CN113108831A

CN113108831A - Sensor with a sensor element

Info

Publication number: CN113108831A
Application number: CN202110132843.7A
Authority: CN
Inventors: 饶欢欢; 万霞; 逯新凯; 黄隆重; 金骑宏; 黄宁杰
Original assignee: Hangzhou Sanhua Research Institute Co Ltd
Current assignee: Hangzhou Sanhua Research Institute Co Ltd
Priority date: 2021-01-29
Filing date: 2021-01-29
Publication date: 2021-07-13

Abstract

A sensor is provided that includes a housing portion and a sensing assembly; the sensor is also provided with a containing cavity and a channel; the shell part is positioned at the periphery of the accommodating cavity; the sensing assembly comprises a first substrate and a sensing element; the first substrate is positioned in the accommodating cavity; the sensing element is electrically connected with the first substrate and comprises a core part; the core portion has a sensing region exposed to the channel; the shell is provided with a guide hole which is at least one part of a channel, the core part is fixed with the shell and seals one end of the channel; the channel is not communicated with the accommodating cavity. The sensor provided by the application is simple in structure.

Description

Sensor with a sensor element

Technical Field

The application relates to the technical field of signal sensing, in particular to a sensor.

Background

The sensor in the related art, shown with reference to fig. 1A and 1B, includes a core 55 and a shell 53. The core 55 includes a substrate 75 and a detecting chip 74 fixed on the upper side of the substrate 75, and the detecting chip 74 is electrically connected to the circuit board 70. The detection chip 74 and the substrate 75 are hermetically bonded by the adhesive 72, and a sealing gasket 52 is disposed at the bottom wall of the cavity of the housing 53, so that pressure leakage between the substrate 75 and the bottom wall of the cavity is prevented by the sealing gasket 52. The sensing chip 74 may integrate both temperature and pressure sensing regions, thus providing the sensor with both temperature sensing and pressure sensing capabilities.

The detection chip is fixed on the upper side of the substrate in the related art, and the substrate and the shell are sealed through the sealing gasket, namely, under the requirement of sealing, the related art needs to comprise the substrate, the sealing gasket and other parts, and the shell also needs to be correspondingly provided with a groove structure for accommodating the sealing gasket, so that the structure of the related art is complex.

Disclosure of Invention

The application aims to provide a sensor with a simpler structure.

A sensor is provided that includes a housing portion and a sensing assembly; the sensor is also provided with a containing cavity and a channel; the shell part is positioned at the periphery of the accommodating cavity; the sensing assembly comprises a first substrate and a sensing element; the first substrate is at least partially positioned in the accommodating cavity;

the sensing element is electrically connected with the first substrate; the sensing element includes a core portion having a sensing region exposed to the channel;

the shell part is provided with a guide hole which is at least one part of the channel, the core part is fixed with the shell part, and the core part seals one end of the channel; the channel is not communicated with the accommodating cavity.

The sensor that provides at this application, core portion is fixed with casing portion, and the one end of the sealed passageway of core portion accepts the chamber and does not communicate with each other with the passageway, is favorable to like this that fluid and core portion expose and realize the detection of fluid correlation parameter in the regional contact of sensing of passageway, and the fluid is difficult to contact the chamber of accepting of sensor, is favorable to simplifying the overall structure of sensor when guaranteeing the leakproofness.

Drawings

FIG. 1A is a schematic cross-sectional view of a sensor according to the related art;

FIG. 1B is an enlarged view of a portion of the sensor of FIG. 1A;

FIG. 2 is a schematic perspective view of a first embodiment of the sensor of the present application;

FIG. 3 is a schematic perspective view of the sensor shown in FIG. 2 at another angle;

FIG. 4 is an exploded schematic view of the sensor shown in FIG. 2;

FIG. 5 is another exploded view of the sensor shown in FIG. 2;

FIG. 6 is a schematic perspective cross-sectional view of the sensor shown in FIG. 2;

FIG. 7 is a schematic perspective cross-sectional view of another angle of the sensor shown in FIG. 2;

FIG. 8 is a schematic perspective cross-sectional view of yet another angle of the sensor shown in FIG. 2;

FIG. 9 is a schematic view of the mating and core portions of the sensor shown in FIG. 2 secured together;

FIG. 10 is a schematic cross-sectional view of the sensing element of the sensor shown in FIG. 2;

FIG. 11 is a schematic view of an assembly of the first substrate and the second substrate of the sensor shown in FIG. 2;

FIG. 12 is a schematic cross-sectional perspective view of a second embodiment of the sensor of the present application;

FIG. 13 is an enlarged schematic view of a portion of the sensor shown in FIG. 11;

FIG. 14 is a schematic perspective view of a third embodiment of a sensor according to the present application;

FIG. 15 is a schematic perspective cross-sectional view of the sensor shown in FIG. 13;

FIG. 16 is a schematic perspective view of a fourth embodiment of a sensor according to the present application;

FIG. 17 is a schematic perspective cross-sectional view of the sensor portion shown in FIG. 15;

FIG. 18 is a schematic cross-sectional perspective view of a fifth embodiment of a sensor of the present application;

FIG. 19 is a corresponding perspective view of an embodiment of the valve assembly of the present application;

fig. 20 is a cross-sectional schematic view of the valve assembly of fig. 18.

Detailed Description

Exemplary embodiments of the present application will be described in detail below with reference to the accompanying drawings. If several embodiments exist, the features of these embodiments may be combined with each other without conflict.

As shown in fig. 2 to 17, the present application provides a sensor 100, the sensor 100 including a housing portion 1 and a sensing assembly. At least part of the sensing assembly is accommodated in the housing portion 1. The sensing assembly includes a first substrate 21 and a sensing element 22.

The first substrate 21 has a plate-shaped structure with a certain thickness, and the first substrate 21 includes a first surface 211, a second surface 212, and a side surface 213. The first surface 211 and the second surface 212 are located on different sides in the thickness direction of the first substrate 21. The side 213 is located between the first surface 211 and the second surface 212. The first surface 211 may be an upper side surface of the first substrate 21 illustrated in the respective views, and the second surface 212 may be a lower side surface of the first substrate 21 illustrated in the respective views. The sensor 100 has a receiving cavity 200, and the first substrate 21 is at least partially located in the receiving cavity 200. Sensor 100 also has a channel in which a fluid can flow. The first substrate 21 is provided with a plurality of circuit elements and circuit arrangements, and accordingly, when the sensor 100 is used for measuring a fluid parameter, care should be taken to achieve sealing and prevent the fluid from entering the receiving cavity 200.

The first substrate 21 may be a circuit board whose main material is resin, or a circuit board whose main material is ceramic. In some embodiments, the first substrate 21 is provided with a notch portion 23 penetrating the first substrate 21 in a thickness direction thereof. The sensing element 22 is at least partially accommodated in the notch portion 23, which is beneficial for the sensing element 22 to approach the bottom housing of the housing portion 1, and the sensing element 22 is electrically connected to the first substrate 21. The first substrate 21 provides circuit support for the sensing elements 22, as other circuit elements and circuits of the first substrate 21 are designed to receive and process signals sensed by the sensing elements 22. In one embodiment, the first substrate 21 includes a plurality of conductive regions 25 on the first surface 211, the sensing element 22 includes binding lines 24, and the binding lines 24 of the sensing element 22 are electrically connected to the conductive regions of the first substrate 21. The conductive areas 25 may be embodied as a structure of pads, which facilitates the soldering of the binding lines 24 of the sensing element 22.

Of course, the first substrate 21 may not be provided with the notch 23, and accordingly, the sensing element 22 may be arranged side by side with the first substrate 21, or the sensing element 22 may be located under the first substrate 21 as long as the two can be electrically connected.

The housing part 1 is provided with a guiding hole 13, the guiding hole 13 may be a through hole penetrating the housing part 1, or only a part of the through hole, or may be a hole formed by combining a plurality of housing parts included in the housing part 1, for example, one housing part provides a groove similar to a half hole, and the other housing part provides another groove similar to a half hole, so that the grooves of the two housing structures can be combined to form a complete guiding hole. The housing portion 1 further includes a fitting portion 111, the fitting portion 111 is located on the second surface 212 side of the first substrate 21, and the guide hole 13 penetrates the fitting portion 111.

The guide hole 13 is at least a part of a channel. Although the channel may comprise other structures capable of flowing fluid, in some embodiments, the sensing element 22 comprises a core portion 221, and the receiving cavity 200 and the channel are respectively located at different sides of the core portion 221. The core part 221 is fixed to the housing part 1 so that the core part 221 and the housing part 1 both enclose the receiving cavity 200, the guiding hole of the housing part 1 is at least a part of the channel, the core part 221 in turn seals one end of the channel so that the core part 221 and the housing part 1 are both arranged at the periphery of the channel.

In some embodiments, the sensing element 221 is provided with a sensing cavity 222. The sensing chamber 222 is also part of a channel, i.e. the channel comprises the conducting hole 13 and also the sensing chamber 222, which areas are in fluid communication. The core portion 221 may be concave to form the sensing cavity 222, and the core portion 221 may also cooperate with other structures such as the housing portion 1 or a glue layer to form the sensing cavity 222.

The core part 221 has a sensing region 223 exposed to the sensing cavity 222. The sensing chamber 221 communicates with the guide hole 13. The inner surface of the matching portion 111 close to the first substrate 21 is provided with a first opening 131, and the first opening 131 is located at one side of the guiding hole 13 close to the first substrate 21. Correspondingly, the surface of the matching portion 111 away from the first substrate 21 is provided with a second opening 132, and the second opening 132 is located on the side of the guiding hole 13 away from the first substrate 21. When the guide hole 13 has a linear central axis, the first opening 131 and the second opening 132 are openings on different sides of the guide hole 13 in the axial direction, respectively. The second opening 132 is a fluid inlet port, and the fluid enters the guide hole 13 from the second opening 132, finally exits the guide hole 13 into the sensing chamber 222 from the first opening 131, and is in direct contact with the sensing region 223 exposed to the sensing chamber 222, so that the sensing region 223 can detect and collect a temperature and/or pressure signal of the fluid during the contact with the fluid.

On a plane perpendicular to the thickness direction of the first substrate 21, an area surrounded by a projection contour of the first opening 131 is located within a projection range of the core portion 221, the core portion 221 and the matching portion 111 are fixed and hermetically connected, and the core portion 221 is located between the receiving cavity 200 and the channel. The sensing cavity 222 is not communicated with the accommodating cavity 200.

In some embodiments, referring to fig. 10, the core portion 221 of the sensing element 22 is a three-layer structure including a substrate layer 2201, an intermediate layer 2202, and a top layer 2203, the substrate layer 2201 and the intermediate layer 2202 enclose a sensing cavity 222 with an opening, the sensing element 22 may further include a vacuum cavity 2204, the vacuum cavity 2204 may be enclosed by the top layer 2203 and the intermediate layer 2202, the vacuum cavity is disposed on the other side of the sensing cavity away from the guide hole 13, the vacuum cavity is not communicated with the sensing cavity, and the vacuum cavity is favorable for ensuring that the fluid pressure sensed by the sensing region 223 is absolute pressure, of course, some sensing elements 22 may not be provided with a vacuum cavity, and accordingly, the fluid pressure sensed by the sensing region 223 is relative pressure. The substrate layer may be a glass substrate, the intermediate layer may be a silicon crystal cell material, and the top layer 2203 may also be a glass material. The sensing region 223 may include a pressure sensing region and a temperature sensing region. In this way, the pressure sensing function and the temperature sensing function can be integrated in the same sensing element 22. Specifically, the sensing element 22 is a back pressure type temperature pressure chip, that is, the sensing element 22 is a back pressure type pressure temperature sensor chip integrating pressure and temperature at the same time, the fluid enters the sensing cavity 222 from a small hole at the bottom of the sensing element 22, the front surface of the back pressure type sensing element 22 is not in contact with the fluid, the middle layer of the silicon wafer of the core part 221 has a sensing area 223 exposed in the sensing cavity 222, the sensing element 22 can be prepared by a Micro Electro Mechanical System (MEMS) technology, the size of the sensing element prepared by the MEMS technology is small, and the corresponding product size is generally in the millimeter level or even smaller. The pressure sensing region of the sensing region 223 is pressure-detected by a piezoresistive wheatstone bridge, and when no pressure is applied to the thin film of the silicon cell when the circuit is switched on, the wheatstone bridge is balanced and the output voltage is 0. When pressure is applied to the thin film of the silicon cell, the balance of the Wheatstone bridge is broken and a voltage is output. Therefore, the pressure change can be reflected by the change of the electric signal in the detection circuit, so that the pressure detection function is realized. The temperature sensing region of the sensing region 223 may implement temperature detection through a PN junction diode circuit. The sensing element 22 integrated with the temperature and pressure detecting function of the back pressure type improves the degree of integration, contributing to a reduction in the volume of the sensor 100.

Of course, in some other embodiments, the sensing element 22 may not be provided with the sensing cavity 222, i.e., the core part 221 of the sensing element 22 may be in a film shape, which seals the first opening 131 of the guide hole 13. The guide hole 13 is a passage of the sensor 100.

The fixing manner between the core portion 221 and the fitting portion 111 includes one of adhesion, eutectic bonding, sintering fixation, and glass micro-fusion fixation. In actual processing and manufacturing, the fixing and sealing between the core part 221 and the matching part 111 can be realized by selecting a sealant adhesive and a eutectic welding mode, and the process is simple and easy to realize. Referring to fig. 9 and 10, the core portion 221 and the mating portion 111 (specifically, the protruding portion 32 in fig. 9) are fixed by the sealant M, and the sealant M can also seal therebetween. Fluid does not readily leak from the guide hole 13 and the sensing chamber 222 to the receiving chamber 200.

In some embodiments, the pilot hole 13 includes a small diameter section 133 and a large diameter section 134. The sensing chamber 222 is located at one side of the axial direction of the small diameter section 133, and the large diameter section 134 is located at the other side of the axial direction of the small diameter section 133. The small diameter section 133 communicates the sensing cavity 222 with the large diameter section 134, and the large diameter section 134 communicates the small diameter section 133 with the exterior of the sensor 100. The small diameter section 133 facilitates the sealing between the core part 221 and the mating part 111, and the smaller size of the channel structure facilitates the stability of the sealing connection between the core part 221 and the mating part and reduces the difficulty of sealing. The small diameter section 133 can be in millimeter scale, which is advantageous for reducing the size of the sensing element 22 and further for miniaturization of the sensor 100.

The fitting portion 111 may be a part of the structure of the housing portion 1, and the housing portion 1 further includes other structures, such as a metal sleeve, etc., the other structures may be an integral structural member with the fitting portion 11, the other structures may also be an integral member with the fitting portion 11, and the fitting portion 11 and the other structures are fixed together by fixing means, such as welding, glue, etc.

When the sensing element 22 integrates both temperature and pressure detection functions, a temperature difference is easily generated since the temperature sensing region of the sensing element 22 is relatively distant from the fluid inlet port of the guide hole 13, i.e., the second opening 132. For better heat conduction, the material of the matching portion 111 is metal, and optionally, at least a partial area of the second surface 212 of the first substrate 21 is a non-conductive insulating area, where no circuit or electronic component is disposed on the first substrate 21. The insulating region of the first substrate 21 is at least partially in direct contact with the mating portion 111. This is not likely to cause short circuits or affect signal measurements.

Of course, in other embodiments, whether the second surface 212 of the first substrate 21 includes the non-conductive insulating region may not be limited, that is, the second surface 21 of the first substrate 21 may include the conductive region and may also include the insulating region. Although the material of the matching portion 111 is metal, the sensor 100 further includes an adhesive portion 14, as shown in fig. 6, the adhesive portion 14 is located between the first substrate 21 and the matching portion 111, and the first substrate 21 is fixed to the matching portion 111 through the adhesive portion 14. The adhesive portion 14 may be a gel of an insulating material, and the corresponding adhesive portion 14 may function as an insulator.

As shown in fig. 6 and 7, in order to prevent the first substrate 21 from rotating or shaking in the housing portion 1 as much as possible, the housing portion 1 may further include a plurality of positioning pillars 15 protruding from the engaging portion 111, and correspondingly, the first substrate 21 is provided with a hole 214 matching with the positioning pillars 15, and the positioning pillars 15 may be at least partially received in the hole 214. In the assembling process, the first substrate 21 can be positioned in the assembling process through the hole cavity 214 and the positioning column 15 of the housing portion 1, and the first substrate 21 is not easy to rotate or shake in the housing portion 1, which is beneficial to processing and manufacturing.

In some embodiments, the housing portion 1 includes a first housing 11 and a second housing 12, and the first housing 11 includes a cylindrical portion 112, a bent portion 113, and a fitting portion 111. One end of the cylindrical body 112 in the axial direction (i.e., the vertical direction in fig. 6) is connected to the fitting portion 111, and the other end is connected to the bent portion 113. The barrel portion 112 is disposed around the first base plate 21. The bent portion 113 extends from the cylindrical portion 112 in the axial direction of the cylindrical portion 112. The first substrate 21 is located between the second shell 12 and the matching portion 111, and the bending portion 113 presses against the second shell 12. The first case 11 and the second case 12 are fixed together to form a receiving space in which the sensing assembly is received.

As for the first housing 11, in some embodiments, the cylindrical portion 112 and the bent portion 113 are an integral structure, and the cylindrical portion 112 and the fitting portion 111 are a separate structure. The fitting portion 111 includes a cross arm portion 31 and a projection 32, and the projection 32 projects from the cross arm portion 31 toward the second surface 212 of the first substrate 21. The fitting portion 111 thus forms a stepped structure at the portion where the arm portion 31 and the projection 32 are connected, which facilitates positioning and assembly of the barrel portion 112. The barrel 112 includes a distal end portion 33, and the distal end portion 33 is located on a side of the barrel 112 away from the bent portion 113 in the axial direction. The end portion 33 of the cylindrical body 112 is located at the periphery of the protrusion 32, and the cylindrical body 112 may cooperate with the step structure in order to achieve the sealing of the housing portion 1, in particular the first housing 11. The tip end portion 33 is welded and fixed to the arm portion 31 (as at position a in fig. 7), or the tip end portion 33 is welded and fixed to the boss portion 32 near the inner peripheral side of the boss portion 32 (as at position B in fig. 7).

The present application provides an alternative assembly method, when assembling the sensor 100, the fitting portion 111 and the sensing element 22 can be fixed first, for example, by selecting an adhesive method, the core portion 221 of the sensing element 22 is fixed on the top of the protruding portion 32 by the sealant M, and the sensing cavity 222 of the sensing element 22 is communicated with the guide hole 13 of the fitting portion 111. Then, the adhesive part 14 is arranged in a smearing manner in a partial area of the top of the protruding part 32, and then the first substrate 21 is fixed with the matching part 111 through the adhesive part 14, and the positioning column 15 can be arranged to protrude from the protruding part 32, so that the positioning column 15 extends into the hole 214 of the first substrate 21, and thus the first substrate 21 can be limited in rotation. The bent portion 113 extends in the longitudinal direction in the same vertical state as the barrel portion 112, and then a housing portion including the barrel portion 112 and the vertical bent portion 113 is fitted around the periphery of the first substrate 21, and the tip portion 33 of the barrel portion 112 and the lateral arm portion 31 are fixed by laser welding or the tip portion 33 is fixed by laser welding on the inner side of the protruding portion 32 and the outer peripheral side of the protruding portion 32. The second shell 12 and the first base plate 21 are at least partially aligned in the longitudinal direction, the second shell 12 is press-mounted above the first base plate 21, the first base plate 21 is clamped and positioned between the second shell 12 and the matching part 111, and then the vertical bending part 122 is pressed inwards to form a flanging through a tool. The bending portion 122 can press against the second shell 12, and the second shell 12 presses against the first substrate 21. Therefore, the second housing 12 can be stably mounted with respect to the first housing 11 without dropping.

In another embodiment of the present application, referring to fig. 11, the sensing assembly further includes a first substrate 21, a second substrate 51, a first piece 4 and a second piece 5, wherein the second substrate 51 is at least partially received in the receiving cavity 200. The first member 4 is fixed to the first substrate 21 and electrically connected thereto. The second member 5 is fixed to the second substrate 51 and electrically connected thereto. The first substrate 21 is spaced apart from the second substrate 51. At least part of the first piece 4 and at least part of the second piece 5 are both located between the first base plate 21 and the second base plate 51.

One of the first and

second members

4, 5 is provided with a recess 241 and the other comprises an extension 251 matching the recess 241. In fig. 11, the first member 4 is illustrated as being provided with a recess 241 and the second member 5 as including an extension 251. Of course, it is also possible in other ways for the first part 4 to comprise the projection 251 and for the second part 5 to be provided with the recess 241. The protruding portion 251 is at least partially received in the groove 241, and the first member 4 and the second member 5 are electrically connected by contact. And the first piece 4 and the second piece 5 are positioned and assembled by the cooperation of the groove 241 and the protruding part 251.

The first substrate 21 and the second substrate 51 may be different circuit boards, and the second substrate 51 may reduce the problem that the first substrate 21 carrying all circuits is easily oversized. This also facilitates a reduction in the radial dimension of the sensor 100 by the two circuit boards. The first substrate 21 and/or the second substrate 51 may be provided with a circuit and circuit elements to perform noise reduction, signal amplification, signal compensation, and other processing on the fluid pressure signal or the temperature signal sensed by the sensing element 22, so as to improve the quality of the signal.

In an assembly manner of the sensor including the first substrate 21 and the second substrate 51, the bending portion 113 of the first shell 11 presses the second shell 12, the second shell 12 can press the upper surface of the second substrate 51, the second substrate 51 indirectly presses the first substrate 21 in a manner that the second member 5 extends into the groove 241 of the first member 4, and the first substrate 21 is pressed against the upper surface of the matching portion 111 under stress. The overall assembly structure is thus relatively simple and robust. The first substrate 21 and the second substrate 51 are positioned and connected by the first member 4 and the second member 5.

There are various fixing methods of the first substrate 21 and the first member 4, and in one of the fixing methods provided in the present application, the first substrate 21 is provided with a hole, a part of the first member 4 is inserted into the hole, and then the first member 4 is fixed to the peripheral wall of the hole formed in the first substrate 21 by soldering or the like. The fixing manner of the second substrate 51 and the second member 5 is the same, and the description thereof is omitted.

In order to transmit the signal sensed by the sensing element 22 to the outside, as shown in the figure, the second shell 12 may be provided with a plurality of fitting holes 121, and the sensor 100 may include a plurality of conductive members 40, and the conductive members 40 are at least partially received in the fitting holes 121. As shown in fig. 4 to 5, the conductive member 40 is a metal spring. A first end of the conductive member 40 abuts against a conductive region 25 (pad) formed at an upper surface of the second substrate 51, a middle portion of the conductive member 40 is received in the fitting hole 121 of the second case 12, and a second end of the conductive member 40 extends upward beyond the second case 12 from the middle portion. The first end of the conductive member 40 is used for electrically connecting with the second substrate 51, and the second end of the conductive member 40 is used for electrically connecting with components outside the sensor 100, for example, the second end may interfere with circuit boards inside other valve components, i.e., a signal sensed by the sensing element 22 may be conducted to the circuit board of the valve component, which facilitates further control of the valve component. The fitting hole 121 has a larger aperture size on the side of the second case 12 closer to the second base plate 51 than on the side farther from the second base plate 51. In some embodiments, in a direction away from the second substrate 51 along the axial direction of the fitting hole 121, the fitting hole 121 is a tapered hole with a gradually decreasing hole diameter, and the conductive member 40 is a tapered spring adapted to the hole diameter of the fitting hole 121. That is, the conductive member 40 may be a tapered spring having a small upper portion and a large lower portion, and the conductive member 40 may be in a compressed state after being connected to another circuit board, which is advantageous to improve the stability of the connection between the conductive member 40 and an external circuit board.

Of course, the second housing 12 may be formed by insert molding the conductive member 40. As shown in fig. 14 and 15, the conductive member 40 may be in the form of a pin. The second housing 12 is made of plastic, and the second housing 12 is formed by injection molding. The upper end of the conductive member 40 is a terminal for connecting other components, and the other end of the conductive member 40 is electrically connected to the second substrate 51, for example, by a spring, or the two can be in direct contact.

The first shell 11 can be made of metal material, the metal material is used for conveniently processing and flanging to form the bending portion 113, the forming difficulty is reduced, and meanwhile, the metal material is used for conveniently welding and fixing the tail end portion 33 of the barrel portion 112 and the matching portion 111. The first housing 11 is made of metal, so as to reduce electromagnetic interference (EMI) from the outside to the electronic components inside the sensor 100. The second housing 13 may be of a plastic material. This is advantageous for reducing costs and weight of the sensor 100. The second case 13 is an insulating member so that the first case 11 and the conductive member 40 can be insulated and isolated from each other.

In some embodiments, the first shell 11 may be a metal piece made of aluminum or a metal piece made of stainless steel, and the metal piece made of aluminum has a light weight, so that when the sensor 100 is used in an automobile thermal management system, the light weight design of the whole automobile is facilitated. The metal piece made of stainless steel is slightly heavier than the metal piece made of aluminum, but the metal piece made of stainless steel has the advantage of being convenient to weld. At least a part of the first housing 11 made of Metal material may be manufactured by Die casting (Die casting), extrusion Molding, or Metal Injection Molding (MIM).

Referring to fig. 12, in some embodiments, the projection 32 includes a support arm 321, and the support arm 321 is located between the barrel portion 112 and the first base plate 21. The support arm 321 contacts a surface of the second substrate 51 adjacent to the first substrate 21. The second shell 12 presses against the second substrate 51, and the second substrate 51 presses against the supporting arms 321. In this way, the supporting arm 321 can provide a certain supporting force for the second substrate 51, and the supporting arm 321 can provide more peripheral protection for the first substrate 21, so as to reduce the influence of the welding of the barrel portion 112 and the mating portion 111 on the first substrate 21.

In some embodiments, the sensing element 22 may be a separate pressure detection element. As shown in fig. 17, the sensing region 223 of the core portion 221 includes a pressure sensing region. The sensing assembly further includes a temperature sensing member 26, the temperature sensing member 26 and the sensing element 22 are of a split structure, so as to work independently, and the temperature sensing member 26 is electrically connected to the first substrate 21. The temperature sensing member 26 is at least partially located on the side of the surface of the matching portion 111 close to the first substrate 21, and the temperature sensing member 26 is at least partially accommodated in the notch portion 23. The material of the matching portion 111 is metal, and the temperature sensing element 26 is directly contacted with the matching portion 111 or fixed by bonding with a heat conducting adhesive. The metal material of the matching part 111 has good thermal conductivity, and can conduct the heat of the fluid to the temperature sensing element 26, the temperature sensing element 26 can be a patch type thermistor, and the resistance of the thermistor type temperature sensor is reduced along with the increase of the temperature. The size of a temperature sensing element corresponding to the patch type thermistor is small, and the size of some products is about 1.0mm multiplied by 0.5 mm. Accordingly, the temperature sensing member 26 can conduct heat through the fitting portion 111 made of a metal material without directly contacting the fluid, and accordingly, the temperature sensing member 26 can be prevented from being corroded and impacted by the fluid, which is beneficial to prolonging the service life thereof.

The guide hole 13 having the small diameter section 133 and the large diameter section 134 may be formed in a split type structure in the fitting portion 111 in order to reduce the difficulty in processing and manufacturing the fitting portion 111. As shown in fig. 16 and 17, the sensing region 223 of the core portion 221 includes a pressure sensing region and/or a temperature sensing region. The material of the matching portion 111 is metal, and the matching portion 111 includes a first sub-portion 17 and a second sub-portion 18, that is, the first sub-portion 17 and the second sub-portion 18 are both made of metal. The first sub-section 17 has a hole portion 171 of uniform radial dimension. The second sub-portion 18 is at least partially received in the hole portion 171. The second sub-portion 18 is fixed to the core 221 in a sealing manner. The small diameter section 133 is disposed on the second sub-portion 18. The bore portion 171 includes the large diameter section 134, that is, at least a portion of the cell structure of the bore portion 171 not filled by the second sub-portion 18 forms the large diameter section 134. At the time of processing, the first sub-portion 17 of the fitting portion 111 may be provided with a hole portion 171 penetrating therethrough. Such hole portions 171 having uniform hole diameters in the axial direction are relatively easier to machine. The second sub-portion 18 is also provided with a through hole, which is a small diameter section 133.

At least a part of the peripheral wall 172 of the first sub-portion 17 forming the hole portion 171 is attached to the outer peripheral side of the second sub-portion 18, i.e., the first sub-portion 17 and the second sub-portion 18 can be tightly fitted in direct contact. Or the peripheral wall 172 of the first sub-portion 17 forming the hole portion 171 is welded integrally with the outer peripheral side of the second sub-portion 18 (see the position C in fig. 16).

Referring to fig. 19 and 20, an embodiment of the present application further provides a valve assembly 300, which includes the sensor 100 of the above embodiment, the valve assembly 300 further includes a valve body 301, the sensor 100 is fixedly mounted on the valve body 301, and the valve body 301 includes a first flow passage 302.

In the cross-sectional structure shown in fig. 20, a sealing member 91 is further provided between the fitting portion 111 and the valve body 301 of the sensor 100, the valve body 301 is provided with a mounting cavity, and the sensor 100 is at least partially accommodated in the mounting cavity of the valve body 301. The sealing member 91 may be pressed between the wall portion of the valve body portion 301 forming the mounting chamber and the fitting portion 111 of the housing portion 1. The housing portion 1 and the valve body portion 301 are sealed by the sealing member 91, so that the guide hole 13 forms a fluid-tight passage allowing fluid to flow in the axial direction thereof.

The valve assembly 300 further includes a compression nut 92, in the case of the sensor 100, the fitting portion 111 of the first housing 12 is radially outwardly protruded with respect to the cylindrical body portion 112, at least a part of the outwardly protruded structure is fitted with the compression nut 92, the compression nut 92 is annular and is provided on an outer peripheral side of the cylindrical body portion 112, an outer periphery of the compression nut 92 is screwed with the valve body portion 301, and the compression nut 92 is pressed on an upper side of the fitting portion 111 to fix the sensor 100 and the valve body portion 301 together.

The valve assembly 300 provided in the embodiments of the present application may further include a fluid control assembly fixed to the valve body 301. The fluid control component can be an electronic expansion valve and is used for controlling the flow of the refrigerant in the automobile air conditioning system to realize the throttling of the refrigerant. The fluid control assembly correspondingly comprises a coil assembly and other structures, and redundant description is not repeated for the fluid control assembly.

The above embodiments are only used for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood based on the descriptions of directions such as "front", "back", "left", "right", "upper", "lower", etc. for those skilled in the art, and although the present application has been described in detail in the present application with reference to the above embodiments, those skilled in the art should understand that those skilled in the art can still make modifications or equivalent substitutions on the present application, and all technical solutions and modifications thereof that do not depart from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims

1. A sensor, comprising a housing portion and a sensing assembly; the sensor is also provided with a containing cavity and a channel; the shell part is positioned at the periphery of the accommodating cavity; the sensing assembly comprises a first substrate and a sensing element; the first substrate is at least partially positioned in the accommodating cavity;

the shell part is provided with a guide hole which is at least one part of the channel; the core part is fixed with the shell part and seals one end of the channel; the channel is not communicated with the accommodating cavity.

2. The sensor according to claim 1, wherein the circuit substrate includes a first surface and a second surface on different sides in a thickness direction thereof; the shell part comprises a matching part positioned on the side of the second surface of the first substrate; the guide hole penetrates through the matching part;

the guide hole is formed with a first opening at an inner side surface of the housing portion near the first substrate, and the core portion and the fitting portion are fixed at a periphery of the first opening.

3. The sensor of claim 2, wherein the sensing element is provided with a sensing cavity, the sensing cavity being in communication with the guide hole; the sensing region is exposed to the sensing cavity and at least a portion of the sensing region is opposite the first opening;

the sensing region comprises a pressure sensing region and a temperature sensing region; the matching part is made of metal;

wherein the sensor further comprises a viscose part; the adhesive part is positioned between the first substrate and the matching part, and the first substrate is fixed with the matching part through the adhesive part; or at least a partial region of the second surface of the first substrate is a non-conductive insulating region, and the insulating region is at least partially in contact with the matching part.

4. The sensor according to claim 2 or 3, wherein the housing portion includes a first case and a second case, the first case including a barrel portion, a bent portion, and the fitting portion; one end of the barrel body part in the axial direction is connected with the matching part, and the other end of the barrel body part in the axial direction is connected with the bending part; the barrel portion is disposed around the first substrate; the bending part extends from the barrel part to the axial lead direction of the barrel part; the first substrate is located between the second shell and the matching portion, and the bending portion abuts against the second shell.

5. The sensor of claim 4, wherein the barrel portion and the bend are of unitary construction; the barrel body part and the matching part are of split structures;

the mating portion includes a cross arm portion and a projection projecting from the cross arm portion toward the first substrate second surface; the barrel part comprises a tail end part which is positioned on one side of the barrel part far away from the bending part in the axial direction; a tip end portion of the barrel portion is located at a periphery of the projection portion; the tip end portion is welded and fixed to the arm portion, or the tip end portion is welded and fixed to the projecting portion near the inner peripheral side of the projecting portion.

6. The sensor of claim 5, wherein the sensing assembly further comprises a second substrate, a first member, and a second member, the second substrate being positioned in the receiving cavity; the first piece is fixed with the first substrate and electrically connected with the first substrate; the second part is fixed with the second substrate and is electrically connected with the second substrate; the first substrate and the second substrate are arranged at intervals; at least a portion of the first piece and at least a portion of the second piece are both located between the first substrate and the second substrate;

one of the first piece and the second piece is provided with a groove, and the other piece comprises an extending part matched with the groove; the extending part is at least partially accommodated in the groove, and the first piece is electrically connected with the second piece.

7. The sensor of claim 6, wherein the projection includes a support arm located between the barrel portion and the first substrate; the supporting arm is in contact with the surface of the second substrate close to the first substrate; the second shell is pressed against the second substrate, and the second substrate is pressed against the supporting arm.

8. The sensor of claim 2, wherein the sensing assembly further comprises a temperature sensing member, the temperature sensing member and the sensing element being of a separate structure, the sensing region comprising a pressure sensing region; the temperature sensing part is electrically connected with the first substrate; the temperature sensing piece is at least partially positioned on the side of the surface, close to the first substrate, of the matching part, and the temperature sensing piece is directly contacted with the matching part or is fixedly adhered through heat-conducting glue.

9. Sensor according to claim 3 or 8, characterized in that the guide hole (13) comprises a small diameter section and a large diameter section; the sensing cavity is positioned on one side of the small-diameter section in the axial direction, and the large-diameter section is positioned on the other side of the small-diameter section in the axial direction; the small-diameter section is communicated with the sensing cavity and the large-diameter section;

the first substrate is provided with a notch part penetrating through the first substrate along the thickness direction of the first substrate, and at least part of the sensing element is accommodated in the notch part;

the core portion is fixed to the mating portion by one of bonding, eutectic welding, and sintering fixation;

the first substrate comprises a plurality of conductive areas positioned on the first surface; the sensing element further comprises a binding line electrically connecting the core part and the conductive region of the first substrate.

10. The sensor of claim 9, wherein the sensing region comprises a pressure sensing region and a temperature sensing region; the matching part is made of metal;

the matching part comprises a first sub-part and a second sub-part, and the first sub-part is provided with a hole part; the second sub-part is at least partially accommodated in the hole part; the second sub-part is fixed with the core part; the small-diameter section is arranged on the second sub-part; the bore portion includes the large diameter section; at least a partial area of the peripheral wall of the hole formed by the first sub-part is attached to the outer periphery of the second sub-part, or the peripheral wall of the hole formed by the first sub-part and the outer periphery of the second sub-part are welded into a whole.