CN114689115A - Sensor with a sensor element - Google Patents

Abstract

A sensor, comprising: the device comprises a shell, a substrate assembly and a sensing unit. The sensor is provided with a flow channel extending along the vertical direction, the substrate assembly comprises a substrate, an electronic element and a plurality of conducting paths, the substrate comprises a first surface and a second surface which are positioned at two opposite sides of the thickness direction of the substrate, the flow channel is at least partially positioned at the lower side of the second surface, and the electronic element is installed on the first surface. The shell is provided with an inner cavity positioned on the upper side of the second surface, and the shell is connected with the substrate in a sealing manner through gluing, so that the inner cavity is not communicated with the flow channel. The shell and the base plate are connected in a gluing and sealing mode, and the sealing performance between the inner cavity and the flow channel is good.

Description

Sensor with a sensor element

Technical Field

The present application relates to a measuring device, and more particularly, to a sensor.

Background

A sensor in the related art, comprising: the device comprises a shell, a substrate assembly and a sensing unit. The sensor has an inner cavity and a flow channel extending in a vertical direction, the substrate assembly includes a substrate and a plurality of electronic components, and the inner cavity and the flow channel are located on opposite sides of the substrate in a thickness direction. The substrate comprises a first surface and a second surface which are respectively positioned at the upper side and the lower side of the thickness direction of the substrate, the flow channel is at least partially positioned below the second surface, and the electronic element is arranged on the first surface. The sensing unit is electrically connected with the electronic element through a conductive path in the substrate assembly. A sealing ring is compressed between the base plate and the inner wall of the shell so as to realize non-communication and sealing between the inner cavity and the flow channel. In the case of fatigue failure or uncompression of the sealing ring, the sealing performance of the sensor is poor, and the refrigerant in the flow channel risks leaking into the inner cavity.

Disclosure of Invention

The application aims to provide a sensor with good sealing performance.

To achieve the above object, the present application provides a sensor comprising: the sensor comprises a shell, a substrate assembly and a sensing unit, wherein the sensor is provided with an inner cavity and a flow passage; the base plate subassembly includes base plate and a plurality of electronic component, inner chamber and runner are located the ascending different sides of base plate thickness direction respectively, electronic component part at least is located the inner chamber, sensing unit and electronic component electric connection, wherein, the shell has first bonding portion, the base plate has second bonding portion, the sensor still including bond in first bonding portion with sealed glue between the second bonding portion, thereby first bonding portion with second bonding portion sealing connection, the inner chamber with the runner does not communicate.

Compare in correlation technique, this application shell has first bonding portion, and the base plate has the second bonding portion, first bonding portion with sealing connection between the second bonding portion has sealed glue, has realized sealing between inner chamber and the runner to the sealing performance of sensor is better.

Drawings

FIG. 1 is a schematic perspective view of a first embodiment of the sensor of the present application.

Fig. 2 is a perspective view of the sensor shown in fig. 1 from another angle.

Fig. 3 is an exploded view of the sensor shown in fig. 1.

Fig. 4 is another exploded view of the sensor shown in fig. 3.

Fig. 5 is a schematic perspective cross-sectional view of the sensor shown in fig. 1.

Fig. 6 is another schematic perspective cross-sectional view of the sensor shown in fig. 1.

Fig. 7 is a further schematic perspective cross-sectional view of the sensor shown in fig. 1.

Fig. 8 is a schematic longitudinal cross-sectional view of the sensor shown in fig. 1.

Fig. 9 is another schematic longitudinal cross-sectional view of the sensor shown in fig. 1.

Fig. 10 is an enlarged schematic view of the sensor shown in fig. 9 at circle a.

Fig. 11 is an exploded schematic view of the temperature sensing unit shown in fig. 9.

Fig. 12 is an exploded view of another perspective view of the temperature sensing unit shown in fig. 11.

FIG. 13 is a schematic perspective cross-sectional view of a second embodiment of the sensor of the present application.

Fig. 14 is a schematic longitudinal cross-sectional view of the sensor shown in fig. 13.

FIG. 15 is a schematic perspective cross-sectional view of a third embodiment of the sensor of the present application.

FIG. 16 is a schematic view, partially in section, of a fourth embodiment of a sensor according to the present application.

Fig. 17 is a schematic longitudinal cross-sectional view of a fifth embodiment of the sensor of the present application.

FIG. 18 is a schematic longitudinal cross-sectional view of a sixth embodiment of the sensor of the present application.

Fig. 19 is a schematic perspective view of a seventh embodiment of the sensor of the present application.

Fig. 20 is an exploded perspective view of the sensor shown in fig. 19.

Fig. 21 is a schematic longitudinal cross-sectional view of the sensor shown in fig. 19.

Fig. 22 is a schematic perspective view of an eighth embodiment of the sensor of the present application.

Fig. 23 is an exploded perspective view of the sensor shown in fig. 22.

Fig. 24 is a schematic longitudinal cross-sectional view of the sensor shown in fig. 22.

Detailed Description

Exemplary embodiments of the present application will be described in detail below with reference to the accompanying drawings. If several embodiments exist, the features of these embodiments may be combined with each other without conflict. When the description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The statements made in the following exemplary detailed description do not represent all implementations consistent with the present application; rather, they are merely examples of apparatus, products, and/or methods consistent with certain aspects of the present application, as recited in the claims of the present application.

The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present application. As used in the specification and claims of this application, the singular form of "a", "an", or "the" is intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the terms "first," "second," and the like, as used in the description and claims of this application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms a, an, etc. do not denote a limitation of quantity, but rather denote the presence of at least one. Unless otherwise indicated, the terms "front," "back," "left," "right," "up," "down," and the like in this application are used for convenience of description and are not limited to a particular position or spatial orientation. The word "comprise" or "comprises", and the like, is an open-ended expression meaning that an element that precedes "includes" or "comprising" includes "that the element that follows" includes "or" comprises "and its equivalents, that do not preclude the element that precedes" includes "or" comprising "from also including other elements. In this application, the meaning of "a number" if it occurs is two as well as more than two.

As shown in fig. 1 to 12, a sensor 100 according to a first embodiment of the present application includes: the electronic device includes a housing 10, a substrate assembly 40, a sensing unit 50, and a conductive member 60.

As shown in fig. 2 to 8, the sensor 100 has an inner cavity 102 and a flow channel 101 extending in the vertical direction Y, and the substrate assembly 40 includes a substrate 41, a plurality of conductive paths (not numbered), and a plurality of electronic components 45. The thickness direction Y of the substrate 41 is the same as the vertical direction, and therefore, the same reference numeral Y is used. The substrate 41 includes a first surface 411 located on an upper side in the substrate thickness direction Y, a second surface 412 located on a lower side in the substrate thickness direction 41, and a peripheral wall surface 413 connected between the first surface 411 and the second surface 412. The flow channel 101 is located at the lower side in the thickness direction of the substrate 41, and the cavity 102 is located at the upper side in the thickness direction of the substrate 41, that is, the cavity 102 and the flow channel 101 are respectively located at different sides in the thickness direction of the substrate 41. The plurality of electronic components 45 are at least partially disposed in the cavity 102, and the sensing unit 50 is electrically connected to the electronic components 41 through conductive paths in the substrate. The flow channel 101 is located at the lower side of the second surface 412, and the electronic component 45 and the conductive member 60 are located at least partially at the upper side of the first surface 411.

As shown in fig. 10, the housing 10 has a first bonding portion 18, the substrate 41 has a second bonding portion 46, and the sensor 100 further includes a sealant 103 bonded between the first bonding portion 18 and the second bonding portion 46, so that the first bonding portion 18 and the second bonding portion 46 are hermetically connected, and the inner cavity 102 is not communicated with the flow channel 101. According to the sealing structure, the flow channel 101 and the inner cavity 102 are sealed through the sealing glue 103, so that the sealing structure has more reliable sealing performance compared with the sealing ring, and the sealing structure is likely to generate fatigue failure or cause refrigerant leakage due to non-compaction. In addition, the sealing ring 30 may be omitted by sealing with a sealant, so as to reduce the assembly process of the sealing ring 30 and the manufacturing cost of the sensor 100, which will be described in further detail in the following embodiments.

As shown in fig. 3 to 5, the substrate 41 has a substantially disk-like shape, and the peripheral wall surface 413 has a substantially annular surface shape. The peripheral wall 413 is provided with a guide slot 416, the inside of the housing 10 is provided with a guide post 117, and the guide slot 416 and the guide post 117 cooperate to facilitate the guiding installation of the substrate 41 and position the installation direction of the substrate 41. In other alternative embodiments, the substrate 41 may have a square shape, a diamond shape, a polygonal shape, or a special shape, as long as the substrate 41 can be accommodated and fixed in the inner cavity 102 of the housing 10, and the shape of the substrate 41 is not limited in the present application. The substrate 41 may be a ceramic substrate 41, and the conductive paths may be conductive traces such as copper traces disposed within the substrate 41, thereby forming a ceramic circuit board. The substrate 41 of the substrate assembly 40 may be a Printed Circuit Board (PCB) made of a material such as resin, and the conductive paths may be conductive paths such as copper traces provided in the substrate 41.

The electronic component 45 is Surface Mount (SMT) mounted on the first surface 411 of the substrate 41. The sensing unit 50 may be mounted on the first surface 411 or the second surface 412 of the substrate 41 by a Surface Mount Technology (SMT), and the sensing unit 50 may also be mounted on the first surface 411 or the second surface 412 of the substrate 41 by a Through hole (Through hole).

The housing 10 includes a first housing 11 and a second housing 12, and the second housing 12 is at least partially accommodated inside the first housing 11. The first housing 11 has a terrace portion 13, a cylindrical portion 14 extending upward from the terrace portion 13, an abutting portion 15 extending downward from the terrace portion 13, and a bent portion 16 bent from the cylindrical portion 14. The bent portion 16 is formed by caulking and bending from the cylindrical portion 14, the bent portion 16 abuts against the second case 12, and the second case 12 abuts against the substrate 41 to fix the substrate 41 inside the case 10. The docking portion 15 is adapted to be inserted into a valve body mounted to a solenoid valve, which may be an electronic expansion valve, or a system pipe, which may be a connection pipe connecting any two of the heat exchanger, the compressor, the solenoid valve, the accumulator, and the gas-liquid separator.

As shown in fig. 3, 8, and 9, the cylindrical portion 14 includes a first cylindrical portion 141 connected to the terrace portion 13 and a second cylindrical portion 142 connected between the first cylindrical portion 141 and the bent portion 16, and the thickness of the first cylindrical portion 141 in the radial direction X is larger than the thickness of the second cylindrical portion 142 in the radial direction X. The outer wall surface 143 of the first tube 141 and the outer wall surface 143 of the second tube 142 are aligned, the first tube 141 has a first protrusion 144 protruding inward relative to the second tube 142, the first protrusion 144 forms a first step 171 with the first inner wall surface 112 of the first housing 11, and the first protrusion 144 forms a second step 172 with the first inner wall surface 112 of the platform 13.

The first housing 11 is a metal member to reduce electromagnetic interference (EMI) from the outside to the electronic components inside the sensor 100, and the second housing 12 is an insulating member to insulate and isolate the first housing 11 from the conductive member 60. Optionally, the first housing 11 may be a metal piece made of aluminum or a metal piece made of stainless steel, and the metal piece made of aluminum has a light weight, so that the light weight of the sensor 100 is facilitated, and when the sensor 100 is used in an automobile thermal management system, the light weight design of the whole automobile is facilitated. Although the metal piece made of stainless steel is slightly heavier than the metal piece made of aluminum, the metal piece made of stainless steel has the advantage of being convenient to weld. The second housing 12 is an insulating member made of plastic and can be manufactured by an injection molding process, and the conductive member 60 is insulated from the first housing 11 by the insulating second housing 12. The first housing 11 made of Metal material may be manufactured by Die casting (Die casting), extrusion Molding, or Metal Injection Molding (MIM).

As shown in fig. 6 and 9, the second housing 12 has a first end 121 and a second end 122, the bent portion 16 abuts against the second end 122, the first end 121 abuts against the first surface 411 of the substrate 41 and the first step portion 171, the bottom surface 173 of the first step portion 171 is substantially located on the same horizontal line as the first surface 411, and the first step portion 171 is provided to position the mounting position of the second housing 12.

As shown in fig. 3, 4 and 7, the second housing 12 is substantially in the shape of an inverted bowl, and the second housing 12 includes a top wall 123, a peripheral wall 127 extending downward from the top wall 123, and an inner cavity 102 surrounded by the top wall 123 and the peripheral wall 127. The top wall 123 includes a first plateau 124 perpendicular to the surrounding wall 127, a second plateau 125 above the first plateau 124, and a rounded transition 126 connecting between the first plateau 124 and the second plateau 125. The second housing 12 has a plurality of channels 128 extending through the second platform 125 in a vertical direction, the plurality of channels 128 are in communication with the inner cavity 102, and the plurality of channels 128 can be uniformly distributed around the axis of the second platform 125. Bending portion 16 is riveted to first platform 124, and conductive member 60 extends through channel 128 of second platform 125.

As shown in fig. 2 to 10, optionally, the first housing 11 includes two separately formed first main housings 111 and a first inner cylinder 116, and the first inner cylinder 116 is welded to the first main housing 111 to form the first housing 11. The first inner barrel 116 includes the first bonding portion 18, the second bonding portion 46 is located below the first surface 411, as shown in fig. 10, and the second bonding portion 46 is located on the second surface 412. In an alternative embodiment, not shown, the second bonding portion 416 is located on the peripheral wall 413, the first bonding portion 18 is located on the inner side wall of the first housing 11, and the sealant 103 is hermetically connected between the peripheral wall 413 and the vertical side of the second step portion 172. The flow channel 101 is disposed in the first inner cylinder 116, and the inner cavity 102 is located between the second housing 12 and the substrate 41. The sealant 103 is connected between the first adhesive portion 18 and the second adhesive portion 46 of the second surface 412. The two separately formed first main housing 111 and first inner cylinder 116 facilitate the bonding between the first housing 11 and the base plate 41, and the first inner cylinder 116 and the base plate 41 may be bonded to form a plate assembly, and then the plate assembly is inserted into the first main housing 111 for laser welding, thereby reducing the bonding difficulty between the first housing 11 and the base plate 41.

As shown in fig. 8 to 10, the first main housing 111 includes a first inner wall surface 112 facing the second surface 412, the top surface 113 of the first inner cylinder 116 is higher than the top surface 113 of the first inner wall surface 112, a gap 19 is formed between the second surface 412 and the first inner wall surface 112, and the sealant 103 is sealingly connected between the gap 19 and the flow channel 101, so that the gap 19 is not communicated with the flow channel 101. The first main housing 111 and the first inner cylinder 116 may be hermetically connected by laser welding, argon arc welding, brazing, or by gluing. The first bonding part 18 of the first inner cylinder 116 is connected with the substrate 41 in a sealing manner by gluing, so that the flow channel 101 is not communicated with the inner cavity 102, and the risk that the refrigerant enters the upper side of the substrate 41 from the flow channel 101 to influence the normal operation of the electronic components is reduced. The present application has more reliable sealing performance against fatigue failure that may occur in the seal ring 30 or refrigerant leakage caused by non-compression due to the sealing of the flow passage 101 and the inner cavity 102 by adhesion. The seal ring 30 may also be omitted by an adhesive seal, which reduces the assembly process of the seal ring 30 and reduces the manufacturing cost of the sensor 100, as will be described in further detail in later embodiments.

As shown in fig. 8, optionally, the first main housing 111 includes a receiving groove 114 recessed relative to the top surface 113 of the first inner wall surface 112, a sealing ring 30 or a cushion pad is disposed in the receiving groove 114, a top portion 301 of the sealing ring 30 or the cushion pad contacts with the second surface 412 of the substrate 41, and a bottom portion 302 of the sealing ring 30 or the cushion pad contacts with the groove bottom wall 115 forming the receiving groove 114. The sealing ring 30 or the buffer pad provided here can provide a buffer effect when the substrate 41 is mounted in place, thereby reducing the risk of hard contact between the second surface 412 of the substrate 41 and the first inner wall surface 112 of the first main case 111, and damage to the substrate 41. The illustrated embodiment employs a seal ring 30 that provides a cushioning effect while also providing a double seal, thereby enhancing the redundancy of the seal of the sensor 100.

As shown in fig. 3 to 6, the conductive member 60 is a coil spring. The conductive member 60 includes a first end 61, a second end 62, and an intermediate portion 63 connected between the first end 61 and the second end 62, the first end 61 abuts against the first surface 411 of the substrate 41, the intermediate portion 63 is received in the channel 128 of the second housing 12, and the second end 62 extends upward from the intermediate portion 63 beyond the second housing 12. A first end 61 of the conductive member 60 is electrically connected to the conductive path and a second end 62 of the conductive member 60 is adapted to be electrically connected to a component external to the sensor 100. The conductive piece 60 of the coil spring structure is abutted against the circuit board inside the electromagnetic valve, so that the sensing signal can be conducted to the electromagnetic valve, the structure is simple, the assembly is convenient, and the further control of the electromagnetic valve is facilitated.

The sensing unit 50 is electrically connected to the conductive path. In the illustrated embodiment, the sensing unit 50 includes a temperature sensing unit 51 and a pressure sensing unit 52, and in an alternative embodiment, only at least one of the temperature sensing unit 51 and the pressure sensing unit 52 may be included. The pressure sensing unit 52 is disposed on the first surface 411 of the substrate 41, the substrate 41 is provided with a guide hole 414 penetrating in a vertical direction, one side of the guide hole 414 is communicated with the flow channel 101, and the other side of the guide hole 414 is sealed by the pressure sensing unit. The pressure sensing unit 52 is disposed above the guiding hole 414, that is, the pressure sensing unit 52 is a backpressure type pressure sensing unit. The pressure sensing unit 52 is disposed on the first surface 411 of the substrate 41, and compared with the second surface 412 of the substrate 41, the risk of corrosion of the refrigerant to the pressure sensing unit 52 and the pins thereof is reduced, and corresponding corrosion-resistant glue protection can be omitted, so that the structure is simpler and the production cost is lower. The refrigerant may flow from the flow passage and flow to the pressure sensing unit through the guide hole 414, so that the pressure sensing unit 50 senses the pressure of the refrigerant.

The temperature sensing unit 51 comprises a temperature sensing part 511 and a pin part 512, the temperature sensing part 511 is positioned below the substrate 41, and the temperature sensing part 511 is exposed in the flow channel 101 or extends downwards to exceed the flow channel 101, so that the temperature sensing part 511 can be fully contacted with the refrigerant, the temperature difference of the refrigerant flowing from the flow channel 101 is reduced, and the sensitivity and the accuracy of the refrigerant temperature detection are improved. The lead part 512 is connected to the substrate 41 and electrically connected to the conductive path of the substrate assembly 40, the temperature change of the refrigerant causes the current change in the temperature sensing part 511 to be conducted to the substrate assembly 40 through the lead, and the electronic component 45 includes a conditioning chip, a processing chip, a resistor, a capacitor, and the like, so that the real-time temperature of the refrigerant can be calculated.

When the pressure sensing unit 52 is in contact with the refrigerant, the pressure change of the refrigerant is converted into an electrical signal, and the corresponding chip on the substrate assembly 40 calculates the real-time pressure of the refrigerant, so that the real-time monitoring of the temperature and the pressure of the refrigerant is realized, and the accurate control and the intelligent design of the electromagnetic valve are facilitated. The temperature sensing unit 51 may be an NTC temperature sensing element, the pressure sensing unit 52 may be a MEMS pressure sensing element, a MEMS (Micro electro mechanical System) pressure integrated chip, and the size of the MEMS pressure integrated chip is smaller, and the size of a common MEMS pressure integrated chip is generally in the millimeter level, or even smaller. A Wheatstone bridge with 4 resistors is manufactured on the surface of a silicon cup film of the pressure sensor integrated chip prepared by adopting the MEMS technology, and when a circuit is connected, when no pressure acts on the silicon cup film, the Wheatstone bridge is balanced, and the output voltage is 0. When pressure acts on the silicon cup film, the balance of the Wheatstone bridge is broken, and voltage is output. Therefore, the pressure change can be reflected by the change of the electric signal in the detection circuit, so that the pressure detection function is realized.

As shown in fig. 11 and 12, the temperature sensing unit 51 further includes a protection sleeve 514 for protecting the pin portion 512, the protection sleeve 514 is made of an insulating material resistant to corrosion by refrigerant, and optionally, the protection sleeve 514 is made of a plastic material. The protection sleeve 514 includes an upper end portion 515, a lower end portion 516, and two pin holes 517 that penetrate the upper end portion 515 and the lower end portion 516 in the vertical direction (the length direction of the protection sleeve 514). The lead portion 512 penetrates through two lead holes 517 of the lower end portion 516, and penetrates through the lead holes 517 from the upper end portion 515 to be welded to the substrate 41. The upper end portion 515 may be physically secured, or glued, soldered, etc. to the second surface 412 of the base plate 41, thereby enhancing the stability of the protective sleeve 514 when impacted by a refrigerant. The protection sleeve 514 can also be directly clamped between the temperature sensing part 511 and the second surface 412, so that the structure is simpler and the production process is less. The lower end 516 is in close proximity to the temperature sensing unit 511, thereby protecting the lead portion 512 from the refrigerant to the maximum extent. The design of the protective sleeve 514 reduces the risk of refrigerant impingement and corrosion on the pin portion 512 of the temperature sensing unit 51, thereby improving the service life of the sensor 100. The lead portion 512 may also be coated with a coating that is resistant to corrosion by the refrigerant, thereby further reducing the corrosion of the lead portion 512 by the refrigerant. The upper end 515 is a generally cylindrical shape and the lower end 516 is two cylindrical shapes coupled to each other, which can provide a fool-proof design to prevent the protection sleeve 514 from being inserted in a wrong direction.

As shown in fig. 13 to 14, the sensor according to the second embodiment of the present application mainly differs from the first embodiment in that the entire sensor is free of the sealing ring 30, and sealing is achieved by the sealant adhesion between the first adhesion portion 18 and the second adhesion portion 416 of the second surface 412, thereby saving the cost of the sealing ring 30, and in that a more reliable seal can be provided against fatigue failure and compression failure of the sealing ring 30, thereby reducing the risk of refrigerant leakage. The second embodiment retains the receiving groove 114 of the first embodiment in which the seal ring 30 is placed, so that the existing mold of the first embodiment can be used, thereby reducing the manufacturing cost of mold switching.

As shown in fig. 15, in order to provide a sensor according to the third embodiment of the present application, the third embodiment is different from the second embodiment mainly in that the receiving groove 114 is eliminated, the first inner wall surface 112 and the second surface 412 are both horizontally disposed and are disposed in parallel and spaced apart from each other, and the mold is simpler in manufacturing relative to the receiving groove 114.

As shown in fig. 16, in order to provide a sensor according to a fourth embodiment of the present disclosure, the fourth embodiment is mainly different from the previous embodiments in that the first adhesive portion 18 includes a contact surface 181 abutting against the second adhesive portion 416 of the second surface 412 and a receiving groove 182 recessed downward from the contact surface 181, and the receiving groove 182 is filled with the sealant 103. The arrangement of the accommodating groove 182 facilitates the automatic dispensing of the sealant 103.

As shown in fig. 17, the fifth embodiment is different from the previous embodiments mainly in that the first housing 11 and the first adhesive part 18 are a single piece, and the first adhesive part 18 is a part of the first housing 11, in order to provide a sensor according to the fifth embodiment of the present application. The first housing 11 may be integrally formed by Metal Die casting (Die casting), extrusion Molding (MIM), or Metal powder Injection Molding (MIM). The first housing 11 includes a first inner wall surface 112 facing the second surface 412, the first bonding portion 18 is formed by protruding upward from the first inner wall surface 112, a top surface 113 of the first bonding portion 18 is higher than the first inner wall surface 112, a gap 19 is formed between the first inner wall surface 112 and the second surface 412, the arrangement of the gap 19 reduces hard contact between the substrate 41 and the first inner wall surface 112 of the first housing 11 when the substrate is mounted, and of course, a sealing ring or a cushion pad may be filled in the gap 19 to further play a role of buffering.

As shown in fig. 18, in order to provide a sensor according to a sixth embodiment of the present invention, the sixth embodiment is mainly different from the fifth embodiment in that the first bonding portion 18 includes a contact surface 181 contacting the second surface 412 and a receiving groove 182 formed by recessing the contact surface 181 downward, the receiving groove 182 is filled with a sealant, and a cushion pad or a seal ring 30 may or may not be provided in the gap 19.

As shown in fig. 19 to 21, a sensor according to a seventh embodiment of the present invention is different from the first embodiment mainly in the structure of the substrate assembly 40, the conductive member 60, and the sensing unit 50. The substrate assembly 40 may also include a ceramic substrate 41 and a Flexible Printed Circuit (FPC) 44, the FPC 44 is disposed above the ceramic substrate 41, and the FPC 44 is electrically connected to the conductive member 60. Conductive element 60 may be a metal plate with first end 61 of conductive element 60 in physical and electrical communication with flexible circuit board 44, middle portion 63 of conductive element 60 received in channel 128 of second housing 12, and second end 62 of conductive element 60 extending beyond the top surface of second housing 12.

The ceramic substrate 41 includes a sensing region 417, which can directly sense the pressure of the refrigerant when the pressure of the refrigerant is received, thereby directly acting as the pressure sensing unit 52 without an additional MEMS pressure sensor 100 chip. The sensing substrate 41 includes a lower ceramic diaphragm located at the lower end and an upper ceramic plate located above the ceramic diaphragm, the thickness of the lower ceramic diaphragm is smaller than that of the upper ceramic plate, and the lower ceramic diaphragm and the upper ceramic plate form a ceramic capacitor. The lower ceramic diaphragm has a sensing region 417, and the sensing region 417 may be aligned with the plane of or recessed relative to the rest of the lower ceramic diaphragm. The sensing region 417 is electrically connected to three cover wires (not shown), which are embedded in the lower ceramic diaphragm. The substrate assembly 40 further has a conductive pillar electrically connected to the three covering lines, respectively, one end of the conductive pillar is physically connected to the covering line, and the other end of the conductive pillar is exposed out of the sensing substrate. The ceramic pressure sensor is based on the piezoresistive effect, pressure directly acts on the lower surface of the lower ceramic diaphragm to enable the diaphragm to generate tiny deformation, the thick film resistor is printed on the back surface of the ceramic diaphragm to be connected into a Wheatstone bridge, due to the piezoresistive effect of the piezoresistor, the bridge generates a voltage signal which is in direct proportion to the pressure, highly linear and in direct proportion to excitation voltage, the conductive column can conduct the voltage signal to the conductive path and the conditioning chip to conduct corresponding voltage and pressure conversion, and therefore pressure of refrigerant fluid in the flow channel 101 is obtained.

The temperature sensing unit 51 includes a temperature guiding needle 513 and a temperature sensing part 511, the temperature guiding needle 513 extends downward beyond the second surface 412, and the temperature sensing part 511 is located on the upper side of the first surface 411 and is directly contacted with or closely adjacent to the temperature guiding needle 513.

The first housing 11 has a first bonding portion 18 protruding from the first inner wall surface 112, the second bonding portion 416 is located on the second surface 412, a diameter of a cavity 183 formed by the first bonding portion 18 is larger than a diameter of the runner 101, and a projection of the temperature probe 513 in a vertical direction is located outside the runner 101 and located inside the first bonding portion 18 and the cavity 183. The heat conducting pins 513 may be fixed and sealed to the substrate 41 by glass micro-melting and sintering, so that the sealing performance is good. Through the structural design of the temperature-sensing pin 513, the temperature-sensing part 511 can be disposed on the first surface 411 side of the substrate 41, and the temperature-sensing part 511 can be a surface mount NTC structure, so that the impact of the temperature-sensing probe on the refrigerant is reduced. Of course, the temperature sensing unit 51 may also be a pin NTC structure as in the first embodiment.

As shown in fig. 22 to 24, a sensor according to an eighth embodiment of the present application is mainly different from the first embodiment in the structure of a sensing unit 50. The temperature sensing unit 51 and the pressure sensing unit 52 both adopt a patch type structure, the temperature sensing unit 51 is a patch type NTC structure, and the pressure sensing unit 52 is a patch type MEMS structure. The patch type NTC structure is a patch type thermistor, and the thermistor type temperature sensor reduces the resistance along with the increase of the temperature. The size of a temperature sensor corresponding to the patch type thermistor is small, and the size of some products is about 1.0mm multiplied by 0.5 mm. The base plate 41 includes a cylindrical portion 415 protruding downward from the second surface 412, and a sealant 103 is disposed between the cylindrical portion 415 and the first housing 10, so as to achieve a sealed connection. The barrel portion 415 has the second bonding portion 416, the first housing 11 has the first bonding portion 18, and the arrangement direction of the first bonding portion 18, the sealant 103 and the second bonding portion 416 is perpendicular to the thickness direction Y of the substrate and is the same as the radial direction X, so that the sealant 103 can be applied more conveniently and easily. The chip type temperature sensing unit 51 and the chip type pressure sensing unit 52 are wrapped with the corrosion-resistant glue 104, so that the chip type temperature sensing unit 51 and the chip type pressure sensing unit 52 are protected from the corrosion, impact and the like of the refrigerant. Alternatively, the corrosion resistant glue 104 may be a fluorine containing flexible silicon glue.

Sealant 103 may be capable of withstanding the temperature and pressure of the refrigerant, and may be selected to be, for example, an epoxy-based two-component structural adhesive or an epoxy-based one-component structural adhesive.

The above embodiments are only used for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood by those skilled in the art based on the detailed description of the present application with reference to the above embodiments, but those skilled in the art should understand that the present application can be modified or substituted equally by those skilled in the art, and all technical solutions and modifications thereof that do not depart from the spirit and scope of the present application should be covered in the scope of the claims of the present application.

Claims (10)

1. A sensor, comprising: the sensor comprises a shell, a substrate assembly and a sensing unit, wherein the sensor is provided with an inner cavity and a flow passage; the base plate subassembly includes base plate and a plurality of electronic component, inner chamber and runner are located the ascending different sides of base plate thickness direction respectively, electronic component part at least is located the inner chamber, sensing unit and electronic component electric connection, wherein, the shell has first bonding portion, the base plate has the second bonding portion, the sensor still including bond in first bonding portion with sealed glue between the second bonding portion, thereby first bonding portion with the second bonding portion sealing connection, the inner chamber with the runner does not communicate.

2. The sensor of claim 1, wherein: the base plate comprises a first surface positioned on the upper side of the thickness direction of the base plate and a second surface positioned on the lower side of the thickness direction of the base plate, the inner cavity is positioned above the first surface, and the flow channel is positioned below the second surface;

the shell comprises a first shell and a second shell, the second shell is provided with a first end portion and a second end portion, the first end portion is abutted against the first surface of the substrate, the first shell is provided with a platform portion, a cylindrical portion extending upwards from the platform portion and a bending portion bent from the cylindrical portion, and the bending portion is abutted against the second end portion of the second shell.

3. The sensor of claim 2, wherein: the first shell is provided with the runner, the inner cavity is located between the second shell and the substrate, the first shell is an integrated piece, the first bonding portion is a part of the first shell, and the second bonding portion is located below the first surface.

4. The sensor of claim 2, wherein: the first shell comprises a first main shell body and a first inner cylinder body, the flow channel is arranged in the first inner cylinder body, the inner cavity is located between the second shell body and the base plate, the first inner cylinder body is welded in the first main shell body, the first inner cylinder body comprises a first bonding portion, and the second bonding portion is located below the first surface.

5. A sensor as claimed in claim 3, wherein: the first shell comprises a first inner wall face arranged opposite to the second surface, the first bonding portion is formed by upward protruding extension of the first inner wall face, the top face of the bonding portion is higher than that of the first inner wall face, a gap is formed between the first inner wall face and the second surface, the sealant is connected between the gap and the flow channel in a sealing mode, and the gap is not communicated with the flow channel.

6. The sensor of claim 5, wherein: the first bonding portion comprises a contact surface abutted to the second surface and a groove formed by downward depression relative to the contact surface, the groove is filled with the sealant, and a cushion pad or a sealing ring is arranged in the gap.

7. The sensor of claim 4, wherein: the first main shell comprises a first inner wall surface arranged opposite to a second surface, the top surface of the first inner cylinder body is higher than the top surface of the first inner wall surface, a gap is formed between the second surface and the first inner wall surface, the sealant is connected between the gap and the flow channel in a sealing manner, and the gap is not communicated with the flow channel;

the first main casing body and the first interior barrel pass through laser welding sealing connection, the second bonding portion is located the second surface of base plate, the top of barrel in first bonding portion is located.

8. The sensor of claim 7, wherein: the first main casing body still includes the sunken accepting groove that sets up of top surface relative first internal face, set up in the accepting groove and have sealing washer or blotter, the top of sealing washer or blotter contacts with the second surface of base plate, the bottom of sealing washer or blotter contacts with the tank bottom wall that forms the accepting groove.

9. The sensor of claim 2, wherein: the base plate still includes the barrel portion that extends to being close to the runner from the second surface, the barrel portion has the second portion of bonding, first casing has first portion of bonding, the direction of arranging of first portion of bonding, sealed glue, second portion of bonding is perpendicular to the thickness direction of base plate.

10. The sensor of any one of claims 2 to 8, wherein: the temperature sensing unit comprises a temperature sensing unit and a pressure sensing unit, the pressure sensing unit is arranged on the first surface of the substrate, the substrate is provided with a guide groove which penetrates through the substrate along the vertical direction, the pressure sensing unit is arranged above the guide groove, the temperature sensing unit comprises a temperature sensing part and a pin part, the pin part is connected to the substrate, and the temperature sensing part is positioned below the substrate; the first shell is a metal piece, and the second shell is an insulating piece.

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