CN113109693A - Power supply method for TO 56-TO 38 batch test in environment of-40 ℃ TO 85 DEG C - Google Patents
Power supply method for TO 56-TO 38 batch test in environment of-40 ℃ TO 85 DEG C Download PDFInfo
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- CN113109693A CN113109693A CN202110385723.8A CN202110385723A CN113109693A CN 113109693 A CN113109693 A CN 113109693A CN 202110385723 A CN202110385723 A CN 202110385723A CN 113109693 A CN113109693 A CN 113109693A
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- power supply
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- testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
Abstract
The invention discloses a power supply method for a TO 56-TO 38 batch test in an environment of-40 ℃ TO 85 ℃, which comprises the following steps: step one, equipment inspection; step two, inserting TO; step three, testing the daughter board; step four, replacement testing; testing at different temperatures; step six, completing the test; compared with the conventional power supply method for batch testing, the power supply system is separated from the testing system, the power supply system can work in a stable environment, the power supply system is not influenced by the temperature change of the oven, and stable current is provided for the testing system.
Description
Technical Field
The invention relates TO the technical field of chip testing, in particular TO a power supply method for TO56_ TO38 batch testing in an environment of-40 ℃ TO 85 ℃.
Background
In the DML laser, because there is no TEC TO stabilize the temperature of the LD chip, the light emitting characteristic of the LD chip changes with the temperature change, and the wavelength also changes with the wavelength change, in order TO meet specific requirements, the light emitting efficiency of the LD and the light emitting linear characteristic of the LD need TO be ensured in the operating range of the LD, and the power stability of the monitor diode and the change range of the wavelength must meet the application standards of the corresponding module level, so the LD needs TO be measured at high and low temperatures.
Disclosure of Invention
The invention aims TO provide a power supply method for a TO56_ TO38 batch test in an environment of-40 ℃ TO 85 ℃ so as TO solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a power supply method for a TO56_ TO38 batch test in an environment of-40 ℃ TO 85 ℃ comprises the following steps: step one, equipment inspection; step two, inserting TO; step three, testing the daughter board; step four, replacement testing; testing at different temperatures; step six, completing the test;
in the first step, the equipment inspection comprises the following steps:
1) the power supply system is connected with an external power supply to electrify the power supply motherboard;
2) starting all the devices and running software;
3) checking whether the equipment is in a normal working state;
4) analyzing and processing the abnormal state of the equipment to recover the equipment to be normal;
5) setting working parameters of equipment;
in the second step, the TO TO be tested is inserted into the socket on the daughter board;
in the third step, the daughter board is mounted on the motherboard, and power supply is started for TO;
wherein in the fourth step, the replacement test comprises the following steps:
1) performing a 64PCSTO test;
2) after the test is finished, opening the constant temperature box, and pulling out the daughter board on the mother board;
3) inserting another TO-mounted daughter board into a connector of the mother board for testing, and thus circularly replacing and testing;
in the fifth step, the temperature test comprises the following steps:
1) after the test of one temperature point is finished, setting the temperature of the constant temperature box as the next temperature point;
2) after the temperature of the constant temperature box is stable, testing at the current temperature;
in the sixth step, the test completion comprises the following steps:
1) after the test of all temperature points is finished, the constant temperature box is restored to normal temperature;
2) and taking out the tested product.
Preferably, in the step 1), the external power supply is 220V, the power supply system is disposed outside the oven, the power supply motherboard is disposed inside the oven, and the power supply motherboard is connected to the power supply system through a wire.
Preferably, in the step one 3), the normal working state includes stable power supply of the power supply system, stable temperature of the thermostat and normal running of the test software.
Preferably, in the second step, 64 sockets are arranged on the daughter board, and 64PCS TO can be supplied with power at one time.
Preferably, in the third step, the daughter board is plugged with the connector of the motherboard through a gold finger.
Preferably, in the step six 2), after the tested product is taken out, the equipment needs to be shut down, and the connection between the power supply system and the external power supply is disconnected.
Compared with the prior art, the invention has the beneficial effects that: compared with the conventional power supply method for batch testing, the power supply system and the test system are separated, the power supply system can work in a stable environment, the power supply system is not influenced by the temperature change of the oven, and stable current is provided for the test system.
Drawings
FIG. 1 is a flow chart of a method of the present invention;
fig. 2 is a block diagram of the device placement of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, an embodiment of the present invention is shown: a power supply method for a TO56_ TO38 batch test in an environment of-40 ℃ TO 85 ℃ comprises the following steps: step one, equipment inspection; step two, inserting TO; step three, testing the daughter board; step four, replacement testing; testing at different temperatures; step six, completing the test;
in the first step, the equipment inspection comprises the following steps:
1) the power supply system is connected with an external power supply to enable the power supply motherboard to be electrified, the external power supply is 220V, the power supply system is arranged outside the incubator, the power supply motherboard is arranged inside the incubator, and the power supply motherboard is connected with the power supply system through a wire;
2) starting all the devices and running software;
3) checking whether the equipment is in a normal working state, wherein the normal working state comprises stable power supply of a power supply system, stable temperature of a thermostat and normal running of test software;
4) analyzing and processing the abnormal state of the equipment to recover the equipment to be normal;
5) setting working parameters of equipment;
in the second step, the TO be tested is inserted into the sockets on the daughter board, 64 sockets are arranged on the daughter board, and 64PCS TO can be supplied with power at one time;
in the third step, the golden fingers of the daughter board are plugged with the connector of the motherboard TO supply power TO the TO;
wherein in the fourth step, the replacement test comprises the following steps:
1) performing a 64PCSTO test;
2) after the test is finished, opening the constant temperature box, and pulling out the daughter board on the mother board;
3) inserting another TO-mounted daughter board into a connector of the mother board for testing, and thus circularly replacing and testing;
in the fifth step, the temperature test comprises the following steps:
1) after the test of one temperature point is finished, setting the temperature of the constant temperature box as the next temperature point;
2) after the temperature of the constant temperature box is stable, testing at the current temperature;
in the sixth step, the test completion comprises the following steps:
1) after the test of all temperature points is finished, the constant temperature box is restored to normal temperature;
2) and taking out the tested product, closing the equipment, and disconnecting the power supply system from the external power supply.
Based on the above, the power supply system is arranged outside the incubator and separated from the power supply mother board when the power supply system is used, so that the power supply system is not influenced by temperature change of the oven, stable current is provided for the test system, the power supply mother board is provided with the sockets, the plug replacement test of a plurality of sub-modules is facilitated, each sub-board is provided with 64 sockets, 64PCS TO can be simultaneously supplied with power at one time, and batch test is realized.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A power supply method for a TO56_ TO38 batch test in an environment of-40 ℃ TO 85 ℃ comprises the following steps: step one, equipment inspection; step two, inserting TO; step three, testing the daughter board; step four, replacement testing; testing at different temperatures; step six, completing the test; the method is characterized in that:
in the first step, the equipment inspection comprises the following steps:
1) the power supply system is connected with an external power supply to electrify the power supply motherboard;
2) starting all the devices and running software;
3) checking whether the equipment is in a normal working state;
4) analyzing and processing the abnormal state of the equipment to recover the equipment to be normal;
5) setting working parameters of equipment;
in the second step, the TO TO be tested is inserted into the socket on the daughter board;
in the third step, the daughter board is mounted on the motherboard, and power supply is started for TO;
wherein in the fourth step, the replacement test comprises the following steps:
1) performing a 64PCSTO test;
2) after the test is finished, opening the constant temperature box, and pulling out the daughter board on the mother board;
3) inserting another TO-mounted daughter board into a connector of the mother board for testing, and thus circularly replacing and testing;
in the fifth step, the temperature test comprises the following steps:
1) after the test of one temperature point is finished, setting the temperature of the constant temperature box as the next temperature point;
2) after the temperature of the constant temperature box is stable, testing at the current temperature;
in the sixth step, the test completion comprises the following steps:
1) after the test of all temperature points is finished, the constant temperature box is restored to normal temperature;
2) and taking out the tested product.
2. The power supply method for the TO56_ TO38 batch test in the environment of-40 ℃ TO 85 ℃ as claimed in claim 1, wherein: in the step 1), an external power supply is 220V, a power supply system is arranged outside the incubator, a power supply motherboard is arranged inside the incubator, and the power supply motherboard is connected with the power supply system through a wire.
3. The power supply method for the TO56_ TO38 batch test in the environment of-40 ℃ TO 85 ℃ as claimed in claim 1, wherein: in the step one 3), the normal working state comprises stable power supply of a power supply system, stable temperature of the thermostat and normal running of test software.
4. The power supply method for the TO56_ TO38 batch test in the environment of-40 ℃ TO 85 ℃ as claimed in claim 1, wherein: in the second step, 64 sockets are arranged on the daughter board, and 64PCS TO can be supplied with power at one time.
5. The power supply method for the TO56_ TO38 batch test in the environment of-40 ℃ TO 85 ℃ as claimed in claim 1, wherein: and in the third step, the daughter board is spliced with the connector of the motherboard through the gold finger.
6. The power supply method for the TO56_ TO38 batch test in the environment of-40 ℃ TO 85 ℃ as claimed in claim 1, wherein: in the step six 2), after the tested product is taken out, the equipment needs to be closed, and the connection between the power supply system and the external power supply is disconnected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110385723.8A CN113109693A (en) | 2021-04-10 | 2021-04-10 | Power supply method for TO 56-TO 38 batch test in environment of-40 ℃ TO 85 DEG C |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110385723.8A CN113109693A (en) | 2021-04-10 | 2021-04-10 | Power supply method for TO 56-TO 38 batch test in environment of-40 ℃ TO 85 DEG C |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113109693A true CN113109693A (en) | 2021-07-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110385723.8A Pending CN113109693A (en) | 2021-04-10 | 2021-04-10 | Power supply method for TO 56-TO 38 batch test in environment of-40 ℃ TO 85 DEG C |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113109693A (en) |
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2021
- 2021-04-10 CN CN202110385723.8A patent/CN113109693A/en active Pending
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