CN113050763A - Wind scooper and heat dissipation system - Google Patents
Wind scooper and heat dissipation system Download PDFInfo
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- CN113050763A CN113050763A CN201911384814.9A CN201911384814A CN113050763A CN 113050763 A CN113050763 A CN 113050763A CN 201911384814 A CN201911384814 A CN 201911384814A CN 113050763 A CN113050763 A CN 113050763A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 45
- 238000005192 partition Methods 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims description 61
- 230000000694 effects Effects 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an air guide cover and a heat dissipation system using the same, wherein the air guide cover comprises: the two partition plates are arranged at intervals, a channel is formed between the partition plates, and the channel comprises an air inlet and an air outlet communicated with the air inlet; and the guide plate is arranged in the channel, two side edges of the guide plate are respectively connected with the two clapboards of the channel, three through areas are defined in the channel, the three areas comprise a first area close to one side of the air inlet, a second area close to one side of the air outlet and a third area positioned between the first area and the second area, and the guide plate is used for guiding the air flow entering the first area to pass through the third area and enter the second area and then be discharged out of the air guide cover. The air guide cover increases the circulation rate of air flow in the air guide cover by arranging the guide plate in the channel, and has positive help for improving the heat dissipation efficiency.
Description
Technical Field
The invention belongs to the field of heat dissipation, and relates to an air guide cover and a heat dissipation system.
Background
The housing of the computing device typically includes a plurality of heat generating components such as a central processing unit (cpu), memory banks, etc. Because the heating element can generate heat during working, in order to reduce the temperature of some heating elements, an air guide cover is generally arranged at the heating element, the air guide cover comprises an air inlet and an air outlet, the air is guided into the heating element through the air inlet of the air guide cover, and the heat of the heating element is dissipated to the air outlet of the air guide cover by airflow so as to be discharged out of the air guide cover. However, the flow rate of air in the conventional wind scooper is slow, and the air after heat dissipation is easily accumulated at the air outlet of the wind scooper, so that the temperature of the heating element at the air outlet is increased, and the heat dissipation efficiency of the heating element is affected.
Disclosure of Invention
The invention provides a wind scooper in a first aspect, comprising:
the two partition plates are arranged at intervals, a channel is formed between the partition plates, and the channel comprises an air inlet and an air outlet communicated with the air inlet; and
the air guide plate is arranged in the channel, two side edges of the air guide plate are respectively connected with the two partition plates of the channel, three through areas are defined in the channel, the three areas comprise a first area close to one side of the air inlet, a second area close to one side of the air outlet and a third area located between the first area and the second area, and the air guide plate is used for guiding air flow entering the first area to pass through the third area, entering the second area and then being discharged out of the air guide cover.
A second aspect of the present invention provides a heat dissipation system, including:
a wind scooper according to the first aspect of the present invention;
a main board; and
the heating element is arranged on the mainboard and generates heat during working, the heating element comprises a first heating element and a second heating element, the first heating element is positioned in a first area in the channel, the second heating element is positioned in a second area in the channel, air flowing into the first area gives the first heating element for heat dissipation, and the air flowing through the first area is guided by the guide plate and then enters the second area for heat dissipation of the second heating element.
The air guide cover increases the circulation rate of air flow in the air guide cover by arranging the guide plate in the channel, effectively reduces the air flow gathering at the air outlet and has positive help for improving the heat dissipation efficiency.
Drawings
Fig. 1 is a schematic view of an air guiding cover according to an embodiment of the invention.
Fig. 2 is a schematic sectional view taken along line II-II of fig. 1.
Fig. 3 is a schematic view of another angle of an air guiding cover according to an embodiment of the invention.
Fig. 4 is a schematic view of a second heat dissipation system according to an embodiment of the invention.
Fig. 5 is a schematic view of another angle of the second heat dissipation system according to the embodiment of the invention.
Fig. 6 is an exploded view of a second heat dissipation system according to an embodiment of the present invention.
Description of the main elements
Channel 12
Connecting portion 1843
First heat generating element 221
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a detailed description of the present invention will be given below with reference to the accompanying drawings and specific embodiments. It should be noted that in the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, and that the described embodiments are merely a subset of embodiments of the invention, rather than all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example one
Referring to fig. 1, the present embodiment provides an air guiding cover 100, in the present embodiment, the air guiding cover 100 includes: two partitions 10 arranged at a distance from each other and a baffle 18. A channel 12 is formed between the partition boards 10, and the channel 12 includes an air inlet 14 and an air outlet 16 communicated with the air inlet 14. The air deflector 18 is disposed in the channel 12, two side edges of the air deflector 18 are respectively connected to the two partition boards 10 of the channel 12, and three through regions are defined in the channel 12, the three regions include a first region 122 close to one side of the air inlet 14, a second region 124 close to one side of the air outlet 16, and a third region 126 located between the first region 122 and the second region 124, and the air deflector 18 is configured to guide the air flow entering the first region 122 to pass through the third region 126, enter the second region 124, and then be discharged out of the air guiding cover 100.
With reference to fig. 1, in the present embodiment, the wind scooper 100 further includes a fan 11. The fan 11 is disposed in the channel 12 and located in the third region 126. The fan 11 is used for sucking cold air from the air inlet 14, and making the cold air flow through the first area 122 and the third area 126 and enter the second area 124.
Referring to fig. 2 and 3, in the present embodiment, the baffle 18 is substantially W-shaped within the channel 12, wherein the W-shape opens toward the top end 101. Each of the partitions 10 includes a top end 101 and a bottom end 103 opposite to the top end 101, the baffle 18 extends along the extending direction of the channel 12, the baffle 18 includes a first end 182 close to the air inlet 14, a second end 184 close to the air outlet 16, and a first inclined portion 1841, a second inclined portion 1842 and a connecting portion 1843 between the first end 182 and the second end 184, the first end 182 is connected to the top ends 101 of the two partitions 10 at the side of the air inlet 14, the second end 184 is connected to the top ends 101 of the two partitions 10 at the side of the air outlet 16, the first inclined portion 1841 extends from the first end 182 toward the bottom end 103 and inclines toward the side of the air outlet 16, the second inclined portion 1842 extends from the second end 184 toward the bottom end 103 and inclines toward the side of the air inlet 14, the connection portion 1843 is connected between the first inclined portion 1841 and the second inclined portion 1842 and protrudes toward the top end 101, the first inclined portion 1841 cooperates with the partition 10 to define the first region 122, the second inclined portion 1842 cooperates with the partition 10 to define the second region 124, and the connection portion 1843 cooperates with the partition 10 to define the third region 126.
The fan 11 and the guide plate 18 are arranged in the channel 12 of the wind scooper 100, so that the circulation rate of airflow in the wind scooper 100 is increased, the aggregation of the airflow at the air outlet 16 is effectively reduced, and the improvement of the heat dissipation efficiency is positively facilitated.
Example two
In this embodiment, a heat dissipation system 200 is provided, in this embodiment, the heat dissipation system 200 includes: the air guide cover 100, the main board 20 and the heating element 22 arranged on the main board 20. The wind scooper 100 is disposed on the main board 20 and covers the heating element 22. The heating element 22 generates heat during operation. The heat generating element 22 includes a first heat generating element 221 and a second heat generating element 222, wherein the heat generating element 22 is respectively located in the first area 122 and the second area 124 of the wind scooper 100, the air flowing into the first area 122 dissipates heat of the first heat generating element 221, and the air flowing through the first area 122 is guided by the guide plate 18 and then flows into the second area 124 to dissipate heat of the second heat generating element 222.
As shown in fig. 4, in the present embodiment, the heat dissipation system 200 further includes another wind scooper 100, and the two wind scoopers 100 have the same structure and are substantially parallel and spaced apart from each other. In other embodiments, the number of the wind scoops 100 in the heat dissipation system 200 may be three or four, and the number of the wind scoops varies depending on the distribution of the heat generating elements 22 on the actual motherboard 20.
With continued reference to fig. 4, the heat dissipation system 200 further includes an upper cover plate 24, and the upper cover plate 24 is located between the two wind scoops 100. The upper cover plate 24 covers two adjacent partition plates 10 in the middle of the two wind scoopers 100, and forms a rectangular channel 26 between the two wind scoopers 100 by matching with the two partition plates 10. In this embodiment, two sides of the upper cover plate 24 are respectively fixedly connected to the top ends 101 of the two partition plates 10. In this embodiment, the upper cover plate 24 and the two wind scoopers 100 are integrally formed. In other embodiments, the upper cover plate 24 and the two wind scoops 100 may be fixedly connected by welding or the like. When there are more than two wind scoopers 100, there may be two or more than two upper cover plates 24 to form two or more rectangular channels 26 between the adjacent wind scoopers 100.
As shown in fig. 5, the rectangular channel 26 includes a first port 13 and a second port 15 opposite to the first port 13, and the rectangular channel 26 includes a fourth area 262 near the first port 13, a fifth area 264 near the second port 15, and a sixth area 266 between the fourth area 262 and the fifth area 264. In particular, the first port 13 is located on the same side as the air inlet 14, and the second port 15 is located on the same side as the air outlet 16.
With reference to fig. 5, in the present embodiment, the heat dissipation system 200 includes three fans 11, one fan 11 is disposed in each of the third areas 126 in the two wind scoops 100, and the two fans 11 are used for sucking cold air from the air inlet 14, so that the cold air enters the heat dissipation system 200 from the air inlet 14, and then exits the heat dissipation system 200 from the air outlet 16; also disposed in the sixth area 266 is the fan 11, and the fan 11 is used for drawing cold air from the first port 13, entering the heat dissipation system 200 through the first port 13, and then exiting the heat dissipation system 200 through the second port 15.
In this embodiment, the first heating element 221 and the second heating element 222 are memory modules, and the heating element 22 further includes a third heating element 223, a fourth heating element 224, a fifth heating element 225, and a sixth heating element 226, where the third heating element 223 and the fourth heating element 224 are both cpus, and the fifth heating element 225 and the sixth heating element 226 are memory modules. In other embodiments, the third heating element 223 and the fourth heating element 224 are not limited to a cpu, and may be other heating elements. Specifically, the heating elements 22 covered by the two wind scoopers 100 are the first heating element 221, the second heating element 222, the third heating element 223, and the fourth heating element 224, respectively. The fifth and sixth heat generating elements 225 and 226 are located in the fourth and fifth regions 262 and 264, respectively.
Referring to fig. 5 and fig. 6, in the present embodiment, in the two wind scoops 100, the cold air flows through the first area 122 from the wind inlet 14, and dissipates heat of the first heating element 221 and the fifth heating element 225 in the first area 122, respectively; the fans 11 installed in the third region 126 guide the airflow passing through the first region 122 to the second region 124 through the air deflectors 18, respectively, to radiate heat to the second heat generating element 222 and the sixth heat generating element 226, respectively. In the rectangular passage 26, the cool air flows through the fourth area 262 from the first port 13, and dissipates heat of the third heating element 223 located in the fourth area 262; the fan 11 installed in the sixth area 266 directly delivers the airflow passing through the fourth area 262 to the fifth area 264 to radiate heat from the fourth heat generating element 224.
The heat dissipation system 200 of the present embodiment performs a heat dissipation effect test by using Flotherm software. The temperature of the heating element 22 under the heat dissipation of the heat dissipation system 200 of this embodiment is measured at an ambient temperature of 25 ℃, and is shown in the following table:
TABLE 1
| Assembly | Specification (. degree. C.) | Temperature after heat dissipation |
| First heat generating element | 85 | 75.6 |
| Second heating element | 85 | 71.9 |
| Fifth heating element | 85 | 84.6 |
| Sixth heating element | 85 | 83.8 |
As can be seen from table 1, the heat dissipation system 200 of the present embodiment achieves the target heat dissipation effect on the heat generating elements 22, and the temperature after heat dissipation is lower than the temperature at the specification value.
The heat dissipation system 200 is used for dissipating heat from the heating element 22 on the motherboard 20 by combining the air guiding cover 100 and the upper cover plate 24, and the heat dissipation system 200 covers the heating element 22 according to the distribution rule of the heating element 22 on the motherboard 20, so that the heat dissipation effect is significantly improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the scope of the technical solutions of the present invention.
Claims (10)
1. An air scoop, comprising:
the two partition plates are arranged at intervals, a channel is formed between the partition plates, and the channel comprises an air inlet and an air outlet communicated with the air inlet; and
the air guide plate is arranged in the channel, two side edges of the air guide plate are respectively connected with the two partition plates of the channel, three through areas are defined in the channel, the three areas comprise a first area close to one side of the air inlet, a second area close to one side of the air outlet and a third area located between the first area and the second area, and the air guide plate is used for guiding air flow entering the first area to pass through the third area, entering the second area and then being discharged out of the air guide cover.
2. The wind scooper of claim 1, further comprising a fan disposed within the channel and located in the third region.
3. The wind scooper of claim 2, wherein the fan is configured to draw cold air from the wind inlet, so that the cold air flows through the first area and the third area and enters the second area.
4. The wind scooper of claim 1, wherein each of the partitions includes a top end and a bottom end opposite the top end; the baffle plate extends along the extending direction of the channel, the baffle plate comprises a first end close to the air inlet, a second end close to the air outlet, and a first inclined part, a second inclined part and a connecting part which are arranged between the first end and the second end, the first end is connected with the top ends of the two partition plates on one side of the air inlet, the second end is connected with the top ends of the two partition plates on one side of the air outlet, the first inclined part extends from the first end to the bottom end direction and inclines towards one side of the air outlet, the second inclined part extends from the second end to the bottom end direction and inclines towards one side of the air inlet, the connecting part is connected between the first inclined part and the second inclined part and protrudes towards the top end direction, and the first inclined part and the partition plates are matched to define the first area, the second inclined portion cooperates with the partition plate to define the second region, and the connecting portion cooperates with the partition plate to define the third region.
5. A heat dissipation system, comprising:
an air scoop according to any of claims 1 to 4;
a main board; and
the heating element is arranged on the mainboard and generates heat during working, the heating element comprises a first heating element and a second heating element, the first heating element is positioned in a first area in the channel, the second heating element is positioned in a second area in the channel, air flowing into the first area gives the first heating element for heat dissipation, and the air flowing through the first area is guided by the guide plate and then enters the second area for heat dissipation of the second heating element.
6. The heat dissipation system of claim 5, further comprising another wind scooper, wherein the two wind scoopers are spaced apart; the heat dissipation system further comprises an upper cover plate, the upper cover plate is covered on two adjacent partition plates in the middle of the two air guiding covers and is matched with the two partition plates to form a rectangular channel between the two air guiding covers, the rectangular channel comprises a first port and a second port opposite to the first port, and the rectangular channel comprises a fourth area close to the first port, a fifth area close to the second port and a sixth area located between the fourth area and the fifth area.
7. The heat dissipation system of claim 6, wherein the first port is on a same side as the air inlet and the second port is on a same side as the air outlet.
8. The heat dissipating system of claim 7, wherein said heat dissipating system comprises three fans, two of said air scoops each having one of said fans disposed therein and one of said fans disposed in said sixth area, said fan disposed in said sixth area being adapted to draw cold air from said first port, into said heat dissipating system from said first port, and out of said heat dissipating system from said second port.
9. The heat dissipation system of claim 6, wherein the first and second heat generating elements are memory modules, and the heat generating elements further include a third heat generating element, a fourth heat generating element, a fifth heat generating element, and a sixth heat generating element, the third and fourth heat generating elements are both cpus, the fifth and sixth heat generating elements are memory modules, the third and fourth heat generating elements are located in the fourth and fifth areas, respectively, and the fifth and sixth heat generating elements are located in the first and second areas in the other wind scooper, respectively.
10. The heat dissipating system of claim 6, wherein the top cover plate and the two air scoops are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911384814.9A CN113050763B (en) | 2019-12-28 | 2019-12-28 | Wind scooper and heat radiation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911384814.9A CN113050763B (en) | 2019-12-28 | 2019-12-28 | Wind scooper and heat radiation system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113050763A true CN113050763A (en) | 2021-06-29 |
| CN113050763B CN113050763B (en) | 2023-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911384814.9A Active CN113050763B (en) | 2019-12-28 | 2019-12-28 | Wind scooper and heat radiation system |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100032139A1 (en) * | 2008-08-07 | 2010-02-11 | Inventec Corporation | Wind-guiding cover |
| CN102841660A (en) * | 2011-06-23 | 2012-12-26 | 鸿富锦精密工业（深圳）有限公司 | Computer cooling system |
| CN205961666U (en) * | 2016-08-17 | 2017-02-15 | 杭州昆海信息技术有限公司 | Communication equipment |
| TWM586292U (en) * | 2019-07-24 | 2019-11-11 | 呈和有限公司 | Ventilating hood with fan |
-
2019
- 2019-12-28 CN CN201911384814.9A patent/CN113050763B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100032139A1 (en) * | 2008-08-07 | 2010-02-11 | Inventec Corporation | Wind-guiding cover |
| CN102841660A (en) * | 2011-06-23 | 2012-12-26 | 鸿富锦精密工业（深圳）有限公司 | Computer cooling system |
| CN205961666U (en) * | 2016-08-17 | 2017-02-15 | 杭州昆海信息技术有限公司 | Communication equipment |
| TWM586292U (en) * | 2019-07-24 | 2019-11-11 | 呈和有限公司 | Ventilating hood with fan |
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| Publication number | Publication date |
|---|---|
| CN113050763B (en) | 2023-11-03 |
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