CN113058921A - Cleaning equipment and cleaning method - Google Patents
Cleaning equipment and cleaning method Download PDFInfo
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- CN113058921A CN113058921A CN202110260274.4A CN202110260274A CN113058921A CN 113058921 A CN113058921 A CN 113058921A CN 202110260274 A CN202110260274 A CN 202110260274A CN 113058921 A CN113058921 A CN 113058921A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a cleaning apparatus and a cleaning method, the cleaning apparatus including: the first tank body is used for containing process liquid and bearing a piece to be cleaned; the second tank body is arranged on one side of the first tank body and is used for containing process liquid from the liquid supplementing device; the liquid conveying device is respectively connected with the first tank body and the second tank body and is used for selectively carrying out an inter-tank circulation mode or an in-tank circulation mode, wherein the inter-tank circulation mode is that the process liquid circularly flows between the first tank body and the second tank body, and the process liquid in the first tank body flows along a first direction; the circulation mode in the tank is to circulate the process liquid in the first tank in a second direction, and the second direction is opposite to the first direction. The cleaning equipment and the cleaning method provided by the invention can improve the process uniformity, and can avoid the generation of a flow field dead zone in a single flow direction, thereby improving the cleaning effect and preventing the generation of contact point defects.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a cleaning device and a cleaning method.
Background
At present, the tank type cleaning equipment generally adopts a double-tank design of an inner tank and an outer tank, and realizes the circulation flow of liquid medicine between the inner tank and the outer tank through a circulating system. The inner tank is used for carrying wafers to clean the wafers, and the uniform and stable temperature, concentration and circulating flow rate are required to be maintained to achieve a good cleaning effect. The outer tank is mainly used for preparing liquid and supplementing liquid, in the process, a liquid supplementing pipeline firstly injects liquid medicine into the outer tank, the liquid medicine flows into the inner tank from the bottom of the inner tank through the circulating system after being naturally diffused and mixed, and overflows into the outer tank from the top of the inner tank. Therefore, the circulation flow direction of the chemical liquid is always a unidirectional circulation flow direction from the outer tank to the inner tank, which inevitably causes the following problems in practical use:
first, a heater is usually disposed in a liquid medicine conveying pipeline of the circulating system to heat the liquid medicine flowing into the inner tank, but the temperature of the tank body (especially a high-temperature tank body) naturally drops in the using process, so that the temperature of the area close to the bottom of the tank body is always higher than that of the area at the top of the tank body, and thus the etching rates of the wafers in different areas in the vertical direction are different, and the etching uniformity is affected.
Secondly, because of the obstruction of the wafer supporting device, a flow field dead zone is easily generated near the contact position of the wafer and the wafer, and because the liquid medicine in the inner groove has single flow direction, the dead zone position can not move, and along with the continuous process, particle deposition and pollutant adhesion can occur at the contact position, so that the contact point defect is easily formed on the wafer.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a cleaning device and a cleaning method for a semiconductor manufacturing process, which can improve the process uniformity and avoid the generation of a flow field dead zone in a single flow direction, thereby improving the cleaning effect and preventing the generation of contact point defects.
To achieve the object of the present invention, there is provided a cleaning apparatus for use in a semiconductor manufacturing process, comprising:
the first tank body is used for containing process liquid and bearing a piece to be cleaned;
the second tank body is arranged on one side of the first tank body and is used for containing process liquid from the liquid supplementing device; and
the liquid conveying device is respectively connected with the first tank body and the second tank body and is used for selectively carrying out an inter-tank circulation mode or an in-tank circulation mode, wherein the inter-tank circulation mode is that process liquid circularly flows between the first tank body and the second tank body, and the process liquid in the first tank body flows along a first direction; the tank circulation mode is to circulate a process liquid in a second direction in the first tank, and the second direction is opposite to the first direction.
Optionally, the liquid delivery device comprises:
a first conveying unit connected to the first tank body at first and second positions of the first tank body and connected to the second tank body at third and fourth positions of the second tank body, for causing the process liquid in the first tank body to flow out from the first position and to flow into the second tank body from the third position, and for causing the process liquid in the second tank body to flow out from the fourth position and to flow into the first tank body from the second position; the first position is higher than the second position so that the process liquid in the first tank body flows along the direction from bottom to top;
the second conveying unit is connected with the first tank body at a fifth position and a sixth position of the first tank body, and is used for pumping out the process liquid in the first tank body from the fifth position and flowing into the first tank body from the sixth position; the fifth position is lower than the sixth position, so that the process liquid in the first tank body flows in the top-down direction; and
and the switching unit is respectively connected with the first conveying unit and the second conveying unit and is used for switching between the work of the first conveying unit and the work of the second conveying unit.
Optionally, the first conveying unit includes:
the overflow structure is respectively connected with the top opening of the first tank body and the top opening of the second tank body and is used for conveying the process liquid overflowing from the top opening of the first tank body into the second tank body;
and the first pipeline structure is respectively connected with the bottom of the first tank body and the bottom of the second tank body and is used for conveying the process liquid flowing out of the bottom of the second tank body into the first tank body from the bottom of the first tank body.
Optionally, the second conveying unit includes:
the second pipeline structure is connected with the bottom of the first tank body, is connected with the inside of the first tank body at the sixth position, and is used for conveying the process liquid flowing out of the bottom of the first tank body into the first tank body from the sixth position; the sixth position is located on the side wall of the first groove body and close to the position of the top opening of the first groove body.
Optionally, first pipeline structure includes first pipeline, second pipeline and third pipeline, wherein, the feed liquor end of first pipeline with the bottom intercommunication of second cell body, the play liquid end of first pipeline with the feed liquor end of second pipeline is connected, the play liquid end of second pipeline with the feed liquor end of third pipeline is connected, the play liquid end of third pipeline with the bottom intercommunication of first cell body.
Optionally, the second pipeline structure includes a fourth pipeline and a fifth pipeline, wherein a liquid inlet end and a liquid outlet end of the fourth pipeline are respectively connected to the third pipeline and the first pipeline; the liquid inlet end of the fifth pipeline is connected with the liquid outlet end of the second pipeline and the liquid inlet end of the third pipeline, and the liquid outlet end of the fifth pipeline is communicated with the sixth position of the first groove body and the inside of the first groove body.
Optionally, the cleaning apparatus further comprises: the circulating pump and the temperature control device are arranged on the second pipeline;
the circulating pump is used for pumping the process liquid in the second tank body when the first conveying unit works and pumping the process liquid in the first tank body when the second conveying unit works;
the temperature control device is used for controlling the temperature of the process liquid flowing through the second pipeline.
Optionally, the switching unit comprises a first three-way valve, a second three-way valve and a third three-way valve, wherein,
a first port of the first three-way valve is communicated with a liquid outlet end of the third pipeline, a second port of the first three-way valve is communicated with a liquid inlet end of the fourth pipeline, and a third port of the first three-way valve is communicated with a liquid inlet end of the third pipeline; the first three-way valve is used for communicating the liquid outlet end of the third pipeline with the liquid inlet end of the fourth pipeline in an in-tank circulation mode, and communicating the liquid inlet end and the liquid outlet end of the third pipeline in an inter-tank circulation mode;
a first port of the second three-way valve is communicated with a liquid inlet end of the third pipeline, a second port of the second three-way valve is communicated with a liquid outlet end of the second pipeline, and a third port of the second three-way valve is communicated with a liquid inlet end of the fifth pipeline; the second three-way valve is used for communicating the liquid outlet end of the second pipeline and the liquid inlet end of the fifth pipeline in the in-tank circulation mode, and communicating the liquid outlet end of the second pipeline and the liquid inlet end of the third pipeline in the inter-tank circulation mode;
a first port of the third three-way valve is communicated with a liquid outlet end of the fourth pipeline, a second port of the third three-way valve is communicated with a liquid inlet end of the first pipeline, and a third port of the third three-way valve is communicated with a liquid outlet end of the first pipeline; and the third three-way valve is used for communicating the liquid outlet end of the fourth pipeline with the liquid outlet end of the first pipeline in an in-tank circulation mode, and communicating the liquid inlet end and the liquid outlet end of the first pipeline in an inter-tank circulation mode.
Optionally, still be provided with a plurality of feed liquor holes on the lateral wall of first cell body, and be a plurality of the feed liquor hole is followed the circumference interval distribution of first cell body, the quantity of fifth pipeline is no longer than the quantity in feed liquor hole, and every the play liquid end of fifth pipeline is connected with one or more the feed liquor hole corresponds.
Optionally, all the liquid inlet holes are located below the specified height position, and the specified height position satisfies: and when the tank internal circulation mode is carried out, all the liquid inlet holes are positioned below the liquid level of the process liquid in the first tank body.
Optionally, the cleaning apparatus further includes a control unit, and the control unit is configured to control the liquid conveying device to switch between the inter-tank circulation mode and the intra-tank circulation mode at specified intervals in the process of cleaning the to-be-cleaned member;
the set of the specified duration satisfies: a first area formed between a first moment and a second moment of the first temperature curve and the second temperature curve is equal to a second area formed between the second moment and a third moment; the first temperature curve is a variation curve of a first temperature value at a first specified position in the first direction in the first groove body; the second temperature curve is a variation curve of a second temperature value at a second specified position in the first direction in the first groove body; the first time, the second time and the third time are respectively corresponding times when the first temperature value and the second temperature value are equal in sequence three times in the process of continuously switching between the inter-tank circulation mode and the in-tank circulation mode three times.
Optionally, the cleaning apparatus further comprises:
the first temperature sensor is used for detecting a first temperature value corresponding to the first designated position in the first tank body and sending the first temperature value to the control unit; and
and the second temperature sensor is used for detecting a first temperature value corresponding to the second appointed position in the first groove body and sending the first temperature value to the control unit.
Optionally, the overflow structure includes a buffer tank body, the buffer tank body and the second tank body together form an annular tank body surrounding the first tank body, the top of the outer side wall of the buffer tank body and the second tank body, which is far away from the first tank body, is higher than the top opening height of the first tank body, and the top of the inner side wall of the buffer tank body and the second tank body, which is close to the first tank body, is lower than or equal to the top opening height of the first tank body; and the interior of the buffer tank body is communicated with the interior of the second tank body, and the buffer tank body is used for collecting the process liquid overflowing from the top opening of the first tank body into the second tank body.
As another technical solution, an embodiment of the present invention further provides a cleaning method, which is applied to the cleaning apparatus provided in the embodiment of the present invention; the cleaning method comprises the following steps:
and in the process of cleaning the piece to be cleaned, controlling the liquid conveying device to switch between the inter-tank circulation mode and the in-tank circulation mode at specified intervals.
Optionally, the setting of the specified duration satisfies: a first area formed between a first moment and a second moment of the first temperature curve and the second temperature curve is equal to a second area formed between the second moment and a third moment; the first temperature curve is a variation curve of a first temperature value at a first specified position in the first direction in the first groove body; the second temperature curve is a variation curve of a second temperature value at a second specified position in the first direction in the first groove body; the first time, the second time and the third time are respectively corresponding times when the first temperature value and the second temperature value are equal in sequence three times in the process of continuously switching between the inter-tank circulation mode and the in-tank circulation mode three times.
The invention has the following beneficial effects:
in the technical scheme of the cleaning equipment and the cleaning method used in the semiconductor manufacturing process, provided by the embodiment of the invention, the liquid conveying device is respectively connected with the first tank body and the second tank body and is used for selectively carrying out an inter-tank circulation mode or an intra-tank circulation mode, wherein the inter-tank circulation mode is that process liquid circularly flows between the first tank body and the second tank body, and the process liquid in the first tank body flows along a first direction; the circulation mode in the tank is to circulate the process liquid in the first tank in a second direction, and the second direction is opposite to the first direction. In the process of carrying out the process, the liquid conveying device is used for switching between the inter-tank circulation mode and the in-tank circulation mode, so that the flowing direction of the process liquid in the first tank body can be changed, the temperature uniformity in the first tank body can be improved, and the process uniformity can be improved; in addition, the flow field dead zone generated by single liquid flow direction can be avoided, so that the cleaning effect can be improved, and the defect of a contact point is prevented.
Drawings
Fig. 1 is a schematic block diagram of a cleaning apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic block diagram of a cleaning apparatus according to a second embodiment of the present invention;
FIG. 3 is a schematic block diagram of a cleaning apparatus according to a third embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an overflow structure adopted in a third embodiment of the present invention;
FIG. 5 is a schematic diagram of the connection of a first piping structure and a second piping structure employed in a third embodiment of the present invention;
FIG. 6A is a schematic view showing the flow direction of the liquid in the circulation mode between the tanks in the cleaning apparatus according to the third embodiment of the present invention;
FIG. 6B is a schematic view showing the flow direction of the liquid in the circulation mode in the tank of the cleaning apparatus according to the third embodiment of the present invention;
FIG. 7A is a schematic illustration of the connection of a first three-way valve used in a third embodiment of the present invention;
FIG. 7B is a schematic illustration of the connection of a second three-way valve used in a third embodiment of the present invention;
FIG. 7C is a schematic illustration of the connection of a third three-way valve employed in a third embodiment of the present invention;
FIG. 8 is a horizontal sectional view of a first tank body used in a third embodiment of the present invention;
FIG. 9 is a graph showing the temperature change in the first tank during the process of the cleaning apparatus according to the third embodiment of the present invention;
fig. 10 is a flow chart of a cleaning method according to a fourth embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes in detail a cleaning apparatus and a cleaning method for use in a semiconductor manufacturing process according to the present invention with reference to the accompanying drawings.
First embodiment
Referring to fig. 1, the cleaning apparatus for use in the semiconductor manufacturing process according to the present embodiment includes a first tank 1, a second tank 2 and a liquid conveying device 3, wherein the first tank 1 is generally a tank with an open top for containing a process liquid and carrying a member to be cleaned. When the process is performed, the piece to be cleaned (for example, a wafer) is soaked in the process liquid in the first tank body 1, so that the cleaning process of the piece to be cleaned is realized. The second tank body 2 is arranged on one side of the first tank body 1, and is generally a tank body with an open top, and is used for containing the process liquid from the liquid supplementing device so as to supplement the process liquid into the first tank body 1 when the concentration of the process liquid in the first tank body 1 does not meet the requirement.
The liquid conveying device 3 is respectively connected with the first tank body 1 and the second tank body 2 and is used for selectively carrying out an inter-tank circulation mode A or an in-tank circulation mode B, wherein the inter-tank circulation mode A is that the process liquid circularly flows between the first tank body 1 and the second tank body 2, and the process liquid in the first tank body 1 flows along a first direction; the tank circulation mode B is a mode in which the process liquid is circulated in the first tank body 1 in a second direction opposite to the first direction.
In the process of carrying out the process, the flow direction of the process liquid in the first tank body 1 can be changed by switching between the inter-tank circulation mode A and the in-tank circulation mode B by using the liquid conveying device 3, namely, the flow direction is switched between the first direction and the second direction, so that the temperature difference in the first tank body 1 caused by the single flow direction of the liquid can be avoided, the temperature uniformity in the first tank body 1 is improved, and the process uniformity can be improved; meanwhile, the flow field dead zone generated by single flow direction of the liquid can be avoided, so that the cleaning effect can be improved, and the defect of a contact point is prevented.
It should be noted that, in practical applications, the first direction and the second direction may be set according to specific requirements as long as the directions of the first direction and the second direction are opposite, for example, the first direction is from bottom to top, and the second direction is from top to bottom; as another example, the first direction and the second direction are two opposite horizontal directions.
Second embodiment
Referring to fig. 2, the cleaning apparatus provided in this embodiment is a specific implementation of the liquid delivery device 3 in the first embodiment. Specifically, the liquid transport apparatus 3 includes a first transport unit 31, a second transport unit 32, and a switching unit 33. Wherein the first transporting unit 31 is connected to the first trough body 1 at the first position H1 and the second position H2 of the first trough body 1, and is connected to the second trough body 2 at the third position H3 and the fourth position H4 of the second trough body 2. The second conveying unit 32 is connected to the first trough body 1 at a fifth position H5 and a sixth position H6 of the first trough body 1. It should be noted that the positions H1-H6 shown in fig. 2 only indicate connection points, and do not indicate specific height positions of the first tank body.
The first conveying unit 31 is used for making the process liquid in the first tank body 1 flow out from the first position H1 and flow into the second tank body 2 from the third position H3, and making the process liquid in the second tank body 2 flow out from the fourth position H4 and flow into the first tank body 1 from the second position H2; the first position H1 is higher than the second position H2 so that the process liquid in the first tank 1 flows in the bottom-up direction, i.e., the first direction is bottom-up.
The second conveying unit 32 is used for pumping out the process liquid in the first tank body 1 from the fifth position H5 and flowing into the first tank body 1 from the sixth position H6; the fifth position H5 is lower than the sixth position H6, so that the process liquid in the first tank 1 flows from top to bottom, i.e., the second direction is from top to bottom.
The switching unit 33 is connected to the first conveying unit 31 and the second conveying unit 32, respectively, and is configured to switch between the operation of the first conveying unit 31 and the operation of the second conveying unit 32, so that the flowing direction of the process liquid in the first tank 1 is switched between a bottom-up direction and a top-down direction, and thus the temperature uniformity in the first tank 1 in the vertical direction can be improved, and the process uniformity can be further improved; meanwhile, the flow field dead zone generated by single flow direction of the liquid can be avoided, so that the cleaning effect can be improved, and the defect of a contact point is prevented.
Third embodiment
The cleaning apparatus provided in this embodiment is a specific implementation of the first conveying unit 31, the second conveying unit 32, and the switching unit 33 in the second embodiment described above.
Referring to fig. 3 and 4, in the present embodiment, the first delivery unit 31 includes an overflow structure 4 and a first pipeline structure. As shown in fig. 4, the overflow structure 4 is connected to the top opening of the first tank 1 and the top opening of the second tank 2, and is configured to convey the process liquid overflowing from the top opening of the first tank 1 into the second tank 2. That is, the top opening of the first tank 1 and the top opening of the second tank 2 correspond to the first position H1 of the first tank 1 and the third position H3 of the second tank 2, respectively.
The overflow structure 4 may have various structures, for example, in the present embodiment, as shown in fig. 4, the overflow structure 4 includes a buffer tank body, the buffer tank body and the second tank body together form an annular tank body surrounding the first tank body 1, and the top of the buffer tank body away from the outer side wall 41 of the first tank body 1 and the top of the second tank body 2 away from the outer side wall 21 of the first tank body 1 are higher than the top opening height of the first tank body 1, that is, the outer side wall 41 of the buffer tank body and the outer side wall 21 of the second tank body 2 together form an annular enclosure capable of preventing the process liquid in the first tank body 1 from overflowing. Moreover, the top of the inner side wall 42 of the buffer tank body close to the first tank body 1 and the top of the inner side wall 22 of the second tank body 2 close to the first tank body 1 are lower than or equal to the opening height of the top of the first tank body 1, so that the process liquid in the first tank body 1 can overflow into the buffer tank body and the second tank body 2; and the inside of the buffer tank body is communicated with the inside of the second tank body 2, and the buffer tank body is used for collecting the process liquid overflowing from the top opening of the first tank body 1 into the first tank body 2. The flow direction of the process liquid overflowing from the top opening of the first tank body 1 is shown by the arrow in fig. 4.
It should be noted that in the present embodiment, the top opening of the first tank body 1 and the top opening of the second tank body 2 correspond to the first position H1 of the first tank body 1 and the third position H3 of the second tank body 2, respectively, but the present invention is not limited to this, and in practical applications, the heights of the first position H1 and the third position H3 may be set as required. Accordingly, other liquid conveying structures may be adopted to realize the process liquid in the first tank 1 flowing out from the first position H1 and flowing into the second tank 2 from the third position H3.
The first pipeline structure is respectively connected with the bottom of the first tank body 1 and the bottom of the second tank body 2 and used for conveying process liquid flowing out of the bottom of the second tank body 2 into the first tank body 1 from the bottom of the first tank body 1. That is, the bottom of the first tank 1 and the bottom of the second tank 2 correspond to the second position H2 of the first tank 1 and the fourth position H4 of the second tank 2, respectively. Thus, the process liquid can flow into the first tank 1 from the bottom of the first tank 1 and flow out from the top opening of the first tank 1, thereby forming a liquid flow direction from bottom to top. The first pipeline structure and the overflow structure can realize the inter-tank circulation mode A, namely, the process liquid circularly flows between the first tank body 1 and the second tank body 2, and the process liquid in the first tank body 1 flows from bottom to top.
For example, as shown in fig. 3, in this embodiment, the first pipeline structure includes a first pipeline 311, a second pipeline 312 and a third pipeline 313 connected in series in sequence, wherein a liquid inlet end of the first pipeline 311 is connected to the bottom of the second tank 2, a liquid outlet end of the first pipeline 311 is connected to a liquid inlet end of the second pipeline 312, a liquid outlet end of the second pipeline 312 is connected to a liquid inlet end of the third pipeline 313, and a liquid outlet end of the third pipeline 313 is connected to the bottom of the first tank 1. The process liquid in the second tank 2 may be transferred from the bottom of the first tank 1 to the inside of the first tank 1 via the first pipe 311, the second pipe 312, and the third pipe 313 in this order.
In this embodiment, the second conveying unit 32 includes a second pipeline structure, which is connected to the bottom of the first tank 1 and connected to the inside of the first tank 1 at the sixth position H6, and is used for conveying the process liquid flowing out of the bottom of the first tank 1 from the sixth position H6 into the first tank 1; the sixth position is located on the side wall of the first tank body 1 and close to the top opening of the first tank body 1, so that the process liquid in the first tank body 1 can flow from top to bottom.
For example, referring to fig. 3 and 5 together, the second pipeline structure includes a fourth pipeline 322 and a fifth pipeline 321, wherein a liquid inlet end 322a and a liquid outlet end 322b of the fourth pipeline 322 are respectively connected to the third pipeline 313 and the first pipeline 311, and the connection point is located at the first connection point C1; the liquid inlet end 321a of the fifth pipeline 321 is connected with the liquid outlet end 312b of the second pipeline 312 and the liquid inlet end 313a of the third pipeline 313, and the liquid outlet end 321b of the fifth pipeline 321 is communicated with the inside of the first tank body 1 at the sixth position H6 (i.e., at the position on the side wall of the first tank body 1 and close to the top opening of the first tank body 1) of the first tank body 1.
In this embodiment, optionally, the cleaning apparatus further includes: a circulation pump 314 and a temperature control device 315 provided on the second pipe 312; the circulating pump 314 is used for pumping the process liquid in the second tank body 2 when the first conveying unit works, and pumping the process liquid in the first tank body 1 when the second conveying unit works; the temperature control device 315 is used to control the temperature of the process liquid flowing through the second conduit 312. In practical applications, a filter 316 and/or a concentration sensor 317 may be optionally disposed on the second pipeline 312.
After flowing out of the third pipe 313, the process liquid in the first tank 1 can be conveyed to the first pipe 311 through the fourth pipe 322, so that the process liquid can flow through the circulating pump 314, the temperature control device 315, the filter 316 and the concentration sensor 317 on the second pipe 312, and then flow into the first tank 1 through the fifth pipe 321 at the sixth position H6 of the first tank 1. Thereby, it is possible to realize that the second piping structure shares the circulation pump 314, the temperature control device 315, the filter 316, and the concentration sensor 317 on the second piping 312 with the first piping structure.
It should be noted that, in this embodiment, the second pipeline structure and the first pipeline structure may share at least one of the circulating pump 314, the temperature control device 315, the filter, and the concentration sensor, so that the equipment cost may be reduced. Of course, in practical application, the second pipeline structure and the first pipeline structure may be also independently arranged, in which case, according to specific needs, at least one of the circulating pump, the temperature control device, the filter and the concentration sensor may be separately equipped on the second pipeline structure and the first pipeline structure, respectively.
The structure of the switching unit 33 may be various, for example, in the present embodiment, as shown in fig. 3, the switching unit 33 includes a first three-way valve 331, a second three-way valve 332, and a third three-way valve 333, wherein, as shown in fig. 7A, a first port 331a of the first three-way valve 331 communicates with the liquid inlet end 313a of the third pipeline 313, a second port 331c communicates with the liquid inlet end 322a of the fourth pipeline 322, and a third port 331b communicates with the liquid outlet end 313b of the third pipeline 313. Specifically, the third line 313 is divided into a first portion D1 and a fourth portion D4, and the first port 331a and the third port 331b of the first three-way valve 331 are connected in series between the first portion D1 and the fourth portion D4; the connection point of the second port 331C of the first three-way valve 331 and the fourth line 322 is located at a first connection point C1. The first three-way valve 331 is used to connect the liquid outlet end 313B of the third pipeline 313 and the liquid inlet end 322a of the fourth pipeline 322 in the in-tank circulation mode B (i.e., the connected state shown in fig. 6B), and to connect the liquid inlet end 313a and the liquid outlet end 313B of the third pipeline 313 in the inter-tank circulation mode a (i.e., the connected state shown in fig. 6A).
As shown in fig. 7B, the first port 332B of the second three-way valve 332 is communicated with the liquid inlet end 313a of the third pipeline 313, the second port 332a is communicated with the liquid outlet end 312B of the second pipeline 312, and the third port 332c is communicated with the liquid inlet end 321a of the fifth pipeline 321. The second three-way valve 332 is used to connect the liquid outlet end 312B of the second pipeline 312 and the liquid inlet end 321a of the fifth pipeline 321 in the in-tank circulation mode B (i.e., the connected state shown in fig. 6B), and to connect the liquid outlet end 312B of the second pipeline 312 and the liquid inlet end 313a of the third pipeline 313 in the inter-tank circulation mode a (i.e., the connected state shown in fig. 6A).
As shown in fig. 7C, the first port 333b of the third three-way valve 333 communicates with the liquid outlet end 322b of the fourth pipeline 322, the second port 333a communicates with the liquid inlet end 311a of the first pipeline 311, and the third port 333C communicates with the liquid outlet end 311b of the first pipeline 311. Specifically, the first line 311 is divided into the second portion D2 and the third portion D3, and the second port 333a and the third port 333c of the third three-way valve 333 are connected in series between the third portion D3 and the second portion D2; a connection point of the first port 333b of the third three-way valve 333 and the liquid outlet end 322b of the fourth pipe 322 is located at a second connection point C2. The third three-way valve 333 is used to connect the liquid outlet end 322B of the fourth pipeline 322 and the liquid outlet end 311B of the first pipeline 311 in the in-tank circulation mode B (i.e., the connected state shown in fig. 6B), and to connect the liquid inlet end 311a and the liquid outlet end 311B of the first pipeline 311 in the inter-tank circulation mode a (i.e., the connected state shown in fig. 6A).
By means of the first, second, and third three- way valves 331, 332, and 333, when the inter-tank circulation mode a is performed, the first, second, and third lines 311, 312, and 313 may be turned on, and the fourth and fifth lines 322 and 321 may be turned off, at which time, the process liquid in the second tank body 2 may be sequentially transferred from the bottom of the first tank body 1 to the inside of the first tank body 1 via the first, second, and third lines 311, 312, and 313, the circulating flow direction of the process liquid is as indicated by an arrow shown in fig. 6A, and the flow direction X1 of the process liquid in the first tank body 1 is from bottom to top.
In the tank circulation mode B, as shown in fig. 5, the first portion D1 of the third pipe 313 between the bottom of the first tank body 1 and the first connection point C1, the fourth pipe 322, the second portion D2 of the first pipe 311 between the second connection point C2 and the liquid outlet end 311B of the first pipe 311, the second pipe 312, and the fifth pipe 321 may be connected, and the third portion D3 of the first pipe 311 between the liquid inlet end 311a and the second connection point C2, and the fourth portion D4 of the third pipe 313 between the first connection point C1 and the liquid inlet end 313a of the third pipe 313 may be disconnected. At this time, the process liquid in the first tank 1 may be transferred from the sixth position H6 of the first tank 1 to the inside of the first tank 1 via the first portion D1, the fourth pipe 322, the second portion D2, the second pipe 312, and the fifth pipe 321 in this order, that is, the circulating flow direction of the process liquid is the arrow direction shown in fig. 6B, and the flow direction X2 of the process liquid in the first tank 1 is from top to bottom.
It should be noted that in this embodiment, the switching unit 33 uses a three-way valve to realize switching between two pipeline structures, but the embodiment of the present invention is not limited to this, and in practical applications, the switching unit 33 may also use any other switch structure to realize switching between two pipeline structures.
In the present embodiment, as shown in fig. 8, a plurality of liquid inlet holes 111 are further provided on the side wall of the first tank body 1, and the plurality of liquid inlet holes 111 are distributed at intervals along the circumferential direction of the first tank body 1. By the arrangement, the process liquid can be quickly and uniformly mixed after entering the first tank body 1, the uniformity of the temperature in the first tank body 1 in the circumferential direction is improved, and the flowing speed of the process liquid can be improved. It should be noted that a part of the plurality of liquid inlet holes 111 may be distributed on one side of the first trough body 1, and another part may be symmetrically distributed on the opposite side. Optionally, the number of the liquid inlet holes 111 is 15-20, and the diameter of each liquid inlet hole 111 is 5 mm.
In addition, the number of the fifth pipes 321 is not more than the number of the liquid inlet holes 111, and the liquid outlet end 321b of each fifth pipe 321 is correspondingly connected with one or more liquid inlet holes 111, so as to communicate with the inside of the first tank 1 through the liquid inlet holes 111 connected thereto. Only one fifth pipe 321 is schematically shown in fig. 3 to 6B, and in practice, the number of fifth pipes 321 may be increased according to specific needs.
Optionally, all the liquid inlet holes 111 are located below a specified height position, and the specified height position satisfies: when the tank circulation pattern B is performed, all the liquid inlet holes 111 are located below the liquid level of the process liquid in the first tank body 1. Thus, the process liquid sprayed from the liquid inlet hole 111 can be prevented from generating bubbles and forming mist, for example, the acid solution can be prevented from forming acid mist, and the process safety can be improved. The predetermined height position is preferably 20mm below the liquid level of the process liquid in the first tank body 1 in the tank circulation mode B.
In this embodiment, optionally, in order to realize automatic control of switching between the inter-tank circulation mode a and the intra-tank circulation mode B, the cleaning apparatus further includes a control unit configured to periodically switch between the inter-tank circulation mode a and the intra-tank circulation mode B during cleaning of a member to be cleaned (e.g., a wafer), that is, control the liquid conveying device 3 to switch between the inter-tank circulation mode a and the intra-tank circulation mode B every specified time interval, so that the flow direction of the process liquid in the first tank body 1 can be alternately changed to reduce the temperature difference at different positions in the liquid flow direction (e.g., the top and the bottom in the first tank body 1 in the vertical direction).
In the present embodiment, in order to eliminate the temperature difference at different positions in the liquid flow direction to the maximum, the switching frequency may be set in such a manner that the above-described specified time period is set. Specifically, as shown in fig. 3, the cleaning apparatus further includes a first temperature sensor 51 and a second temperature sensor 52, wherein the first temperature sensor 51 is configured to detect a first temperature value corresponding to a first designated position (for example, a position close to the top of the first tank 1) in the first tank 1, and send the first temperature value to the control unit; the second temperature sensor 52 is configured to detect a second temperature value at a second designated position (for example, a position close to the bottom of the first tank 1) in the first tank 1, and send the second temperature value to the control unit. Optionally, as shown in fig. 8, the first temperature sensor 51 and the second temperature sensor 52 are disposed on different sides from the liquid inlet hole 111 to avoid affecting the detection accuracy. In addition, the cleaning apparatus further includes liquid level sensors 61, 62 provided in the first tank body 1 and the second tank body 2, respectively.
Taking the example that the first temperature sensor 51 detects the temperature of the first tank body 1 near the top and the second temperature sensor 52 detects the temperature of the first tank body 1 near the bottom, the specific method for acquiring the specified time length is as follows:
firstly, a liquid supplementing pipeline 7 provides process liquid, and liquid preparation is completed according to the requirements of a process formula in a certain proportion and at a certain temperature; then, the inter-tank circulation mode a is started, and the values of the first temperature sensor 51 and the second temperature sensor 52 at this time are recorded after the readings of the two sensors are stabilized. As shown in fig. 9, in the inter-tank circulation mode a, the readings at which the first temperature sensor 51 and the second temperature sensor 52 reach stability are T1 and T2, respectively.
When the first switching is performed at the time M0, that is, when the inter-tank circulation mode a is switched to the in-tank circulation mode B, the readings of the first temperature sensor 51 and the second temperature sensor 52 start to change, that is, the temperature of the first tank body 1 near the bottom gradually decreases, and the temperature of the first tank body 1 near the top gradually increases. The reading of the first temperature sensor 51 and the reading of the second temperature sensor 52 reach equality at time M1, then continue to change, and reach a new steady state, at which the readings of the first temperature sensor 51 and the second temperature sensor 52 are T3, T4, respectively.
The second switching, i.e., switching from the in-tank circulation mode B to the inter-tank circulation mode a, is performed at time (M0+ n), where n is the time difference between the first switching and the second switching. The reading value of the first temperature sensor 51 and the reading value of the second temperature sensor 52 start to change, that is, the temperature of the first tank body 1 near the bottom gradually rises, and the temperature of the first tank body 1 near the top gradually falls. The reading of the first temperature sensor 51 and the reading of the second temperature sensor 52 reach equality at time M2, then continue to change and reach the same steady state as at time M0, at which time the readings of the first temperature sensor 51 and the second temperature sensor 52 are T1 and T2, respectively.
The third switching, i.e., switching from the inter-tank circulation mode a to the in-tank circulation mode B, is performed at time (M0+2n), and 2n is the time difference between the first switching and the third switching. The reading value of the first temperature sensor 51 and the reading value of the second temperature sensor 52 start to change, that is, the temperature of the first tank body 1 near the bottom gradually decreases, and the temperature of the first tank body 1 near the top gradually increases. The reading of the first temperature sensor 51 and the reading of the second temperature sensor 52 reach equality at the time (M1+2n), then continue to change, and reach the same steady state as the time (M0+ n), at which the readings of the first temperature sensor 51 and the second temperature sensor 52 are T3, T4, respectively.
By repeating this operation, the first temperature curve Q1 and the second temperature curve Q2 shown in fig. 9 can be obtained by taking the time length 2n as a cycle period.
Calculating a first area S1 and a first area S2 formed by the first temperature curve Q1 and the second temperature curve Q2, and adjusting the size of the n value until the first area S1 is equal to the first area S2. The magnitude of the first area S1 equal to the value of n corresponding to the first area S2, that is, set to the above-described specified time period (switching frequency), can eliminate the temperature difference at different positions in the liquid flow direction to the maximum extent.
Fourth embodiment
The present embodiment also provides a cleaning method applied to a cleaning apparatus, for example, the cleaning apparatus in any one of the first to third embodiments described above.
Referring to fig. 10, the cleaning method includes:
and S1, controlling the liquid conveying device to switch between the inter-tank circulation mode and the in-tank circulation mode at specified intervals in the process of cleaning the piece to be cleaned.
In this way, the flow direction of the process liquid in the first tank can be alternated to reduce the temperature difference at different positions in the liquid flow direction (e.g., in the vertical direction, top and bottom in the first tank).
Optionally, in order to eliminate the temperature difference at different positions in the flowing direction of the liquid to the maximum, the setting of the specified time length satisfies: the first temperature profile Q1 and the second temperature profile Q2 form a first area S1 and a first area S2 that are equal as shown in fig. 9.
Optionally, the first direction is a bottom-up direction; the second direction is a top-down direction. In this way, the temperature uniformity in the vertical direction in the first tank body 1 can be improved.
In summary, in the technical solutions of the cleaning apparatus and the cleaning method provided in the embodiments of the present invention, the liquid conveying device is respectively connected to the first tank body and the second tank body, and is configured to selectively perform an inter-tank circulation mode or an intra-tank circulation mode, where the inter-tank circulation mode is to circulate the process liquid between the first tank body and the second tank body, and to make the process liquid in the first tank body flow along the first direction; the circulation mode in the tank is to circulate the process liquid in the first tank in a second direction, and the second direction is opposite to the first direction. In the process of carrying out the process, the liquid conveying device is used for switching between the inter-tank circulation mode and the in-tank circulation mode, so that the flowing direction of the process liquid in the first tank body can be changed, the temperature uniformity in the first tank body can be improved, and the process uniformity can be improved; in addition, the flow field dead zone generated by single liquid flow direction can be avoided, so that the cleaning effect can be improved, and the defect of a contact point is prevented.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (15)
1. A cleaning apparatus for use in a semiconductor manufacturing process, comprising:
the first tank body is used for containing process liquid and bearing a piece to be cleaned;
the second tank body is arranged on one side of the first tank body and is used for containing process liquid from the liquid supplementing device; and
the liquid conveying device is respectively connected with the first tank body and the second tank body and is used for selectively carrying out an inter-tank circulation mode or an in-tank circulation mode, wherein the inter-tank circulation mode is that process liquid circularly flows between the first tank body and the second tank body, and the process liquid in the first tank body flows along a first direction; the tank circulation mode is to circulate a process liquid in a second direction in the first tank, and the second direction is opposite to the first direction.
2. The cleaning apparatus defined in claim 1, wherein the liquid delivery device comprises:
a first conveying unit connected to the first tank body at first and second positions of the first tank body and connected to the second tank body at third and fourth positions of the second tank body, for causing the process liquid in the first tank body to flow out from the first position and to flow into the second tank body from the third position, and for causing the process liquid in the second tank body to flow out from the fourth position and to flow into the first tank body from the second position; the first position is higher than the second position so that the process liquid in the first tank body flows along the direction from bottom to top;
the second conveying unit is connected with the first tank body at a fifth position and a sixth position of the first tank body, and is used for pumping out the process liquid in the first tank body from the fifth position and flowing into the first tank body from the sixth position; the fifth position is lower than the sixth position, so that the process liquid in the first tank body flows in the top-down direction; and
and the switching unit is respectively connected with the first conveying unit and the second conveying unit and is used for switching between the work of the first conveying unit and the work of the second conveying unit.
3. The cleaning apparatus according to claim 2, wherein the first conveying unit includes:
the overflow structure is respectively connected with the top opening of the first tank body and the top opening of the second tank body and is used for conveying the process liquid overflowing from the top opening of the first tank body into the second tank body;
and the first pipeline structure is respectively connected with the bottom of the first tank body and the bottom of the second tank body and is used for conveying the process liquid flowing out of the bottom of the second tank body into the first tank body from the bottom of the first tank body.
4. The cleaning apparatus according to claim 2, wherein the second conveying unit includes:
the second pipeline structure is connected with the bottom of the first tank body, is connected with the inside of the first tank body at the sixth position, and is used for conveying the process liquid flowing out of the bottom of the first tank body into the first tank body from the sixth position; the sixth position is located on the side wall of the first groove body and close to the position of the top opening of the first groove body.
5. The cleaning equipment as claimed in claim 4, wherein the first pipeline structure comprises a first pipeline, a second pipeline and a third pipeline, wherein a liquid inlet end of the first pipeline is communicated with the bottom of the second tank body, a liquid outlet end of the first pipeline is connected with a liquid inlet end of the second pipeline, a liquid outlet end of the second pipeline is connected with a liquid inlet end of the third pipeline, and a liquid outlet end of the third pipeline is communicated with the bottom of the first tank body.
6. The cleaning apparatus defined in claim 5, wherein the second pipeline arrangement comprises a fourth pipeline and a fifth pipeline, wherein a liquid inlet end and a liquid outlet end of the fourth pipeline are connected to the third pipeline and the first pipeline, respectively; the liquid inlet end of the fifth pipeline is connected with the liquid outlet end of the second pipeline and the liquid inlet end of the third pipeline, and the liquid outlet end of the fifth pipeline is communicated with the sixth position of the first groove body and the inside of the first groove body.
7. The cleaning apparatus defined in claim 6, further comprising: the circulating pump and the temperature control device are arranged on the second pipeline;
the circulating pump is used for pumping the process liquid in the second tank body when the first conveying unit works and pumping the process liquid in the first tank body when the second conveying unit works;
the temperature control device is used for controlling the temperature of the process liquid flowing through the second pipeline.
8. The cleaning apparatus according to claim 6, wherein the switching unit includes a first three-way valve, a second three-way valve, and a third three-way valve, wherein,
a first port of the first three-way valve is communicated with a liquid outlet end of the third pipeline, a second port of the first three-way valve is communicated with a liquid inlet end of the fourth pipeline, and a third port of the first three-way valve is communicated with a liquid inlet end of the third pipeline; the first three-way valve is used for communicating the liquid outlet end of the third pipeline with the liquid inlet end of the fourth pipeline in an in-tank circulation mode, and communicating the liquid inlet end and the liquid outlet end of the third pipeline in an inter-tank circulation mode;
a first port of the second three-way valve is communicated with a liquid inlet end of the third pipeline, a second port of the second three-way valve is communicated with a liquid outlet end of the second pipeline, and a third port of the second three-way valve is communicated with a liquid inlet end of the fifth pipeline; the second three-way valve is used for communicating the liquid outlet end of the second pipeline and the liquid inlet end of the fifth pipeline in the in-tank circulation mode, and communicating the liquid outlet end of the second pipeline and the liquid inlet end of the third pipeline in the inter-tank circulation mode;
a first port of the third three-way valve is communicated with a liquid outlet end of the fourth pipeline, a second port of the third three-way valve is communicated with a liquid inlet end of the first pipeline, and a third port of the third three-way valve is communicated with a liquid outlet end of the first pipeline; and the third three-way valve is used for communicating the liquid outlet end of the fourth pipeline with the liquid outlet end of the first pipeline in an in-tank circulation mode, and communicating the liquid inlet end and the liquid outlet end of the first pipeline in an inter-tank circulation mode.
9. The cleaning equipment as claimed in claim 6, wherein a plurality of liquid inlet holes are further formed in the side wall of the first tank body, the liquid inlet holes are distributed along the circumferential direction of the first tank body at intervals, the number of the fifth pipelines is not more than that of the liquid inlet holes, and the liquid outlet end of each fifth pipeline is correspondingly connected with one or more liquid inlet holes.
10. The cleaning apparatus according to claim 9, wherein all the liquid inlet holes are located below a specified height position which satisfies: and when the tank internal circulation mode is carried out, all the liquid inlet holes are positioned below the liquid level of the process liquid in the first tank body.
11. The cleaning apparatus according to any one of claims 1 to 10, further comprising a control unit for controlling the liquid delivery device to switch between the inter-tank circulation mode and the intra-tank circulation mode at intervals of a specified duration during cleaning of the member to be cleaned;
the set of the specified duration satisfies: a first area formed between a first moment and a second moment of the first temperature curve and the second temperature curve is equal to a second area formed between the second moment and a third moment; the first temperature curve is a variation curve of a first temperature value at a first specified position in the first direction in the first groove body; the second temperature curve is a variation curve of a second temperature value at a second specified position in the first direction in the first groove body; the first time, the second time and the third time are respectively corresponding times when the first temperature value and the second temperature value are equal in sequence three times in the process of continuously switching between the inter-tank circulation mode and the in-tank circulation mode three times.
12. The cleaning apparatus defined in claim 11, further comprising:
the first temperature sensor is used for detecting a first temperature value corresponding to the first designated position in the first tank body and sending the first temperature value to the control unit; and
and the second temperature sensor is used for detecting a first temperature value corresponding to the second appointed position in the first groove body and sending the first temperature value to the control unit.
13. The cleaning equipment as claimed in claim 3, wherein the overflow structure comprises a buffer tank body, the buffer tank body and the second tank body together form an annular tank body surrounding the first tank body, the top of the outer side wall of the buffer tank body and the second tank body far away from the first tank body is higher than the top opening height of the first tank body, and the top of the inner side wall of the buffer tank body and the second tank body near the first tank body is lower than or equal to the top opening height of the first tank body; and the interior of the buffer tank body is communicated with the interior of the second tank body, and the buffer tank body is used for collecting the process liquid overflowing from the top opening of the first tank body into the second tank body.
14. A cleaning method characterized by being applied to the cleaning apparatus of any one of claims 1 to 13; the cleaning method comprises the following steps:
and in the process of cleaning the piece to be cleaned, controlling the liquid conveying device to switch between the inter-tank circulation mode and the in-tank circulation mode at specified intervals.
15. The cleaning method according to claim 14, wherein the setting of the specified period of time satisfies: a first area formed between a first moment and a second moment of the first temperature curve and the second temperature curve is equal to a second area formed between the second moment and a third moment; the first temperature curve is a variation curve of a first temperature value at a first specified position in the first direction in the first groove body; the second temperature curve is a variation curve of a second temperature value at a second specified position in the first direction in the first groove body; the first time, the second time and the third time are respectively corresponding times when the first temperature value and the second temperature value are equal in sequence three times in the process of continuously switching between the inter-tank circulation mode and the in-tank circulation mode three times.
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| CN114540960A (en) * | 2022-04-22 | 2022-05-27 | 江苏英思特半导体科技有限公司 | Circulating tank for silicon wafer corrosion |
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