CN113039632B - 使用实验设计及响应表面模型的工艺优化 - Google Patents

使用实验设计及响应表面模型的工艺优化 Download PDF

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Publication number
CN113039632B
CN113039632B CN201980073210.4A CN201980073210A CN113039632B CN 113039632 B CN113039632 B CN 113039632B CN 201980073210 A CN201980073210 A CN 201980073210A CN 113039632 B CN113039632 B CN 113039632B
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China
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candidates
processor
metrology tool
metrology
tool
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CN201980073210.4A
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English (en)
Chinese (zh)
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CN113039632A (zh
Inventor
S·比蒂
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KLA Corp
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KLA Tencor Corp
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Priority claimed from US16/594,845 external-priority patent/US11062928B2/en
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Publication of CN113039632A publication Critical patent/CN113039632A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201980073210.4A 2018-11-21 2019-11-20 使用实验设计及响应表面模型的工艺优化 Active CN113039632B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862770647P 2018-11-21 2018-11-21
US62/770,647 2018-11-21
US16/594,845 2019-10-07
US16/594,845 US11062928B2 (en) 2019-10-07 2019-10-07 Process optimization using design of experiments and response surface models
PCT/US2019/062308 WO2020106784A1 (en) 2018-11-21 2019-11-20 Process optimization using design of experiments and response surface models

Publications (2)

Publication Number Publication Date
CN113039632A CN113039632A (zh) 2021-06-25
CN113039632B true CN113039632B (zh) 2022-03-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980073210.4A Active CN113039632B (zh) 2018-11-21 2019-11-20 使用实验设计及响应表面模型的工艺优化

Country Status (6)

Country Link
JP (1) JP7329597B2 (ja)
KR (1) KR102548663B1 (ja)
CN (1) CN113039632B (ja)
IL (1) IL282726B1 (ja)
SG (1) SG11202104655QA (ja)
WO (1) WO2020106784A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7496498B2 (ja) 2020-08-27 2024-06-07 パナソニックＩｐマネジメント株式会社 情報処理方法、プログラム、および情報処理装置
JP7496497B2 (ja) 2020-08-27 2024-06-07 パナソニックＩｐマネジメント株式会社 情報処理方法、プログラム、および情報処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050246044A1 (en) * 2004-04-28 2005-11-03 International Business Machines Corporation System and method for optimizing metrology sampling in apc applications
US20060009872A1 (en) * 2004-07-08 2006-01-12 Timbre Technologies, Inc. Optical metrology model optimization for process control
CN105580123A (zh) * 2013-08-23 2016-05-11 科磊股份有限公司 多模型计量
CN108701625A (zh) * 2016-02-24 2018-10-23 科磊股份有限公司 光学计量的准确度提升

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7269526B2 (en) * 2005-05-04 2007-09-11 Hitachi Global Storage Technologies Netherlands B.V. Aggregated run-to-run process control for wafer yield optimization
JP2007285906A (ja) 2006-04-18 2007-11-01 Hitachi High-Technologies Corp 荷電粒子線システム、および測定パラメータ設定方法
US9076827B2 (en) * 2010-09-14 2015-07-07 Applied Materials, Inc. Transfer chamber metrology for improved device yield
US20140214192A1 (en) * 2013-01-25 2014-07-31 Dmo Systems Limited Apparatus For Design-Based Manufacturing Optimization In Semiconductor Fab
US9255877B2 (en) 2013-05-21 2016-02-09 Kla-Tencor Corporation Metrology system optimization for parameter tracking

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050246044A1 (en) * 2004-04-28 2005-11-03 International Business Machines Corporation System and method for optimizing metrology sampling in apc applications
US20060009872A1 (en) * 2004-07-08 2006-01-12 Timbre Technologies, Inc. Optical metrology model optimization for process control
CN105580123A (zh) * 2013-08-23 2016-05-11 科磊股份有限公司 多模型计量
CN108701625A (zh) * 2016-02-24 2018-10-23 科磊股份有限公司 光学计量的准确度提升

Also Published As

Publication number Publication date
IL282726B1 (en) 2024-09-01
WO2020106784A1 (en) 2020-05-28
KR102548663B1 (ko) 2023-06-27
SG11202104655QA (en) 2021-06-29
IL282726A (en) 2021-06-30
KR20210080585A (ko) 2021-06-30
JP2022507871A (ja) 2022-01-18
JP7329597B2 (ja) 2023-08-18
CN113039632A (zh) 2021-06-25

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