CN113096538A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
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- CN113096538A CN113096538A CN202110397638.3A CN202110397638A CN113096538A CN 113096538 A CN113096538 A CN 113096538A CN 202110397638 A CN202110397638 A CN 202110397638A CN 113096538 A CN113096538 A CN 113096538A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/56—Means for preventing chafing or fracture of flexible leads at outlet from coupling part
- H01R13/567—Traverse cable outlet or wire connection
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Abstract
A display panel and a manufacturing method thereof, the display panel comprises: the circuit board comprises a substrate, a first wiring pattern, a connecting line, a first printed pattern layer and a second printed pattern layer. The substrate has: the front surface and the back surface are oppositely arranged, the side surface is connected with the front surface and the back surface, and the first chamfer surface is positioned between the front surface and the side surface. The first routing pattern is arranged on the front surface. The connecting line covers the first routing pattern and extends from the front face to the side face at least through the first chamfer face. The first printing pattern layer covers the connecting line and at least extends from the front surface to the first chamfer surface. The second printed design layer covers at least a portion of the first printed design layer and extends at least from the front face to the first chamfered face.
Description
Technical Field
The present invention relates to a display panel and a method for fabricating the same, and more particularly, to a display panel capable of protecting a connection line on a side surface of a substrate and a method for fabricating the same.
Background
In tiled displays (tiling displays), each display panel used for tiling must have a narrow bezel; furthermore, the connecting lines with a sufficiently large area need to be arranged in the narrow frame to achieve low contact resistance.
However, it is not easy to wind the connection line around the boundary of the display panel. After the process of winding the connection wires, the connection wires are usually broken or scratched at the chamfers, and thus, the lines of the display panel may be defective or fail to function.
Disclosure of Invention
The invention provides a display panel and a manufacturing method thereof, which can protect connecting wires positioned at the boundary of the display panel, avoid the fracture of the connecting wires and ensure the normal operation of the display panel.
The invention provides a display panel and a manufacturing method thereof, which can reduce seams among a plurality of display panels in a spliced display and improve the image display quality of the spliced display.
Based on the above, one embodiment of the present invention provides a display panel, including: the circuit board comprises a substrate, a first wiring pattern, a connecting line, a first printed pattern layer and a second printed pattern layer. The substrate has: the front surface and the back surface are oppositely arranged, the side surface is connected with the front surface and the back surface, and the first chamfer surface is positioned between the front surface and the side surface. The first routing pattern is arranged on the front surface. The connecting line covers the first routing pattern and extends from the front face to the side face at least through the first chamfer face. The first printing pattern layer covers the connecting line and at least extends from the front surface to the first chamfer surface. The second printed design layer covers at least a portion of the first printed design layer and extends at least from the front face to the first chamfered face.
In an embodiment of the invention, a distance a is set between an end of the first print pattern layer far from the side surface and the side surface. A distance b is set between one end of the second print pattern layer, which is far from the side surface, and the side surface. A distance c is set between one end of the first trace pattern close to the side surface and the side surface. A distance d is set between one end of the first chamfer surface, which is far away from the side surface, and the side surface; and, the following relationship is satisfied:
a≥b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
in an embodiment of the invention, the first printing pattern layer has a thickness f. The first and second printed pattern layers on the front side have a combined thickness g. The first printing pattern layer and the second printing pattern layer are positioned on the first chamfer surface and have the total thickness h; and, the following relationship is satisfied:
g>f>0，
g>h>0。
in an embodiment of the invention, the first printed pattern layer and the second printed pattern layer extend from the front surface to the side surface through the first chamfered surface. A first printed pattern layer and a second printed pattern layer on the side surfaces, having a total thickness i; and, the following relationship is satisfied:
i>g>f>0，
i>g>h>0，
5μm≤i。
in an embodiment of the invention, the first printing pattern layer and the second printing pattern layer are made of insulating glue; the first printing pattern layer and the second printing pattern layer extend from the front surface to the first chamfer surface and expose the connecting line on the side surface. In an embodiment of the invention, the display panel further includes: the electrical connection layer is arranged on the connecting wire; and a glass external wiring layer disposed on the electrical connection layer.
In an embodiment of the invention, the material of the first printing pattern layer and the second printing pattern layer is conductive adhesive; the first printing pattern layer and the second printing pattern layer extend from the front surface to the side surface through the first chamfer surface and cover the connecting line on the side surface. In an embodiment of the invention, the display panel further includes: the electrical connection layer is arranged on the connecting wire; and a glass external wiring layer disposed on the electrical connection layer.
In an embodiment of the present invention, the shapes of the first printing pattern layer and the second printing pattern layer are: an L shape or a C shape.
In an embodiment of the present invention, the substrate further includes: a second chamfer surface located between the side surface and the back surface. The connecting line, the first printing pattern layer and the second printing pattern layer extend from the front surface to the side surface through the first chamfer surface and extend from the side surface to the back surface through the second chamfer surface.
In an embodiment of the invention, the display panel further includes: the second routing pattern is arranged on the back surface. The connecting line extending to the back covers the second routing pattern and is electrically connected with the first routing pattern and the second routing pattern.
In an embodiment of the present invention, the substrate further includes: a second chamfer surface located between the side surface and the back surface. The connecting line and the first printing pattern layer extend from the front surface to the side surface through the first chamfer surface, and extend from the side surface to the back surface through the second chamfer surface. The second print pattern layer extends from the front surface to the first chamfer surface and from the back surface to the second chamfer surface.
In an embodiment of the invention, a distance a is set between an end of the first print pattern layer far from the side surface and the side surface. A distance b is set between one end of the second print pattern layer, which is far from the side surface, and the side surface. A distance c is set between one end of the first trace pattern close to the side surface and the side surface. A distance d is set between one end of the first chamfer surface, which is far away from the side surface, and the side surface; and, the following relationship is satisfied:
a>b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
in an embodiment of the invention, the first printing pattern layer has a first thickness f. The first printing pattern layer and the second printing layer on the front surface have a total thickness g. The first print pattern layer and the second print layer on the first chamfer surface have a total thickness h. The first printed pattern layer on the side face has a thickness i'; and, the following relationship is satisfied:
g>i’>f>0，
g>i’>h>0。
in an embodiment of the invention, the first trace pattern includes: a plurality of first functional regions and at least one second functional region; the patterns of the first printing pattern layer and the patterns of the second printing pattern layer are stacked in a staggered mode and are arranged above the plurality of first functional areas. The pattern of the first printing pattern layer and the pattern of the second printing pattern layer are overlapped with each other and are arranged above the second functional area.
In an embodiment of the invention, the first printing pattern layer has a thickness f. The first and second printed pattern layers on the front side have a combined thickness g. The first and second printed pattern layers on the side surfaces, which overlap each other, have a total thickness i. First and second printed pattern layers on the side surface and stacked alternately with each other, having a total thickness i ″; and, the following relationship is satisfied:
i > i "> 0, and
i>g>f>0。
in an embodiment of the invention, the display panel further includes: and the pixel units are arranged on the front surface of the substrate. Each pixel unit comprises: red micro-leds, green micro-leds, and blue micro-leds.
An embodiment of the present invention further provides a method for manufacturing a display panel, including: providing a substrate having: the front surface and the back surface are oppositely arranged, the side surface is connected with the front surface and the back surface, and the first chamfer surface is positioned between the front surface and the side surface; forming a first routing pattern on the front surface of the substrate; forming a connecting line on the substrate; the method for forming the connecting line comprises the following steps: forming a film layer on the substrate to cover the first trace pattern and extend from the front surface to the side surface at least through the first chamfer surface; forming a first printing pattern layer on the substrate, covering the film layer, and at least extending from the front surface to the first chamfer surface; forming a second printing pattern layer on the substrate, covering at least one part of the first printing pattern layer, and at least extending from the front surface to the first chamfer surface; and etching the film layer by using the first printing pattern layer and the second printing pattern layer as etching masks to form the connecting line extending from at least the front surface to the side surface through the first chamfer surface.
Based on the above, in the display panel and the manufacturing method thereof according to the embodiments of the invention, at least two printed pattern layers are formed on the connecting lines located at the boundary of the display panel, so that the connecting lines can be well protected, the connecting lines are prevented from being broken, and the normal operation of the display panel is ensured. The first print pattern layer covering the connection line may be a topography buffer layer (a second print pattern layer) which is formed more flat on the first print pattern layer. Moreover, when a plurality of display panels are spliced to form the spliced display, the thickness of the printing pattern layer positioned on the side surface of each display panel is controlled, so that the seam between two adjacent display panels can be reduced, and the image display quality of the spliced display is improved.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic perspective view of a display panel 100 according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of a display panel 100A according to an embodiment of the invention.
Fig. 3 is a schematic cross-sectional view of a display panel 100B according to an embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a display panel 100C according to an embodiment of the invention.
Fig. 5 is a schematic cross-sectional view of a display panel 100D according to an embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of a display panel 100E according to an embodiment of the invention.
Fig. 7 is a schematic diagram illustrating a process of manufacturing the first printed pattern layer 140 and the second printed pattern layer 150 by observing the side surface 116 of the display panel 100C from arrow B in fig. 4.
Fig. 8 is a schematic view of the side surface 116 of the display panel 100E viewed from arrow C in fig. 6, and the manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 is performed.
Fig. 9 is a top view and a side view of a display panel 100F according to an embodiment of the invention.
Fig. 10 is a schematic diagram illustrating a manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 by observing the side surface 116 of the display panel 100F of fig. 9.
Fig. 11 is a schematic cross-sectional view of the display panel 100F taken along the section line D-D' of fig. 9.
Description of reference numerals:
100. 100A, 100B, 100C, 100D, 100E, 100F: display panel
110: substrate
112: front side
114: back side of the panel
116: side surface
118. 118 a: first chamfer surface
118 b: second chamfer plane
120. 120 a: first routing pattern
120 b: second routing pattern
122: first functional region
124: second functional region
130: connecting wire
140: first printing pattern layer
150: second printing pattern layer
160: pixel unit
162: red micro-LED
164: green micro light-emitting diode
166: blue micro light-emitting diode
170: electrical connection layer
180: external wiring layer for glass
210. 310: manufacturing step of first printing pattern layer
220. 222, 320: manufacturing step of second printing pattern layer
a. b, c, d: distance between two adjacent plates
f. i': thickness of
g. h, i ": total thickness
Detailed Description
Fig. 1 is a schematic perspective view of a display panel 100 according to an embodiment of the invention. Referring to fig. 1, a display panel 100 includes: the substrate 110, the first trace pattern 120, the connection line 130, the first printed pattern layer 140, and the second printed pattern layer 150. The substrate 110 has: the front surface 112 and the back surface 114 are oppositely arranged, the side surface 116 connecting the front surface 112 and the back surface 114, and the first chamfer surface 118 positioned between the front surface 112 and the side surface 116. The first trace pattern 120 is disposed on the front surface 112. The connecting line 130 covers the first trace pattern 120 and extends at least from the front surface 112 to the side surface 116 through the first chamfered surface 118. The first printed pattern layer 140 covers the connecting line 130 and extends at least from the front surface 112 to the first chamfered surface 118. The second printed design layer 150 covers at least a portion of the first printed design layer 140 and extends at least from the front side 112 to the first chamfered surface 118.
Referring to fig. 1, the display panel 100 may further include: the pixel units 160 are disposed on the front surface 112 of the substrate 110. Each pixel unit 160 includes: red micro-leds 162, green micro-leds 164, and blue micro-leds 166. A Micro Light Emitting Diode (Micro Light Emitting Diode) includes: self-luminescence, short response time, high luminous efficiency, low power consumption, high contrast, wide working temperature range, high water and oxygen barrier property, long service life and the like. In other embodiments, the pixel unit 160 may also use a sub-millimeter light emitting diode (mini LED), and the invention is not limited to the kind of the light source.
Referring to fig. 1, in the display panel 100, at least two print pattern layers (i.e., a first print pattern layer 140 and a second print pattern layer 150) are formed on the connection line 130 located at the boundary (i.e., the first chamfered surface 118 and the side surface 116) of the display panel 100; in the embodiment of fig. 1, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 of the substrate 110 through the first chamfered surface 118; therefore, the connection lines 130 can be well protected, and the display panel 100 can be ensured to operate normally by avoiding the breakage or damage of the connection lines 130. Also, when a plurality of display panels 100 are tiled, since the thickness of at least two print pattern layers (i.e., the first print pattern layer 140 and the second print pattern layer 150) is thick, the handling margin (handling margin) of the tiling job can be made larger.
Fig. 2 is a schematic cross-sectional view of a display panel 100A according to an embodiment of the invention. In the following embodiments, the dimension and thickness of each film layer can be set to obtain a film layer structure with a preferable strength, thereby providing a better protection effect for the connection line 130.
Referring to fig. 2, in the display panel 100A, a distance a (i.e., the length of the first printed pattern layer 140) is set between an end of the first printed pattern layer 140 away from the side surface 116 and the side surface 116. A distance b (i.e., the length of the second print pattern layer 150) is set between the end of the second print pattern layer 150 away from the side surface 116 and the side surface 116. A distance c (i.e., the shortest distance from the first trace pattern 120 to the side 116) is set between one end of the first trace pattern 120 close to the side 116 and the side 116. A distance d (i.e., the chamfering width of the first chamfering surface 118) is set between one end of the first chamfering surface 118, which is far away from the side surface 116, and the side surface 116; and, the following relationship is satisfied:
a≥b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
only distance a is shown in fig. 2 as being greater than distance b. However, according to the above-described relationship, it is found that: distance a may also be equal to distance b; that is, the length of the first printing pattern layer 140 may be equal to or greater than the length of the second printing pattern layer 150.
With reference to fig. 2, the first printing pattern layer 140 has a thickness f. The first printed design layer 140 and the second printed design layer 150 on the front side 112 have a total thickness g. The first printed pattern layer 140 and the second printed pattern layer 150 on the first chamfered surface 118, having a total thickness h; and, the following relationship is satisfied:
g>f>0，
g>h>0。
it is noted that in the embodiment of fig. 2, the first printed design layer 140 and the second printed design layer 150 extend from the front surface 112 to the first chamfered surface 118. The first printed pattern layer 140 and the second printed pattern layer 150 are not disposed on the connecting lines of the side surface 116. As can be seen from fig. 2, the connection line 130 at the boundary of the display panel 100A (i.e., the first chamfered surface 118) can be well protected by simultaneously disposing the first printed pattern layer 140 and the second printed pattern layer 150 on the first chamfered surface 118, so as to prevent the connection line 130 from being broken.
Referring to fig. 2, the first printing pattern layer 140 and the second printing pattern layer 150 are made of insulating glue; the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the first chamfered surface 118, and expose the connecting lines 130 on the side surfaces 116. The display panel 100A may further include: an electrical connection layer 170 disposed on the connection line 130; and a glass outer wiring layer 180 disposed on the electrical connection layer 170. Accordingly, the first printed pattern layer 140 and the second printed pattern layer 150 can be used to protect the connection wire 130, and the connection wire 130 is electrically connected to the glass external wiring layer 180 through the electrical connection layer 170; the electrical connection layer 170 is, for example, an Anisotropic Conductive Film (ACF), and the glass external wiring layer 180 is, for example, a Chip On Film (COF).
Fig. 3 is a schematic cross-sectional view of a display panel 100B according to an embodiment of the invention. Referring to fig. 3, in the display panel 100B, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 through the first chamfered surface 118. A first printed design layer 140 and a second printed design layer 150 on the side surface 116, having a total thickness i; and, the following relationship is satisfied:
i>g>f>0，
i>g>h>0，
5μm≤i。
it may be noted that in the embodiment of fig. 3, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 via the first chamfered surface 118; therefore, the first print pattern layer 140 and the second print pattern layer 150 are also provided on the connecting lines of the side surfaces 116. As shown in fig. 3, the connection line 130 at the boundary of the display panel 100B (i.e., the side surface 116 and the first chamfered surface 118) can be well protected by disposing the first printed pattern layer 140 and the second printed pattern layer 150 on the first chamfered surface 118 at the same time, so as to prevent the connection line 130 from being broken.
Referring to fig. 3, the material of the first printing pattern layer 140 and the second printing pattern layer 150 is conductive adhesive. The first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 through the first chamfered surface 118, and cover the connecting line 130 on the side surface 116. The display panel 100B may further include: an electrical connection layer 170 disposed on the connection line 130; and a glass outer wiring layer 180 disposed on the electrical connection layer 170. Accordingly, the first printed pattern layer 140 and the second printed pattern layer 150 can be used to protect the connection wire 130, and the first printed pattern layer 140, the second printed pattern layer 150 and the connection wire 130 are electrically connected to the glass external wiring layer 180 through the electrical connection layer 170; the electrical connection layer 170 is, for example, an anisotropic conductive film, and the external wiring layer 180 is, for example, a flip chip film.
In the embodiment of fig. 2 and 3, the first printing pattern layer 140 and the second printing pattern layer 150 are L-shaped. In the following embodiments of fig. 4 and 5, the first printing pattern layer 140 and the second printing pattern layer 150 have a C-shape. The shape of the first printed pattern layer 140 and the second printed pattern layer 150 is not limited in the present invention, and may be a shape that can appropriately cover the connection line 130.
Fig. 4 is a schematic cross-sectional view of a display panel 100C according to an embodiment of the invention. Referring to fig. 4, in addition to the first chamfered surface 118a, the substrate 110 further includes: a second chamfered surface 118b located between the side surface 116 and the back surface 114. The connecting line 130, the first printed pattern layer 140 and the second printed pattern layer 150 extend from the front surface 112 to the side surface 116 through the first chamfered surface 118a, and extend from the side surface 116 to the back surface 114 through the second chamfered surface 118 b.
Referring to fig. 4, the display panel 100C further includes: the second trace pattern 120b is disposed on the back surface 114. The connecting wires 130 extending to the back surface 114 cover the second trace pattern 120b and electrically connect the first trace pattern 120a and the second trace pattern 120 b.
In the display panel 100C of fig. 4, the following relationship is satisfied among the distance a, the distance b, the distance C, and the distance d:
a≥b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
the thickness f, the total thickness g, the total thickness h, and the total thickness i satisfy the following relationship:
i>g>f>0，
i>g>h>0，
μm≤i。
it is noted that, in the embodiment of fig. 4, in addition to protecting the connecting line 130 at the first chamfered surface 118a, the connecting line 130 at the position indicated by the arrow a (i.e. the second chamfered surface 118b) of fig. 4 is also protected by the first printed pattern layer 140 and the second printed pattern layer 150, so as to avoid the fracture problem; the first print pattern layer 140 covering the connection line 130 may serve as a topographic buffer layer (a "topography buffer layer"), and the second print pattern layer 150 may be formed flat on the first print pattern layer 140 to better cover the connection line 130.
Fig. 5 is a schematic cross-sectional view of a display panel 100D according to an embodiment of the invention. Referring to fig. 5, in the display panel 100D, the following relationships are satisfied among the distance a, the distance b, the distance c, and the distance D:
a≥b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
the thickness f, the total thickness g, the total thickness h, and the total thickness i satisfy the following relationship:
i>g>f>0，
i>g>h>0，
5μm≤i。
fig. 6 is a schematic cross-sectional view of a display panel 100E according to an embodiment of the invention. Referring to fig. 6, in addition to the first chamfered surface 118a, the substrate 110 further includes: a second chamfered surface 118b located between the side surface 116 and the back surface 114. The connecting line 130 and the first printing pattern layer 140 extend from the front surface 112 to the side surface 116 through the first chamfered surface 118a, and extend from the side surface 116 to the back surface 114 through the second chamfered surface 118 b. The second printed pattern layer 150 extends from the front surface 112 to the first chamfered surface 118a and from the back surface 114 to the second chamfered surface 118 b.
It is noted that, in the display panel 100E of fig. 6, only the first print pattern layer 140 having the thickness i' is formed on the connection line 130 positioned at the side surface 116.
Referring to fig. 6, a distance a is set between an end of the first print pattern layer 140 away from the side surface 116 and the side surface 116. A distance b is set between one end of the second print pattern layer 150 away from the side surface 116 and the side surface 116. A distance c is set between one end of the first trace pattern 130 close to the side 116 and the side 116. A distance d is set between one end of the first chamfered surface 118a far from the side surface 116 and the side surface 116; and, the following relationship is satisfied:
a>b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
referring to fig. 6, the first printing pattern layer 140 has a first thickness f. The first printed design layer 140 and the second printed design layer 150 on the front side 112 have a total thickness g. The first printed pattern layer 140 and the second printed pattern layer 150 on the first chamfered surface 118a have a total thickness h. The first printed pattern layer 140 on the side 116 has a thickness i'; and, the following relationship is satisfied:
g>i’>f>0，
g>i’>h>0。
fig. 7 is a schematic diagram illustrating a process of manufacturing the first printed pattern layer 140 and the second printed pattern layer 150 by observing the side surface 116 of the display panel 100C from arrow B in fig. 4. Referring to fig. 4 and fig. 7, in the step 210 of fabricating the first printed pattern layer 140, the first printed pattern layer 140 is formed on the front surface 112, the first chamfered surface 118a, the side surface 116, the second chamfered surface 118b and the back surface 114 of the substrate 110; in the step 220 of forming the second print pattern layer 150, the second print pattern layer 150 is formed on the front surface 112, the first chamfered surface 118a, the side surface 116, the second chamfered surface 118b, and the back surface 114 of the substrate 110; that is, in the display panel 100C of the embodiment of fig. 4 and 7, the first print pattern layer 140 and the second print pattern layer 150 are formed on the side surface 116.
Fig. 8 is a schematic view of the side surface 116 of the display panel 100E viewed from arrow C in fig. 6, and the manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 is performed. Referring to fig. 6 and 8, in the step 210 of fabricating the first printed pattern layer 140, the first printed pattern layer 140 is formed on the front surface 112, the first chamfered surface 118a, the side surface 116, the second chamfered surface 118b and the back surface 114 of the substrate 110. In the step 222 of fabricating the second printing pattern layer 150, the second printing pattern layer 150 is formed only on the front surface 112, the first chamfered surface 118a, the second chamfered surface 118b and the back surface 114 of the substrate 110, i.e. the second printing pattern layer 150 is not formed on the side surface 116.
In the display panel 100E, only the first print pattern layer 140 is formed on the side surface 116, and the thickness of the print pattern layer on the side surface 116 can be reduced. As a result, when a plurality of display panels 100E are tiled to constitute a tiled display, the thickness of the print pattern layer on the side surface 116 of the display panel 100E can be reduced, and the seam between two adjacent display panels 100E can be reduced. In this way, a plurality of display panels 100E can be seamlessly spliced to form a large-sized display device, and the gap between adjacent display panels 100E is small, which is helpful for improving the display quality.
Fig. 9 is a top view and a side view of a display panel 100F according to an embodiment of the invention. Referring to fig. 9, in the display panel 100F, the first trace pattern 120 includes: a plurality of first functional regions 122 and at least one second functional region 124; the patterns of the first printed pattern layer 140 and the second printed pattern layer 150 are stacked in a staggered manner and disposed above the plurality of first functional regions 122. The pattern of the first print pattern layer 140 and the pattern of the second print pattern layer 150 overlap each other and are disposed above the second functional region 124.
Referring to fig. 9, in the display panel 100F, the first print pattern layer 140 has a thickness F. The first printed design layer 140 and the second printed design layer 150 on the front side 112 have a total thickness g. The first printed pattern layer 140 and the second printed pattern layer 150, which overlap each other on the side surface 116, have a total thickness i. First and second printed pattern layers 140 and 150 on the side surface 116, which are alternately stacked with each other, having a total thickness i ″; and, the following relationship is satisfied:
i > i "> 0, and
i>g>f>0。
fig. 10 is a schematic diagram illustrating a manufacturing process of the first printed pattern layer 140 and the second printed pattern layer 150 by observing the side surface 116 of the display panel 100F of fig. 9. Referring to fig. 9 and 10, in the step 310 of fabricating the first printed pattern layer 140, the first printed pattern layer 140 is formed on the front surface 112, the first chamfered surface 118a, the side surface 116, the second chamfered surface 118b and the back surface 114 of the substrate 110.
In the step 320 of forming the second print pattern layer 150, the second print pattern layer 150 is formed on the front surface 112, the first chamfered surface 118a, the side surface 116, the second chamfered surface 118b, and the back surface 114 of the substrate 110. It is noted that the plurality of patterns of the second printed pattern layer 150 are alternately stacked in alignment with the intervals P between the plurality of patterns of the first printed pattern layer 140, thereby, as shown in the top plan view of fig. 9, making a portion of the first and second printed pattern layers 140 and 150 on the side surface 116 have the total thickness i, and another portion of the first and second printed pattern layers 140 and 150 have the total thickness i ″.
In addition, when the conductive paste is used as the material of the first print pattern layer 140 and the second print pattern layer 150 in the manufacturing step 310 of the first print pattern layer 140 and the manufacturing step 320 of the second print pattern layer 150 described in fig. 10, it is possible to easily perform large-area printing on the plurality of first functional regions 122 having the same function and to electrically connect the first functional regions 122; further, the second functional region 124 having a different function may be printed to achieve a protective function, and the first functional region 122 may be electrically separated from each other.
Fig. 11 is a schematic cross-sectional view of the display panel 100F taken along the section line D-D' of fig. 9. Referring to fig. 11, it can be seen that: the patterns of the second printed pattern layer 150 are alternately stacked in alignment with the intervals P between the patterns of the first printed pattern layer 140. In the display panel 100F of fig. 11, there are also shown: a thickness f of the first printed pattern layer 140, and a total thickness g of the first printed pattern layer 140 and the second printed pattern layer 150 on the front surface 112.
The following description will be made by taking the display panel 100 of the embodiment of fig. 1 of the present invention as an example: the invention discloses a manufacturing method of a display panel.
Referring to fig. 1, first, a substrate 110 is provided. The substrate 110 has: the front surface 112 and the back surface 114 are oppositely arranged, the side surface 116 connecting the front surface 112 and the back surface 114, and the first chamfer surface 118 positioned between the front surface 112 and the side surface 116. The substrate 110 may be made of glass; also, chamfering (chamfering) may be performed on the edge between the front surface 112 and the side surface 116 of the substrate 110 and the edge between the back surface 114 and the side surface 116 of the substrate 110.
Next, a first trace pattern 120 is formed on the front surface 112 of the substrate 110. The first trace pattern 120 may be formed by a thin film deposition process in combination with a photolithography etching process. In addition, the first trace pattern 120 may also be formed by a printing process of a conductive material.
Then, the connection line 130 is formed on the substrate 110. The method of forming the connecting line 130 is further described as follows.
First, a film (not shown) is formed on the substrate 110, for example, by a thin film deposition method, so as to cover the first trace pattern 120 and extend from the front surface 112 to the side surface 116 through the first chamfered surface 118.
Next, a first printed pattern layer 140 is formed on the substrate 110, covering the film layer, and extending from at least the front surface 112 to the first chamfered surface 118. The first print pattern layer 140 may be formed by printing a pattern of conductive material.
Then, a second printed pattern layer 150 is formed on the substrate 110, covering at least a portion of the first printed pattern layer 140, and extending at least from the front surface 112 to the first chamfered surface 118. The second printed pattern layer 150 may be formed by printing a pattern of conductive material. The above process for forming the first printing pattern layer 140 and the second printing pattern layer 150 is called as follows: the pattern definition process, i.e., the patterning of the film layer (i.e., the first and second printing patterns 140 and 150) is used as an etching mask to define the connecting lines 130.
Then, the first printed pattern layer 140 and the second printed pattern layer 150 are used as etching masks to etch the film layer, so as to form the connecting line 130 extending from at least the front surface 112 to the side surface 116 through the first chamfered surface 118.
According to the basic steps, the display panels 100A, 100B, 100C, 100D, 100E, and 100F according to the embodiments of the present invention can be manufactured according to the installation positions and the relative sizes of the first printed pattern layer 140 and the second printed pattern layer 150.
In the above-described embodiments, the following are described: at least two print pattern layers (i.e., the first print pattern layer 140 and the second print pattern layer 150) are formed to protect the connecting wires 130 formed on the side surfaces 116, thereby avoiding the wire breakage problem caused by the large stress at the chamfered surfaces (118, 118a, 118 b). In other embodiments, more than two printed pattern layers may be formed to provide better protection effect for the connection line 130, and the number of the printed pattern layers is not limited in the present invention.
The materials of the first printing pattern layer 140 and the second printing pattern layer 150 may be conductive adhesive or insulating adhesive, and may be the same as or different from each other.
In summary, according to the display panel and the manufacturing method thereof of the present invention, at least two printed pattern layers are formed on the connecting lines located at the boundary of the display panel, so that the connecting lines can be well protected, the connecting lines are prevented from being broken, and the normal operation of the display panel is ensured. The first print pattern layer covering the connection line may serve as a topographic buffer layer, and a second print pattern layer that is more flat may be formed on the first print pattern layer. Moreover, when a plurality of display panels are spliced to form the spliced display, the thickness of the printing pattern layer positioned on the side surface of each display panel can be controlled, so that the seam between two adjacent display panels can be reduced, and the image display quality of the spliced display is improved.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (18)
1. A display panel, comprising:
a substrate having: the first chamfering device comprises a front face and a back face which are oppositely arranged, a side face connecting the front face and the back face, and a first chamfering face positioned between the front face and the side face;
a first routing pattern disposed on the front surface;
a connecting line covering the first trace pattern and extending from the front surface to the side surface through the first chamfered surface;
the first printing pattern layer covers the connecting line and at least extends from the front surface to the first chamfer surface; and
and the second printing pattern layer covers at least one part of the first printing pattern layer and at least extends from the front surface to the first chamfer surface.
2. The display panel of claim 1,
a distance a is set between one end of the first printing pattern layer far away from the side surface and the side surface;
a distance b is set between one end of the second printing pattern layer far away from the side surface and the side surface;
a distance c is set between one end of the first routing pattern close to the side surface and the side surface;
a distance d is set between one end of the first chamfer surface, which is far away from the side surface, and the side surface;
and, the following relationship is satisfied:
a≥b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
3. the display panel of claim 1,
the first printing pattern layer has a thickness f;
the first printing pattern layer and the second printing pattern layer on the front surface have a total thickness g;
the first printing pattern layer and the second printing pattern layer which are positioned on the first chamfer surface have a total thickness h;
and, the following relationship is satisfied:
g>f>0，
g>h>0。
4. the display panel of claim 3,
the first printing pattern layer and the second printing pattern layer extend from the front surface to the side surface through the first chamfer surface,
the first printing pattern layer and the second printing pattern layer on the side face have a total thickness i;
and, the following relationship is satisfied:
i>g>f>0，
i>g>h>0，
5μm≤i。
5. the display panel of claim 1,
the first printing pattern layer and the second printing pattern layer are made of insulating glue;
the first printing pattern layer and the second printing pattern layer extend from the front surface to the first chamfer surface and expose the connecting line on the side surface.
6. The display panel of claim 5, further comprising:
an electrical connection layer disposed on the connection line; and
and a glass external wiring layer arranged on the electrical connection layer.
7. The display panel of claim 1,
the first printing pattern layer and the second printing pattern layer are made of conductive adhesive;
the first printing pattern layer and the second printing pattern layer extend from the front surface to the side surface through the first chamfer surface and cover the connecting line on the side surface.
8. The display panel of claim 7, further comprising:
an electrical connection layer disposed on the connection line; and
and a glass external wiring layer arranged on the electrical connection layer.
9. The display panel of claim 1,
the shapes of the first printing pattern layer and the second printing pattern layer are as follows: an L shape or a C shape.
10. The display panel of claim 1,
the substrate further has: a second chamfer surface between the side surface and the back surface,
the connecting line, the first printing pattern layer and the second printing pattern layer extend from the front surface to the side surface through the first chamfer surface and extend from the side surface to the back surface through the second chamfer surface.
11. The display panel of claim 10, further comprising:
a second trace pattern disposed on the back surface,
the connecting line extending to the back covers the second trace pattern and electrically connects the first trace pattern and the second trace pattern.
12. The display panel of claim 1,
the substrate further has: a second chamfer surface between the side surface and the back surface,
the connecting line and the first printing pattern layer extend from the front surface to the side surface through the first chamfer surface and extend from the side surface to the back surface through the second chamfer surface,
the second printing pattern layer extends from the front surface to the first chamfer surface and extends from the back surface to the second chamfer surface.
13. The display panel of claim 12,
a distance a is set between one end of the first printing pattern layer far away from the side surface and the side surface;
a distance b is set between one end of the second printing pattern layer far away from the side surface and the side surface;
a distance c is set between one end of the first routing pattern close to the side surface and the side surface;
a distance d is set between one end of the first chamfer surface, which is far away from the side surface, and the side surface;
and, the following relationship is satisfied:
a>b>c≥d，
30μm≤a，
5μm≤b，
0≤d≤65μm。
14. the display panel of claim 12,
the first printing pattern layer has a first thickness f;
the first printing pattern layer and the second printing pattern layer on the front surface have a total thickness g;
the first printing pattern layer and the second printing pattern layer which are positioned on the first chamfer surface have a total thickness h;
the first printing pattern layer is positioned on the side face and has a thickness i';
and, the following relationship is satisfied:
g>i’>f>0，
g>i’>h>0。
15. the display panel of claim 1,
the first trace pattern includes: a plurality of first functional regions and at least one second functional region, wherein,
the patterns of the first printing pattern layer and the patterns of the second printing pattern layer are mutually staggered and stacked and are arranged above the plurality of first functional areas;
the pattern of the first printing pattern layer and the pattern of the second printing pattern layer are overlapped with each other and are arranged above the second functional area.
16. The display panel of claim 15,
the first printing pattern layer has a thickness f;
the first printing pattern layer and the second printing pattern layer on the front surface have a total thickness g;
the first printing pattern layer and the second printing pattern layer which are overlapped with each other and positioned on the side face have a total thickness i;
the first printing pattern layer and the second printing pattern layer which are positioned on the side face and are mutually staggered and stacked have a total thickness i';
and, the following relationship is satisfied:
i > i "> 0, and
i>g>f>0。
17. the display panel of claim 1, further comprising:
a plurality of pixel units arranged on the front surface of the substrate,
each of the pixel units includes: a red micro LED, a green micro LED, and a blue micro LED.
18. A manufacturing method of a display panel comprises the following steps:
providing a substrate, the substrate having: the first chamfering device comprises a front face and a back face which are oppositely arranged, a side face connecting the front face and the back face, and a first chamfering face positioned between the front face and the side face;
forming a first routing pattern on the front surface of the substrate; and
forming a connection line on the substrate,
the method for forming the connecting line comprises the following steps:
forming a film layer on the substrate to cover the first trace pattern and extend from the front surface to the side surface at least through the first chamfer surface;
forming a first printing pattern layer on the substrate, covering the film layer and at least extending from the front surface to the first chamfer surface;
forming a second printing pattern layer on the substrate, covering at least one part of the first printing pattern layer and at least extending from the front surface to the first chamfer surface; and
and etching the film layer by using the first printing pattern layer and the second printing pattern layer as etching masks to form the connecting line extending from the front surface to the side surface at least through the first chamfer surface.
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| TW109134771A TWI738533B (en) | 2020-10-07 | 2020-10-07 | Display panel and manufacturing method thereof |
| TW109134771 | 2020-10-07 |
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| CN114203038A (en) * | 2021-12-01 | 2022-03-18 | 上海中航光电子有限公司 | Driving panel, display and manufacturing method of driving panel |
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Also Published As
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| CN113096538B (en) | 2023-04-18 |
| TWI738533B (en) | 2021-09-01 |
| TW202215389A (en) | 2022-04-16 |
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