CN113092990A - Matrix type building block millimeter wave module building system - Google Patents
Matrix type building block millimeter wave module building system Download PDFInfo
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- CN113092990A CN113092990A CN202110438549.9A CN202110438549A CN113092990A CN 113092990 A CN113092990 A CN 113092990A CN 202110438549 A CN202110438549 A CN 202110438549A CN 113092990 A CN113092990 A CN 113092990A
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- 239000011438 cord wood Substances 0.000 claims abstract description 16
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- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention discloses a matrix type cordwood millimeter wave module building system, which comprises a module carrier and an electronic circuit building block unit; the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module; the module carrier comprises a matrix type building block carrier, and the matrix type building block carrier comprises a plurality of first unit grids which are distributed in a matrix type and used for placing standard modules and a plurality of second unit grids used for placing standard microstrip circuits; the module carrier also comprises more than one side wall which is positioned at the side edge of the module carrier and can be used for installing a connector; when the connector is installed on the side wall, the connector is connected with the standard microstrip circuit in one of the second unit grids; the waveguide transition module is disposed on one side of the module carrier. The matrix type building system based on the millimeter wave module can flexibly realize the design building of various systems, saves the design test cost and is easy to popularize and apply.
Description
Technical Field
The invention relates to the technical field of microwave circuits, in particular to a microwave circuit system.
Background
In the field of microwave engineering, an electronic system is composed of many single-function devices (modules) and sub-systems.
In a general system design process, a sub-circuit is designed for verification, and then a system circuit is designed. This design work needs to be done twice. Before each system test, the performance of each single-function/subsystem module needs to be tested, and the system test can be carried out after all the single-function/subsystem modules work normally.
In the millimeter wave frequency band, a cavity module structure is usually adopted for circuit design, so that how to solve the problems of repeated design and repeated test is a problem to be solved urgently.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects in the prior art, the invention provides a matrix type cordwood millimeter wave module building system.
The technical scheme is as follows: in order to solve the technical problem, the invention provides a matrix type cordwood millimeter wave module building system, which comprises a module carrier and an electronic circuit building block unit;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
the module carrier comprises a matrix type building block carrier, and the matrix type building block carrier comprises a plurality of first unit grids which are distributed in a matrix type and used for placing standard modules and a plurality of second unit grids used for placing standard microstrip circuits;
the module carrier also comprises more than one side wall which is positioned at the side edge of the module carrier and can be used for installing a connector;
when the connector is installed on the side wall, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed on one side of the module carrier.
Preferably, the standard module comprises an amplifier module and/or a mixer module and/or a frequency multiplier module and/or a pass-through module.
Also preferably, the standard microstrip circuit comprises a 180 ° through microstrip and/or a 90 ° through microstrip and/or a filter microstrip circuit and/or a combiner microstrip circuit and/or a coupler microstrip circuit.
Preferably, the waveguide transition module is a transition waveguide for converting a signal from microstrip transmission to waveguide transmission.
Preferably, the through module comprises a 180 ° through microstrip module and/or a 90 ° through microstrip module.
Preferably, the input and the output of the standard module are both insulated pins.
Further preferably, the matrix distribution is an M × N matrix, wherein M ≧ 2, N ≧ 3, and M, N are integers;
the first unit grids for placing the standard modules are adjacent to the second unit grids for placing the standard microstrip circuits; and/or
In the matrix distribution, the first unit grids for placing the standard modules and the first unit grids adjacent to the first unit grids for placing the standard modules are adjacent to each other at the same vertex; and/or
In the matrix distribution, the first unit grids for placing the standard modules and a plurality of second unit grids adjacent to the first unit grids for placing the standard microstrip circuits are adjacent to each other at the same vertex; and/or
In the matrix distribution, a first unit grid for placing the standard module and a plurality of second unit grids adjacent to the first unit grid for placing the standard microstrip circuit are abutted in a shared manner.
Preferably, the bottom surface of the second unit grid for placing the standard microstrip circuit is a metal plane, and the standard microstrip circuit is adhered to the metal plane; and/or
The bottom of the first unit grid for placing the standard module is a step hole, and the standard module is welded in the step hole and/or embedded in the step hole.
Preferably, the inner conductor of the connector is aligned with the center of the second unit where the standard microstrip circuit connected with the connector is located;
the side wall is a metal wall, and the metal wall is provided with a mounting hole for assembling the connector.
Preferably, the input and the output of the standard module are both insulated pins;
the bottom surface of the second unit grid for placing the standard microstrip circuit is a metal plane, and the standard microstrip circuit is adhered to the metal plane;
the height difference between the lowest point of the cylindrical surfaces of the input and output insulating pins arranged on the standard module in the first unit grid and the upper surface of the microstrip line of the standard microstrip circuit arranged in the second unit grid is not more than 0.05 mm.
Preferably, the side walls comprise a lower side wall at the lower side for mounting the connector, and/or a left side wall at the left side for mounting the connector, and/or a right side wall at the right side for mounting the connector;
the waveguide transition module is disposed above the module carrier.
The invention also provides another matrix type cordwood millimeter wave module building system which comprises a module carrier and electronic circuit building block units;
the module carrier comprises a cavity and a lower side wall positioned at the lower side of the cavity and used for installing a connector, and/or a left side wall positioned at the left side of the cavity and used for installing a connector, and/or a right side wall positioned at the right side of the cavity and used for installing a connector;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
a plurality of first unit grids for placing standard modules and a plurality of second unit grids for placing standard microstrip circuits are arranged in the cavity; the first unit grids and the second unit grids are distributed in the cavity in a matrix manner;
when the lower side wall and/or the left side wall and/or the right side wall is/are provided with the connector, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed above the module carrier.
The invention also provides a matrix type cordwood millimeter wave module building system which comprises a module carrier and electronic circuit building block units;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
the module carrier comprises a cavity, a matrix type building block carrier positioned in the cavity, and a lower side wall positioned at the lower side of the cavity and used for installing a connector, and/or a left side wall positioned at the left side of the cavity and used for installing a connector, and/or a right side wall positioned at the right side of the cavity and used for installing a connector;
the matrix type building block carrier comprises a plurality of first unit grids which are distributed in a matrix type and used for placing standard modules and a plurality of second unit grids used for placing standard microstrip circuits;
when the lower side wall and/or the left side wall and/or the right side wall is/are provided with the connector, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed above the module carrier.
Has the advantages that: according to the matrix type modular millimeter wave module building system provided by the invention, on one hand, the design of a basic electronic circuit is solidified by selecting various electronic circuit building block units which are designed/set in advance, and on the other hand, the structural structure of the matrix type modular building system of the millimeter wave module/module carrier is combined, so that the building, the design, the evaluation and the test of various simple or complex module systems can be flexibly realized, and the flexible design and the evaluation test of various simple or even complex circuit systems by adopting the module/module carrier structure in a millimeter wave frequency band are very facilitated.
Meanwhile, the basic performance of each electronic circuit building block unit only needs to be tested once in advance, and when various complex circuit systems built by the building block building system are used for system testing, the basic performance testing of each electronic circuit building block unit does not need to be carried out repeatedly, so that the building design and the test evaluation of the millimeter wave frequency band complex circuit system are facilitated.
On the whole, the method is ingenious, flexible and good in universality, saves design time and processing and testing cost, and is easy to popularize and apply in the design of the integrated circuit in the millimeter wave frequency band.
Drawings
FIG. 1 is a schematic top view of a matrix-type modular millimeter wave module building system according to an embodiment;
FIG. 2 is a schematic diagram of various electronic circuit building elements provided in one embodiment;
FIG. 3 is a schematic structural diagram of a millimeter wave frequency multiplier single-function module design/evaluation system built in one of the applications;
FIG. 4 is a schematic structural diagram of a millimeter wave mixer single-function module design/evaluation system built in one of the applications;
FIG. 5 is a schematic structural diagram of a millimeter wave amplifier single-function module design/evaluation system built in one of the applications;
FIG. 6 is a schematic structural diagram of a receiving channel module system built in one of the applications;
fig. 7 is a schematic structural diagram of a transmit channel module system built in one of the applications.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited to the following examples.
The matrix type cordwood millimeter wave module building system provided by the embodiment comprises a module carrier and an electronic circuit building block unit;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
the module carrier comprises a matrix type building block carrier, and the matrix type building block carrier comprises a plurality of first unit grids which are distributed in a matrix type and used for placing standard modules and a plurality of second unit grids used for placing standard microstrip circuits;
the module carrier also comprises more than one side wall which is positioned at the side edge of the module carrier and can be used for installing a connector;
when the connector is installed on the side wall, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed on one side of the module carrier. The waveguide transition module is a transition waveguide for converting the signal from microstrip transmission to waveguide transmission.
In some embodiments, the side walls include a lower side wall on a lower side for mounting a connector, and/or a left side wall on a left side for mounting a connector, and/or a right side wall on a right side for mounting a connector; the waveguide transition module is disposed above the module carrier. In the present embodiment, as shown in fig. 1, the side walls include a lower side wall 1 on the lower side (lower side of the module carrier) for mounting connectors, a left side wall 2 on the left side (left side of the module carrier) for mounting connectors, and a right side wall 3 on the right side (right side of the module carrier) for mounting connectors.
The side wall is a metal wall. That is, in the present embodiment, the lower side wall 1, the left side wall 2, and the right side wall 3 are metal walls, and the metal walls are provided with mounting holes for mounting connectors. The mounting holes are through holes and/or threaded holes and the like.
The lower side wall 1, the left side wall 2, the right side wall 3, and the connector mounted on the right side wall 3 in fig. 1 are only shown schematically, and in practical applications, the lower side wall and/or the left side wall and/or the right side wall may be selectively arranged/arranged according to the needs of an application scenario, and the connector is mounted on the lower side wall 1 and/or the left side wall 2 and/or the right side wall 3.
In certain embodiments, the standard modules comprise amplifier modules and/or mixer modules and/or frequency multiplier modules and/or pass-through modules. In some embodiments, the through module includes a 180 ° through microstrip module and/or a 90 ° through microstrip module, etc. In some embodiments, the standard microstrip circuit comprises a 180 ° through microstrip and/or a 90 ° through microstrip and/or a filter microstrip circuit and/or a combiner microstrip circuit and/or a coupler microstrip circuit, etc. The through microstrip of the standard microstrip circuit comprises a 180-degree through microstrip and/or a 90-degree through microstrip.
In the present invention, when the connector is mounted on the side wall, the connector is connected to the standard microstrip circuit in one of the second unit cells. Specifically, in this embodiment, when the lower side wall 1 and/or the left side wall 2 and/or the right side wall 3 is/are provided with a connector, the connector is connected to a through microstrip in one of the second unit squares, and the through microstrip is a 180 ° through microstrip or a 90 ° through microstrip in a standard microstrip circuit.
In the matrix-type modular millimeter wave module building system according to an embodiment, a schematic diagram of the above electronic circuit building units (which may also be referred to as electronic circuit basic units or electronic building basic units) is shown in fig. 2, where fig. 2(a) is an amplifier module, fig. 2(b) is a mixer module, fig. 2(c) is a frequency multiplier module, fig. 2(d) is a 180-degree through microstrip module, fig. 2(e) is a 90-degree through microstrip module, fig. 2(f) is a waveguide transition module, i.e., a transition waveguide, fig. 2(g) is a connector, fig. 2(h) is a 180-degree through microstrip, and fig. 2(i) is a 90-degree through microstrip. The filter microstrip circuit, the combiner microstrip circuit, and the coupler microstrip circuit are not shown in the figures.
In this embodiment, the standard modules available for placement in the first cell pane include an amplifier module, a mixer module, a frequency multiplier module, and a pass-through module; the through module comprises a 180-degree through microstrip module and a 90-degree through microstrip module. Also in this embodiment, standard microstrip circuits that may be used for placement in the second cell squares include 180 ° pass-through microstrips, 90 ° pass-through microstrips, filter microstrip circuits (not shown), combiner microstrip circuits (not shown), and coupler microstrip circuits (not shown).
The input and output of the standard module are all insulated pins.
In the matrix type cordwood millimeter wave module building system provided by the invention, the matrix type distribution is an MxN matrix, wherein M is more than or equal to 2, N is more than or equal to 3, and M, N is an integer. The first unit grids for placing the standard modules are all provided with second unit grids for placing the standard microstrip circuits, and the second unit grids are adjacent to the first unit grids. Namely: and second unit grids for placing the standard microstrip circuit are arranged/distributed right above and/or right below and/or right left and/or right of each first unit grid for placing the standard module.
In the present embodiment shown in fig. 1, M is 2 and N is 5. That is, in this embodiment, the matrix-type building block carrier includes a plurality of first cell squares for placing standard modules (which are referred to as modules in fig. 1 for short) and a plurality of second cell squares for placing standard microstrip circuits (which are referred to as microstrips in fig. 1 for short) distributed in a 2 × 5 matrix. It can also be said that: the module carrier comprises a plurality of first unit grids for placing standard modules (correspondingly, simply called modules in figure 1) and a plurality of second unit grids for placing standard microstrip circuits (correspondingly, simply called microstrips in figure 1); the first unit grids and the second unit grids are integrally distributed in a 2 x 5 matrix form in the module carrier. The first unit grids for placing the standard modules are all provided with second unit grids for placing the standard microstrip circuits, and the second unit grids are adjacent to the first unit grids. In this embodiment, as shown in fig. 1, the first row and the second row are numbered sequentially from bottom to top, and the first column to the 5 th column are numbered sequentially from left to right, specifically, the second unit squares for placing the standard microstrip circuit are arranged at the positions corresponding to the 1 st, 2 nd, 4 th, and 5 th columns in the first row and the positions corresponding to the 1 st, 3 th, and 5 th columns in the second row (that is, the blank squares in fig. 1); the first unit square for placing the standard module is arranged at the position corresponding to the 3 rd column in the first row and the positions corresponding to the 2 nd and 4 th columns in the second row (namely, the shaded square in fig. 1). In the present embodiment as shown in fig. 1, two transition waveguides are included above the module carrier.
In some embodiments, the first cell grid for placing the standard module and the adjacent first cell grid for placing the standard module in the matrix distribution are adjacent to each other at a common vertex, that is, the first cell grid for placing the standard module adjacent to the first cell grid in the matrix distribution is arranged diagonally.
In some embodiments, in the matrix distribution, the first cell grid for placing the standard module and the second cell grid adjacent to the first cell grid for placing the standard microstrip circuit are in vertex-sharing abutment and/or edge-sharing abutment. In the matrix distribution, the first unit grids for placing the standard modules and a plurality of (or part of) adjacent second unit grids for placing the standard microstrip circuits are adjacent to each other at the same vertex; and/or in the matrix distribution, the first unit grids for placing the standard modules and a plurality of (or part of) adjacent second unit grids for placing the standard microstrip circuits are in mutual edge adjacency.
It can also be said that: in the matrix distribution, the second unit grids for placing the standard microstrip circuit are arranged at the positions, which are on the same side, of the peripheries of the first unit grids for placing the standard modules, and the first unit grids of the same kind are not arranged. In the matrix distribution, the positions of the first unit grids sharing the top points at the periphery for placing the standard modules can be provided with the second unit grids for placing the standard microstrip circuit and the first unit grids for placing the standard modules.
The term "co-vertex adjacent" as used herein, may also refer to the adjacent two unit cells having only one vertex in common (or alternatively, only one vertex in common).
The term "adjacent to each other" as used herein, may also be referred to as "adjacent to each other" means that two adjacent unit cells share one side (or, alternatively, have one side adjacent to each other). The unit squares include a first unit square and a second unit square.
In some embodiments, the bottom surface of the second unit square for placing the standard microstrip circuit is a metal plane. Standard microstrip circuitry is bonded to the metal plane by conductive glue.
In some embodiments, the bottom of the first unit square for placing the standard module is a stepped hole. The standard module is welded in the step hole and/or embedded in the step hole. In some embodiments, the standard module is embedded in the step hole by welding, bonding or clamping.
The second unit grids and the first unit grids jointly form a matrix type building block carrier positioned in the module carrier.
In this embodiment, the inner conductor of the connector is aligned with the center of the second unit to which the standard microstrip circuit is connected. The connector is connected to standard microstrip circuitry disposed in the second cell square.
In some embodiments, the input and output of the standard module are both insulated pins; the bottom surface of the second unit grid for placing the standard microstrip circuit is a metal plane, and the standard microstrip circuit is adhered to the metal plane through conductive glue. The height difference between the lowest point of the cylindrical surfaces of the input and output insulating pins arranged on the standard module in the first unit grid and the upper surface of the microstrip line of the standard microstrip circuit arranged in the second unit grid is not more than 0.05 mm.
In some embodiments, another matrix-type modular millimeter wave module building system (in this embodiment, it may also be called a modular millimeter wave cavity module building system, or a matrix-type modular millimeter wave cavity module building system, or a millimeter wave cavity module matrix-type modular millimeter wave building system) is provided, which includes a module carrier and an electronic circuit building block unit;
the module carrier (the module carrier may also be referred to as a cavity module or a cavity module carrier) comprises a cavity, and a lower side wall at the lower side of the cavity for mounting a connector and/or a left side wall at the left side of the cavity for mounting a connector and/or a right side wall at the right side of the cavity for mounting a connector;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
a plurality of first unit grids for placing standard modules and a plurality of second unit grids for placing standard microstrip circuits are arranged in the cavity of the module carrier; the first unit grids and the second unit grids are distributed in a matrix form in a cavity of the module carrier;
when the lower side wall and/or the left side wall and/or the right side wall is/are provided with the connector, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed above the module carrier. The waveguide transition module is a transition waveguide for converting the signal from microstrip transmission to waveguide transmission. In this embodiment, other structures are similar to those in the above embodiments and are not described again.
In some embodiments, a further matrix-type modular millimeter wave module building system (in this embodiment, it may also be referred to as a modular millimeter wave cavity module building system, or a matrix-type modular millimeter wave cavity module building system, or a millimeter wave cavity module matrix-type modular millimeter wave building system) is provided, which includes a module carrier and an electronic circuit building block unit; the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
the module carrier (the module carrier is also called as a cavity module or a cavity module carrier) comprises a cavity, a matrix type building block carrier positioned in the cavity, and a lower side wall positioned at the lower side of the cavity and used for installing a connector, and/or a left side wall positioned at the left side of the cavity and used for installing a connector, and/or a right side wall positioned at the right side of the cavity and used for installing a connector;
the matrix type building block carrier comprises a plurality of first unit grids which are distributed in a matrix type and used for placing standard modules and a plurality of second unit grids used for placing standard microstrip circuits;
when the lower side wall and/or the left side wall and/or the right side wall is/are provided with the connector, the connector is connected with the standard microstrip circuit in one of the second unit grids; the waveguide transition module is disposed above the module carrier. The waveguide transition module is a transition waveguide for converting the signal from microstrip transmission to waveguide transmission.
In this embodiment, the second unit squares and the first unit squares together form a matrix-type block carrier located in the cavity of the module carrier. In some embodiments, the second unit square and the first unit square are commonly disposed on a bottom plate located at the bottom of the chamber. In this embodiment, other structures are similar to those in the above embodiments and are not described again.
The slash symbol "/" herein denotes an or. The electronic circuit building elements described herein may also be referred to as electronic circuit base elements, or electronic building base elements, or electronic circuit base modules. The matrix distribution may also be referred to as a matrix distribution structure. The microstrip described herein/in the figures may also be referred to as a standard microstrip circuit. The microstrip module may also be referred to as a through microstrip module. The matrix type cordwood millimeter wave module building system can be also called a cordwood millimeter wave module building system, can be also called a millimeter wave module matrix type cordwood millimeter wave module building system, or can be called a cordwood millimeter wave module building system for short, or can be called a millimeter wave module cordwood millimeter wave module building system.
In a microwave system, it is common to include single function module design/evaluation, transmission channel system design/evaluation, reception channel system design/evaluation, and the like. For convenience of understanding, the above-mentioned embodiment of M ═ 2 and N ═ 5 is taken as an example below, and the matrix-type building block millimeter wave module building system provided by the embodiment is used for designing and building various module systems or design/evaluation structures. That is, in the matrix-type modular millimeter wave module building system provided in this embodiment, various single-function module design/evaluation structures and multi-function system design/evaluation structures are designed and built by using the above-mentioned various electronic circuit building blocks (also referred to as electronic circuit basic units, or electronic building block basic units, or electronic circuit basic modules), for example.
An example of an evaluation structure application for designing a built single-function/subsystem module is as follows:
fig. 3 shows a schematic structural diagram of a millimeter wave frequency multiplier single-function module design/evaluation system built in one of the applications, which is composed of several electronic circuit building blocks (also referred to as a base module) including a frequency multiplier module shown in fig. 2(c), a 180 ° through microstrip shown in fig. 2(h), a connector shown in fig. 2(g), and a transition waveguide shown in fig. 2 (f). In this application example, specifically, the frequency multiplier module is located in the first unit grid of the second row and the 4 th column of the matrix distribution structure; the 180-degree through microstrip is positioned in a second unit grid of the 4 th row of the first row of the matrix distribution structure; the connector is arranged on the lower side wall and is connected with the 180-degree straight-through microstrip arranged in the first row and the 4 th column in the matrix distribution structure; one of the insulated pin ports of the frequency multiplier module is connected to a transition waveguide disposed above the module carrier. And the other insulated pin port of the frequency multiplier module is connected with the 180-degree through microstrip adjacent to the insulated pin port.
Fig. 4 is a schematic structural diagram of a millimeter wave mixer single-function module design/evaluation system built in one of the applications (in the drawing, IF is an intermediate frequency port, RF is a radio frequency port, and LO is a local oscillator port), and the millimeter wave mixer single-function module design/evaluation system is composed of several electronic circuit building blocks, i.e., a mixer module shown in fig. 2(b), 2 through microstrips of 180 ° shown in fig. 2(h), 2 connectors shown in fig. 2(g), and a transition waveguide shown in fig. 2 (f). In this application example, specifically, the mixer module is located in the first unit grid of the second row and the 2 nd column of the matrix distribution structure; the first 180-degree through microstrip is positioned in a second unit grid of the first row and the 2 nd column of the matrix distribution structure, and the second 180-degree through microstrip is positioned in a second unit grid of the second row and the 1 st column of the matrix distribution structure; wherein, the first connector is arranged on the lower side wall and is connected with the 180-degree through microstrip arranged in the first row and the 2 nd column in the matrix distribution structure; wherein the second connector is arranged on the left side wall and is connected with the 180-degree through microstrip arranged in the second row and the 1 st column in the matrix distribution structure; one of the insulated pin ports of the mixer module is connected to a transition waveguide disposed above the module carrier. The mixer module is respectively connected with two 180-degree through microstrips adjacent to the mixer module through the other two insulating pin ports of the mixer module.
Fig. 5 is a schematic structural diagram of a millimeter wave amplifier single-function module design/evaluation system built in one of the applications, and the millimeter wave amplifier single-function module design/evaluation system is composed of several electronic circuit building blocks, namely, an amplifier module shown in fig. 2(a), 2 through microstrip modules of 180 ° shown in fig. 2(d), 2 through microstrip modules of 90 ° shown in fig. 2(i), and 2 transition waveguides shown in fig. 2 (f). In this application example, specifically, the amplifier module is located in the first unit grid of the second row and the 2 nd column of the matrix distribution structure; the first 90-degree through microstrip is positioned in a second unit grid of a first row and a second row 2 of the matrix distribution structure, and the second 90-degree through microstrip is positioned in a second unit grid of a first row and a second row 4 of the matrix distribution structure; the first 180-degree through microstrip module is positioned in a first unit grid in a 3 rd row of the matrix distribution structure, and the second 180-degree through microstrip module is positioned in a first unit grid in a 4 th row of the matrix distribution structure; one of the insulating pin ports of the amplifier module is connected with a first transition waveguide arranged above the module carrier; one of the insulated pin ports of a second 180 ° straight-through microstrip module is connected to a second transition waveguide disposed above the module carrier. Specifically, in this application example, from input to output, the second transition waveguide, the second 180 ° through microstrip module, the second 90 ° through microstrip, the first 180 ° through microstrip module, the first 90 ° through microstrip, the amplifier module, and the first transition waveguide are connected in sequence. The amplifier module and the 180-degree straight-through microstrip module are connected with the 90-degree straight-through microstrip adjacent to the amplifier module and the 180-degree straight-through microstrip through respective insulating pin ports.
Examples of applications of the design/evaluation structure for designing a built multifunctional module or multifunctional system are as follows:
fig. 6 is a schematic structural diagram of a receiving channel module system built in one of the applications, which is composed of several electronic circuit building blocks, i.e., a mixer module shown in fig. 2(b), a frequency multiplier module shown in fig. 2(c), 3 through microstrips of 180 ° shown in fig. 2(h), 2 transition waveguides shown in fig. 2(f), and 2 connectors shown in fig. 2(g), thereby completing an evaluation system of a receiving channel module. In this application example, specifically, the mixer module is located in the first unit grid of the second row and the 2 nd column of the matrix distribution structure; the frequency multiplier module is positioned in a first unit grid of a second row and a 4 th column of the matrix distribution structure; the first 180-degree through microstrip is positioned in a second unit grid in the 2 nd row of the first row of the matrix distribution structure, the second 180-degree through microstrip is positioned in a second unit grid in the 3 rd row of the second row of the matrix distribution structure, and the third 180-degree through microstrip is positioned in a second unit grid in the 5 th row of the second row of the matrix distribution structure; a first connector is arranged on the lower side wall and is connected with a first 180-degree through microstrip arranged in a first row and a second row in the matrix distribution structure; the second connector is arranged on the right side wall and is connected with a third 180-degree through microstrip arranged in a second row and a 5 th column in the matrix distribution structure; one of the insulated pin ports of the mixer module is connected to a first transition waveguide disposed above the module carrier. In the figure, a mixer module and a frequency multiplier module are connected with 180-degree through microstrips adjacent to the mixer module and the frequency multiplier module through respective insulating pin ports.
Fig. 7 is a schematic structural diagram of a transmit channel module system constructed in one of the applications, and the transmit channel module system is composed of several electronic circuit building blocks, i.e., an amplifier module shown in fig. 2(a), a frequency multiplier module shown in fig. 2(c), a 90 ° through microstrip module shown in fig. 2(e), 2 transition waveguides shown in fig. 2(f), a 180 ° through microstrip shown in fig. 2(h), 2 90 ° through microstrips shown in fig. 2(i), and a connector shown in fig. 2 (g). In this application example, specifically, the amplifier module is located in the first unit grid of the second row and the 2 nd column of the matrix distribution structure; the frequency multiplier module is positioned in a first unit grid of a second row and a 4 th column of the matrix distribution structure; the 90-degree straight-through microstrip module is positioned in a first unit grid of a first row and a 3 rd column of the matrix distribution structure; the first 90-degree through microstrip is positioned in a second unit grid of a first row and a second column 2 of the matrix distribution structure, and the second 90-degree through microstrip is positioned in a second unit grid of a second row and a second column 3 of the matrix distribution structure; the 180-degree through microstrip is positioned in a second unit grid of a second row and a 5 th column of the matrix distribution structure; the connector is arranged on the right side wall and is connected with the 180-degree straight-through microstrip arranged in the second row and the 5 th column in the matrix distribution structure; one of the insulated pin ports of the amplifier module is connected to a first transition waveguide disposed above the module carrier. Specifically, in this application example, from input to output, the connector, the 180 ° through microstrip, the frequency multiplier module, the second 90 ° through microstrip, the 90 ° through microstrip module, the first 90 ° through microstrip, the amplifier module, and the first transition waveguide are connected in sequence. The amplifier module, the frequency multiplier module and the 90-degree through microstrip module are connected with the adjacent 90-degree through microstrip through respective insulating pin ports. The frequency multiplier module is also connected with a 180-degree through microstrip adjacent to the frequency multiplier module through an insulating pin port.
Certainly, the module system or the design/evaluation structure designed and built by applying the method is far more than that, and under different application scenes of the millimeter wave frequency band, flexible design of various complex circuit systems of the millimeter wave frequency band can be carried out through the matrix type modular millimeter wave module building system provided by the invention.
Therefore, in the matrix type cordwood millimeter wave module building system provided by the invention, building, designing, evaluating and testing of various modules or systems under a millimeter wave frequency band can be realized through the structural structures of the module carrier and various electronic circuit building block units distributed in the module carrier. In the above example, a plurality of first unit squares for placing standard modules and a plurality of second unit squares for placing standard microstrip circuits are distributed in a 2 × 5 matrix structure, and in a practical application scenario, the matrix-type building block millimeter wave module building system provided by the invention can flexibly select values of M and N, that is, the sizes of the matrix-type distribution structures of the plurality of first unit squares and the plurality of second unit squares in the module carrier are flexibly adjusted, for example, the matrix-type distribution specification of 5 × 3 or 5 × 5 is changed, so that more electronic circuit building block units are spliced, and the requirements of more flexible or more complex system building, design or evaluation test of the microwave system are met.
The above is only a preferred embodiment of the present invention, it should be noted that the above embodiment does not limit the present invention, and various changes and modifications made by workers within the scope of the technical idea of the present invention fall within the protection scope of the present invention.
Claims (12)
1. The utility model provides a system is built to matrix cordwood millimeter wave module which characterized in that: the module comprises a module carrier and an electronic circuit building block unit;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
the module carrier comprises a matrix type building block carrier, and the matrix type building block carrier comprises a plurality of first unit grids which are distributed in a matrix type and used for placing standard modules and a plurality of second unit grids used for placing standard microstrip circuits;
the module carrier also comprises more than one side wall which is positioned at the side edge of the module carrier and can be used for installing a connector;
when the connector is installed on the side wall, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed on one side of the module carrier.
2. The matrix-type modular millimeter wave module building system of claim 1, wherein: the standard module comprises an amplifier module and/or a mixer module and/or a frequency multiplier module and/or a pass-through module; and/or
The standard microstrip circuit comprises a 180-degree through microstrip and/or a 90-degree through microstrip and/or a filter microstrip circuit and/or a combiner microstrip circuit and/or a coupler microstrip circuit.
3. The matrix-type modular millimeter wave module building system of claim 1, wherein: the waveguide transition module is a transition waveguide for converting the signal from microstrip transmission to waveguide transmission.
4. The matrix-type modular millimeter wave module building system of claim 2, wherein: the through module comprises a 180-degree through microstrip module and/or a 90-degree through microstrip module.
5. The matrix-type modular millimeter wave module building system of claim 1, wherein: and the input and the output of the standard module are both insulating pins.
6. The matrix-type modular millimeter wave module building system of claim 1, wherein: the matrix distribution is an M multiplied by N matrix, wherein M is more than or equal to 2, N is more than or equal to 3, and M, N is an integer;
the first unit grids for placing the standard modules are adjacent to the second unit grids for placing the standard microstrip circuits; and/or
In the matrix distribution, the first unit grids for placing the standard modules and the first unit grids adjacent to the first unit grids for placing the standard modules are adjacent to each other at the same vertex; and/or
In the matrix distribution, the first unit grids for placing the standard modules and a plurality of second unit grids adjacent to the first unit grids for placing the standard microstrip circuits are adjacent to each other at the same vertex; and/or
In the matrix distribution, a first unit grid for placing the standard module and a plurality of second unit grids adjacent to the first unit grid for placing the standard microstrip circuit are abutted in a shared manner.
7. The matrix-type modular millimeter wave module building system of claim 1, wherein: the bottom surface of the second unit grid for placing the standard microstrip circuit is a metal plane, and the standard microstrip circuit is adhered to the metal plane; and/or
The bottom of the first unit grid for placing the standard module is a step hole, and the standard module is welded in the step hole and/or embedded in the step hole.
8. The matrix-type modular millimeter wave module building system of claim 1, wherein: the inner conductor of the connector is aligned to the center of the second unit where the standard microstrip circuit connected with the connector is located;
the side wall is a metal wall, and the metal wall is provided with a mounting hole for assembling the connector.
9. The matrix-type modular millimeter wave module building system of claim 1, wherein: the input and the output of the standard module are both insulating pins;
the bottom surface of the second unit grid for placing the standard microstrip circuit is a metal plane, and the standard microstrip circuit is adhered to the metal plane;
the height difference between the lowest point of the cylindrical surfaces of the input and output insulating pins arranged on the standard module in the first unit grid and the upper surface of the microstrip line of the standard microstrip circuit arranged in the second unit grid is not more than 0.05 mm.
10. The matrix-type modular millimeter wave module building system of claim 1, wherein: the side walls comprise a lower side wall positioned at the lower side and used for installing the connector, and/or a left side wall positioned at the left side and used for installing the connector, and/or a right side wall positioned at the right side and used for installing the connector;
the waveguide transition module is disposed above the module carrier.
11. The utility model provides a system is built to matrix cordwood millimeter wave module which characterized in that: the module comprises a module carrier and an electronic circuit building block unit;
the module carrier comprises a cavity and a lower side wall positioned at the lower side of the cavity and used for installing a connector, and/or a left side wall positioned at the left side of the cavity and used for installing a connector, and/or a right side wall positioned at the right side of the cavity and used for installing a connector;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
a plurality of first unit grids for placing standard modules and a plurality of second unit grids for placing standard microstrip circuits are arranged in the cavity; the first unit grids and the second unit grids are distributed in the cavity in a matrix manner;
when the lower side wall and/or the left side wall and/or the right side wall is/are provided with the connector, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed above the module carrier.
12. The utility model provides a system is built to matrix cordwood millimeter wave module which characterized in that: the module comprises a module carrier and an electronic circuit building block unit;
the electronic circuit building block unit comprises a standard module, a standard microstrip circuit, a connector and a waveguide transition module;
the module carrier comprises a cavity, a matrix type building block carrier positioned in the cavity, and a lower side wall positioned at the lower side of the cavity and used for installing a connector, and/or a left side wall positioned at the left side of the cavity and used for installing a connector, and/or a right side wall positioned at the right side of the cavity and used for installing a connector;
the matrix type building block carrier comprises a plurality of first unit grids which are distributed in a matrix type and used for placing standard modules and a plurality of second unit grids used for placing standard microstrip circuits;
when the lower side wall and/or the left side wall and/or the right side wall is/are provided with the connector, the connector is connected with the standard microstrip circuit in one of the second unit grids;
the waveguide transition module is disposed above the module carrier.
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Address after: 211100 9 Jiangning Road, Jiangning economic and Technological Development Zone, Nanjing, China Patentee after: Nanjing Milewei Microelectronics Technology Co.,Ltd. Country or region after: China Address before: 211100 9 Jiangning Road, Jiangning economic and Technological Development Zone, Nanjing, China Patentee before: NANJING MILEWEI Corp. Country or region before: China |