CN113083766A - 单片晶圆清洗方法 - Google Patents
单片晶圆清洗方法 Download PDFInfo
- Publication number
- CN113083766A CN113083766A CN202110241048.1A CN202110241048A CN113083766A CN 113083766 A CN113083766 A CN 113083766A CN 202110241048 A CN202110241048 A CN 202110241048A CN 113083766 A CN113083766 A CN 113083766A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning
- cleaning liquid
- clear water
- spray pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 225
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 121
- 239000007921 spray Substances 0.000 claims abstract description 121
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 86
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000005507 spraying Methods 0.000 claims abstract description 44
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 18
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 123
- 239000000243 solution Substances 0.000 description 17
- 239000007789 gas Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002912 waste gas Substances 0.000 description 3
- 101000580354 Rhea americana Rheacalcin-2 Proteins 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110241048.1A CN113083766A (zh) | 2021-03-04 | 2021-03-04 | 单片晶圆清洗方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110241048.1A CN113083766A (zh) | 2021-03-04 | 2021-03-04 | 单片晶圆清洗方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113083766A true CN113083766A (zh) | 2021-07-09 |
Family
ID=76666372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110241048.1A Pending CN113083766A (zh) | 2021-03-04 | 2021-03-04 | 单片晶圆清洗方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113083766A (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101689491A (zh) * | 2007-05-23 | 2010-03-31 | 细美事有限公司 | 基板干燥的装置与方法 |
US20140290703A1 (en) * | 2013-03-28 | 2014-10-02 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
CN104190652A (zh) * | 2014-08-11 | 2014-12-10 | 厦门润晶光电有限公司 | 一种中大尺寸蓝宝石晶圆图案化制程蚀刻后清洗装置及方法 |
CN105006424A (zh) * | 2015-07-29 | 2015-10-28 | 上海集成电路研发中心有限公司 | 单片式湿法清洗方法 |
TW201945094A (zh) * | 2018-05-01 | 2019-12-01 | 黃俊傑 | 晶圓清洗裝置 |
CN209947802U (zh) * | 2018-05-16 | 2020-01-14 | 东京毅力科创株式会社 | 显影处理装置 |
-
2021
- 2021-03-04 CN CN202110241048.1A patent/CN113083766A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101689491A (zh) * | 2007-05-23 | 2010-03-31 | 细美事有限公司 | 基板干燥的装置与方法 |
US20140290703A1 (en) * | 2013-03-28 | 2014-10-02 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
CN104190652A (zh) * | 2014-08-11 | 2014-12-10 | 厦门润晶光电有限公司 | 一种中大尺寸蓝宝石晶圆图案化制程蚀刻后清洗装置及方法 |
CN105006424A (zh) * | 2015-07-29 | 2015-10-28 | 上海集成电路研发中心有限公司 | 单片式湿法清洗方法 |
TW201945094A (zh) * | 2018-05-01 | 2019-12-01 | 黃俊傑 | 晶圓清洗裝置 |
CN209947802U (zh) * | 2018-05-16 | 2020-01-14 | 东京毅力科创株式会社 | 显影处理装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20221219 Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Applicant after: Jiangsu Yadian Technology Co.,Ltd. Address before: 210000 room 605-7, Tongxi building, 1347 Shuanglong Avenue, Jiangning District, Nanjing City, Jiangsu Province (Jiangning Development Zone) Applicant before: Yadian Technology Nanjing Co.,Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Applicant after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Applicant before: Jiangsu Yadian Technology Co.,Ltd. |