CN113108830A

CN113108830A - Sensor with a sensor element

Info

Publication number: CN113108830A
Application number: CN202011637634.XA
Authority: CN
Inventors: 饶欢欢; 万霞; 逯新凯; 金骑宏; 黄隆重; 黄宁杰
Original assignee: Hangzhou Sanhua Research Institute Co Ltd
Current assignee: Hangzhou Sanhua Research Institute Co Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-07-13
Also published as: CN113418562A; WO2022142738A1

Abstract

A sensor, comprising: the temperature sensing device comprises a shell, a substrate assembly, a temperature sensing unit and a pressure sensing unit. The sensor is provided with accommodating cavities and flow channels which are positioned on different sides in the thickness direction of the substrate, the flow channels are not communicated with the accommodating cavities, and the electronic element and the pressure sensing unit are positioned in the accommodating cavities. The temperature sensing unit is electrically connected with the electronic element, and the pressure sensing unit is electrically connected with the electronic element. The base plate is of an integral structure and comprises a first surface facing the containing cavity and a second surface facing the flow channel, and the distance between the pressure sensing unit and the first surface is smaller than that between the pressure sensing unit and the second surface. This application can come parts such as pin of protection pressure sensing unit through base plate self structure, and the base plate structure as an organic whole, and the structure is comparatively simple.

Description

Sensor with a sensor element

Technical Field

The present application relates to a measuring device, and more particularly, to a sensor.

Background

A sensor in the related art includes: the temperature sensing device comprises a shell, a substrate assembly, a temperature sensing unit and a pressure sensing unit. The sensor has the chamber and the runner of acceping that are located the different sides on the base plate thickness direction, and the runner is not communicated with acceping the chamber. The electronic element is positioned in the containing cavity, and the pressure sensing unit is positioned in the flow channel. The pressure sensing unit is arranged on the surface of the substrate close to the flow channel, the foot of the pressure sensing unit needs to be protected by sealing glue and the like, and the substrate is composed of two plates which are arranged in a split mode, so that the structure is complex.

Disclosure of Invention

The present application provides a sensor, comprising: a housing, a substrate assembly, a temperature sensing unit, and a pressure sensing unit; the substrate assembly is positioned in the shell and comprises a substrate and a plurality of electronic elements connected to the substrate, and the substrate is provided with a guide hole penetrating along the thickness direction of the substrate;

the sensor is provided with an accommodating cavity and a flow channel which are positioned on different sides in the thickness direction of the substrate, the flow channel is not communicated with the accommodating cavity, at least part of the electronic element is positioned in the accommodating cavity, at least part of the pressure sensing unit is positioned in the accommodating cavity, one end of the guide hole is communicated with the flow channel, and the pressure sensing unit seals the other end of the guide hole;

the temperature sensing unit is electrically connected with the electronic element, the pressure sensing unit is electrically connected with the electronic element, the substrate is of an integrated structure and comprises a first surface facing the accommodating cavity and a second surface facing the flow channel, and the distance between the pressure sensing unit and the first surface is smaller than the distance between the pressure sensing unit and the second surface.

Compared with the related art, the distance between the pressure sensing unit and the first surface is smaller than the distance between the pressure sensing unit and the second surface, the parts such as pins of the pressure sensing unit can be protected through the structure of the substrate, the substrate is of an integrated structure, and the structure is simpler.

Drawings

FIG. 1 is a schematic perspective view of a first embodiment of the sensor of the present application.

Fig. 2 is a perspective view of the sensor shown in fig. 1 from another angle.

Fig. 3 is an exploded view of the sensor shown in fig. 1.

Fig. 4 is another exploded view of the sensor shown in fig. 3.

Fig. 5 is an exploded perspective cross-sectional view of the sensor shown in fig. 3.

Fig. 6 is a perspective view of the temperature sensing unit shown in fig. 3.

Fig. 7 is another perspective view of the sensor shown in fig. 3.

Fig. 8 is a schematic quarter perspective cross-sectional view of the sensor shown in fig. 1.

Fig. 9 is another schematic perspective cross-sectional view of the sensor shown in fig. 1.

Fig. 10 is a schematic perspective cross-sectional view of the sensor shown in fig. 1.

Fig. 11 is a schematic longitudinal cross-sectional view of the sensor shown in fig. 1.

Fig. 12 is a schematic perspective view of a second embodiment of the sensor of the present application.

Fig. 13 is an exploded perspective view of the sensor shown in fig. 12.

Fig. 14 is a schematic quarter perspective cross-sectional view of the sensor shown in fig. 12.

FIG. 15 is a schematic cross-sectional perspective view of a third embodiment of the sensor of the present application.

FIG. 16 is a schematic longitudinal cross-sectional view of a fourth embodiment of the sensor of the present application.

Fig. 17 is an exploded perspective view of a fifth embodiment of the sensor of the present application.

Fig. 18 is a perspective view of the sensor of the present application applied to a solenoid valve.

FIG. 19 is an exploded perspective view of the solenoid valve of FIG. 18.

FIG. 20 is another perspective exploded view of the solenoid valve of FIG. 19.

Fig. 21 is a schematic perspective cross-sectional view of the solenoid valve shown in fig. 18.

FIG. 22 is a schematic diagram of a system in which the sensor of the present application is used in a thermal management system.

Detailed Description

As shown in fig. 1 to 11, a sensor 100 according to a first embodiment of the present application includes: the sealing member includes a housing 10, a sealing ring 30, a substrate assembly 40, a temperature sensing unit 50, a pressure sensing unit 60, and a conductive member 70.

As shown in fig. 8 and 11, the sensor 100 has a housing chamber 102 and a flow channel 101 extending in the up-down direction. As shown in fig. 3 to 5, the substrate assembly 40 is located inside the housing 10, and the substrate assembly 40 includes a substrate 41, a plurality of conductive paths (not numbered), and a plurality of electronic components 45. The thickness direction Y of the substrate 41 is the same as the up-down direction, and the substrate 41 includes a first surface 411 located on the upper side in the thickness direction Y of the substrate 41, a second surface 412 located on the lower side in the thickness direction Y of the substrate 41, and a peripheral wall surface 413 connected between the first surface 411 and the second surface 412. The first surface 411 faces the receiving cavity 102, and the second surface 412 faces the flow channel 101. The substrate 41 has a guide hole 414 penetrating in a thickness direction thereof, one end of the guide hole 414 communicates with the flow channel 101, and the pressure sensing unit 60 seals the other end of the guide hole 414.

As shown in fig. 8, the flow channel 101 is located at the lower side of the substrate 41 in the thickness direction, and the housing cavity 102 is located at the upper side of the substrate 41 in the thickness direction, that is, the housing cavity 102 and the flow channel 101 are respectively located at different sides of the substrate 41 in the thickness direction. The sealing ring 30 is hermetically connected between the base plate 41 and the housing 10, so that the flow channel 101 is not communicated with the receiving cavity 102, and the hidden danger of refrigerant leakage caused by the refrigerant flowing from the flow channel 101 flowing into the receiving cavity 102 is reduced.

As shown in fig. 3 and 8, the electronic component 45 and the pressure sensing unit 60 are connected to the first surface 411 of the substrate 41, and both the electronic component 45 and the pressure sensing unit 60 are at least partially located in the receiving cavity 102. The temperature sensing unit 50 is electrically connected to the electronic device 45, and the pressure sensing unit 60 is electrically connected to the electronic device 45. The pressure sensing unit 60 may include a lead soft pin or a hard pin.

As shown in fig. 3 to 5, the substrate 41 has a substantially disk-like shape, and the peripheral wall surface 413 has a substantially annular surface shape. The peripheral wall 413 is provided with a first guide groove 416, the housing 10 has a guide post 115 inside, and the first guide groove 416 and the guide post 115 cooperate to facilitate guiding installation of the substrate 41 and position the installation direction of the substrate 41. In other alternative embodiments, the substrate 41 may have a square shape, a diamond shape, a polygonal shape, or a special shape, as long as the substrate 41 can be received and fixed in the receiving cavity 102 of the housing 10, and the shape of the substrate 41 is not limited in the present application.

The substrate 41 may be a ceramic substrate 41, and the conductive paths may be conductive traces such as copper traces disposed within the substrate 41, thereby forming a ceramic circuit board. The substrate 41 of the substrate assembly 40 may be a Printed Circuit Board (PCB) made of a material such as resin, and the conductive paths may be conductive paths such as copper traces provided in the substrate 41. The ceramic circuit board has better corrosion resistance and better temperature conductivity compared with a printed circuit board. The printed circuit board is less expensive to manufacture than a ceramic circuit board and facilitates soldering of the electronic component 45. The conductive paths in the substrate 41 and the base 41 of the present application are not limited to the two exemplary embodiments, as long as the temperature sensing unit 50, the pressure sensing unit 60, the electronic components 45, and the conductive member 70 can be electrically connected to each other. The substrate 41 has an integrated structure, and the pressure sensing unit 60 and the temperature sensing unit 50 are both electrically connected to the conductive path of the substrate 41, so that the structure that two plates are assembled and connected together is simpler, the assembling procedures are reduced, and the manufacturing process is simplified.

Referring to fig. 3 to 5 and 8 to 11, the housing 10 includes a first housing 11 and a second housing 12, and the second housing 12 is at least partially accommodated in the first housing 11. The first housing 11 has a terrace portion 13, a cylindrical portion 14 extending upward from the terrace portion 13, an abutting portion 15 extending downward from the terrace portion 13, and a bent portion 16 bent from the cylindrical portion 14. The bent portion 16 is formed by caulking and bending from the cylindrical portion 14, the bent portion 16 abuts against the second case 12, and the second case 12 abuts against the substrate 41 to fix the substrate 41 inside the case 10. The docking portion 15 is adapted to be inserted and mounted into a solenoid valve, which may be an electronic expansion valve, or a system pipe, which may be a connection pipe connecting any two of the heat exchanger, the compressor, the solenoid valve, the accumulator, and the gas-liquid separator. The platform part 13 has a platform surface 131 for fitting the corresponding mounted component, and the platform surface 131 is planar. The first housing 11 includes a first inner wall surface 117 disposed facing the second surface 412, and the first housing 11 has a first groove 114 recessed from the first inner wall surface 117.

The seal ring 30 is received in the first groove 114, and the seal ring 30 is fluidly sealed between the flow passage 101 and the receiving cavity 102. The seal ring 30 is compressed between the second surface 412 of the base plate 41 and the groove bottom surface 115 of the first groove 114. As shown in fig. 9, the seal ring 30 is in the shape of an O-ring, and the seal ring 30 has a top portion 301 that abuts the second surface 412 of the base plate 41 and a bottom portion 302 that abuts the groove bottom surface 115 of the first groove 114.

As shown in fig. 3, 8, and 11, the cylindrical portion 14 includes a first cylindrical portion 141 connected to the terrace portion 13 and a second cylindrical portion 142 connected between the first cylindrical portion 141 and the bent portion 16, and the thickness of the first cylindrical portion 141 in the radial direction X is larger than the thickness of the second cylindrical portion 142 in the radial direction X. The outer wall surface 143 of the first tube 141 and the outer wall surface 143 of the second tube 142 are aligned, the first tube 141 has a first protrusion 144 protruding inward relative to the second tube 142, the first protrusion 144 forms a first step 171 with the first inner wall surface 117 of the first housing 11, and the first protrusion 144 forms a second step 172 with the second inner wall surface 145 of the second tube 142.

As shown in fig. 4 and 9, the second housing 12 has a first end 121 and a second end 122, the bent portion 16 abuts against the second end 122, the first end 121 abuts against the first surface 411 and the second step portion 172 of the substrate 41, the bottom surface 173 of the second step portion 172 is substantially located on the same horizontal line with the first surface 411, and the second step portion 172 is provided to position the mounting position of the second housing 12.

As shown in fig. 3 and 4, the second housing 12 is substantially in the shape of an inverted bowl, and the second housing 12 includes a top wall 123, a peripheral wall 127 extending downward from the top wall 123, and a housing cavity 102 surrounded by the top wall 123 and the peripheral wall 127. The top wall 123 includes a first platform 124 perpendicular to the peripheral wall 127, a second platform 125 above the first platform 124, and a rounded transition 126 connecting between the first and

second platforms

124, 125. The peripheral wall 127 is provided with second guide grooves 129 for engaging with the guide posts 115, and the first guide grooves 416 of the base plate 41 and the second guide grooves 129 of the second housing 12 are aligned so that the guide posts 115 of the first housing 11 engage with the first guide grooves 416 and the second guide grooves 129 to guide the mounting direction of the base plate assembly 40 and the second housing 12.

The second housing 12 has a plurality of second holes 128 penetrating the second platform 125 along the vertical direction, the plurality of second holes 128 are communicated with the receiving cavity 102, and the plurality of second holes 128 can be uniformly distributed around the axis of the second platform 125. As shown in fig. 9, the bent portion 16 is press-fit to the first platform 124, and the conductive member 70 penetrates through the second duct 128 of the second platform 125.

The first housing 11 is a metal member to reduce electromagnetic interference (EMI) from the outside to the electronic components inside the sensor 100, and the second housing 12 is an insulating member to insulate and isolate the first housing 11 from the conductive member 70. Optionally, the first housing 11 may be a metal piece made of aluminum or a metal piece made of stainless steel, and the metal piece made of aluminum has a light weight, so that the light weight of the sensor 100 is facilitated, and when the sensor 100 is used in an automobile thermal management system, the light weight design of the whole automobile is facilitated. Although the metal piece made of stainless steel is slightly heavier than the metal piece made of aluminum, the metal piece made of stainless steel has the advantage of being convenient to weld. The second housing 12 is an insulating member made of plastic and can be manufactured by an injection molding process, and the conductive member 70 is insulated from the first housing 11 by the second housing 12 made of insulating material. The first housing 11 made of Metal material may be manufactured by Die casting (Die casting), extrusion Molding, or Metal Injection Molding (MIM).

As shown in fig. 3 and 10, the conductive member 70 is a coil spring. The conductive member 70 includes a first end 71, a second end 72, and a middle portion 73 connected between the first end 71 and the second end 72, the first end 71 abuts against the first surface 411 of the substrate 41, the middle portion 73 is received in the second channel 128 of the second housing 12, and the second end 72 extends upward from the middle portion 73 beyond the second housing 12. A first end 71 of the conductive member 70 is electrically connected to the conductive path and a second end 72 of the conductive member 70 is adapted to be electrically connected to a component external to the sensor 100. The conductive member 70 of the coil spring structure abuts against the circuit board inside the solenoid valve, i.e. the sensing signal is conducted to the solenoid valve, which facilitates further control of the solenoid valve.

As shown in fig. 8 and 11, the substrate 41 is provided with a guide hole 414 penetrating in a vertical direction, the pressure sensing unit 60 is disposed above the guide hole 414, and a distance from the pressure sensing unit 60 to the first surface 411 is smaller than a distance from the pressure sensing unit 60 to the second surface 412, that is, the pressure sensing unit 60 is a back pressure type pressure sensing unit. The pressure sensing unit 60 is disposed on the first surface 411 of the substrate 41, and compared with the second surface 412 of the substrate 41, the risk of corrosion of the refrigerant to the pressure sensing unit 60 and the pins thereof is reduced, and the corresponding corrosion-resistant glue protection can be omitted, so that the structure is simpler and the production cost is lower. The refrigerant may flow in from the flow passage and flow into the pressure sensing unit 50 through the guide hole 414, so that the pressure sensing unit 50 converts the pressure of the refrigerant into an electrical signal, and the electronic component 45 includes a conditioning chip, a processing chip, a resistor, a capacitor, etc., so that the real-time pressure of the refrigerant can be calculated.

The temperature sensing unit 50 includes a temperature sensing part 51 and a pin part 52, the temperature sensing part 51 is located below the substrate 41, and the temperature sensing part 51 is exposed in the flow channel 101 or extends downward to exceed the flow channel 101, so that the temperature sensing part 51 can be fully contacted with the refrigerant, the temperature difference after the refrigerant flows in from the flow channel 101 is reduced, and the sensitivity and accuracy of the refrigerant temperature detection are improved. The substrate 41 has a pin hole 418 penetrating the substrate 41 in a thickness direction of the substrate 41, the temperature sensing part 51 is located at a distance from the second surface 412 that is smaller than a distance from the temperature sensing part 51 to the first surface 411, and the pin part 52 extends from the temperature sensing part 51 through the pin hole 418. The lead part 52 is connected to the substrate 41 and electrically connected to the conductive path of the substrate assembly 40, the temperature change of the refrigerant causes the current change in the temperature sensing part 51 to be conducted to the substrate assembly 40 through the lead, and the electronic component 45 includes a conditioning chip, a processing chip, a resistor, a capacitor, and the like, so that the real-time temperature of the refrigerant can be calculated.

When the pressure sensing unit 60 is in contact with the refrigerant, the pressure of the received refrigerant is converted into an electrical signal, when the temperature sensing unit 50 is in contact with the refrigerant, the temperature of the received refrigerant is converted into an electrical signal, and the electronic elements 45 such as the corresponding chips on the substrate assembly 40 calculate the real-time pressure and temperature of the refrigerant according to the electrical signal, so that the real-time monitoring of the temperature and pressure of the refrigerant is realized, and the accurate control and intelligent design of the electromagnetic valve are facilitated. The Temperature sensing unit 50 may be an NTC (Negative Temperature Coefficient) Temperature sensing element, the pressure sensing unit 60 may be an MEMS (Micro electro mechanical System) pressure sensing element, the MEMS pressure integrated chip has a small size, and the size of a common MEMS pressure integrated chip is generally in the millimeter level or even smaller. A Wheatstone bridge with 4 resistors is manufactured on the surface of a silicon cup film of the pressure sensor integrated chip prepared by adopting the MEMS technology, and when the circuit is accessed, when no pressure acts on the silicon cup film, the Wheatstone bridge is balanced, and the output voltage is 0. When pressure acts on the silicon cup film, the balance of the Wheatstone bridge is broken, and voltage is output. Therefore, the pressure change can be reflected by the change of the electric signal in the detection circuit, so that the pressure detection function is realized. The NTC temperature sensing element is a thermistor and a probe, and the principle is as follows: the resistance value decreases rapidly with increasing temperature. Which typically consists of 2 or 3 metal oxides, mixed in a fluid-like clay and calcined in a high temperature furnace to a dense sintered ceramic. The physical dimensions are quite flexible and they can be as small as 0.010 inches or very small in diameter.

The pressure sensing unit 60 is mounted on the first surface 411 of the substrate 41 in a Surface Mount Technology (SMT), the temperature sensing unit 50 is soldered on the first surface 411 of the substrate 41 in a Through hole (Through hole), the pressure sensing unit 60 is an MEMS sensor, and the temperature sensing unit 50 is a pin-type NTC thermistor temperature sensor. The pin-type temperature sensing unit 501 can extend the temperature sensing unit 51 into the flow channel 101 or close to the opening side of the flow channel 101, so that when sensing the refrigerant flowing into the flow channel, the temperature sensing unit can sense the temperature in time, and the temperature sensing unit is close to the opening side of the flow channel 101, so that the temperature measurement error caused by the temperature change in the process of the refrigerant flowing into the flow channel is reduced. Meanwhile, the pin-type temperature sensing unit 501 is matched with the back-pressure patch pressure sensing unit 60, so that the simple structure of the pressure sensing unit 51 and the measurement timeliness and accuracy of the temperature sensing unit 501 can be perfectly combined.

As shown in fig. 3 to 7, the temperature sensing unit 50 further includes a foot rest 53 for protecting the lead portion 52, the foot rest 53 is made of an insulating material resistant to corrosion by the refrigerant, and optionally, the foot rest 53 is made of a plastic material. The first housing 11 has a first housing cavity 111 and a first duct 112, the first housing cavity 111 is at least partially located between the cylindrical portion 14, the bent portion 16, and the platform portion 13, and the first duct 112 is at least partially located inside the platform portion 13. The first hole 112 is communicated with the first shell inner cavity 111, the foot rest 53 is at least partially positioned in the first hole 112, and the pin part 52 has a first foot part 521 positioned in the foot rest 53, a second foot part 522 positioned in the substrate 41, a third foot part 523 positioned in the accommodating cavity 102, and a fourth foot part 524 connected between the first foot part 521 and the temperature sensing part 51. The foot rest 53 includes a rest main body portion 531 and a first positioning portion 532, the inner wall of the first housing 11 has a second positioning portion 113, the first positioning portion 532 cooperates with the second positioning portion 113, and as shown in fig. 10, the first positioning portion 532 is sandwiched between the second positioning portion 113 and the second surface 412 of the substrate 41. The first positioning portion 532 cooperates with the second positioning portion 114 of the first housing 11 to facilitate positioning when the footrest 53 is mounted.

As shown in fig. 5 and 10, the first positioning portion 532 protrudes from the holder main body portion 531, and the second positioning portion 113 forms a step surface on the inner wall of the first housing 11. The first positioning portion 532 has a first contact surface 533, the second positioning portion 113 has a second contact surface 114, the first contact surface 533 contacts with the second contact surface 114, the first positioning portion 532 further includes a third contact surface 534, the third contact surface 534 contacts with the second surface 412 of the substrate 41, and the third contact surface 534 is far away from the opening 105 of the flow channel relative to the first contact surface 114.

As shown in fig. 9 and 11, the flow passage 101 is at least partially disposed on the foot rest 53, the flow passage 101 includes a first flow passage 103 and a second flow passage 104 which are communicated with each other, the first flow passage 103 is located between the second flow passage 104 and the guide hole 414, the inner diameter of the first flow passage 103 is smaller than the inner diameter of the second flow passage 104, the inner diameter of the first flow passage 103 is larger than the inner diameter of the guide hole 414, and the axial line of the first flow passage 103 coincides with the axial line of the guide hole 414.

As shown in fig. 4, the foot rest 53 includes an upper end 535, a lower end 536, and two pin holes 537 penetrating the upper end 535 and the lower end 536 in the up-down direction (the longitudinal direction of the foot rest 53). The lead portion 52 is inserted through two lead holes 537 of the lower end portion 536, and is soldered to the substrate 41 through the lead holes 537 from the upper end portion 535. The upper end 535 may be secured to the second surface 412 of the substrate 41 by physical fastening, gluing, or the like, thereby enhancing the stability of the foot rest 53 when impacted by a refrigerant. The foot rest 53 can also be directly clamped between the temperature sensing part 51 and the second surface 412, so that the structure is simpler and the production process is less. The lower end 536 is in close proximity to the temperature sensing unit 51 to protect the lead unit 52 from the refrigerant to the maximum extent. The design of the foot rest 53 reduces the risk of refrigerant impingement and corrosion on the pin portion 52 of the temperature sensing unit 50, thereby improving the service life of the sensor 100. The lead portion 52 may also be coated with a coating that is resistant to corrosion by the refrigerant, thereby further reducing the corrosion of the lead 512 by the refrigerant. The first positioning portion 532 is disposed on the upper end 535, and the first positioning portion 532 cooperates with the second positioning portion 114 of the first housing 11 to facilitate positioning when the footrest 53 is mounted.

As shown in fig. 7 and 8, the foot rest 53 has a bottom plate portion 541, the bottom plate portion 541 is located at the lower end 536 of the foot rest 53, the bottom plate portion 541 is a part of the rest body portion 531, the temperature sensing portion 51 is partitioned from the foot rest 53 by the provision of the bottom plate portion 541, and the lead portion 52 is inserted into the lead hole 537, thereby blocking the lead portion 52 from the refrigerant and further reducing the influence of the lead portion 52 from the refrigerant impact.

The first positioning portion 532 includes a disk portion 538 protruding in a radial direction X with respect to the holder main body portion 531, and a plurality of protruding pillars 539 protruding upward from the disk portion 538, a diameter of the disk portion 538 is larger than a diameter of the holder main body portion 531, and outer circumferential surfaces of the plurality of protruding pillars 539 are aligned with outer circumferential surfaces of the disk portion. The plurality of bosses 539 are circumferentially uniformly distributed around the axis of the tray body 538, and optionally, the plurality of bosses 539 are four bosses, so that the supporting base plate 41 is more stable. The first contact surface 533 is disposed on the lower side of the body portion 538, and the third contact surface 534 is disposed on the upper side of the protruding post 539.

As shown in fig. 12 to 14, in order to provide a sensor according to a second embodiment of the present invention, the second embodiment is mainly different from the first embodiment in that the first housing 11 includes a first main case 21 and a first inner case 22 which are separately provided. The first main case 21 and the second surface 412 of the base plate 41 are sealed and fixed by adhesion, or a metal ring is exposed on the surface of the second surface 412 of the base plate 41, and the first inner case 22 and the metal ring are sealed and fixed by soldering. In addition, the foot rest 53 of the temperature sensing unit 50 in the second embodiment is different from that in the first embodiment, the flow passage 101 is formed by the first inner casing 22 without forming the flow passage 101 in the foot rest 53 in the second embodiment, the flow passage 101 is formed by the first inner casing 22, and the foot rest 53 is positioned in the flow passage 101. The first inner shell 22 and the first main shell 21 may be sealed and fixedly connected by welding, such as gluing or laser welding, between the first inner shell 22 and the first main shell 21. Because the setting of first inner shell 22 has made things convenient for sealing connection between first casing 11 and the base plate 41, can glue first inner shell 22 earlier or weld with base plate 41, glue first inner shell 22 again or weld in first main shell 21 to sticky or the welded degree of difficulty has been reduced. The arrangement of the seal ring 30, the conductive member 70, the second housing 12, the temperature sensing part 51, and the leg part 52 is basically the same as that of the first embodiment, and will not be described again.

As shown in fig. 15, in order to provide a sensor according to the third embodiment of the present invention, the main difference from the second embodiment is that the sealing ring 30 is omitted in this embodiment, and there is no sealing ring in the entire sensor, the first inner shell 22 is first fixed and connected to the second surface 412 of the base plate 41 by welding or gluing, and then the first inner shell 22 is inserted into the first hole 112 of the first main shell 21, and the first inner shell 22 is connected to the first main shell 21 by laser welding or gluing. The sealing between the flow channel 101 and the accommodating cavity 102 is realized by welding, gluing and the like among the first inner shell 22, the base plate 41 and the first main shell 21, so that a sealing ring is omitted, the material cost is reduced, and the risk of refrigerant leakage caused by the failure of the sealing ring is reduced.

As shown in fig. 16, in order to provide a sensor according to a fourth embodiment of the present invention, the main difference from the third embodiment is that the first housing 11 has an integral structure, the inner wall of the first housing 11 is provided with the second protrusion 18 protruding toward the second surface 412 of the substrate 41, and the second protrusion and the second surface 412 of the substrate 41 are sealed by gluing or welding, etc., so that a sealing ring is omitted, and compared with the third embodiment, the first housing 11 of the fourth embodiment has a simpler structure, does not need to be provided separately, and reduces the processes of sealing and fixing connection between the separately provided first housings 11.

As shown in fig. 17, in order to provide a sensor according to the fifth embodiment of the present invention, the difference from the previous embodiment is that the second surface 412 of the base plate 41 is provided with a ring of metal ring 46, the first inner shell 22 and the metal ring 46 are sealed and fixed by welding, and then the assembly formed by the base plate 41 and the first inner shell 22 is inserted into the first hole 112 of the first main shell 21, and the first inner shell 22 and the first main shell 21 are sealed and fixed by laser welding.

As shown in fig. 18 to 21, a solenoid valve 200 according to the present application includes the sensor 100 according to any of the foregoing embodiments, taking the sensor 100 of the first embodiment as an example. The solenoid Valve 200 may be an Electronic Expansion Valve (EXV) including a Valve body 80, a cover 81, a Valve core 82, a Valve core seat 83, a motor portion, a circuit board 84, and a connector 85. The valve body 80 comprises a first channel 801 and a second channel 802 which are parallel to each other, and a first mounting cavity 803 and a second mounting cavity 804 which are parallel to each other, wherein the first mounting cavity 803 is communicated with the first channel 801, and the second mounting cavity 804 is communicated with the second channel 802.

The valve core 82 is installed in the first installation cavity 803 for controlling the on/off or throttling state of the refrigerant in the first channel 801, and the sensor 100 is installed in the second installation cavity 804 for detecting the temperature and pressure of the refrigerant flowing into the second channel 802. The circuit board 84 is mounted in the cover cavity 811 of the cover 81, the conductive member 70 of the sensor 100 abuts against the lower surface of the circuit board 84, and the connector 100 is connected to the upper surface of the circuit board 84.

The motor part and the valve core 82 are positioned in the valve core seat, the motor part comprises a static iron core/stator 86 and a movable iron core/rotor 87, the static iron core 86 surrounds the movable iron core 87, the movable iron core 87 is mechanically connected with the valve core 82, and the static iron core 86 is electrically connected with the circuit board 84. The sensor 100 and the connector 85 are electrically connected to the circuit board 84, and the connector 85 is electrically connected to the outside, so that the stationary core 86 can be energized or the temperature and pressure signals in the sensor 100 can be transmitted to an external controller. When the static iron core 86 is electrified, the changed current generates a magnetic field to drive the movable iron core 97 to rotate, and the movable iron core 97 drives the valve core 82 to do linear up-and-down motion through the nut-screw mechanism, so that the on-off or throttling of the refrigerant in the first channel 801 is realized.

As shown in fig. 22, the present application also provides a thermal management or air conditioning system 900 that includes a compressor 91, a condenser 92, a solenoid valve (electronic expansion valve) 200, an evaporator 93, and a sensor 100. The compressor 91 compresses the refrigerant into high-temperature and high-pressure refrigerant, releases heat to air or cooling liquid through the condenser 92, enters the first channel 801 of the electromagnetic valve (electronic expansion valve) 200 for throttling and pressure reduction to become low-temperature and low-pressure refrigerant, enters the evaporator 93 for absorbing heat from the air or the cooling liquid to evaporate into gaseous refrigerant, and enters the compressor for circulation after the temperature and the pressure of the refrigerant are measured through the second channel 802 and the sensor 100. The sensor 100 and the electronic expansion valve 200 are merely described in principle in the system, and the actual physical structure is an integrated structure as shown in fig. 18 to 21.

The above embodiments are only for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood by those skilled in the art based on the detailed description of the present application with reference to the above embodiments, but those skilled in the art should understand that the present application can be modified or substituted equally by those skilled in the art, and all technical solutions and modifications thereof without departing from the spirit and scope of the present application should be covered by the claims of the present application.

Claims

1. A sensor, comprising: a housing, a substrate assembly, a temperature sensing unit, and a pressure sensing unit; the substrate assembly is positioned in the shell and comprises a substrate and a plurality of electronic elements connected to the substrate, and the substrate is provided with a guide hole penetrating along the thickness direction of the substrate; the sensor is provided with an accommodating cavity and a flow channel which are positioned on different sides in the thickness direction of the substrate, the flow channel is not communicated with the accommodating cavity, at least part of the electronic element is positioned in the accommodating cavity, at least part of the pressure sensing unit is positioned in the accommodating cavity, one end of the guide hole is communicated with the flow channel, and the pressure sensing unit seals the other end of the guide hole; the temperature sensing unit is electrically connected with the electronic element, the pressure sensing unit is electrically connected with the electronic element, the substrate is of an integrated structure and comprises a first surface facing the accommodating cavity and a second surface facing the flow channel, and the distance between the pressure sensing unit and the first surface is smaller than the distance between the pressure sensing unit and the second surface.

2. The sensor of claim 1, wherein: the temperature sensing unit comprises a temperature sensing part and a pin part connected with the temperature sensing part, the substrate is provided with a pin hole penetrating through the substrate along the thickness direction of the substrate, the distance from the temperature sensing part to the second surface is smaller than that from the temperature sensing part to the first surface, and the pin part extends from the temperature sensing part to extend through the pin hole.

3. The sensor of claim 2, wherein: the pressure sensing unit is mounted on the first surface of the substrate in a patch mode, and the temperature sensing unit is welded on the first surface of the substrate in a perforation mode.

4. The sensor of claim 2, wherein: the shell comprises a first shell and a second shell, the second shell is provided with a first end portion and a second end portion, the first end portion is abutted against the first surface of the substrate, the first shell is provided with a platform portion, a cylindrical portion extending upwards from the platform portion and a bending portion bending from the cylindrical portion, the bending portion is abutted against the second end portion of the second shell, the first shell is a metal shell, and the second shell is an insulating shell.

5. The sensor of claim 4, wherein: the first shell is provided with a first shell inner cavity and a first pore, at least part of the first shell inner cavity is located between the cylindrical part, the bending part and the platform part, at least part of the first pore is located inside the platform part, the first pore is communicated with the first shell inner cavity, the sensor further comprises a foot support, at least part of the foot support is located in the first pore, the pin part is provided with a first foot part located in the foot support, a second foot part located in the substrate, a third foot part located in the accommodating cavity and a fourth foot part connected between the first foot part and the temperature sensing part.

6. The sensor of claim 5, wherein: the foot support comprises a support main body part and a first positioning part, the inner wall of the first shell is provided with a second positioning part, the first positioning part is matched with the second positioning part, and the first positioning part is clamped between the second positioning part and the second surface.

7. The sensor of claim 6, wherein: the first positioning portion protrudes relative to the main body portion, the second positioning portion forms a step surface on the inner wall of the first shell, the first positioning portion is provided with a first contact surface, the second positioning portion is provided with a second contact surface, the first contact surface is in contact with the second contact surface, the first positioning portion further comprises a third contact surface, the third contact surface is in contact with the second surface, and the third contact surface is far away from the opening of the flow channel relative to the first contact surface.

8. The sensor of claim 7, wherein: the flow channel is at least partially arranged on the foot support and comprises a first flow channel and a second flow channel which are communicated with each other, the first flow channel is positioned between the second flow channel and the guide hole, the inner diameter of the first flow channel is smaller than that of the second flow channel, the inner diameter of the first flow channel is larger than that of the guide hole, and the axial lead of the first flow channel is coincident with that of the guide hole.

9. The sensor of claim 4, wherein: the sensor further comprises a sealing ring, the first shell comprises a first inner wall surface which faces the second surface, the first shell comprises a first groove which is formed by sinking the first inner wall surface, the sealing ring is contained in the first groove, and the sealing ring is in fluid sealing between the flow channel and the containing cavity.

10. The sensor of claim 4, wherein: the sensor further comprises a conductive piece, the second shell comprises a second hole which penetrates through the second shell in the thickness direction, one end of the conductive piece is electrically and physically connected with the first surface of the substrate, the other end of the conductive piece is located on the outer side of the second shell, and the conductive piece further comprises an accommodating part which is accommodated in the second hole.