CN111313963A - System and method for testing and screening high and low temperature performance of laser - Google Patents
System and method for testing and screening high and low temperature performance of laser Download PDFInfo
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- CN111313963A CN111313963A CN202010137987.7A CN202010137987A CN111313963A CN 111313963 A CN111313963 A CN 111313963A CN 202010137987 A CN202010137987 A CN 202010137987A CN 111313963 A CN111313963 A CN 111313963A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
- H04B10/073—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an out-of-service signal
- H04B10/0731—Testing or characterisation of optical devices, e.g. amplifiers
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C19/00—Electric signal transmission systems
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Abstract
The invention belongs to the technical field of optical communication, and particularly relates to a system and a method for testing and screening high and low temperature performance of a laser. Assembling and welding a laser module to be tested on an optical module, inserting the laser module to be tested into a connecting socket of an optical module test board through a golden finger, and placing the laser module to be tested into a high-low temperature box to simulate the temperature of a test environment for testing; the transmitting end of the optical module test board is connected with the transmitting end of the error code meter and is powered by a voltage-stabilized power supply; the laser module to be tested is respectively connected with the optical power meter and the wavelength meter through a shunt; the power and wavelength change conditions of the laser during normal temperature and high and low temperature work are respectively monitored in real time through the optical power meter and the wavelength meter, and the power consumption condition of the laser on a module is calculated through the real-time current change on the voltage-stabilized power supply. The invention has compatibility and expansibility, can test and screen the lasers in different environments and different packaging forms, and reduces the batch reject ratio of products.
Description
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to a system and a method for testing and screening high and low temperature performance of a laser.
Background
An optical module is a carrier for transmission between a switch and a device, and the core performance of the module is largely determined by the performance of the laser, as it were. The performance of the laser is tested completely or even excellent under the condition of normal temperature; however, when testing in a severe environment, the laser device has the problems of poor product performance, such as high-temperature wavelength shift, power consumption exceeding range at low temperature, power failure at high temperature, and the like. In practical production, the laser regeneration generally does not test the high and low temperature performance of the product for productivity reasons. In the existing high and low temperature performance test of the laser, most manufacturers directly perform simulation high and low temperature test during the laser test, which can be completed at high temperature, but the risk of short circuit of circuits and devices exposed due to the generation of condensed water vapor during the low temperature test can be met. If the laser is not subjected to high and low temperature small lot verification tests, a large number of bad chips can be produced. This causes a large area of defective products to appear, which adversely affects manufacturers.
The laser chips are produced according to batches, the performance of each batch of chips is different, the packaged devices can inherit or even amplify the difference, and if each batch of chips is subjected to a small batch of screening tests before production, the performance of the batch of chips can be mastered, so that the subsequent production is greatly facilitated.
Disclosure of Invention
In order to solve the existing problems, the invention provides a system and a method for testing and screening the high and low temperature performance of a laser, which can avoid a large number of bad chips in production by screening the high and low temperature performance of the laser in small batches.
In order to achieve the purpose, the invention adopts the technical scheme that:
a test screening system for high and low temperature performance of a laser comprises an error code meter, a power meter, a wavelength meter, a splitter, a laser module to be tested, an optical module test box, a high and low temperature box, a stabilized voltage power supply and a test computer.
The laser module to be tested comprises a laser to be tested and an optical module, the laser to be tested is assembled and welded on the optical module, and the laser module to be tested is inserted into a connecting socket of an optical module test box through a golden finger; the optical module test box is placed in a high-low temperature box, the high-low temperature box is used for simulating a test environment, the optical module test box is in communication connection with a computer through a USB, and the real-time temperature of the laser module to be tested is monitored at any time.
The transmitting end of the optical module test box is connected with the transmitting end of the error code meter; the stabilized voltage power supply supplies power to the optical module test box, is positioned outside the high-low temperature box and calculates the power consumption condition of the laser on the module through the real-time change of the current on the stabilized voltage power supply;
the transmitting end of the laser module to be tested is connected with the input end of the branching unit through an optical fiber jumper, one output end of the branching unit is connected with the port of the power meter through the optical fiber jumper, and the other output end of the branching unit is connected with the port of the wavelength meter through the optical fiber jumper; and respectively monitoring the power and wavelength change conditions of the laser to be detected in real time when the laser works in different temperature environments through the optical power meter and the wavelength meter.
A test screening method for high and low temperature performance of a laser adopts the test screening system, and comprises the following specific steps:
(1) and (3) normal temperature test: firstly, testing product data at normal temperature, observing the real temperature reported value of the laser to be tested on computer software in real time, and recording the wavelength of the wavemeter, the power value of the power meter and the current value of the stabilized voltage power supply after the reported temperature is stable.
(2) And (3) high-temperature testing: opening the high-low temperature box, setting the temperature in the box to be 60 ℃ for high-temperature test, and observing the real temperature report value of the laser to be tested on the computer software in real time; after the reported temperature is stable, recording the wavelength of the wavelength meter, the power value of the power meter and the current value of the voltage-stabilized power supply, and calculating the power consumption value according to the current value; setting the temperature value of the high-low temperature box to 65 ℃, and repeating the operation; and by analogy, the temperature of the high-temperature box and the low-temperature box is sequentially increased by taking 5 ℃ as a unit, and the operation is repeated after the temperature is stable each time until the wavelength, the power or the power consumption exceeds the range or the reported temperature of computer software exceeds 85 ℃, and the high-temperature test is stopped.
(3) And (3) low-temperature testing: opening the door of the high-low temperature box, observing the reported temperature of the computer software, closing the door of the high-low temperature box when the temperature is recovered to be below 30 ℃, and setting the temperature in the box to be-5 ℃ for low-temperature test; when the reported temperature of the computer software is stable, recording corresponding wavelength, power and current value; reducing the temperature of the high-low temperature box by taking 5 ℃ as a unit, and repeating the operation; and stopping the low-temperature test until the wavelength, the power or the power consumption exceeds the range or the reported temperature of the computer software exceeds-40 ℃.
Wherein, the wavelength range is the time frequency value of the normal temperature test +/-0.004 THz or the wavelength value of the normal temperature test +/-0.04 nm, the power range is the absolute value of the power difference value of the normal temperature test and the power range is not more than 1dB, and the power consumption range is not more than 2.2W.
Compared with the prior art, the invention has the following advantages:
(1) by adopting the invention, small batches of chips in each batch of chips are extracted for high-low temperature performance screening, large-scale defective products after batch production of the chips can be avoided, and the batch reject ratio of the products can be reduced;
(2) the invention has compatibility and expansibility, and can aim at the comparison of the performance and the power consumption of the same packaging form under different environments or the comparison of the performance and the power consumption of different packaging forms under the same environment. When the performance requirement proposed by the customer is higher, the performance can be ensured by simulating the test condition of the customer for screening by changing the ambient temperature of the high and low boxes.
(3) The risk that circuits and devices exposed outside have short circuits due to the generation of condensed water vapor is avoided by packaging the laser in the module, the limit temperature test can be carried out, the effect of real use of a customer is simulated, and the test method is real and reliable.
(4) In relatively extreme circumstances where a semiconductor Cooler (TEC) is chosen such that the lower the power consumption of the laser, the better, the test data recorded using the method of the present invention may provide a factual basis for comparing the choice of different brands of semiconductor coolers with the laser.
(5) The method is not limited by a clamp, different lasers can be replaced conveniently, the lasers in different packaging forms can be tested, and the comparison of the performance and the power consumption of the same packaging form in different environments or the comparison of the performance and the power consumption of different packaging forms in the same environment can be met.
Drawings
FIG. 1 is a schematic diagram of a test screening system for high and low temperature performance of a laser of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, a system for testing and screening high and low temperature performance of a laser includes an error code meter, a power meter, a wavemeter, a splitter, a laser module to be tested, an optical module testing box, a high and low temperature box, a regulated power supply, and a testing computer. The system is adopted to carry out high-temperature and low-temperature screening on the laser, and the specific process is as follows:
the first embodiment is as follows:
in the present embodiment, 10 lasers of the same batch of chips are selected, the screened test item is a high and low temperature industrial test, and the test system is shown in fig. 1. And respectively assembling 10 lasers to be tested in 10 optical modules, sequentially inserting the laser modules to be tested into the connecting sockets of the optical module test box through the golden fingers, and performing high-low temperature screening test. The method comprises the following specific steps: the transmitting end of the error code instrument is connected to the transmitting end of the optical module testing box, a stabilized voltage power supply is used for supplying power to the testing box, the testing box is placed in a high-low temperature box, and the high-low temperature box can simulate the temperature of a testing environment; an optical fiber jumper is led out from a transmitting end TX of an optical module and connected to an input end of an optical splitter, one output end of the splitter is connected with an optical power meter through the optical fiber jumper, and power tests under different environmental temperatures are carried out; and the other output end of the splitter is connected with a wavemeter through an optical fiber jumper to test the change of wavelength or frequency under different environmental temperatures. And recording the real-time current change of each temperature point through a voltage-stabilized power supply, thereby calculating the change of power consumption. After testing the normal temperature data, setting the temperature value of the high-low temperature box to be 60 ℃, sequentially increasing the temperature of the high-low temperature box to 85 ℃ by taking 5 ℃ as a unit, and repeating the operation; after the high-temperature test is finished, opening the door of the high-low temperature box, observing the reported temperature of the computer software, closing the door of the high-low temperature box when the temperature is recovered to be below 30 ℃, setting the temperature in the box to be minus 5 ℃ for low-temperature test, and sequentially reducing the temperature of the high-low temperature box to 40 ℃ by taking 5 ℃ as a unit, and repeating the operation; the specific test results are detailed in table 1 below (only some data are shown).
TABLE 1 high and low temperature performance test data of 10 lasers in the first embodiment
From the results in table 1, it can be seen that 10 test lasers meet the requirements of industrial level (-40 ℃ to 85 ℃), that is, the batch of laser chips can meet the requirements of industrial level according to the structure and the assembly method, and can be produced in batch.
Example two:
in this embodiment, 6 lasers of the same batch of chips are selected, the screened test items are high and low temperature industrial tests, the test system is shown in fig. 1, the 6 lasers are respectively assembled in 6 optical modules, and the laser modules to be tested are sequentially inserted into the connection sockets of the optical module test box through the gold fingers to perform the high and low temperature screening test. The method comprises the following specific steps: the transmitting end of the error code instrument is connected to the transmitting end of the module testing box, a stabilized voltage power supply is used for supplying power to the testing box, the connected testing box is placed into a high-low temperature box, and the high-low temperature box can simulate the temperature of a testing environment; an optical fiber jumper is led out from a transmitting end TX of an optical module and connected to an input end of an optical splitter, one output end of the splitter is connected with an optical power meter through the optical fiber jumper, and power tests under different environmental temperatures are carried out; and the other output end of the splitter is connected with a wavemeter through an optical fiber jumper to test the change of wavelength or frequency under different environmental temperatures. And recording the real-time current change of each temperature point through a voltage-stabilized power supply, thereby calculating the change of power consumption. The specific test results are detailed in table 2 below.
TABLE 2 high and low temperature performance test data of 6 lasers in example II
From the results in table 2, it can be seen that the 6 test lasers do not meet the requirements of the industrial grade. When the test temperature is 70 ℃, the wavelength of the laser to be tested deviates and exceeds the deviation range, so that the batch of lasers can not meet the production requirements under the simulated high-temperature environment, the batch of lasers can not be produced in batches, the hidden danger problem of a company which stops from the source as early as possible is solved, unnecessary waste is saved, and unnecessary loss of products with defective performance to customers is avoided.
Claims (2)
1. The high and low temperature performance test screening system of the laser is characterized by comprising an error code meter, a power meter, a wavelength meter, a shunt, a laser module to be tested, an optical module test box, a high and low temperature box, a stabilized voltage power supply and a test computer;
the laser module to be tested comprises a laser to be tested and an optical module, the laser to be tested is assembled and welded on the optical module, and the laser module to be tested is inserted into a connecting socket of an optical module test box through a golden finger; the optical module test box is placed in a high-low temperature box, the high-low temperature box is used for simulating a test environment, the optical module test box is in communication connection with a computer through a USB, and the real-time temperature of a laser module to be tested is monitored at any time;
the transmitting end of the optical module test box is connected with the transmitting end of the error code meter; the stabilized voltage power supply supplies power to the optical module test box, is positioned outside the high-low temperature box and calculates the power consumption condition of the laser on the module through the real-time change of the current on the stabilized voltage power supply;
the transmitting end of the laser module to be tested is connected with the input end of the branching unit through an optical fiber jumper, one output end of the branching unit is connected with the port of the power meter through the optical fiber jumper, and the other output end of the branching unit is connected with the port of the wavelength meter through the optical fiber jumper; and respectively monitoring the power and wavelength change conditions of the laser to be detected in real time when the laser works in different temperature environments through the optical power meter and the wavelength meter.
2. A test screening method for high and low temperature performance of a laser adopts the test screening system of claim 1, and is characterized by comprising the following specific steps:
(1) and (3) normal temperature test: firstly, testing product data at normal temperature, observing a real temperature reported value of a laser to be tested on computer software in real time, and recording the wavelength of a wavemeter, the power value of a power meter and the current value of a voltage-stabilized power supply after the reported temperature is stable;
(2) and (3) high-temperature testing: opening the high-low temperature box, setting the temperature in the box to be 60 ℃ for high-temperature test, and observing the real temperature report value of the laser to be tested on the computer software in real time; after the reported temperature is stable, recording the wavelength of the wavelength meter, the power value of the power meter and the current value of the voltage-stabilized power supply, and calculating the power consumption value according to the current value; setting the temperature value of the high-low temperature box to 65 ℃, and repeating the operation; in this way, the temperature of the high-temperature and low-temperature boxes is sequentially increased by taking 5 ℃ as a unit, and the operation is repeated after the temperature is stable each time until the wavelength, the power or the power consumption exceeds the range, or the reported temperature of computer software exceeds 85 ℃, and the high-temperature test is stopped;
(3) and (3) low-temperature testing: opening the door of the high-low temperature box, observing the reported temperature of the computer software, closing the door of the high-low temperature box when the temperature is recovered to be below 30 ℃, and setting the temperature in the box to be-5 ℃ for low-temperature test; when the reported temperature of the computer software is stable, recording corresponding wavelength, power and current value; reducing the temperature of the high-low temperature box by taking 5 ℃ as a unit, and repeating the operation; stopping low-temperature test until the wavelength, power or power consumption exceeds the range or the reported temperature of computer software exceeds-40 ℃;
wherein, the wavelength range is the time frequency value of the normal temperature test +/-0.004 THz or the wavelength value of the normal temperature test +/-0.04 nm, the power range is the absolute value of the power difference value of the normal temperature test and the power range is not more than 1dB, and the power consumption range is not more than 2.2W.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111722655A (en) * | 2020-08-04 | 2020-09-29 | 国家电网有限公司信息通信分公司 | Optical module debugging and testing system, optical module debugging and testing method and upper computer |
| CN112198599A (en) * | 2020-12-07 | 2021-01-08 | 武汉乾希科技有限公司 | Coupling method and apparatus for optical communication device |
| CN112284688A (en) * | 2020-09-29 | 2021-01-29 | 厦门三优光电股份有限公司 | Automatic testing system and testing method of TOSA (transmitter optical subassembly) |
| CN112285517A (en) * | 2020-09-29 | 2021-01-29 | 厦门三优光电股份有限公司 | Automatic test system and test method for APD-TIA ROSA |
| CN112924773A (en) * | 2021-01-20 | 2021-06-08 | 江苏亮点光电科技有限公司 | MOPA laser high-low temperature testing device and testing method thereof |
| CN116298647A (en) * | 2023-05-11 | 2023-06-23 | 中国电子科技集团公司第十研究所 | Workstation and method for module environment experiment |
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2020
- 2020-03-03 CN CN202010137987.7A patent/CN111313963A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111722655A (en) * | 2020-08-04 | 2020-09-29 | 国家电网有限公司信息通信分公司 | Optical module debugging and testing system, optical module debugging and testing method and upper computer |
| CN111722655B (en) * | 2020-08-04 | 2022-02-25 | 国家电网有限公司信息通信分公司 | Optical module debugging and testing system, optical module debugging and testing method and upper computer |
| CN112284688A (en) * | 2020-09-29 | 2021-01-29 | 厦门三优光电股份有限公司 | Automatic testing system and testing method of TOSA (transmitter optical subassembly) |
| CN112285517A (en) * | 2020-09-29 | 2021-01-29 | 厦门三优光电股份有限公司 | Automatic test system and test method for APD-TIA ROSA |
| CN112285517B (en) * | 2020-09-29 | 2021-06-11 | 厦门三优光电股份有限公司 | Automatic test system and test method for APD-TIA ROSA |
| CN112284688B (en) * | 2020-09-29 | 2021-06-11 | 厦门三优光电股份有限公司 | Automatic testing system and testing method of TOSA (transmitter optical subassembly) |
| CN112198599A (en) * | 2020-12-07 | 2021-01-08 | 武汉乾希科技有限公司 | Coupling method and apparatus for optical communication device |
| CN112198599B (en) * | 2020-12-07 | 2021-02-12 | 武汉乾希科技有限公司 | Coupling method and apparatus for optical communication device |
| CN112924773A (en) * | 2021-01-20 | 2021-06-08 | 江苏亮点光电科技有限公司 | MOPA laser high-low temperature testing device and testing method thereof |
| CN116298647A (en) * | 2023-05-11 | 2023-06-23 | 中国电子科技集团公司第十研究所 | Workstation and method for module environment experiment |
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