核/壳纳米片分散在正己烷中,每个CdSe/CdS核/壳纳米片中含有4个单层的CdSe核纳米片(~1.4nm)。
步骤2.3交叉指型电极1放入聚四氟乙烯井3的方形槽内,加入CdSe/CdS核/壳纳米片正己烷溶液,通过液-液界面自组装控制纳米晶体取向。
在聚四氟乙烯井3中放置上述制备的交叉指型电极1作为基板,聚四氟乙烯井3为3mm×3mm大小的方形槽,井的底部有一个排水孔,如图2所示;将约2.4mL的油酸(4.2mM)/二甘醇(OA/DEG)溶液加入井中,然后从顶部加入上述制备的CdSe/CdS核/壳纳米片正己烷溶液;用玻璃培养皿覆盖聚四氟乙烯井3以减慢正己烷蒸发的速度;己烷溶剂完全蒸发后,缓慢排出二甘醇DEG,使自组装膜沉积在基质上,其中纳米片面朝下,两侧边缘分别朝向正负电极。
Claims (5)
1.一种基于量子限制斯塔克效应的光开关的制备方法,其特征在于,具体包括如下步骤:
步骤1,在石英衬底上刻蚀交叉指型电极;
步骤2,在交叉电极之间沉积有序取向的II-VI族半导体纳米片NPLs层,所述有序取向是指纳米片面朝下,其中两侧边缘分别朝向正负电极,所述II-VI族半导体纳米片为CdSe/CdS纳米片,且为核/壳异质结构的CdSe/CdS纳米片。
2.根据权利要求1所述一种基于量子限制斯塔克效应的光开关的制备方法,其特征在于,步骤1中在石英衬底上刻蚀交叉指型电极,具体过程为:
对石英衬底烘烤脱水,在石英衬底上涂光刻胶,用掩膜版挡住衬底进行曝光、显影,用高真空镀膜机镀金属膜;清洗掉光刻胶得到周期性的电极结构,即交叉指型电极,交叉指型电极的两侧有金属线引出端,用于连接外部电压的正负极。
3.根据权利要求1所述一种基于量子限制斯塔克效应的光开关的制备方法,其特征在于,步骤2中核/壳异质结构的CdSe/CdS纳米片的制备过程如下:
步骤2.1,CdSe核纳米片的制备;
Se前驱体的制备:Se粉和十八烯加入玻璃瓶中;用聚四氟乙烯塞封口密封,超声后得到Se粉悬浊液体;
Cd前驱体的制备:氧化镉、油酸和十八烯加入三口烧瓶;磁力搅拌的条件下,通入氩气进行鼓泡除气,升温至240℃,直至溶液从浑浊变成无色透明,再降温至60℃;将透明前驱体溶液转移至玻璃取样瓶中,用聚四氟乙烯塞封口密封,通入氩气除气;
S前驱体的制备:辛硫醇和十八烯加入玻璃取样瓶;用聚四氟乙烯塞封口密封,通入氩气除气,摇晃使充分混合;
将氧化镉、十四酸、十八烯加入三口烧瓶;磁力搅拌的条件下,通入氩气进行鼓泡除气,在110℃温度下除气30min; 继续升温至285℃,直至溶液无色透明,再降温至90℃;注入Se前驱体溶液,再次除气;升温至195℃时,加入醋酸镉;继续升温至240℃,反应得到CdSe核纳米片;快速降至室温,当温度降至180℃时注入油酸;用正己烷-乙醇混合溶液离心提纯,最后将沉淀分散在正己烷中;
步骤2.2,CdSe/CdS核/壳纳米片的制备
取CdSe纳米片、Cd前驱体溶液和十八烯加入三口烧瓶;磁力搅拌的条件下,通入氩气鼓泡除气,室温除气40 min;升温至80℃继续除气20 min;在氩气保护下,设置300℃升温;温度升至180℃时,注入油胺;同时,硫前驱通过注射泵开始注入,速度为3 mL h-1;前驱体注入完成后,保持在300℃退火10 min;冷却至室温,在温度降至240℃时加入正己烷,降温至180℃时加入油酸;用甲醇进行原位提纯两次,去除溶液中过多的十八烯;加入正己烷-乙醇混合溶液离心提纯,将制备好的CdSe/CdS核/壳纳米片分散在正己烷中。
4.根据权利要求1所述一种基于量子限制斯塔克效应的光开关的制备方法,其特征在于,步骤2中在交叉电极之间沉积有序取向的II-VI族半导体纳米片NPLs层,具体为:
1)在聚四氟乙烯井内放置上交叉电极作为基板;
2)将油酸/二甘醇(OA / DEG)溶液加入井中,然后加入CdSe/CdS核/壳纳米片正己烷溶液;
3)用玻璃培养皿覆盖聚四氟乙烯井以减慢正己烷蒸发的速度;
4)己烷溶剂完全蒸发后,缓慢排出二甘醇DEG,使自组装膜沉积在基质上,纳米片面朝下,两侧边缘分别朝向正负电极。
5.根据权利要求1所述一种基于量子限制斯塔克效应的光开关的制备方法,其特征在于,电极间距为几个微米量级。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN105487264A (zh) * | 2015-12-29 | 2016-04-13 | 东南大学 | 一种基于量子限制斯塔克效应的电光调制器件制备方法 |
CN110127631A (zh) * | 2019-04-26 | 2019-08-16 | 湖北大学 | 一种蓝光闪锌矿CdSe/CdS核冠结构纳米片的制备方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN105487264A (zh) * | 2015-12-29 | 2016-04-13 | 东南大学 | 一种基于量子限制斯塔克效应的电光调制器件制备方法 |
CN110127631A (zh) * | 2019-04-26 | 2019-08-16 | 湖北大学 | 一种蓝光闪锌矿CdSe/CdS核冠结构纳米片的制备方法 |
Non-Patent Citations (2)
Title |
---|
Electric-field-driven accumulation and alignment of CdSe and CdTe nanorods in nanoscale devices;Hu, ZH 等;《NANO LETTERS》;20061018;第6卷(第11期);全文 * |
Low-Threshold Amplified Spontaneous Emission and Lasing from Thick-Shell CdSe/CdS Core/Shell Nanoplatelets Enabled by High-Temperature Growth;Zhang, L 等;《ADVANCED OPTICAL MATERIALS》;20191219;全文 * |
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