CN204361118U - The shower type wet-method etching equipment of solar silicon wafers - Google Patents
The shower type wet-method etching equipment of solar silicon wafers Download PDFInfo
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- CN204361118U CN204361118U CN201520034205.1U CN201520034205U CN204361118U CN 204361118 U CN204361118 U CN 204361118U CN 201520034205 U CN201520034205 U CN 201520034205U CN 204361118 U CN204361118 U CN 204361118U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of shower type wet-method etching equipment of solar silicon wafers, comprising: for transporting forward the transport assembly of silicon chip, be located at the spray assemblies transported above assembly, be located at the liquid supply assembly transported below assembly.Silicon chip is placed in interval on transport assembly, transports assembly and transports silicon chip forward, and spray box sprays liquid downwards; Transport liquid that assembly flows down connecing in liquid bath and be polymerized.Corrosive liquid sprays or drips on silicon chip by the mode of the utility model shower, and unnecessary liquid and reaction product flow to and connect liquid bath, thus ensure the erosion uniformity of silicon chip.
Description
Technical field
The utility model relates to photovoltaic industry, particularly relates to a kind of shower type wet-method etching equipment of solar silicon wafers.
Background technology
In photovoltaic industry, the wet-method etching process of silicon chip generally adopts silicon chip to be soaked in corrosive liquids carries out surface treatment, because the corrosive liquid scale of construction in reaction zone is very large, together with the corrosive liquid of participation reaction and reacted product are entrained in the corrosive liquid having neither part nor lot in reaction, cause the liquor strength region property concentration in reactive tank inconsistent, this reduces greatly by causing the uniformity of silicon chip surface process, very large on production and processing Si wafer quality impact out.
Therefore, a kind of shower type wet-method etching equipment of solar silicon wafers of effective raising silicon chip surface Disposal quality how is provided to be industry technical problem urgently to be resolved hurrily.
Utility model content
The utility model provides a kind of shower type wet-method etching equipment of solar silicon wafers of effective raising silicon chip surface Disposal quality for the problems referred to above.
The technical scheme that the utility model proposes is, the shower type wet-method etching equipment of design solar silicon wafers, comprising: transport assembly, comprises longitudinally evenly distributed cylinder, the electric element of head roll, transports assembly and is used for transporting silicon chip forward.Spray assemblies, comprise be positioned at above cylinder, longitudinal separation arrange spray box, spray box bottom surface be evenly provided with liquid-leaking nozzle.Liquid supply assembly, comprises being located to transport and connects liquid bath below assembly, be positioned to connect below liquid bath and with the secondary groove connecing liquid bath and be communicated with, the circulating line be connected with described secondary groove and spray assemblies, and be positioned at secondary groove and export the circulating pump be connected with circulating line.
Preferably, circulation delivery side of pump is provided with two-way pipeline, and in first via pipeline access spray box, the second road pipeline takes back in secondary groove.
Preferably, the import department of spray box is provided with flow valve, and first via pipeline accesses spray box again through flow valve, and circulating pump is connected with frequency converter, by the rotating speed of Frequency Converter Control circulating pump.
Preferably, the liquid-leaking nozzle of spray box is tapered, and the aperture of liquid-leaking nozzle is from top to bottom strengthened gradually; Or the liquid-leaking nozzle of spray box is straight tube shape, and the bottom surface of straight tube is provided with a circle taper scrobicular ring, and the aperture of this taper scrobicular ring is strengthened downwards gradually by straight tube hole.
Further, this equipment also comprises fluid infusion system, be provided with in fluid infusion system: be positioned at the sensor for countering of the feeding port transporting assembly, the controller be connected with sensor for countering and the liquid supply device be connected with controller, sensor for countering counts silicon chip, send a signal to controller after reaching setting quantity, controller controls liquid supply device and supplement new liquid in secondary groove.
Fluid infusion system comprises: be located at the sealant supplement cylinder above secondary groove, the liquid-transport pipe-line controlled with feed liquor bottom this sealant supplement cylinder of UNICOM, bottom also UNICOM one liquid supplementation pipe of described sealant supplement cylinder, be connected to and thick mend valve and essence mends valve in this liquid supplementation pipe, the top of sealant supplement cylinder is provided with one for the ultrasonic liquid leveller of sealant supplement cylinder level sensing, and this ultrasonic liquid leveller is connected with controller.
In one embodiment, secondary groove inner top is provided with one for the liquid level detector of level sensing in secondary groove, and this liquid level detector is connected with controller.
Compared with prior art, the mode of the utility model shower is by medicine liquid spray or drip on silicon chip, the reacted product of silicon chip and the liquid having neither part nor lot in reaction can connect liquid bath by rapid runner along with unnecessary liquid, avoid tradition and soak the situation that in reactive mode, around silicon chip, liquor strength is uneven, erosion uniformity between the erosion uniformity of effective guarantee monolithic silicon chip surface and multi-disc silicon chip, substantially increases the quality of production of silicon chip and reduces production fraction defective.More excellent, in order to save material, being aggregated in the residue liquid connect in liquid bath and can also drawing back hydrojet box and recycle, liquid is fully utilized, further, can also arrange fluid infusion system, liquid is after the circulation of a period of time, and concentration there will be deviation, fluid infusion system can after there is deviation in liquor strength, supplementing new liquid to connecing liquid bath, to balance liquor strength, improving production automation degree.
Accompanying drawing explanation
Below in conjunction with embodiment and accompanying drawing, the utility model is described in detail, wherein:
Fig. 1 is device structure schematic diagram of the present utility model;
Fig. 2 is fluid infusion system structural representation of the present utility model.
Embodiment
In the wet-method etching process of solar silicon wafers, general being soaked in corrosive liquids by silicon chip carries out surface treatment, together with the corrosive liquid of participation reaction and reacted product are entrained in the corrosive liquid having neither part nor lot in reaction, cause the liquor strength region property concentration in reactive tank inconsistent, affect the quality of production of silicon chip, the utility model adopts the mode of shower sprayed by corrosive liquid or drip on silicon chip, unnecessary liquid and reaction product can flow back to secondary groove in time, avoid the problem that the liquor strength on silicon chip is uneven.
The shower type wet-method etching equipment of the solar silicon wafers that the utility model proposes, comprising: transport assembly, spray assemblies and liquid supply assembly.
Transport assembly and comprise longitudinally evenly distributed cylinder 2, the electric element of head roll 2, transport assembly and be used for transporting silicon chip 3 forward.Spray assemblies comprise be positioned at above cylinder 2, longitudinal separation arrange spray box 4, spray box 4 bottom surface be evenly provided with liquid-leaking nozzle.Liquid supply assembly comprises and connects liquid bath 1, secondary groove 7, circulating line 5 and circulating pump 6, connect the opening up below being located at transport assembly of liquid bath 1, for receiving the liquid transporting and assembly flows down, secondary groove 7 be positioned to connect below liquid bath 1 and with connect liquid bath 1 and be communicated with, the liquid connecing liquid bath 1 reception flows to secondary groove 7 and collects, circulating line 5 is connected between secondary groove 7 and spray assemblies, the import of circulating line 5 is connected on secondary groove 7, outlet is divided into the pipeline of multiple parallel connection to access each spray box 4 respectively, circulating pump 6 is positioned at the outlet of secondary groove 7, circulating pump 6 is connected on circulating line 5, for the liquid in secondary groove being pumped in spray box 4.
Secondary groove 7 and connecing between liquid bath 1 is connected by many tube connectors, and the liquid connect in liquid bath 1 enters secondary groove 7 from tube connector, and the effect arranging many tube connectors allows the liquid connect in liquid bath 1 can enter secondary groove 7 faster.Also be provided with mudhole bottom secondary groove 7, be convenient to the secondary groove 7 of periodic cleaning.Need the longer time because the corrosive liquid flowing back to secondary groove 7 participates in silicon slice corrosion again, the corrosive liquid and the reacted product that participate in reaction are better miscible at secondary groove 7 with the corrosive liquid having neither part nor lot in reaction.
The outlet of circulating pump 6 is provided with two-way pipeline, the first via pipeline access spray box 4 in, the second road pipeline takes back in secondary groove 7, and the object taking back secondary groove 7 utilizes the impulsive force of liquid to stir the liquid in secondary groove 7, make that liquid mixes evenly.Under the acting in conjunction of secondary groove 7 and circulating pump 6, liquid fully mixes, and this just makes the circulating medical solution concentration at every turn participating in chemical reaction close to consistent, ensures silicon chip 3 reaction mass.
The import department of spray box 4 is provided with flow valve 8, and first via pipeline accesses spray box 4 again through flow valve 8, and circulating pump 6 is connected with frequency converter, by the rotating speed of Frequency Converter Control circulating pump 6.Because spray box 4 is provided with multiple, liquid level in spray box 4 can determine the fast jogging speed that liquid drips, flow valve 8 is set in the import of spray box 4 and can ensures that the liquid level in each spray box 4 is consistent, frequency converter according to the aperture controlled circulation pump 6 drawing liquid speed of flow valve 8, thus makes the speed dropping liquid that spray box 4 keeps equal.In actual applications, can according to the aperture of different process requirements adjustment flow valve 8.
The liquid-leaking nozzle of spray box 4 is tapered, and the aperture of liquid-leaking nozzle is from top to bottom strengthened gradually. or the liquid-leaking nozzle of spray box 4 is straight tube shape, and the bottom surface of straight tube is provided with a circle taper scrobicular ring, and the aperture of this taper scrobicular ring is strengthened downwards gradually by straight tube hole.It is that drops drips that spray box 4 controls liquid by liquid-leaking nozzle.Liquid when linearly type flows down from spray box liquid just contacted silicon chip and washed away by follow-up liquid, flow velocity is fast and impulsive force is larger, be unfavorable for that silicon chip reacts, drops falls and can ensure that liquid and silicon chip 3 can have the longer reaction time, ensures that silicon chip sufficient reacting is even.
This equipment also comprises fluid infusion system, be provided with in fluid infusion system: be positioned at the sensor for countering of the feeding port transporting assembly, the controller be connected with sensor for countering and the liquid supply device be connected with controller, sensor for countering counts silicon chip 3, controller is sent a signal to after reaching predetermined number, controller controls liquid supply device and supplement new liquid in secondary groove 7, after new liquid has supplemented, sensor for countering has counted again.Wherein, controller can adopt PLC or PC end.
Fluid infusion system comprises: be located at the sealant supplement cylinder 9 above secondary groove 7, the liquid-transport pipe-line 10 controlled with feed liquor bottom this sealant supplement cylinder 9 of UNICOM, bottom also UNICOM's liquid supplementation pipe 11 of sealant supplement cylinder, be connected to and thick mend valve 12 and essence mends valve 13 in this liquid supplementation pipe 11, the top of sealant supplement cylinder 9 is provided with one for the ultrasonic liquid leveller 14 of sealant supplement cylinder 9 level sensing, and this ultrasonic liquid leveller 14 is connected with controller.Ultrasonic liquid leveller 14 is used as range sensor, and the liquid level detected in sealant supplement cylinder 9 controls amount infused, because the precision of ultrasonic liquid leveller 14 own is very high, coordinates size double valve replenishing line, can improve the accuracy of amount infused.
Based on above-mentioned device structure, in one embodiment, this equipment is also included in secondary groove 7 inner top and is provided with one for the liquid level detector of level sensing in secondary groove 7, and this liquid level detector is connected with controller.When equipment runs, counting inductor counts silicon chip, when reaching predetermined number, sensor for countering triggers fluid infusion system fluid infusion, liquid level detector detects secondary groove 7 liquid level, and liquid level is fed back to controller, controller converses the real-time volume needing fluid infusion, the thick benefit valve 12 opened in liquid supplementation pipe carries out fluid infusion, ultrasonic liquid leveller 14 detects the height that in sealant supplement cylinder 9, liquid level declines, and feed back to controller, when controller conversion contrast soon arrives the amount infused of setting, close thick benefit valve 12, then essence benefit valve 13 is opened, meticulous fluid infusion is carried out to secondary groove 7.
In another embodiment, this equipment also comprises in secondary groove 7 and is provided with liquor strength detector, when counter reaches setting quantity, liquor strength in secondary groove 7 is detected, and feed back to controller, controller proportionally calculates amount infused according to testing result, is carrying out fluid infusion by fluid infusion system to secondary groove 7.
Certainly in actual applications, connect below liquid bath 1 and also can not arrange secondary groove, liquid is direct after entering and connecing liquid bath 1 to be drawn back in spray box 4 by circulating pump 6.When the outlet of circulating pump 6 is provided with two-way pipeline, the first via pipeline access spray box 4 in, the second road pipeline takes back in liquid bath 7, make that liquid mixes evenly.Meanwhile, during fluid infusion system fluid infusion, new liquid is added directly to connecing in liquid bath 1.
In a preferred embodiment, the travelling speed of transporting assembly is 1.8-2.5M/Min, and the spacing distance between silicon chip is about 20mm, after counting inductor count down to 200, triggers fluid infusion system and supplements new liquid to secondary groove, ensure the dynamic equilibrium of circulating medical solution.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (7)
1. a shower type wet-method etching equipment for solar silicon wafers, is characterized in that comprising:
Transport assembly, comprise longitudinally evenly distributed cylinder, the electric element of head roll, transport assembly and be used for transporting silicon chip forward;
Spray assemblies, comprise be positioned at above cylinder, longitudinal separation arrange spray box, spray box bottom surface be evenly provided with liquid-leaking nozzle;
Liquid supply assembly, comprises being located to transport and connects liquid bath below assembly, be positioned to connect below liquid bath and with the secondary groove connecing liquid bath and be communicated with, the circulating line be connected with described secondary groove and spray assemblies, and be positioned at secondary groove and export the circulating pump be connected with circulating line.
2. shower type wet-method etching equipment as claimed in claim 1, it is characterized in that, described circulation delivery side of pump is provided with two-way pipeline, and in first via pipeline access spray box, the second road pipeline takes back in secondary groove.
3. shower type wet-method etching equipment as claimed in claim 2, it is characterized in that, the import department of described spray box is provided with flow valve, and first via pipeline accesses spray box again through flow valve, and circulating pump is connected with frequency converter, by the rotating speed of Frequency Converter Control circulating pump.
4. shower type wet-method etching equipment as claimed in claim 1, it is characterized in that, the liquid-leaking nozzle of described spray box is tapered, and the aperture of liquid-leaking nozzle is from top to bottom strengthened gradually; Or the liquid-leaking nozzle of spray box is straight tube shape, and the bottom surface of straight tube is provided with a circle taper scrobicular ring, and the aperture of this taper scrobicular ring is strengthened downwards gradually by straight tube hole.
5. shower type wet-method etching equipment as claimed in claim 1, it is characterized in that, this equipment also comprises fluid infusion system, be provided with in fluid infusion system: be positioned at the sensor for countering of the feeding port transporting assembly, the controller be connected with sensor for countering and the liquid supply device be connected with controller, sensor for countering counts silicon chip, send a signal to controller after reaching setting quantity, controller controls liquid supply device and supplement new liquid in secondary groove.
6. shower type wet-method etching equipment as claimed in claim 5, it is characterized in that, described fluid infusion system comprises: be located at the sealant supplement cylinder above secondary groove, the liquid-transport pipe-line controlled with feed liquor bottom this sealant supplement cylinder of UNICOM, bottom also UNICOM one liquid supplementation pipe of described sealant supplement cylinder, be connected to and thick mend valve and essence mends valve in this liquid supplementation pipe, the top of sealant supplement cylinder is provided with one for the ultrasonic liquid leveller of sealant supplement cylinder level sensing, and this ultrasonic liquid leveller is connected with controller.
7. shower type wet-method etching equipment as claimed in claim 6, is characterized in that, described secondary groove inner top is provided with one for the liquid level detector of level sensing in secondary groove, and this liquid level detector is connected with controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520034205.1U CN204361118U (en) | 2015-01-19 | 2015-01-19 | The shower type wet-method etching equipment of solar silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520034205.1U CN204361118U (en) | 2015-01-19 | 2015-01-19 | The shower type wet-method etching equipment of solar silicon wafers |
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| Publication Number | Publication Date |
|---|---|
| CN204361118U true CN204361118U (en) | 2015-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520034205.1U Expired - Fee Related CN204361118U (en) | 2015-01-19 | 2015-01-19 | The shower type wet-method etching equipment of solar silicon wafers |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538503A (en) * | 2015-01-19 | 2015-04-22 | 常州捷佳创精密机械有限公司 | Showering-type wet-process velvet making equipment with solar silicon chips and method |
| CN107919307A (en) * | 2017-12-05 | 2018-04-17 | 泰州中来光电科技有限公司 | A kind of feeding device of wet etching |
| WO2018162546A1 (en) * | 2017-03-10 | 2018-09-13 | Gebr. Schmid Gmbh | Method for producing textured wafers and roughening spray jet treatment device |
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
-
2015
- 2015-01-19 CN CN201520034205.1U patent/CN204361118U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538503A (en) * | 2015-01-19 | 2015-04-22 | 常州捷佳创精密机械有限公司 | Showering-type wet-process velvet making equipment with solar silicon chips and method |
| WO2018162546A1 (en) * | 2017-03-10 | 2018-09-13 | Gebr. Schmid Gmbh | Method for producing textured wafers and roughening spray jet treatment device |
| CN107919307A (en) * | 2017-12-05 | 2018-04-17 | 泰州中来光电科技有限公司 | A kind of feeding device of wet etching |
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 Termination date: 20190119 |
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| CF01 | Termination of patent right due to non-payment of annual fee |