CN113108104A - Sensor device and valve assembly - Google Patents

Abstract

A sensor device is provided that includes a substrate assembly, a housing, and a first seal structure; the substrate assembly comprises a substrate body and at least one sensing element; the substrate body is provided with a first side surface and a second side surface which are arranged oppositely; the sensing element is positioned on the side of the second side surface; the substrate body comprises a second conductive part, and the second conductive part comprises contact parts positioned on the first side surface and the second side surface of the substrate body; the sensing element is electrically connected with the contact part of the second conductive part on the second side surface; the housing includes a bottom wall portion and a side wall portion; the bottom wall part is positioned at the side of the second side surface of the substrate body; the side wall part is at least partially positioned at the periphery of the substrate body; the first sealing structure is positioned between the substrate body and the shell and is respectively contacted with the substrate body and the shell, and the substrate body is in sealing fit with the shell through the first sealing structure. The application provides a sensor device wholly seals the position few, simple structure.

Description

Sensor device and valve assembly

Technical Field

The application relates to the technical field of sensors, in particular to a sensor device and a valve assembly.

Background

In some application scenarios, it is necessary to provide sensors to detect relevant parameters of the working medium, such as temperature signals and/or pressure signals. As shown in fig. 1, the sensor assembly 100 in the related art includes a rectangular pressure sensor element 130, a middle plate assembly 140, and a temperature sensor element 170. The end of the mid-plate assembly forms a tubular member 165, the wires 160 of the temperature sensor 170 extend within the elongated tubular member 165 and are connected to the circuit board 120 through a hole in the mid-plate assembly from the side, the pressure sensor element 130 is positioned above the mid-plate assembly 140, and the housing of the sensor assembly 100 has an inlet opening 175 that delivers fluid to the surface of the pressure sensor element 130 that senses pressure for pressure sensing purposes.

The related art sensor assembly requires sealing of the midplane assembly 140 to the housing 150 and sealing between the midplane assembly and the rectangular pressure sensor element 130. The sensor device in the related art has the disadvantages of complex structure, more sealing positions and poor controllability of the sealing effect.

Disclosure of Invention

The purpose of the present application is to provide a sensor device having a small number of sealing positions and a simple overall structure.

A first aspect of the present application provides a sensor device comprising a substrate assembly, a housing, and a first seal structure;

the substrate assembly comprises a substrate body and at least one sensing element; the sensing element is used for directly or indirectly contacting with the fluid to sense pressure and/or temperature; the substrate body is provided with a first side surface and a second side surface which are arranged oppositely; the sensing element is positioned on the side of the second side surface of the substrate body; the substrate body comprises a second conductive part, and the second conductive part comprises a plurality of contact parts positioned on the second side surface of the substrate body; the sensing element is electrically connected with the contact part of the second conductive part on the second side surface;

the housing includes a bottom wall portion and a side wall portion; the bottom wall part is positioned on the side of the second side surface of the substrate body; the side wall part is at least partially positioned at the periphery of the substrate body; the first sealing structure is positioned between the substrate body and the shell and is respectively contacted with the substrate body and the shell, and the substrate body is in sealing fit with the shell through the first sealing structure.

The second aspect of the present application further provides a valve assembly, which includes a valve body and the sensor device described above, the sensor device is fixedly connected to the valve body, the valve body is provided with a first channel for fluid to flow through, and the sensing element can directly or indirectly sense a pressure signal and/or a temperature signal of the fluid in the first channel.

The application provides a sensor device has realized the sealed cooperation relation between base plate body and the shell through first seal structure, is favorable to reducing the sealed position of whole product, and sensor device's structure is simpler.

Drawings

Fig. 1 is a schematic structural view of a temperature and pressure sensor in the related art;

FIG. 2 is a schematic perspective view of a sensor device according to the present application;

FIG. 3 is an exploded perspective view of the sensor device of FIG. 2 of the present application;

FIG. 4 is a schematic cross-sectional view of a sensor device of the present application;

FIG. 5 is an enlarged view of a portion of the sensor device of the present application;

FIG. 6 is a schematic view of an assembly structure of a substrate assembly and a first conductive portion of a sensor device according to the present invention;

FIG. 7 is a schematic view of a cover structure of a sensor device according to the present application;

FIG. 8 is a bottom view of a base plate assembly of the sensor device of the present application;

FIG. 9 is a schematic cross-sectional view of a substrate assembly of the sensor device of the present application;

FIG. 10 is a perspective view of a valve assembly provided herein;

FIG. 11 is an exploded perspective view of the valve assembly of FIG. 10 of the present application;

fig. 12 is a schematic cross-sectional view of a valve assembly of the present application.

Detailed Description

Referring to fig. 2 to 12, the present application provides a sensor device 100, which can be integrated with various valve components, such as a valve component separately installed on a valve body, or integrated with an electronic expansion valve, a thermostatic expansion valve, a solenoid valve, etc., to form a valve component, and the sensor device 100 can be used to detect a pressure parameter and/or a temperature parameter of a refrigerant, and of course, can also be used to detect a pressure parameter and/or a temperature parameter of other fluids.

The sensor device 100 of the present application includes a substrate assembly 1, a housing 3, and a first seal structure 41.

The substrate assembly 1 comprises a substrate body 11 and at least one sensing element 12. The sensing element 12 is used to directly or indirectly sense the pressure and/or temperature of the fluid. In particular, the sensing element 12 has a sensing region. The sensing region may be in direct contact with the fluid or in indirect contact with the fluid to perform the function of sensing the associated signal. The sensing element 12 may integrate both pressure sensing and temperature sensing functions or even more sensing functions. Of course, the sensing element 12 alone may also perform the sensing function of only one of the pressure and the temperature.

The substrate body 11 has a first side surface 111 and a second side surface 112 on both sides in the thickness direction thereof, respectively. The sensor device 100 can transmit signals to other devices receiving or processing temperature/pressure signals through a plurality of first conductive parts 10, the first conductive parts 10 are located on the first side 111 of the substrate body 11, and the sensing elements 12 are located on the second side 112 of the substrate body 11.

The substrate body 11 includes a second conductive portion 13, the second conductive portion 13 includes a plurality of contact portions 131 located on the first side surface 111 and the second side surface 112 of the substrate body 11, and the sensing element 12 is electrically connected to the contact portions 131 of the second conductive portion 13 on the second side surface 112. Specifically, the sensing element 12 may be directly fixed to the second side 112 of the substrate body 11 and contact the contact portion 131.

The second conductive part 13 and the substrate body 11 form an integral structure, and as shown in fig. 9, the substrate body 11 includes a plurality of second cavities 113, and the second conductive part 13 is at least partially accommodated in the second cavities 113. And the second conductive part 13 is connected with the cavity wall of the second cavity 113 formed by the substrate body 11 in a sealing way, and the second conductive part 13 is respectively contacted with the sensing element 12 and the first conductive part 10.

The sensor device 100 further comprises a cover 2, the cover 2 being provided with a plurality of first through holes 201 extending through the cover 2, the first conductive portion 10 being at least partially received in the first through holes 201. In some embodiments, the cover 2 abuts against at least a partial region of the first side 111 of the substrate body 11, the cover 2 includes a main body 20 and a protrusion 21 located at the periphery of the main body 20, and a plurality of first through holes 201 are provided in the main body 20, so that the first through holes 201 are disposed through the main body 20.

The housing 3 is provided with a bottom wall portion 31 and a side wall portion 32, the bottom wall portion 31 is located on the side of the second side surface 111 of the substrate body 11, the side wall portion 32 is located at least partially on the periphery of the substrate body 11, the first sealing structure 41 is located between the substrate body 11 and the housing 3, the first sealing structure 41 is in contact with the substrate body 11 and the housing 3, respectively, and the substrate body 11 and the housing 3 are in sealing fit through the first sealing structure 41. The first sealing structure 41 may be a sealing gasket with elasticity, or a sealant, or a solder structure melted by the sealing.

At least a partial region of the bottom wall portion 31 can realize indirect support of the substrate body 11, the bottom wall portion 31 has a first cavity 310, the first cavity 310 is at least partially opposite to a sensing region of the sensing element 12, and a projection of the sensing region of the sensing element 12 on a plane perpendicular to a thickness direction of the substrate body 11 is at least partially located within a projection range of the first cavity 310 on the plane. The side wall portion 32 is at least partially located at the periphery of the substrate body 11, and the side wall portion 32 may be integrally connected with the bottom wall portion 31 or both may be directly welded and fixed to form an integral structure.

The side wall portion 32 is provided with a stopper projection 321, at least a part of the lid body 2 is closer to the substrate body 11 than the stopper projection 321, and a projection of the stopper projection 321 on a plane perpendicular to the thickness direction of the substrate body 11 at least partially overlaps a projection of the lid body 11 on the plane. Specifically, the limiting protrusion 321 is located on a side of the protruding portion 21 away from the substrate body 11, and at least a partial region of a surface of the limiting protrusion 321 and the protruding portion 21 away from the first side 111 along the thickness direction of the substrate body 11 can contact to achieve limiting, that is, the cover 2 is limited from leaving the substrate body 11 along the thickness direction of the substrate body 11.

The bottom wall portion 31 and the cover body 2 of the housing 3 of the sensor device 100 are respectively located at two sides of the substrate body 11, and the limiting protrusion 321 of the side wall portion 32 of the housing 3 limits the cover body 2 to be away from the substrate body 11, which is beneficial to realizing the fixation among the substrate body 11, the housing 3 and the cover body 2, thereby correspondingly reducing the overall welding steps and the processing and assembling complexity of the sensor device 100.

The side wall portion 32 includes a first wall section 322 and a second wall section 323, the first wall section 322 is connected between the bottom wall portion 31 and the second wall section 323, the second wall section 323 is connected between the first wall section 322 and the restraining projection 321, and the side wall portion 32 is vertically disposed with respect to the bottom wall portion 31 at both the first wall section 322 and the second wall section 323. The first wall section 322 is located at the periphery of the substrate body 11, and the second wall section 323 is located at the periphery of the protrusion 21.

One specific assembly and molding process among the cover 2, the substrate assembly 1, the first conductive part 10 and the housing 3 is as follows: the side wall portion 32 is first extended in the longitudinal direction while being kept upright, the substrate assembly 1, the first conductive portion 10, and the cover 2 are sequentially fitted into a cylindrical space surrounded by the side wall portion 32 and the bottom wall portion 31, and at this time, the free end of the side wall portion 32 is bent inward by a tool to form a stopper protrusion 321. Therefore, the cover 1 can be stably attached to the board assembly 1 and is not easily dropped.

The wall thickness of the side wall portion 32 at the first wall section 322 is greater than the wall thickness of the side wall portion 32 at the second wall section 323, so that the side wall portion 32 forms a supporting step 33 at the junction of the first wall section 322 and the second wall section 323, and the protrusion 21 of the cover body 2 is clamped and fixed between the supporting step 33 and the limiting protrusion 321.

The support step 33 has a support plane 331 which contacts the protrusion 21, and the thickness of the substrate body 11 is equal to the height of the support plane 331 with respect to the bottom wall portion 31, so that the first side 111 of the substrate body 11 is flush with the support plane 331, and the substrate body 11 is sandwiched and fixed between the main body portion 20 of the lid body 2 and the bottom wall portion 31.

In other embodiments, the edge of the protrusion 21 may be aligned with the edge of the substrate body 11, and the substrate body 11 and the protrusion 21 are clamped and fixed together between the limit projection 321 and the bottom wall portion 31 of the housing 3.

The substrate assembly 1 further includes a cover cylinder portion 14, the cover cylinder portion 14 is at least partially located in the first bore 310, so that the first bore 310 can accommodate at least part of the cover cylinder portion 14, the cover cylinder portion 14 is disposed around the sensing element 12, the cover cylinder portion 14 and the substrate body 11 form a third bore 141 for accommodating the sensing element 12, the cover cylinder portion 14 itself can be a hollow cylinder structure, and when the cover cylinder portion 14 is connected with the substrate body 11, the substrate body 11 blocks one side of the hollow structure of the cover cylinder portion 14 from opening, so that the cover cylinder portion 14 and the substrate body 11 jointly enclose the third bore 141. The substrate assembly 1 further includes a fluorine-containing silicone gel 15 filled in the third cavity 141, and the fluorine-containing silicone gel 15 covers the sensing element 12 so that the sensing element 12 is not in direct contact with the fluid. The inner side wall of the skirt portion 14 may provide a strong adhesive force for the fluorine-containing silicone 15, and the fluorine-containing silicone 15 covers the sensing element 12 so that the sensing element is not in direct contact with the fluid. This avoids corrosion of the pins of the sensing element 12 by the fluid and provides some cushioning between the sensing element 12 and the fluid to protect the sensing element 12. The fluorine-containing silica gel 15 has certain flexibility, and when the sensing element 12 is used for measuring the fluid pressure, the fluid pressure is firstly applied to the fluorine-containing silica gel 15, and then the fluorine-containing silica gel 15 can transmit the fluid pressure to the sensing element 12 for sensing the pressure. And the fluorine-containing silica gel 15 has stronger thermal conductivity than the common silica gel material, when the sensing element 12 is used for measuring the fluid temperature, due to the existence of the fluorine-containing silica gel 15, the fluorine-containing silica gel 15 can improve the accuracy of the temperature signal detected by the sensing element 12.

The bottom wall portion 31 may be provided with a recess or indentation in which the first sealing structure 41 is at least partially received. When the fluid temperature is high, the first sealing structure 41 may be deformed, and the groove or the notch positions the first sealing structure 41, so that the sealing effect of the first sealing structure 41 may be improved, and the first sealing structure 41 may be an elastic sealing gasket.

In some embodiments, the substrate body 11 is a PCB, and the second conductive part 13 includes a metal connecting part 130 located in the second cavity 113, and contact parts 131 respectively located at two sides of the substrate body 11, where the contact parts 131 may be embodied as exposed metal pads located at the first side 111 and the second side 112. The metal connection part 130 has a hollow cylindrical shape, and the hollow portion of the metal connection part 130 forms a via hole of the PCB. The metal connection part 130 is connected to the metal pad. This is advantageous in achieving the electrical connection relationship between the elements located on both sides in the thickness direction of the substrate body 11.

The substrate assembly 1 includes a first sensing element 121 and a second sensing element 122, wherein the first sensing element 121 is a MEMS (Micro electro mechanical System) pressure integrated chip, the size of the MEMS pressure integrated chip is small, and the size of a common MEMS pressure integrated chip is generally in the millimeter level, or even smaller. A Wheatstone bridge with 4 resistors is manufactured on the surface of a silicon cup film of the pressure sensor integrated chip prepared by adopting the MEMS technology, and when the circuit is accessed, when no pressure acts on the silicon cup film, the Wheatstone bridge is balanced, and the output voltage is 0. When pressure acts on the silicon cup film, the balance of the Wheatstone bridge is broken, and voltage is output. Therefore, the pressure change can be reflected by the change of the electric signal in the detection circuit, so that the pressure detection function is realized.

The second sensing element 122 is a chip thermistor, and the thermistor type temperature sensor decreases in resistance as the temperature increases. The size of a temperature sensor corresponding to the patch type thermistor is small, and the size of some products is about 1.0mm multiplied by 0.5 mm.

The sensor device 100 manufactured by using the first sensing element 121 and the second sensing element 122 is more advantageous for product miniaturization. The MEMS pressure integrated chip and the patch thermistor are respectively welded and fixed with the metal bonding pad 131 based on respective pins. In some embodiments, the substrate assembly 1 may further include a conditioning chip 123, which is used to perform denoising, signal amplification, signal compensation, and the like on the pressure signal or the temperature signal, so as to improve the quality of the signal. The related functions of the MEMS pressure integrated chip, the surface mount thermistor, and the conditioning chip described above are correspondingly disclosed in the prior art, and the functions of the elements are not described in detail herein.

The top surface of the main body 20 of the cover 2 away from the first side surface 111 is higher than the top surface of the protruding portion 21 away from the first side surface 111. The cover 2 abuts on at least a partial region of the first side surface 111 of the substrate body 11. The size of the aperture of the first through hole 201 on the side of the cover 2 close to the substrate body 11 is larger than the size of the aperture on the side far from the substrate body 11. In some embodiments, in a direction away from the substrate body 11 along the axial direction of the first through hole 201, the first through hole 201 is a tapered hole with a gradually decreasing hole diameter, and the first conductive part 10 is a tapered spring adapted to the hole diameter of the first through hole 201. Referring to fig. 3, the present embodiment provides five first conductive parts 10 in the form of conical springs, the five first conductive parts 10 functioning to provide a temperature signal output point, a pressure signal output point, a protective earth output point, an input voltage position, and a ground position, respectively.

The first conductive part 10 includes a first sub-part 101 located in the first through hole 201 and a second sub-part 102 connected to a side of the first sub-part 101 away from the substrate body 11, the second sub-part 102 is located outside the first through hole 201, and the first sub-part 101 abuts against or is welded to the metal pad 131 on the first side surface 111 of the substrate body 11. The end of the second sub-portion 102 exposed to the outside of the first through hole 201 may be abutted or soldered to an external circuit board. The first conductive part 10 in the form of a conical spring can be in a compressed state during operation, which is advantageous for improving the stability of the connection of the first conductive part 10 with the substrate body 11 and with an external circuit board.

Based on the same inventive concept, the present application further provides a valve assembly 200, the valve assembly 200 includes a valve body 60 and the sensor device 100 of the previous embodiment, the sensor device 100 is fixedly connected with the valve body 60, the valve body 60 is provided with a first channel 601 for fluid flowing, and the sensing element 12 can directly or indirectly sense a pressure signal and/or a temperature signal of the fluid in the first channel 601.

As illustrated by the sensor device 100 of fig. 10-12 being disposed on the valve body 60, the valve body 60 has a central axis in a first direction (i.e., the transverse direction shown in fig. 12). There is also provided in some embodiments of the present application a valve assembly 200, wherein the valve assembly 200 further comprises a flow regulating unit 300, the valve body 60 is further provided with a second passage 602, the flow regulating unit 300 is fixedly connected with the valve body 60, and the flow regulating unit 300 can regulate the flow of the second passage 602. The second channel 602 is not in communication with the first channel 601.

The flow rate adjusting unit 300 may be embodied as an electronic expansion valve, and the flow rate adjusting unit 300 includes a coil assembly 301, a valve member 302, and the like. The coil assembly 301 includes a stator coil, and the valve member 302 includes a valve seat, a valve core, and a rotor assembly. The valve seat is fixed to the valve body 60, and the stator coil is fitted around the outer periphery of the rotor assembly. The rotor assembly can drive the valve core to move, so that the valve core can move relative to the valve seat, the valve seat is provided with a valve port, and the valve core changes the flow cross-sectional area of the second channel 602 at the valve port by being close to and far away from the valve port, so that throttling can be formed at the valve port. The valve body 60 has a first cavity 601 and the sensor device 100 is at least partially received in the first cavity 603. The valve body 60 has a mounting portion 604 formed corresponding to the wall of the first chamber 603, a second seal portion 42 provided between the bottom wall portion 31 and the mounting portion 604, and the second seal portion 42 is pressed between the bottom wall portion 31 and the mounting portion 604.

The valve assembly 200 further includes a compression nut 400, a portion of the bottom wall portion 31 is radially outwardly protruded with respect to the side wall portion 32, the outwardly protruded portion is engaged with the compression nut 400, the compression nut 400 is press-fitted to a side of the bottom wall portion 31 away from the fitting portion 604, and an outer periphery of the compression nut 400 is screw-coupled with the valve body 60 to fix the sensor device 100 and the valve body 60 together.

Referring to fig. 12, first channel 601 includes a first sub-channel 6011 and a second sub-channel 6012 that axially intersect. The openings formed in the valve body 60 on both axial sides of the second sub-passage 6012 serve as a fluid inlet and a fluid outlet, respectively. The axial direction of first sub-passage 6011 and the axial direction of second sub-passage 6012 may be arranged perpendicularly.

A first opening 71 and a second opening 72 are respectively formed on the valve body 60 on both sides of the first sub-passage 6011 in the axial direction, wherein the first sub-passage 6011 communicates with the second sub-passage 6012 through the first opening 71, the second opening 72 of the first sub-passage 6011 faces the sensing element 12, and the size of the first opening 71 is larger than that of the second opening 72. Accordingly, the bottom end face of the bottom wall portion 31 may be provided as a flat surface, the bottom wall portion 31 is provided at the second opening 71, and the first bore 310 or the penetration hole 141 may communicate with the first sub-passage 6011. The first opening 71 at the lower end of the first sub-channel 6011 is flared relative to the second opening 72 at the upper end, and when fluid enters the first channel 601 along the port at one end of the second sub-channel 6012, the fluid flowing at a high speed can reach the vicinity of the sensing element 12 more quickly through the flare at the flaring position, which is beneficial to reducing the temperature difference of the fluid reaching the position near the sensing element 12 and improving the accuracy of the sensing of the fluid temperature by the sensing element 12.

The above embodiments are only used for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood based on the descriptions of directions such as "front", "back", "left", "right", "upper", "lower", etc. for those skilled in the art, and although the present application has been described in detail in the present application with reference to the above embodiments, those skilled in the art should understand that those skilled in the art can still make modifications or equivalent substitutions on the present application, and all technical solutions and modifications thereof that do not depart from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims (12)

1. A sensor device (100) includes a substrate assembly (1), a housing (3), and a first seal structure (41);

the substrate assembly (1) comprises a substrate body (11) and at least one sensing element (12); the sensing element (12) is for direct or indirect contact with a fluid to sense pressure and/or temperature; the substrate body (11) is provided with a first side surface (111) and a second side surface (112) which are arranged oppositely; the sensing element (12) is positioned on the side of the second side surface (112) of the substrate body (11); the substrate body (11) comprises a second conductive part (13), and the second conductive part (13) comprises a plurality of contact parts (131) positioned on the second side surface (112) of the substrate; the sensing element (12) is electrically connected with the contact part (131) of the second conductive part (13) on the second side surface (112);

the housing (3) comprises a bottom wall portion (31) and a side wall portion (32); the bottom wall portion (31) is located on the side of the second side surface (111) of the substrate body (11); the side wall part (32) is at least partially located at the periphery of the substrate body (11); the first sealing structure (41) is located between the substrate body (11) and the housing (3) and the first sealing structure (41) is respectively contacted with the substrate body (11) and the housing (3), and the substrate body (11) is in sealing fit with the housing (3) through the first sealing structure (41).

2. The sensor device (100) of claim 1, wherein the base plate assembly (1) comprises a cover cylinder portion (14), the cover cylinder portion (14) being connected to the second side surface (112) of the base plate body (11); the bottom wall portion (31) is further provided with a first bore (310) capable of accommodating at least part of the cover cylinder portion (14);

the shroud cylinder (14) being disposed around the sensing element (12); the cover cylinder part (14) and the substrate body (11) form a third cavity (141) for accommodating the sensing element (12); the substrate assembly (1) further comprises fluorine-containing silica gel (15) filled in the third cavity (141); the fluorine-containing silicone gel (15) coats the sensing element (12) so that the sensing element (12) is not in direct contact with a fluid.

3. The sensor device (100) according to claim 1, wherein the sensor device (100) further comprises a cover (2), the cover (2) being at least partially located on the side of the first side (111) of the substrate body (11);

the side wall part (32) comprises a limit convex part (321) for limiting the cover body (2) to be far away from the substrate body (11) along the thickness direction of the substrate body (11), at least part of the cover body (2) is closer to the substrate body (11) than the limit convex part (321), and the projection of the limit convex part (321) on a plane vertical to the thickness direction of the substrate body (11) is at least partially overlapped with the projection of the cover body (2) on the plane; the substrate body (11) is clamped and fixed between the cover body (2) and the bottom wall portion (31).

4. A sensor device (100) according to claim 3, wherein the cover (2) comprises a main body (20) and a protrusion (21) located at the periphery of the main body (20);

the surface of the protruding part (21) far away from the first side surface (111) along the thickness direction of the substrate body (11) is in contact with the limiting convex part (321);

the main body part (20) is provided with a plurality of first through holes (201) penetrating through the main body part (20);

the sensor device (100) further comprises a plurality of first conductive parts (10), the first conductive parts (10) are positioned on the side of the first side surface (111) of the substrate body (11), and the second conductive parts (13) further comprise a plurality of contact parts (131) positioned on the first side surface (111) of the substrate body (11); the first conductive part (10) is electrically connected with the second conductive part (13) at a contact part (131) of the first side surface (112); the first conductive part (10) is at least partially accommodated in the first through hole (201).

5. Sensor device (100) according to claim 4, characterized in that the cover (2) is at least partially in area abutting contact with the first side (111) of the substrate body (11);

the size of an orifice of the first through hole (201) on one side, close to the substrate body (11), of the cover body (2) is larger than that of an orifice on one side far away from the substrate body (11);

the first conductive part (10) comprises a first sub-part (101) positioned in the first through hole (201) and a second sub-part (102) connected to one side of the first sub-part (101) far away from the substrate body (11), and the second sub-part (102) is positioned outside the first through hole (201); the first sub-section (101) and the second conductive section (13) are in contact with or welded to each other at a contact section (131) on the first side surface (112).

6. The sensor device (100) according to claim 4, characterized in that the side wall portion (32) comprises a first wall section (322) and a second wall section (323), the first wall section (322) being connected between the bottom wall portion (31) and the second wall section (323); the second wall section (323) is connected between the first wall section (322) and the stop ledge (321); the first wall section (322) is located at the periphery of the substrate body (11), and the second wall section (323) is located at the periphery of the protrusion (21);

the side wall portion (32) extends perpendicularly with respect to the bottom wall portion (31) at both the first wall section (322) and the second wall section (323); the wall thickness of the side wall part (32) at the first wall section (322) is larger than that of the side wall part (32) at the second wall section (323), so that the side wall part (32) forms a supporting step (33) at the connection of the first wall section (322) and the second wall section (323), and the protruding part (21) of the cover body (2) is clamped and fixed between the supporting step (33) and the limiting protruding part (321).

7. The sensor device (100) according to claim 1, wherein the first seal structure (41) is a ring-shaped gasket having elasticity, and the first seal structure (41) is compressed between the second side surface (112) of the substrate body (11) and the bottom wall portion (31).

8. The sensor device (100) of claim 1, wherein the substrate body (11) has a number of second cavities (113), the second conductive portion (13) further comprising a metal connection (130) at least partially located within the second cavities (113); the metal connecting parts (130) are hermetically connected with the substrate body (11) at the second cavity (113), and the metal connecting parts (130) are respectively connected with the contact parts (131) on the first side surface (111) and the second side surface (112) of the substrate body (11).

9. The sensor device (100) according to claim 1, wherein the substrate body (11) is a PCB board, the substrate assembly (1) comprises a first sensing element (121) and a second sensing element (122), wherein the first sensing element (121) is a MEMS pressure integrated chip and the second sensing element (122) is a patch thermistor; the MEMS pressure integrated chip and the patch type thermistor are respectively welded and fixed with the contact part (131) based on respective pins.

10. A valve assembly (200) comprising a valve body (60) and a sensor device (100) according to any one of claims 1 to 9, the sensor device (100) being fixedly connected to the valve body (60), the valve body (60) being provided with a first channel (601) for fluid flow, the sensing element (12) being capable of directly or indirectly sensing the pressure and/or temperature of the fluid in the first channel (601).

11. The valve assembly (200) of claim 10, wherein the valve assembly (200) further comprises a flow regulating unit (300), the valve body (60) is further provided with a second passage (602) for fluid flow, the flow regulating unit (300) is fixedly connected with the valve body (60), and the flow regulating unit (300) can regulate the flow of the second passage (602).

12. The valve assembly (200) of claim 11, wherein the first channel (601) comprises a first sub-channel (6011) and a second sub-channel (6012) that intersect in an axial direction; a first opening (71) and a second opening (72) are respectively formed on the valve body (60) on two axial sides of the first sub-channel (6011), wherein the first sub-channel (6011) is communicated with the second sub-channel (6012) through the first opening (71), the second opening (72) of the first sub-channel (6011) is opposite to the sensing element (12), and the size of the first opening (71) is larger than that of the second opening (72).

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