CN113053975A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN113053975A CN113053975A CN202110266810.1A CN202110266810A CN113053975A CN 113053975 A CN113053975 A CN 113053975A CN 202110266810 A CN202110266810 A CN 202110266810A CN 113053975 A CN113053975 A CN 113053975A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a display panel, a manufacturing method thereof and a display device, wherein the display panel and the display device comprise: the pixel definition layer comprises a plurality of openings which are arranged at intervals; a common layer including portions located within the plurality of openings; the pixel defining layer further includes a weakening structure disposed adjacent to the plurality of openings for weakening a lateral conduction capability of the common layer. The invention can reduce the probability that the current is transversely transmitted to the adjacent sub-pixels when each sub-pixel emits light, thereby improving the phenomenon of mutual crosstalk between the two adjacent sub-pixels when the sub-pixels emit light.
Description
Technical Field
The invention relates to the technical field of display, in particular to manufacturing of a display device, and specifically relates to a display panel, a manufacturing method of the display panel and a display device.
Background
The OLED display, as a new generation of display, has the advantages of self-luminescence, fast response, wide viewing angle, color saturation, etc. compared with the liquid crystal display.
Specifically, the common layer is generally manufactured in a full-surface coating mode to form a continuous and flat film layer, so that a plurality of parts of the common layer located in a plurality of openings of the pixel defining layer are mutually communicated, but the lateral mobility of the hole injection layer is too high, so that current is transversely transmitted to adjacent sub-pixels when each sub-pixel emits light, and mutual crosstalk among the sub-pixels is caused.
Therefore, it is necessary to provide a display panel, a method for manufacturing the same, and a display device to improve the crosstalk between two adjacent sub-pixels when the light emitting layer emits light.
Disclosure of Invention
The invention aims to provide a display panel, a manufacturing method thereof and a display device, wherein a weakening structure for weakening the transverse conduction capability of a common layer is arranged in a pixel definition layer, and the probability of transverse transmission of current to an adjacent light-emitting layer when a light-emitting layer emits light is reduced by prolonging or even breaking the path of the common layer, so that the technical problem of mutual crosstalk between two adjacent sub-pixels when the light-emitting layer emits light is solved.
An embodiment of the present invention provides a display panel, including:
a pixel defining layer including a plurality of openings arranged at intervals;
a common layer including portions within the plurality of openings;
wherein the pixel defining layer further comprises a weakening structure disposed adjacent to the plurality of openings, the weakening structure for weakening a lateral conduction capability of the common layer.
In one embodiment, the weakening structure comprises one recess or a plurality of recesses arranged at intervals.
In an embodiment, the common layer further includes at least one through hole, and each through hole is disposed opposite to the corresponding recess.
In one embodiment, the common layer is a continuous film layer, and the common layer further includes a portion located within one or more of the recesses.
In one embodiment, a depth of each of the recesses is less than a thickness of the weakening structure.
In one embodiment, the length of each recess is not less than the length of the corresponding opening.
In one embodiment, the weakening structure comprises one projection or a plurality of projections arranged at intervals.
The embodiment of the invention provides a manufacturing method of a display panel, which is used for manufacturing the display panel, and the manufacturing method of the display panel comprises the following steps:
providing a pixel definition layer, wherein the pixel definition layer comprises a plurality of openings arranged at intervals and a weakening structure, and the weakening structure is arranged adjacent to the plurality of openings;
forming a common layer on the pixel defining layer, the common layer including a portion located in the plurality of openings, a lateral conduction capability of the common layer being weakened by the weakening structure.
In one embodiment, the weakening structure comprises a recess or a plurality of recesses arranged at intervals, and the step of forming the common layer on the pixel defining layer comprises:
forming a common film on the pixel defining layer;
and forming at least one through hole on the common film to form the common layer, wherein each through hole is opposite to the corresponding concave part.
Embodiments of the present invention provide a display device comprising a display panel as described in any of the above.
The invention provides a display panel, a manufacturing method thereof and a display device, wherein the display panel and the display device comprise a pixel definition layer and a common layer, the pixel definition layer comprises a plurality of openings which are arranged at intervals, and the common layer comprises parts positioned in the plurality of openings; according to the invention, the weakening structure is arranged in the pixel defining layer and is arranged close to the plurality of openings, the weakening structure is used for weakening the transverse conduction capability of the common layer, so that the connection path between two parts respectively positioned in two adjacent openings in the common layer can be prolonged or even disconnected, the probability that current is transversely transmitted to the adjacent light-emitting layer due to the fact that the two parts are relatively high in electrical connection degree when the light-emitting layer emits light is reduced, and the phenomenon of mutual crosstalk between two adjacent sub-pixels when the light-emitting layer emits light is improved.
Drawings
The invention is further illustrated by the following figures. It should be noted that the drawings in the following description are only for illustrating some embodiments of the invention, and that other drawings may be derived from those drawings by a person skilled in the art without inventive effort.
Fig. 1 is a schematic cross-sectional view of a first display panel according to an embodiment of the invention.
Fig. 2 is a schematic top view of a first pixel definition layer and common layer spreading structure according to an embodiment of the present invention.
Fig. 3 is a schematic top view of a second pixel definition layer and common layer spreading structure according to an embodiment of the present invention.
Fig. 4 is a schematic top view of a third pixel definition layer and common layer spreading structure according to an embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of a second display panel according to an embodiment of the invention.
Fig. 6 is a schematic top view of a first pixel definition layer according to an embodiment of the invention.
Fig. 7 is a schematic top view of a second pixel definition layer according to an embodiment of the invention.
Fig. 8 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present application, it is to be understood that the terms "upper", "corresponding", "close", "far", and the like indicate the orientation or positional relationship based on the drawings, wherein "upper" merely indicates above the object, specifically refers to directly above, obliquely above, and upper surface, and may be in a non-contact state therebetween, and the above orientation or positional relationship is only for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. It should be noted that the terms "thickness" and "depth" are neutral words, for example, "thickness" does not mean a bias toward being thick or thin, but merely means that a reference value exists, and numerical values are not limited. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the drawings, elements having similar structures are denoted by the same reference numerals. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The present invention provides a display panel including, but not limited to, the following embodiments and combinations of the following embodiments.
In one embodiment, as shown in fig. 1, the display panel 100 includes a pixel definition layer 10, where the pixel definition layer 10 includes a plurality of openings 102 disposed at intervals; a common layer 20, the common layer 20 including portions located within the plurality of openings 102; wherein the pixel defining layer 10 further comprises a weakening structure disposed adjacent to the plurality of openings 102, the weakening structure being used for weakening the lateral conduction capability of the common layer 20.
Further, as shown in fig. 1, the display panel 100 further includes an array substrate 30, where the array substrate 30 is located at one side of the pixel definition layer 10 and is used for bearing the pixel definition layer 10 and the common layer 20. The array substrate 30 includes a substrate and a thin film transistor layer disposed on the substrate, the substrate may be a glass substrate, the glass substrate may include but is not limited to quartz powder, strontium carbonate, barium carbonate, boric acid, boric anhydride, aluminum oxide, calcium carbonate, barium nitrate, magnesium oxide, tin oxide, or zinc oxide, and the thin film transistor layer may include but is not limited to low-temperature polysilicon material, oxide material, or amorphous silicon material.
In one embodiment, as shown in fig. 1, the display panel 100 further includes a light emitting layer 40, the light emitting layer 40 includes a plurality of light emitting portions 401, one light emitting portion 401 is disposed in each opening 102, and each light emitting portion 401 includes a cavity portion 402, an organic portion 403 disposed on the cavity portion 402, and an electronic portion 404 disposed on the organic portion 403. Further, the hole portion 402 includes a hole injection portion and a hole transport layer on the hole injection portion, and the electron portion 404 includes an electron transport layer and an electron injection layer on the electron transport layer, wherein the hole injection portion may have a thickness of 5 nm to 10 nm. Specifically, the common layer 20 may include a plurality of common portions 201, a plurality of the common portions 201 correspond to a plurality of the openings 102 one by one, each of the common portions 201 is disposed in the corresponding opening 102, the common portions 201 may include, but are not limited to, at least one of the cavity portion 402 and the electron portion 404, for example, the common portion 201 may be the hole injection portion, and the common portion 201 is exemplified as the cavity portion 402.
It is understood that, as shown in fig. 1, the thickness of the pixel defining layer 10 may be larger than the thickness of the light emitting layer 40, so as to better block the light emitted by each of the light emitting portions 401 from being dispersed all around, and avoid the light emitted by two adjacent light emitting portions 401 from merging to generate color mixing. Specifically, as shown in fig. 1 to 4, the pixel defining layer 10 includes a plurality of weakening portions 101, the plurality of weakening portions 101 are connected to form the weakening structure, further, a cross-sectional view of each weakening portion 101 may be a trapezoid, and a length of an upper base of the trapezoid is smaller than a length of a lower base; still further, an included angle between two side edges of the trapezoid and the bottom edge may be set to be not more than 90 ° and not less than 30 °. Thus, when the light emitting layer 40 is manufactured, the two adjacent weakening portions 101 can guide the liquid material of the corresponding light emitting portion 401 to flow downward, so that the liquid material of the light emitting portion 401 can be better spread on the array substrate 30, and color mixing between different colors of pigments caused by overflow of the liquid material of the light emitting portion 401 is avoided.
In one embodiment, as shown in fig. 1-4, the weakening structure comprises one recess 103 or a plurality of recesses 103 arranged at intervals. The shape of the pattern projected on the array substrate 30 by the recess 103 is not limited. Specifically, at least one of the weakening portions 101 is provided with at least one of the recessed portions 103, for example, the weakening structure may include at least one of the recessed portions 103 provided on one of the weakening portions 101, and for example, the weakening structure may include a plurality of the recessed portions 103 provided in one-to-one correspondence with the plurality of weakening portions 101, that is, one recessed portion 103 may be provided on each of the weakening portions 101.
It is understood that, as shown in fig. 1, the common layer 20 may further include a plurality of connection portions 202, a plurality of connection portions 202 correspond to a plurality of weakening portions 101 one to one, each connection portion 202 is disposed on the corresponding weakening portion 101, and each connection portion 202 may or may not be located in the recess 103 on the corresponding weakening portion 101. Wherein, the constituent materials of the plurality of connection portions 202 and the plurality of common portions 201 may be the same, and further, the plurality of connection portions 202 and the plurality of common portions 201 may be simultaneously prepared to form the common layer 20. It should be noted that, regardless of whether the connection portion 202 is disposed between two adjacent common portions 201, further, regardless of whether the connection portion 202 is located in the corresponding recess 103 on the weakening portion 101, each of the recess portions 103 may extend or even disconnect a connection path between two corresponding adjacent common portions 201, so as to weaken a connection strength between two corresponding adjacent common portions 201 or even block a connection between two corresponding adjacent common portions 201, so as to reduce a capability of the light-emitting layer 40 to conduct between two adjacent common portions 201 during light emission, so as to improve a phenomenon of crosstalk between two adjacent sub-pixels during light emission of the light-emitting layer 40.
In one embodiment, as shown in fig. 2 to 3, the common layer 20 further includes at least one through hole 203, and each through hole 203 is disposed opposite to the corresponding recess 103. Specifically, as shown in fig. 2, when the common layer 20 includes a plurality of through holes 203 corresponding to the plurality of recessed portions 103 one to one, that is, each of the connecting portions 202 is provided with the corresponding through hole 203, a connecting path between any two adjacent common portions 201 can be disconnected, so as to prevent the current in each light emitting portion 401 from being transmitted to the adjacent light emitting portion 401 when the light emitting layer 40 emits light, and further prevent the light emitting layer 40 from crosstalk between two adjacent sub-pixels when the light emitting layer 40 emits light. Specifically, as shown in fig. 3, when the number of the plurality of through holes 203 of the common layer 20 is smaller than the number of the plurality of recesses 103 in the pixel defining layer 10, as shown in fig. 5, i.e. the common layer 20 further comprises a portion 204 located in a portion of the recess 103, and a plurality of through holes 203 which are corresponding to and opposite to the other part of the concave parts 103, compared with the embodiment in fig. 2, the smaller number of the plurality of through holes 203 in the embodiment in fig. 3 can effectively improve the efficiency of the manufacturing process while still weakening the connection strength between two partially adjacent common portions 201 or even blocking the connection between two partially adjacent common portions 201, so as to reduce the ability of the light-emitting layer 40 to conduct between two adjacent common portions 201 when emitting light, so as to improve the phenomenon that the two adjacent sub-pixels mutually cross talk when the light-emitting layer 40 emits light.
It should be noted that, here, one of the connection portions 202 has a portion 204 located in the corresponding recess 103, that is, the connection portion 202 extends downward from the corresponding weakening portion 101 to the corresponding recess 103. Further, for any longitudinal sectional view of the portion 204 of the connecting portion 202 located in the corresponding recessed portion 103, the portions of the connecting portion 202 located on each side of the corresponding recessed portion 103 do not intersect, so as to weaken the connection strength between two corresponding adjacent common portions 201.
In one embodiment, as shown in fig. 4, the common layer 20 is a continuous film layer, and the common layer 20 further includes a portion 204 located in the recess. It can be understood that, a plurality of the connection portions 202 and a plurality of the common portions 201 can be formed directly on the pixel defining layer 10 having a plurality of the recess portions 103 to form a continuous common layer 20, and the through holes 203 are not formed, which can save a process, and according to the above analysis, even if the common layer 20 includes a plurality of the connection portions 202, the portion 204 of each recess portion 103 located in the recess portion can also correspond to the connection path between two adjacent common portions 201, so as to weaken the connection strength between two corresponding adjacent common portions 201, so as to reduce the ability of the light-emitting layer 40 to conduct between two adjacent common portions 201 during light emission, so as to improve the phenomenon of the cross talk between two adjacent sub-pixels during light emission of the light-emitting layer 40.
In one embodiment, as shown in fig. 1 and 5, the depth of each of the recesses 103 is smaller than the thickness of the weakening structure, i.e. the depth of each of the recesses 103 is smaller than the thickness of the corresponding weakening portion 101. It will be appreciated that setting the depth of each recess 103 to be less than the thickness of the corresponding weakened portion 101 maintains the integrity and stability of the corresponding weakened portion 101. Specifically, as shown in fig. 1 and 5, each of the light emitting portions 401 further includes an anode portion and a cathode portion 405, each of the anode portions is located at a side of the corresponding cavity portion 402 away from the corresponding organic portion 403, each of the cathode portions 405 is located at a side of the corresponding electronic portion 404 away from the corresponding organic portion 403, and further, each of the cathode portions 405 may extend to a corresponding plurality of the weakening portions 101 to be connected to each other, so as to form a continuous cathode layer 406. It is understood that setting the depth of each recess 103 to be less than the thickness of the corresponding weakened portion 101 can also avoid the cathode layer 406 from being excessively recessed in a plurality of recesses 103, so as to reduce the risk of breaking the cathode layer 406. Further, the depth of each of the recesses 103 may be one third of the thickness of the corresponding weakening portion 101, for example, the depth of each of the recesses 103 may be 0.1 to 0.3 micrometers. Still further, the width of each of the recesses 103 may be one half of the width of the corresponding weakening part 101, for example, the depth of each of the recesses 103 may be 5 to 8 micrometers.
In one embodiment, as shown in fig. 6, the length of each recess 103 is not less than the length of the corresponding opening 102. It can be understood that, the corresponding light emitting portion 401 is disposed in each of the openings 102, that is, the length of each light emitting portion 401 is not greater than the length of the corresponding opening 102, and the length of the recessed portion 103 is not less than the length of the corresponding opening 102, so that the length of the recessed portion 103 is not less than the length of the corresponding light emitting portion 401, that is, any place between two corresponding adjacent common portions 201 is disconnected, and the phenomenon of crosstalk between two adjacent sub-pixels of the light emitting layer 40 during light emitting is further improved.
In an embodiment, as shown in fig. 7, each of the weakening portions 101 is provided with a plurality of the concave portions 103, and the plurality of the concave portions 103 are arranged along a direction in which a length of the corresponding weakening portion 101 is located. It can be understood that, considering the light transmittance, the width of each of the weakening portions 101 is generally small, and the plurality of recesses 103 in the present embodiment do not penetrate through the corresponding weakening portion 101 in the length direction, so that the integrity and stability of each of the weakening portions 101 can be maintained. Further, a plurality of the concave portions 103 may be arranged along a direction in which the length of the corresponding weakening portion 101 is located, and further, the distance between two adjacent concave portions 103 may be equal.
In one embodiment, the weakening structure also comprises one projection or a plurality of projections arranged at intervals. Specifically, the arrangement of the convex portion may refer to the arrangement of the concave portion 103 described above. Similarly, since the protruding portion is a non-flat structure, that is, the weakening structure including the protruding portion can still weaken the lateral conduction capability of the common layer 20. Wherein, when the weakening structure also comprises one convex portion or a plurality of convex portions arranged at intervals, the specific arrangement mode of the common layer 20 can still refer to the above related description.
In an embodiment, as shown in fig. 1 and 5, the display panel 100 further includes an encapsulation layer 50, and the encapsulation layer 50 is disposed on a side of the plurality of cathode portions 405 away from the array substrate 30. Specifically, the thickness of the encapsulation layer 50 may be 500 nm to 1000 nm, the material of the encapsulation layer 50 may include, but is not limited to, at least one of silicon nitride and silicon oxynitride, and the encapsulation layer 50 is used to block water and oxygen from penetrating into the light emitting layer 40. For example, the encapsulation layer 50 may be a single layer film composed of a material including silicon oxynitride; for another example, the encapsulation layer 50 may be a composite film including a first film layer and a second film layer disposed on both sides of the first film layer, the first film layer including silicon oxynitride, and the second film layer including silicon nitride.
The invention provides a manufacturing method of a display panel, which includes but is not limited to the following embodiments and combinations of the following embodiments.
In an embodiment, as shown in fig. 8, the manufacturing method of the display panel includes, but is not limited to, the following steps.
S10, providing a pixel definition layer, wherein the pixel definition layer comprises a plurality of openings arranged at intervals and weakening structures, and the weakening structures are arranged adjacent to the plurality of openings.
In one embodiment, the step S10 may include, but is not limited to, the following steps: providing an array substrate and an anode layer positioned on the array substrate; and forming a plurality of openings and the weakening structure on one side of the anode layer away from the array substrate.
Wherein, the array substrate and the pixel defining layer can be referred to the above description, the anode layer includes a plurality of the anode portions as described above, and further, a plurality of the anode portions can be connected to form a continuous anode layer. Specifically, the pixel defining layer may be formed by a photolithography process, and the plurality of openings may be formed by irradiating the pixel defining layer with laser.
Wherein, the weakening structure comprises one recess or a plurality of recesses arranged at intervals. Further, the depth of each recess is smaller than the thickness of the corresponding weakening portion. Further, the depth of each of the recesses may be one third of the thickness of the corresponding weakening portion, for example, the depth of each of the recesses may be 0.1 to 0.3 micrometers. Still further, the width of each of the recesses may be one half of the width of the corresponding weakening portion, for example, the depth of each of the recesses may be 5 to 8 micrometers. In an embodiment, each weakening portion is provided with one concave portion, and the length of each concave portion is not smaller than the length of the corresponding opening. In an embodiment, each of the weakening portions is provided with a plurality of the concave portions, the plurality of the concave portions are arranged along a direction in which the length of the corresponding weakening portion is located, and further, distances between two adjacent concave portions may be equal.
S20, forming a common layer on the pixel defining layer, the common layer including a portion located in the plurality of openings, the common layer having lateral conductivity weakened by the weakening structure.
In one embodiment, the step S20 may include, but is not limited to, the following steps: forming a common film on the pixel defining layer; and forming at least one through hole on the common film to form the common layer, wherein each through hole is opposite to the corresponding concave part.
In one embodiment, the display panel further includes a light emitting layer including a plurality of light emitting portions, one of the light emitting portions being disposed in each of the openings, and each of the light emitting portions includes a cavity portion, an organic portion located on the cavity portion, and an electron portion located on the organic portion. Further, the hole portion includes a hole injection portion and a hole transport layer on the hole injection portion, and the electron portion includes an electron transport layer and an electron injection layer on the electron transport layer. Specifically, the common layer may include a plurality of common portions, the plurality of common portions and the plurality of openings correspond to each other one to one, each of the common portions is disposed at the corresponding opening, the common portion may include, but is not limited to, at least one of the hole portion and the electron portion, and the common portion may be, for example, the hole injection portion. Specifically, the plurality of hole injection portions and the plurality of hole transport portions may be formed by forming a hole injection film or a hole transport film continuously over the entire surface by an Open Mask through evaporation, and the thickness of each hole injection portion may be 5 nm to 10 nm.
Specifically, the common portion is taken as the hole injection portion, that is, a common film is formed on the plurality of openings and the weakening structure as the hole injection film, and the thickness of the hole injection film may be 5 nm to 10 nm in the same manner. It is understood that even though the hole injection film covers the opening and the weakening structure at this time, each of the recesses may extend a distribution path of the hole injection film, for example, a height difference exists between a portion of the hole injection film located in the recess and a portion located in a portion other than the recess, and a connection strength between two adjacent portions of the hole injection film located in the portion other than the recess may be weakened to reduce a capability of conduction between two adjacent common portions of the light emitting layer when emitting light, so as to improve a phenomenon that the light emitting layer cross-talks with each other between two adjacent sub-pixels when emitting light.
Further, a laser may be used to remove at least a portion of the common film located in one of the recesses to form the corresponding through hole, where the laser may be an ultraviolet ray, a period of the ultraviolet ray may be in nanoseconds, and a power of the ultraviolet ray may be in milliwatts. It can be understood that, at this time, the hole injection film is located on the opening and a portion of the recess to form the common layer, and as can be seen from the above analysis, referring to the embodiment in fig. 3, in this case, the efficiency of the manufacturing process can be effectively improved, and at the same time, the connection strength between two partially adjacent common portions can still be weakened, or even the connection between two partially adjacent common portions can be blocked, so as to reduce the ability of the light-emitting layer to conduct between two adjacent common portions during light emission, so as to improve the phenomenon of mutual crosstalk between two adjacent sub-pixels during light emission.
It can be understood that, due to the existence of the recesses, when the laser is used to remove at least a portion of the common film located in one of the recesses, on one hand, the inner side of each of the recesses can ensure that most of the energy of the laser is applied to the portion of the common film located in the recess, thereby improving the "removal" efficiency, and on the other hand, the inner side of each of the recesses can block the laser from being emitted to the periphery, thereby further reducing or shielding the subsequent influence of particles or energy of the laser generated during the laser "removal" on the light-emitting layer.
In one embodiment, the step S20 may include, but is not limited to, the following steps: forming a corresponding organic portion on a portion of the common layer located at each of the openings; forming an electron transmission part and an electron injection part corresponding to each organic part in sequence; forming a corresponding cathode portion on each of the electron injection layers; an encapsulation layer is formed on the plurality of cathode portions.
Wherein, a plurality of the organic parts can be simultaneously prepared by using a Fine Metal Mask in an evaporation way; the electron transmission parts and the electron injection parts can be prepared by using an Open Mask in an evaporation mode; the plurality of cathode parts can be prepared by utilizing an Open Mask in a mode of evaporation or sputtering; the packaging layer can be prepared by chemical vapor deposition by utilizing PECVD equipment. Specifically, the organic portions, the electron transport portions, the electron injection portions, the cathode portions, and the encapsulation layer may be arranged in the manner described above with reference to the above description.
The invention also provides a display device comprising a display panel as described in any of the above.
The invention provides a display panel, a manufacturing method thereof and a display device, wherein the display panel and the display device comprise a pixel definition layer and a common layer, the pixel definition layer comprises a plurality of openings which are arranged at intervals, and the common layer comprises parts positioned in the plurality of openings; according to the invention, the weakening structure is arranged in the pixel defining layer and is arranged close to the plurality of openings, the weakening structure is used for weakening the transverse conduction capability of the common layer, so that the connection path between two parts respectively positioned in two adjacent openings in the common layer can be prolonged or even disconnected, the probability that current is transversely transmitted to the adjacent light-emitting layer due to the fact that the two parts are relatively high in electrical connection degree when the light-emitting layer emits light is reduced, and the phenomenon of mutual crosstalk between two adjacent sub-pixels when the light-emitting layer emits light is improved.
The display panel, the manufacturing method thereof, and the display device provided in the embodiments of the present invention are described in detail above, and a specific example is applied in the description to explain the principle and the embodiments of the present invention, and the description of the embodiments is only used to help understanding the technical scheme and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel, comprising:
a pixel defining layer including a plurality of openings arranged at intervals;
a common layer including portions within the plurality of openings;
wherein the pixel defining layer further comprises a weakening structure disposed adjacent to the plurality of openings, the weakening structure for weakening a lateral conduction capability of the common layer.
2. The display panel of claim 1, wherein the weakening structure comprises one recess or a plurality of recesses arranged at intervals.
3. The display panel of claim 2, wherein the common layer further comprises at least one through hole, each through hole being disposed opposite to a corresponding one of the recesses.
4. The display panel of claim 2, wherein the common layer is a continuous film layer, the common layer further comprising a portion located within one or more of the recesses.
5. The display panel of claim 2, wherein a depth of each of the recesses is less than a thickness of the attenuating structures.
6. The display panel according to claim 2, wherein a length of each of the recesses is not smaller than a length of the corresponding opening.
7. The display panel of claim 1, wherein the weakening structure comprises one convex portion or a plurality of convex portions arranged at intervals.
8. A method for manufacturing a display panel according to any one of claims 1 to 7, the method comprising:
providing a pixel definition layer, wherein the pixel definition layer comprises a plurality of openings arranged at intervals and a weakening structure, and the weakening structure is arranged adjacent to the plurality of openings;
forming a common layer on the pixel defining layer, the common layer including a portion located in the plurality of openings, a lateral conduction capability of the common layer being weakened by the weakening structure.
9. The method of manufacturing a display panel according to claim 8, wherein the weakening structure includes one recess or a plurality of recesses arranged at intervals, and the step of forming a common layer on the pixel defining layer includes:
forming a common film on the pixel defining layer;
and forming at least one through hole on the common film to form the common layer, wherein each through hole is opposite to the corresponding concave part.
10. A display device characterized in that the display device comprises a display panel according to any one of claims 1 to 7.
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| CN106876331A (en) * | 2017-03-03 | 2017-06-20 | 武汉华星光电技术有限公司 | OLED display panel and preparation method thereof, display device |
| CN111554822A (en) * | 2020-05-15 | 2020-08-18 | 京东方科技集团股份有限公司 | Organic light emitting diode panel, preparation method thereof and display device |
| CN111599851A (en) * | 2020-06-02 | 2020-08-28 | 京东方科技集团股份有限公司 | Display panel and display device |
-
2021
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106876331A (en) * | 2017-03-03 | 2017-06-20 | 武汉华星光电技术有限公司 | OLED display panel and preparation method thereof, display device |
| CN111554822A (en) * | 2020-05-15 | 2020-08-18 | 京东方科技集团股份有限公司 | Organic light emitting diode panel, preparation method thereof and display device |
| CN111599851A (en) * | 2020-06-02 | 2020-08-28 | 京东方科技集团股份有限公司 | Display panel and display device |
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