CN113071900A - Substrate conveying device - Google Patents
Substrate conveying device Download PDFInfo
- Publication number
- CN113071900A CN113071900A CN202011459908.0A CN202011459908A CN113071900A CN 113071900 A CN113071900 A CN 113071900A CN 202011459908 A CN202011459908 A CN 202011459908A CN 113071900 A CN113071900 A CN 113071900A
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- Prior art keywords
- frame
- support frame
- substrate
- transfer
- support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a substrate conveying device, which can realize stable and accurate substrate conveying. The substrate transfer apparatus includes: a transfer frame equipped with a connection frame combined with the driving part at both end parts; and a support frame on which a substrate for transfer is placed at an upper portion, and having a central support portion coupled and supported on the transfer frame and a free end portion extended from the central support portion to both sides, wherein the support frame includes: a first support frame extendedly formed to have a first length in a width direction of the substrate and curvedly formed to convexly have a predetermined curvature in a lower direction; and a second support frame coupled to a lower portion of the first support frame, elongated to have a second length shorter than the first length, and curved to have a curvature corresponding to that of the first support frame.
Description
Technical Field
The present invention relates to a substrate transfer apparatus, and more particularly, to a substrate transfer apparatus which can stably and accurately transfer a substrate by correcting a sagging amount generated by the self weight of a support frame and a load applied to the support frame when transferring the substrate.
Background
Generally, a substrate used for a display, a semiconductor wafer, an LCD, a photomask glass, and the like is subjected to various processing steps. For example, unit processes such as etching, peeling, cleaning, and drying may be performed.
A substrate transfer apparatus for transferring a substrate is essentially used between unit processes for substrate processing and the like. Namely, the following method is used: the substrate discharged from the pre-treatment process line is conveyed in a horizontal state and supplied to the post-treatment process line, or stored in a cassette or the like.
In addition, the substrate transfer apparatus generally adopts a Cantilever (Cantilever) type in consideration of space utilization such as simplification of the structure and interference with peripheral structures at the time of loading and unloading of the substrate. For example, a central portion of a support frame supporting the substrate is fixedly supported on the driving portion, and the other end portion formed to extend from the central portion takes the form of a free end portion.
At this time, the substrate support frame is disposed in a substantially horizontal state so as to support the substrate in the horizontal state.
However, the substrate support frame having such a structure causes a sagging phenomenon in a downward direction in the free end region due to its own weight and a load of the substrate. Such a sagging phenomenon becomes more serious as the size of the substrate to be transferred becomes larger or the thickness of the support frame becomes thinner, thereby causing a problem of lowering the processing efficiency and quality of the substrate in the substrate manufacturing process requiring precision.
Therefore, there is a need for an apparatus for accurately transferring a substrate without sagging.
Documents of the prior art
Patent document
Patent document 1: contents of the invention of korean registered patent publication No. 1920754 (published on 11/21/2018)
Problems to be solved by the invention
An object of the present invention is to solve the conventional problems, and the present invention provides a substrate transfer apparatus capable of stably and accurately transferring a substrate by bending a support frame in consideration of a sagging amount due to a self-weight of the substrate support frame and a load applied to the substrate support frame.
Means for solving the problems
In order to achieve the above object of the present invention, a substrate transfer apparatus according to an embodiment of the present invention is characterized by comprising: a transfer frame equipped with a connection frame combined with the driving part at both end parts; and a support frame on which a substrate for transfer is placed at an upper portion, having a central support portion coupled and supported on the transfer frame and free end portions formed to be extended from the central support portion to both sides, wherein the support frame includes a first support frame which is extended to have a first length in a width direction of the substrate and is curved to be convex in a lower direction and to have a predetermined curvature.
The support frame may further include a second support frame coupled to a lower portion of the first support frame, elongated to have a second length shorter than the first length, and bent to have a curvature corresponding to that of the first support frame.
By the bending of the first and second support frames, it is possible to prevent the free end portion from being lowered to a height lower than that of the central support portion due to the self weight of the support frames and the load applied to the support frames at the time of substrate transfer.
In the substrate transfer apparatus according to the embodiment of the present invention, the support frame may further include a fastening member coupled to make a central portion of the first support frame and a central portion of the second support frame coincide in a state where the first support frame and the second support frame are overlapped.
In the substrate transport apparatus according to the embodiment of the present invention, the free end portion of the second support frame may be disposed in an 2/3L region of a length L from the central portion to the free end portion of the first support frame.
In the substrate transfer apparatus according to an embodiment of the present invention, the support frame may be provided in plurality at intervals in a length direction of the substrate, and in this case, the transfer frame may include: a first conveying frame provided in a width direction of the substrate and provided at both end portions with connection frames connected with the driving portion; a second transfer frame disposed on an upper side of the first transfer frame, provided in a longitudinal direction of the substrate, and coupled to a central support portion of each of the support frames; and a third transfer frame connecting the first transfer frame and the second transfer frame.
In the substrate transfer apparatus according to an embodiment of the present invention, the third transfer frame may include: a third vertical frame of which a lower end is coupled to the first conveying frame and of which an upper end formed to be vertically elongated is coupled to the second conveying frame; and a third inclined frame, a lower end portion of which is coupled to the first conveying frame, and an upper end portion of which is formed to be inclined and extended is coupled to the second conveying frame.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, the substrate support frame is convexly formed in advance in the lower direction in consideration of the self weight of the support frame and the load of the substrate applied to the support frame, and the sagging amount generated at the free end portion of the support frame is greatly reduced, so that the substrate can be stably and accurately transferred.
According to the present invention, the bending rigidity of the support frame is reinforced by the stacked structure of the first support frame and the second support frame, the deformation of the substrate support frame or the breakage of the substrate conveying apparatus can be prevented, and the vibration suppression and the sagging amount of the substrate support frame can be effectively compensated.
Further, according to the present invention, unnecessary work man-hours for providing a reinforcing structure and the like to reinforce the bending of the support frame forming the Cantilever (Cantilever) structure can be reduced, and costs associated therewith can be reduced.
Drawings
Fig. 1 and 2 are perspective views for explaining a substrate transfer apparatus according to an embodiment of the present invention.
Fig. 3 is a perspective view for explaining a transfer frame of the substrate transfer apparatus of fig. 1.
Fig. 4 is a side view illustrating the substrate transfer apparatus of fig. 1.
Fig. 5 is an exemplary view illustrating a substrate transfer state using the substrate transfer apparatus of fig. 1.
Detailed Description
Hereinafter, preferred embodiments of the present invention that can embody the above-described problems to be solved are described with reference to the accompanying drawings. In describing the embodiment, the same names and the same reference numerals may be used for the same structures, and additional description thereof will be omitted.
Fig. 1 and 2 are perspective views for explaining a substrate transfer apparatus according to an embodiment of the present invention, and fig. 3 is a perspective view for explaining a transfer frame of the substrate transfer apparatus of fig. 1.
Fig. 4 is a side view illustrating the substrate transfer apparatus of fig. 1, and fig. 5 is an exemplary view illustrating a substrate transfer state using the substrate transfer apparatus of fig. 1.
Referring to fig. 1 to 5, a substrate transfer apparatus according to an embodiment of the present invention may include a transfer frame 100 and a support frame 200.
The transfer frame 100 may be connected to a driving unit, not shown, and may move the substrate G in a target direction and position in conjunction with the driving of the driving unit.
The transfer frame 100 may include a first transfer frame 110, a second transfer frame 120, and a third transfer frame 130.
The first transfer frame 110 may be provided in the width direction a2 of the substrate, and connection frames 111 connected to the driving part may be provided at both end portions.
In addition, the first transfer frame 110 may be constituted by an assembly of a first horizontal frame 112 and a first vertical frame 113. For example, the first transfer frame 110 may be configured by a pair of first horizontal frames 112 provided in the width direction a2 of the substrate and a plurality of first vertical frames 113 provided in the length direction a1 of the substrate and connecting the pair of first horizontal frames 112.
The first transverse frame 112 and the first longitudinal frame 113 may be formed of extruded section steel.
The second transfer frame 120 may be disposed on the upper side of the first transfer frame 110, and may be disposed in the longitudinal direction a1 of the substrate. At this time, the lower surface of the central support portion 200a of the support frame 200 may be coupled to the upper surface of the second transfer frame 120. In the case where a plurality of support frames 200 are disposed spaced apart from each other in the length direction a1 of the substrate, the lower surface of the central support portion 200a of each support frame 200 may be coupled to the central upper surface of the second transfer frame 120.
The second transfer frame 120 and the support frame 200 may be fixedly coupled by welding, and may be fixedly coupled using a separate fastening member. The second transfer frame 120 may include a second transverse frame 122 provided in the width direction a2 of the substrate and a second longitudinal frame 121 provided in the length direction a1 of the substrate. Here, the second transverse frame 122 and the second longitudinal frame 121 may be extrusion-formed section steel.
The third transfer frame 130 may connect the first transfer frame 110 and the second transfer frame 120, and may fixedly support the second transfer frame 120 at a certain height in a horizontal state with respect to the first transfer frame 110.
In addition, the third transfer frame 130 may include a third vertical frame 131 and a third inclined frame 132.
The lower end of the third vertical frame 131 may be coupled to the first transfer frame 110, and the upper end formed to be vertically elongated may be coupled to the second transfer frame 120. The third vertical frame 131 may vertically connect the intersection areas of the first and second transfer frames 110 and 120 on a plane. The second transfer frame 120 may be fixedly supported in a horizontal state at a certain height from the first transfer frame 110 by the third vertical frame 131.
A lower end portion of the third inclination frame 132 may be coupled to the first transfer frame 110. The upper end portion formed to be inclined and elongated may be coupled to the second transfer frame 120. The second transfer frame 120 may be more stably fixedly supported in a horizontal state with respect to the first transfer frame 110 by the third inclination frame 132.
A substrate G for transfer may be placed on the upper portion of the support frame 200. Also, it may have a central support portion 200a combined to be supported on the conveying frame 100 and a free end portion 200b extended from the central support portion 200a to both sides.
In addition, a plurality of the support frames 200 may be arranged at intervals along a conveyance direction which is the longitudinal direction a1 of the substrate G. Accordingly, the plurality of support frames 200 may stably support the lower surface of the substrate placed at the upper portion.
Each support frame 200 may include a first support frame 210 and a second support frame 220.
The first support frame 210 may be extendedly formed to have a first length in the width direction a2 of the substrate G, and may be curvedly formed to convexly have a predetermined curvature θ in a lower direction.
Such a first support frame 210 may be manufactured by: is extruded to have a certain section, and then is bent to have a certain curvature θ using a bending device, and then is cut to have a first length.
In addition, a plurality of support pins 211 contacting the lower surface of the substrate G may be provided at the upper surface of the first support frame 210.
The second support frame 220 may be disposed at a lower side of the first support frame 210 and may be extendedly formed to have a second length, and at this time, the second length may be shorter than the first length. In addition, the second support frame 220 may be curved to have a curvature θ corresponding to the curvature θ of the first support frame 210.
The second support frame 220 manufactured in a relatively short length may have a greater rigidity than the first support frame 210, and such second support frame 220 may reinforce the rigidity of the first support frame 210 in a state of being coupled to the lower side of the first support frame 210.
Referring to fig. 5, it is preferable that the free end of the second support frame 220 is disposed in an 2/3L region of a length L from the center to the free end of the first support frame 210 in a state where the center of the first support frame 210 and the center of the second support frame 220 are aligned.
The second support frame 220 may be manufactured as follows: may be extruded to have the same section as the first support frame 210, and then bent to have a certain curvature θ using a bending device, and then cut to have a second length.
As a result, the first support frame 210 and the second support frame 220 can be manufactured by previously calculating the amount of sagging from the center portion to the free end portion in consideration of the own weight of each support frame and the load of the substrate G, and performing the extrusion forming and the bending processing in consideration of the amount of sagging thus calculated.
The curvature θ may be designed in consideration of a sagging amount of the free end portion 200b caused by the load of the first and second support frames 210 and 220 and the load of the substrate. For example, as shown in (a) of fig. 5, the above curvature θ may be designed such that, when the substrate is placed on the first support frame 210, the height H1 of the support pin at the central support portion 200a and the height H2 of the support pin at the free end portion 200b are the same.
Of course, in another embodiment of the present invention, as shown in fig. 5 (b), the above curvature θ may be designed such that the height H1 of the support pin at the central support portion 200a is lower than the height H2 of the support pin at the free end portion 200b when the substrate is placed on the first support frame 210.
The fastening part 230 may be combined to overlap the first and second support frames 210 and 220 and to make the central portion of the first and second support frames 210 and 220 coincide. The fastening member 230 may be a bolt member or may be fixedly coupled by welding.
The fastening portions of the first and second support frames 210 and 220 integrally combined by such a fastening member 230 may be portions that are jointly supported by the conveying frame 100. That is, the fastening portions of the first and second support frames 210 and 220 may be the central support portion 200a of the support frame 200 supported by the conveying frame 100.
Referring to fig. 4, the support frame 200 in which the first support frame 210 and the second support frame 220 are integrally connected by the fastening member 230 in this way can maintain a state in which the central support portion 200a is convexly bent downward in a state in which the substrate is not placed. That is, the support pin 211 of the center support 200a contacting the substrate may maintain the first height H1 at the reference surface (not shown), and the support pin 211 of the free end 200b contacting the substrate may maintain the second height H2 higher than the first height H1.
Referring to fig. 5, when the substrate G for transfer is placed, the free end portion 200b of the support frame 200 may be lowered to a predetermined height while being bent due to the self-weight of the support frame 200 and the load applied to the substrate G of the support frame 200. In this way, the bent support frame 200 can be maintained in a substantially horizontal state in a state where the substrate G is placed, and in contrast to this, can be maintained in a slightly bent state.
As shown in (a) of fig. 5, the height of the support pin of the free end portion 200b, which is deformed due to the self weight of the support frame 200 and the load applied to the substrate G of the support frame 200, i.e., the second height H2, may be maintained at the same height as the height of the support pin of the central support portion 200a, i.e., the first height H1.
Further, according to another embodiment of the present invention, as shown in (b) of fig. 5, the height of the support pin of the free end portion 200b, i.e., the second height H2, may be maintained higher than the first height H1 of the central support portion 200 a. Of course, as shown in (b) in fig. 4, the second height H2 in the state where no substrate is placed is maintained to be higher than the second height H2 in the state where a substrate is placed as shown in (b) in fig. 5.
For example, when a substrate G having a large area is transferred, a swing phenomenon may occur according to vibration characteristics of the transferred substrate G and the support frame 200, and as shown in (b) of fig. 5, a predetermined and appropriate bent state is maintained in a state where the second height H2 of the free end portion 200b is higher than the first height H1 of the central support portion 200a, so that the bent state of the support frame 200 during the transfer can be stably maintained. Therefore, the vibration and sagging amount of the support frame 200 and the substrate G in conveyance can be effectively reduced.
As described above, the substrate transfer apparatus according to the present invention forms the substrate support frame 200 to be convexly bent in the lower direction in advance in consideration of the self weight of the support frame 200 and the load applied to the substrate G of the support frame 200, greatly reduces the sagging amount generated at the free end portions 200b of the substrate and the support frame 200, and thus can stably and accurately transfer the substrate G.
In addition, the substrate transport apparatus according to the present invention reinforces the bending rigidity of the support frame 200 by the stacked structure of the first and second support frames 210 and 220, so that the deformation of the substrate support frame 200 or the breakage of the substrate transport apparatus can be prevented, and the vibration suppression and the sagging amount of the substrate support frame 200 can be effectively improved.
Further, the substrate transfer apparatus according to the present invention has an advantage in that unnecessary work man-hours for excessively additionally providing a reinforcing structure or the like for reinforcing the bending of the support frame forming the Cantilever (Cantilever) structure and costs associated therewith can be reduced.
As described above, the preferred embodiments of the present invention have been described with reference to the accompanying drawings, but those skilled in the art can make various modifications or changes to the present invention without departing from the spirit and scope of the invention described in the claims.
Description of the reference numerals
100: the frame is conveyed to the conveying device,
200: support frame, 200 a: center support portion, 200 b: the free end part of the connecting rod is provided with a connecting rod,
210: a first support frame for supporting the first support frame,
220: a second support frame.
Claims (5)
1. A substrate transfer apparatus, comprising:
a transfer frame equipped with a connection frame combined with the driving part at both end parts; and
a support frame, on which a substrate for transfer is placed, having a central support part combined and supported on the transfer frame and free end parts formed by extending from the central support part to both sides,
wherein the support frame comprises:
a first support frame extendedly formed to have a first length in a width direction of the substrate, and curved to be convex in a lower direction and to have a predetermined curvature; and
a second support frame coupled to a lower portion of the first support frame, elongated to have a second length shorter than the first length, and bent to have a curvature corresponding to that of the first support frame,
thereby preventing the free end portion from being lowered to a height lower than that of the central support portion due to the self-weight of the support frame and a load applied to the support frame at the time of substrate transfer.
2. The substrate transport apparatus according to claim 1, wherein the support frame further comprises a fastening member coupled to make a central portion of the first support frame and a central portion of the second support frame coincide in a state where the first support frame and the second support frame are stacked.
3. The substrate transport apparatus according to claim 1, wherein the free end portion of the second support frame is disposed in an 2/3L region of a length L from the central portion to the free end portion of the first support frame.
4. The substrate transport apparatus according to claim 1,
the support frame is provided in plurality at intervals along a length direction of the substrate,
the transfer frame includes:
a first conveying frame provided in the width direction of the substrate and provided with connecting frames connected to the driving part at both ends;
a second transfer frame disposed on an upper side of the first transfer frame, provided in a longitudinal direction of the substrate, and coupled to a central support portion of each of the support frames; and
a third transfer frame connecting the first transfer frame and the second transfer frame.
5. The substrate transport apparatus according to claim 4, wherein the third transport frame comprises:
a third vertical frame of which a lower end is coupled to the first conveying frame and of which an upper end formed to be vertically elongated is coupled to the second conveying frame; and
a third inclined frame, a lower end portion of which is coupled to the first conveying frame, and an upper end portion of which is formed to be inclined and extended is coupled to the second conveying frame.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020200000030U KR20210001607U (en) | 2020-01-03 | 2020-01-03 | Apparatus for transferring substrate |
| KR20-2020-0000030 | 2020-01-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113071900A true CN113071900A (en) | 2021-07-06 |
| CN113071900B CN113071900B (en) | 2022-08-26 |
Family
ID=76609242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011459908.0A Active CN113071900B (en) | 2020-01-03 | 2020-12-11 | Substrate conveying device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20210001607U (en) |
| CN (1) | CN113071900B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10139157A (en) * | 1996-11-12 | 1998-05-26 | Canon Sales Co Inc | Substrate carrier device |
| CN1393385A (en) * | 2001-06-26 | 2003-01-29 | 日立机电工业株式会社 | Moving loading device for plate shape substrates and its storing device |
| CN1564316A (en) * | 2004-03-23 | 2005-01-12 | 友达光电股份有限公司 | Carriage and transfer gear used same |
| TW200534975A (en) * | 2004-02-18 | 2005-11-01 | Sankyo Seiki Seisakusho Kk | Carrying robot for glass substrate |
| CN101407063A (en) * | 2007-10-12 | 2009-04-15 | 爱斯佩克株式会社 | Arm for automatic machine |
| KR20100031333A (en) * | 2008-09-12 | 2010-03-22 | 주식회사 디엠에스 | Slit coater |
| KR20110009793A (en) * | 2009-07-23 | 2011-01-31 | 주식회사 디엠에스 | Apparatus for processing substrate |
| CN109219487A (en) * | 2016-04-06 | 2019-01-15 | 法国圣戈班玻璃厂 | For transmitting and keeping the device of glass plate especially in cleaning equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101920754B1 (en) | 2011-09-30 | 2018-11-21 | 엘지디스플레이 주식회사 | Transporting apparatus for a glass |
-
2020
- 2020-01-03 KR KR2020200000030U patent/KR20210001607U/en unknown
- 2020-12-11 CN CN202011459908.0A patent/CN113071900B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10139157A (en) * | 1996-11-12 | 1998-05-26 | Canon Sales Co Inc | Substrate carrier device |
| CN1393385A (en) * | 2001-06-26 | 2003-01-29 | 日立机电工业株式会社 | Moving loading device for plate shape substrates and its storing device |
| TW200534975A (en) * | 2004-02-18 | 2005-11-01 | Sankyo Seiki Seisakusho Kk | Carrying robot for glass substrate |
| CN1564316A (en) * | 2004-03-23 | 2005-01-12 | 友达光电股份有限公司 | Carriage and transfer gear used same |
| CN101407063A (en) * | 2007-10-12 | 2009-04-15 | 爱斯佩克株式会社 | Arm for automatic machine |
| KR20100031333A (en) * | 2008-09-12 | 2010-03-22 | 주식회사 디엠에스 | Slit coater |
| KR20110009793A (en) * | 2009-07-23 | 2011-01-31 | 주식회사 디엠에스 | Apparatus for processing substrate |
| CN109219487A (en) * | 2016-04-06 | 2019-01-15 | 法国圣戈班玻璃厂 | For transmitting and keeping the device of glass plate especially in cleaning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113071900B (en) | 2022-08-26 |
| KR20210001607U (en) | 2021-07-14 |
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