CN113037138A - Multi-source integrated micro power supply for intelligent workshop Internet of things manufacturing execution process - Google Patents

Multi-source integrated micro power supply for intelligent workshop Internet of things manufacturing execution process Download PDF

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CN113037138A
CN113037138A CN202110016713.7A CN202110016713A CN113037138A CN 113037138 A CN113037138 A CN 113037138A CN 202110016713 A CN202110016713 A CN 202110016713A CN 113037138 A CN113037138 A CN 113037138A
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capacitor
resistor
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chip
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CN113037138B (en
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杨文安
沈悦
郭宇
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Nanjing University of Aeronautics and Astronautics
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Nanjing University of Aeronautics and Astronautics
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Abstract

Disclosed is a multi-source integrated micro power supply for an intelligent workshop Internet of things manufacturing execution process, comprising: the energy collection module comprises an energy collection unit and is used for efficiently collecting electric energy converted from cutting vibration energy, electric energy converted from cutting heat energy, electric energy converted from cutting noise energy and electric energy converted from structural member deformation energy in the intelligent workshop Internet of things manufacturing execution process, and coupling the collected multi-source electric energy; the energy management module comprises an energy storage unit and an energy management unit; and the energy monitoring module comprises a monitoring unit, an alarm unit, a reset unit and a setting unit, wherein the monitoring unit is used for monitoring the cutting vibration energy, the cutting heat energy, the cutting noise energy and the voltage stored in the energy storage unit after the structural member deformation energy is acted by the energy acquisition module and the output voltage of the voltage in the energy storage unit after the voltage in the energy storage unit is acted by the energy management unit, and controlling the on-off of the energy management unit.

Description

Multi-source integrated micro power supply for intelligent workshop Internet of things manufacturing execution process
Technical Field
The invention relates to the field of micro power supplies, self-powered sensor nodes and wireless sensor networks, in particular to a multi-source integrated micro power supply for an intelligent workshop Internet of things manufacturing execution process.
Background
The development of the intelligent manufacturing technology promotes the change of global industry, the speed of the transition of the manufacturing industry of China from the traditional manufacturing mode to the intelligent manufacturing mode is accelerated, and the manufacturing industry of China still develops towards the intelligent manufacturing direction in a long time in the future. Emerging information technology can be fused with manufacturing industry, and the intellectualization of the management of the manufacturing execution process is realized, so that the intellectualization of the manufacturing workshop is realized. Therefore, the technology of the internet of things is introduced into the manufacturing industry, the manufacturing resource object connection is realized, the field information of the manufacturing execution process is sensed, transmitted and processed in real time, the dynamic requirements of workshop production are met, and the digitization, networking and intellectualization of the manufacturing workshop are important.
With the wide application of the internet of things technology in the manufacturing industry, the manufacturing system using the information perception technology as the driving force, namely the internet of things manufacturing system, strongly pushes the development of intelligent manufacturing towards the directions of automation, informatization, integration and greening. The manufacturing internet of things is a novel manufacturing mode and information service mode which integrates electronic information technologies such as networks, embedded types, RFID (radio frequency identification devices), sensors and the like with manufacturing technologies and realizes dynamic sensing, intelligent processing and optimal control of manufacturing resources and information resources in the manufacturing and service process and the whole life cycle of products. The manufacturing association injects new connotation into the informatization of the manufacturing industry, and is an important technical approach for improving the competitiveness of enterprises. The Wireless Sensor Network (WSN) is a key technology of the internet of things, is an important means for realizing the execution process of the manufacture of the internet of things (machine tool monitoring (chatter monitoring, overload monitoring), cutter monitoring (cutter wear monitoring, cutter damage monitoring), workpiece quality monitoring (surface roughness monitoring, dimensional accuracy monitoring, deformation monitoring and the like)), and workshop environment monitoring (such as temperature, humidity, noise monitoring and the like), and is also an important technical support for manufacturing the internet of things.
The wireless sensing network of the intelligent workshop is a mesh network formed by a large number of distributed sensor nodes with real-time sensing and self-organizing capabilities, the power supply problem of the WSN is increasingly prominent along with the increase of the number of the sensor nodes and the more complicated setting environment of the sensor nodes, and how to supply power to the wireless sensing nodes becomes one of the key problems restricting the development of the WSN in the future. At present, there are two main ways of supplying power to the WSN, namely, a wired power supply way using commercial power and a battery power supply way. For the battery power supply, a dry battery or a rechargeable battery is generally used for supplying power, but the working life of the battery is short due to the limited stored energy of the battery, the battery needs to be replaced periodically or charged, the replacement cost is very high or even cannot be realized for a large number of sensing nodes arranged in an intelligent workshop, and the replaced battery can cause environmental pollution. For wired power supply of a mains supply, a cable needs to be configured for each sensing node and connected to a mains supply switch, and to realize the process, a large amount of manpower is needed to be spent on arranging the mains supply switch and the cable, an installer is required to configure the cable and the mains supply switch for each sensing node without errors, the arrangement of the cable and the power supply switch is required to be reasonable, and the arranged cable cannot be damaged in the monitoring process. The whole process is very tedious for the tester, can bring a lot of inconveniences, if the sensing node is too much, the cable and the switch of arranging can even cause the vision confusion. In addition, as the wireless sensing node develops towards the direction of intellectualization, multifunctionality (capable of simultaneously collecting and processing various physical information) and ultra-low power consumption, the requirement of the wireless sensing node on the power supply is more strict, for example, the power supply is required to be capable of simultaneously providing power supply voltages with different voltage levels so as to meet the power supply voltage requirements of different sensors or circuit modules.
In the intelligent workshop Internet of things manufacturing execution process, the cutting deformation of the structural part can generate energy, the part of cutting deformation energy can finally become the heat energy consumption on the surface of the structural part, and the risk of surface damage of the structural part is increased, so that the structural part deformation energy acquisition device can be used for converting the structural part deformation energy into electric energy, the surface damage of the structural part by the structural part deformation energy is relieved, meanwhile, the electric energy converted from the structural part deformation energy is collected and stored by using a micro power supply, and then the stable electric energy is supplied to microelectronic equipment such as sensor nodes.
In the execution process of the internet of things manufacturing in an intelligent workshop, cutting vibration generally exists, the surface quality of a structural member is seriously damaged, the service life of a machine tool and a cutter is prolonged, and the machining efficiency is improved.
Impact, extrusion and tearing that appear in the execution process are all can produce cutting noise in the thing antithetical couplet of intelligence workshop manufacturing to cutter and the structure piece of being processed are main cutting noise source, and cutting noise's existence can make staff's mood be irritated, irritability, and attention is not concentrated, reduces work efficiency, probably becomes accident's hidden danger even, all is very unfavorable to staff all sides. As a potential renewable energy source, the sound energy has wide development and utilization prospects. The acoustic energy acquisition device can be adopted to absorb cutting noise, reduce the harm of the cutting noise to workers and convert the energy of the cutting noise into electric energy, but the electric energy converted by the cutting noise cannot be directly applied to energy supply of the sensor nodes, a micro power supply is required to be used for collecting and storing the electric energy, and then the stable electric energy is supplied to microelectronic equipment such as the sensor nodes.
In the implementation process of the intelligent workshop Internet of things manufacturing, most of the work consumed by elastic and plastic deformation of a structural part under the action of a cutter, the work consumed by friction of chips and the front cutter surface of the cutter, and the work consumed by friction of the structural part and the rear cutter surface of the cutter are converted into cutting heat, the cutting heat is transmitted out by the chips, the cutter, a workpiece and surrounding media, wherein the heat transmitted into the chips and the surrounding media has no direct influence on processing, but the heat transmitted into the cutter raises the temperature of a cutting area, the temperature of the cutter is raised, the abrasion is intensified, and the service life of the cutter is influenced. The cutting heat is transferred into the structural member, the temperature of the structural member is increased, thermal deformation is generated, and the processing precision is influenced. Therefore, the heat energy collecting device can be used for converting harmful cutting heat energy into electric energy to be stored and utilized, further reducing the harm of cutting heat, meanwhile, the micro power supply can be used for efficiently collecting and storing the converted electric energy, and an ideal solution is provided for self-powering of microelectronic devices such as sensor nodes.
The method for converting mechanical energy into electric energy in the cutting vibration, cutting noise and structural member deformation energy acquisition device comprises electromagnetic conversion, electrostatic conversion and piezoelectric conversion. The electromagnetic energy acquisition device utilizes cutting vibration energy, cutting noise energy and structural member deformation energy to enable the coil and the magnetic field to move relatively, and the coil generates current under the action, so that the coil is large in size, high in energy consumption and poor in energy harvesting effect. The electrostatic energy collecting device utilizes cutting vibration energy, cutting noise energy and structural member deformation energy to change the relation between the pole plates, thereby changing the capacitance. If the electric quantity is constant, the voltage is increased when the capacitance is reduced; and when the voltage is constant, the electric quantity is increased when the capacitance is reduced. The micro-electromechanical system has the advantages that the micro-electromechanical system is easy to integrate with a circuit part and has small volume; however, because the air film between the polar plates has larger damping effect and the distance between the polar plates cannot be too small, the miniaturization is difficult, so the electrostatic energy acquisition device is not used frequently. The piezoelectric energy acquisition device utilizes cutting vibration, cutting noise and structural component deformation to cause piezoelectric material deformation, further causes separation of positive and negative charge centers in the piezoelectric energy acquisition device, generates polarization voltage, and the polarization voltage drives free charges on a polar plate to directionally flow to output electric energy.
The cutting heat energy collecting device comprises a thermoelectric generator and a film thermoelectric generator. The core component of the thermoelectric generator is a group of thermocouples which comprise an N-type semiconductor and a P-type semiconductor which are connected by a metal plate. The conductive connections at opposite ends of the P-type and N-type materials form a complete circuit. The thermoelectric generator (TEG) operates when there is a thermal gradient in the thermocouple (i.e., the top is hotter than the bottom). In this case, the device generates a voltage and forms a current, and the cutting heat energy is converted into electric energy according to the seebeck effect. The thermocouple groups are connected in series to form the thermoelectric module. If heat flows between the top and bottom of the module (creating a temperature gradient), a voltage can be generated and a current created. The thin film thermoelectric generator refers to a TEG manufactured by a thin film technology, the performance of energy conversion is improved to improve their ability as an energy source, and the thin film thermoelectric generator is smaller and thinner than the conventional TEG, and is expected to be directly integrated by an industry standard production method. Therefore, cutting heat in the intelligent workshop Internet of things manufacturing execution process is converted into electric energy by using the thin film thermoelectric generator, the cutting heat hazard is reduced, and meanwhile, the converted electric energy is efficiently collected, stored and supplied to microelectronic equipment such as sensor nodes by using the energy collecting device.
In summary, the conventional commercial power or battery power supply method cannot meet the special requirements of the WSN on the power supply. With the continuous expansion of the scale of the WSN, a self-powered, maintenance-free, low-cost, small, exquisite, portable, and easily-installed power supply technology is urgently needed, and a stable and long-term power supply can be provided for the WSN. An effective solving method is that an energy collecting device is used for collecting cutting vibration energy, cutting heat energy, cutting noise energy and structural part deformation energy existing in the intelligent workshop Internet of things manufacturing execution process, the cutting vibration energy, the cutting heat energy, the cutting noise energy and the structural part deformation energy are converted into electric energy and stored, stable and long-term energy is provided for wireless sensor nodes, and therefore the problems that no commercial power is supplied and batteries need to be replaced frequently are thoroughly solved.
The invention discloses a wireless sensor micro-power supply based on an MEMS vibration energy collector (CN106100447B), which converts vibration energy in the environment into electric energy through a piezoelectric vibration energy collector, and the electric energy is stored in an energy storage element after being acted by an energy management chip BQ 25504. However, the micro power source uses the rechargeable lithium battery as an energy storage element for energy storage, so that the volume of the micro power source is large, the high-specific-energy solid-state storage technology cannot be broken through, and the micro power source only collects and converts vibration energy in the environment, so that the utilization efficiency of the environmental energy is low.
Aiming at the problems, the invention aims to design a multi-source integrated micro power supply for an intelligent workshop Internet of things manufacturing execution process, wherein cutting vibration energy, cutting noise energy and structural member deformation energy in the manufacturing execution process are converted into electric energy by a piezoelectric energy acquisition device and are output to the micro power supply, a film type thermoelectric generator converts the cutting heat energy in the manufacturing execution process into electric energy and outputs the electric energy to the micro power supply, the micro power supply utilizes an LTC3588-1 chip and a peripheral circuit thereof, a BQ25504 chip and a peripheral circuit thereof to carry out coupling collection and conversion on the input electric energy and transmits the electric energy to an energy management module for storage and direct current-direct current conversion, an all-solid-state plane micro super capacitor is used as an energy storage element to store the direct current electric energy output by the energy collection module, and an ADP1612 chip, a peripheral circuit, a TPS 006651 chip and a peripheral circuit are utilized to realize output voltage adjustable design, various voltages such as 5V, 3.3V, 1.8V and 1.2V are output to meet different load requirements, the voltage stored in the energy storage unit and the output voltage of the energy management unit are monitored by using the micro-controller MSP430FR5867 and a peripheral circuit, and the coordination work and the safety protection among the units are realized.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention discloses a multi-source integrated micro power supply for an intelligent workshop Internet of things manufacturing execution process, wherein an energy collection module, an energy management module and an energy monitoring module are integrated into a micro power supply meeting the power supply requirements of microelectronic equipment such as a sensing node and the like, the electric energy converted from cutting vibration energy, the electric energy converted from cutting heat energy, the electric energy converted from cutting noise energy and the electric energy converted from structural member deformation energy in the intelligent workshop Internet of things manufacturing execution process are efficiently collected and stored, and continuous and stable direct current voltage is provided for the microelectronic equipment such as the sensing node and the like. The problem of wireless energy supply of microelectronic equipment such as perception node in the intelligence manufacturing shop is effectively solved.
The embodiment of the present disclosure provides a multi-source integrated micro power supply for an intelligent workshop internet of things manufacturing execution process, which may include: the energy collection module comprises an energy collection unit, the energy collection unit is used for efficiently collecting electric energy converted from cutting vibration energy, electric energy converted from cutting heat energy, electric energy converted from cutting noise energy and electric energy converted from structural member deformation energy in the implementation process of the Internet of things manufacturing of the intelligent workshop, and coupling the collected multi-source electric energy; the energy management module comprises an energy storage unit and an energy management unit, wherein the energy storage unit realizes the optimal configuration of energy storage capacity and energy storage time by using the circulation stability of the all-solid-state planar micro super capacitor with high specific energy; and the energy monitoring module comprises a monitoring unit, an alarming unit, a resetting unit and a setting unit, wherein the monitoring unit is used for monitoring the cutting vibration energy, the cutting heat energy, the cutting noise energy and the structural member deformation energy, storing the voltage in the energy storage unit after the action of the energy acquisition module and the output voltage of the voltage in the energy storage unit after the action of the energy management unit, and controlling the on-off of the energy management unit.
For example, the energy management unit is used for realizing that the output electric energy of the energy storage unit is subjected to DC-DC conversion, and 5V, 3.3V, 1.8V and 1.2V voltages are output, so that the energy supply requirements of different loads are met.
For example, the alarm unit is used for alarming the abnormal work of the energy storage unit and the energy management unit. The reset unit is used for resetting the energy monitoring module. The setting unit is used for providing clocks, voltages and driving programs needed by operation for the microcontroller and the peripheral circuit.
Further, the energy collection module utilizes an ultra-low power consumption chip LTC3588-1 and a peripheral circuit thereof to realize efficient collection of electric energy converted from cutting vibration energy, electric energy converted from cutting noise energy and electric energy converted from structural member deformation energy in an intelligent workshop Internet of things manufacturing execution process, and the peripheral circuit components comprise: one end of the fourth capacitor is connected with a third pin of the LTC3588-1, the other end of the fourth capacitor, one end of the sixth capacitor and a first pin of the LTC3588-1 are connected, the other end of the sixth capacitor is connected with the other end of the seventh capacitor, one end of the fifth capacitor, one end of the second inductor, a first diode anode and a sixth pin of the LTC3588-1 are connected, the other end of the fifth capacitor is grounded, the other end of the second inductor is connected with a second pin of the LTC3588-1, and one end of the seventh capacitor, a seventh pin of the LTC3588-1, an eighth pin of the LTC3588-1 and a ninth pin of the LTC3588-1 are connected.
Further, the energy collection module utilizes an ultra-low power consumption chip BQ25504 and a peripheral circuit thereof to realize the efficient collection of the electric energy converted from the cutting heat energy in the intelligent workshop Internet of things manufacturing execution process, and the peripheral circuit components comprise: a first capacitor, a second capacitor, a third capacitor, an eighth capacitor, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor and a second diode, wherein one end of the first capacitor, one end of the second capacitor and a fifteenth pin of the BQ25504 are connected, the other end of the first capacitor and the other end of the second capacitor are grounded, one end of the third capacitor, one end of the first inductor, one end of the second resistor and a pin 2 of the BQ25504 are connected, the other end of the third capacitor is grounded, the other end of the first inductor is connected with a sixteenth pin LBST of the BQ25504, the other end of the second resistor, one end of the fourth resistor and a third pin of the BQ25504 are connected, the other end of the fourth resistor is grounded, one end of the eighth capacitor is connected with a fourth pin of the BQ25504, and the other end of the eighth capacitor is grounded, one end of the sixth resistor, one end of the eighth resistor and a sixth pin of the BQ25504 are connected, the other end of the sixth resistor, the other end of the seventh resistor, the other end of the fifth resistor and a seventh pin of the BQ25504 are connected, the other end of the eighth resistor is grounded, one end of the ninth resistor, one end of the seventh resistor and an eighth pin of the BQ25504 are connected, one end of the first resistor is connected with an eleventh pin of the BQ25504 to be grounded, the other end of the first resistor, one end of the third resistor and a tenth pin of the BQ25504 are connected, and the other end of the third resistor, one end of the fifth resistor and a ninth pin of the BQ25504 are connected.
Further, in the energy collection module, a diode 1N5819 is arranged outside output pins of an LTC3588-1 chip and a BQ25504 chip to couple collected multi-source energy, the output pin of the LTC3588-1 is connected with the anode of a first diode, the output pin of the BQ25504 is connected with the anode of a second diode, and the cathode of the first diode is connected with the cathode of the second diode.
Further, the energy management unit of the energy management module comprises a TPS650061 chip and its peripheral circuit, an ADP1612 chip and its peripheral circuit. The TPS650061 peripheral circuit component comprises a ninth capacitor, a tenth capacitor, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor, a fourteenth capacitor, a fifteenth capacitor, a tenth resistor, an eleventh resistor, a twelfth resistor, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a sixteenth resistor and a fourth inductor, and can output various voltages of 5V, 3.3V, 1.8V, 1.2V and the like by configuring the resistance value of the resistor in the peripheral circuit to meet different load energy supply requirements, one end of the ninth capacitor, an eighth pin of the TPS650061 and a tenth pin of the TPS650061 are connected, the other end of the ninth capacitor is grounded, one end of the tenth capacitor, one end of the tenth resistor, one end of the eleventh resistor and a nineteenth pin of the 65TPS 0061 are connected, the other end of the tenth capacitor is grounded, the other end of the eleventh resistor is grounded, one end of the twelfth resistor, a voltage of the fifteenth capacitor, One end of the S1 is connected with a first pin of TPS650061, one end of the eleventh capacitor is connected with a second pin of TPS650061, the other end of the eleventh capacitor is grounded, one end of the fourth inductor, one end of the thirteenth resistor, one end of the thirteenth capacitor, one end of the twelfth capacitor and one end of the sixteenth resistor are connected, the other end of the thirteenth resistor, the other end of the thirteenth capacitor, one end of the fourteenth resistor and an eleventh pin of TPS650061 are connected, the other end of the fourteenth resistor is grounded, the other end of the twelfth capacitor is grounded, one end of the fifteenth resistor is connected with a fifth pin of TPS650061, one end of the fourteenth capacitor is connected with a thirteenth pin of TPS650061 and a fourteenth pin of TPS650061, the other end of the fourteenth capacitor is grounded, one end of the fifteenth capacitor is connected with a sixteenth pin of TPS650061 and a seventeenth pin of TPS650061, and the other end of the fifteenth capacitor is grounded. The ADP1612 peripheral circuit comprises an active switch tube, a thirty-fourth capacitor, a thirty-fifth capacitor, a fifth inductor, a voltage stabilizing diode, a thirty-sixth capacitor, a thirty-seventh capacitor, a twenty-first resistor, a twenty-second resistor and a twenty-thirteenth resistor, wherein the drain electrode of the active switch tube is connected with one end of the thirty-fourth capacitor, one end of the fifth inductor and a sixth pin of ADP1612, the other end of the thirty-fourth capacitor is connected with a seventh pin of ADP1612, the other end of the thirty-fifth capacitor, a fourth pin of ADP1612, the other end of a thirty-sixth capacitor, the other end of the twenty-third resistor and the other end of the thirty-seventh capacitor are grounded, one end of the thirty-fifth capacitor is connected with an eighth pin of ADP1612, one end of the thirty-sixth capacitor is connected with the other end of the twenty-first resistor, one end of the twenty-first resistor is connected with the first pin of ADP1612, one end of the twenty-third resistor is connected with the other end, one end of the twenty-second resistor is connected with one end of the thirty-seventh capacitor and the cathode of the voltage stabilizing diode, and the other end of the fifth inductor is connected with the anode of the voltage stabilizing diode and the fifth pin ADP 1612.
Furthermore, the energy storage unit of the energy management module adopts an all-solid-state planar micro super capacitor Cstr as an energy storage element, and the positive electrode of the storage capacitor Cstr is connected with the source electrode of the active switch of the energy management unit, the negative electrode of the first diode of the energy acquisition unit and the negative electrode of the second diode of the energy acquisition unit.
Furthermore, the monitoring unit of the energy monitoring module comprises an ADC module and an I/O module of the MSP430FR5867, a third pin, an eighteenth pin, a nineteenth pin, a thirtieth pin, a thirty-eighth pin and a twenty-ninth pin of the block MSP430FR5867, the third pin is connected with the positive electrode of the storage capacitor Cstr of the energy storage unit, the eighteenth pin is connected with the positive electrodes of the ADP1612 chip in the energy management unit and the thirty-seventh capacitor in the peripheral circuit, the eighteenth pin is connected with the positive electrodes of the TPS650061 chip in the energy management unit and the twenty-second capacitor in the peripheral circuit, the thirtieth pin is connected with the positive electrodes of the TPS650061 chip in the energy management unit and the twenty-third capacitor in the peripheral circuit, the thirty-eighth pin is connected with the positive electrode of the TPS 006651 chip in the energy management unit and the twenty-first capacitor in the peripheral circuit, and the twenty-ninth pin is connected with a grid electrode of an active switching tube in the energy management unit.
Furthermore, the alarm unit of the energy monitoring module comprises an I/O port of the MSP430FR5867 and a peripheral buzzer driving circuit, and comprises a first pin of the MSP430FR5867, a buzzer, a first triode and a nineteenth resistor, wherein the anode of the buzzer is connected with the emitter of the first triode, the cathode of the buzzer is grounded, the collector of the first triode is connected with the anode of a fifth capacitor in the energy collection module, the base of the first triode is connected with one end of the nineteenth resistor, and the first pin of the single chip microcomputer is connected with the other end of the nineteenth resistor.
Furthermore, the reset unit of the energy monitoring module comprises an I/O port of the MSP430FR5867 and a peripheral reset circuit, and comprises a twenty-third pin, a third diode, a seventeenth resistor, a key, a thirty-second capacitor and an eighteenth resistor of the MSP430FR5867, wherein the twenty-third pin is connected with one end of the eighteenth resistor, the other end of the eighteenth resistor is connected with one end of the seventeenth resistor, the anode of the third diode, one end of the thirty-second capacitor and one end of the key, the other end of the thirty-second capacitor is grounded, and the cathode of the third diode and the other end of the seventeenth resistor are connected with the anode of a fifth capacitor of the energy acquisition module.
Further, the setting unit of the energy monitoring module comprises an I/O port of the MSP430FR5867, a peripheral power supply circuit, a peripheral crystal oscillator circuit and a peripheral JTAG circuit, and comprises a thirty-sixth pin, a thirty-seventh pin, a forty-fifth pin, a forty-sixth pin, a crystal, a twenty-ninth capacitor, a twenty-eighth capacitor, a twenty-seventh capacitor and a twenty-sixth capacitor of the MSP430FR5867, the thirty-sixth pin is connected with one end of a twenty-sixth capacitor and the negative electrode of a twenty-seventh capacitor and grounded, the thirty-seventh pin is connected with the other end of the twenty-sixth capacitor, the anode of the twenty-seventh capacitor and the anode of the fifth capacitor in the energy acquisition module, the forty-fifth pin is connected with the anode of a twenty-ninth capacitor and one end of a crystal, the forty-sixth pin is connected with the anode of a twenty-eighth capacitor and the other end of the crystal, and the cathode of the twenty-ninth capacitor is connected with the cathode of the twenty-eighth capacitor.
Embodiments of the invention may have at least one of the following benefits:
(1) according to the multi-source integrated micro power supply, the LTC3588-1 chip, the BQ25504 chip and the surrounding elements are adopted to construct the energy collection module, so that the electric energy converted from cutting vibration energy, the electric energy converted from cutting heat energy, the electric energy converted from cutting noise energy and the electric energy converted from structural member deformation in the process of executing the manufacturing of the intelligent workshop Internet of things are efficiently collected, the energy collection range is further widened, and the environmental energy utilization rate is improved;
(2) according to the multi-source integrated micro power supply, the all-solid-state planar micro super capacitor is used as an energy storage element to store direct current electric energy output by the energy collection module, and the micro super capacitor has excellent flexibility and circulation stability, so that the optimal configuration of energy storage capacity and energy storage time is realized;
(3) the multi-source integrated micro power supply uses TPS650061 and surrounding components to construct an energy management unit, extracts electric energy stored by an energy storage unit and outputs continuous, stable and adjustable direct-current voltage suitable for the power supply requirements of microelectronic equipment such as a sensor and the like, thereby widening the application range of the micro power supply;
(4) the multi-source integrated micro power supply does not need to arrange cables for supplying power to the sensor nodes, is generally lower in installation cost compared with wired power supply, and can be deployed and finished in a shorter time;
(5) the multi-source integrated micro power supply can circularly collect the electric energy converted from cutting vibration energy, the electric energy converted from cutting heat energy, the electric energy converted from cutting noise energy and the electric energy converted from structural member deformation energy in the process of executing the Internet of things manufacturing of an intelligent workshop for unlimited times, supplies power to the sensor node, and can continuously provide energy for the sensor node without frequently replacing a battery compared with the battery for supplying power, thereby saving a large amount of time and cost;
(6) compared with wired power supply, the multi-source integrated micro-power supply is applied to the wireless sensor network, the establishment of the wireless sensor network is not limited by any condition, an establisher can quickly establish a wireless sensor network with complete functions anywhere and anytime, and maintenance and management work after successful establishment is also completely carried out in the network;
(7) the multi-source integrated micro-power supply uses the microcontroller and the peripheral circuit to construct the energy monitoring module, uses the A/D port of the microcontroller to directly measure the voltage stored by the energy storage unit and the voltage output by the energy management unit, does not need to additionally add a voltage stabilizing circuit, and has low cost and high detection accuracy;
(8) the multi-source integrated micro-power supply uses the microcontroller and the peripheral circuit to monitor the energy storage unit and the energy management unit, and realizes the coordination work and the safety protection among the units.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without limiting the invention to the right. In the drawings:
fig. 1 is a schematic diagram illustrating integration of a multi-source integrated micro power supply for an intelligent workshop internet of things manufacturing execution process according to an embodiment of the present invention.
Fig. 2(a) is a schematic diagram of a cutting heat energy collection circuit, i.e., a BQ25504 chip and a peripheral circuit according to an embodiment of the present invention.
Fig. 2(b) is a schematic diagram of a cutting vibration energy, a cutting noise energy, a structural member deformation energy collecting and converting circuit, i.e., an LTC3588-1 chip and a peripheral circuit according to an embodiment of the present invention.
Fig. 3(a) is a schematic diagram of an ADP1612 chip and peripheral circuits in an energy management module according to an embodiment of the invention.
FIG. 3(b) is a schematic diagram of the TPS650061 chip and peripheral circuits in the energy management module according to the embodiment of the invention.
Fig. 4(a) is a Buck circuit topology according to an embodiment of the invention.
FIGS. 4(b), (c), (d) are topology diagrams of Buck DCM equivalent circuits according to embodiments of the invention.
FIG. 4(e) is a Buck DCM current waveform according to an embodiment of the invention.
Fig. 5(a) is a Boost circuit topology according to an embodiment of the present invention.
Fig. 5(b), (c) are Boost CCM equivalent circuit topologies according to embodiments of the invention.
Fig. 5(d), (e) are voltage and current waveforms of the Boost CCM inductor according to an embodiment of the present invention.
FIG. 6 is a circuit schematic of an energy monitoring module according to an embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects of the present invention more clear and understandable, the present invention is described in detail below with reference to the accompanying drawings.
As shown in fig. 1, an embodiment of the present disclosure provides a multi-source integrated micro power supply for an intelligent workshop internet of things manufacturing execution process, which includes: the energy collection module comprises an energy collection unit, the energy collection unit is used for collecting electric energy converted from cutting vibration energy, electric energy converted from cutting heat, electric energy converted from cutting noise and electric energy converted from structural member deformation energy in the intelligent workshop Internet of things manufacturing execution process, and coupling the collected multi-source electric energy; the energy management module comprises an energy storage unit and an energy management unit, wherein the energy storage unit realizes the optimal configuration of energy storage capacity and energy storage time by using the circulation stability of the all-solid-state planar micro super capacitor with high specific energy; and the energy monitoring module comprises a monitoring unit, an alarming unit, a resetting unit and a setting unit, wherein the monitoring unit is used for monitoring the voltage stored in the energy storage unit after the cutting vibration energy, the cutting heat energy, the cutting noise energy and the structural member deformation energy are acted by the energy acquisition module and the output voltage of the voltage in the energy storage unit after the voltage in the energy storage unit is acted by the energy management unit, and controlling the on-off of the energy management unit.
For example, the energy harvesting unit includes an LTC3588-1 chip and peripheral circuitry, a BQ25504 chip and peripheral circuitry. The energy management module comprises an energy storage unit and an energy management unit, wherein the energy storage unit comprises an all-solid-state planar micro super capacitor, and the energy management unit comprises a TPS650061 chip and a peripheral circuit, an ADP1612 chip and a peripheral circuit. The energy monitoring module comprises a monitoring unit, an alarm unit, a reset unit and a setting unit, and a circuit schematic diagram of the energy monitoring module is shown in fig. 6. The monitoring unit comprises an ADC module and an I/O module of MSP430FR5867, the alarm unit comprises an I/O module of the MSP430FR5867 and a peripheral buzzer driving circuit, the reset unit comprises a reset pin of the MSP430FR5867 and a peripheral reset circuit, and the setting unit comprises an I/O module of the MSP430FR5867, a power supply circuit, a crystal oscillator circuit and a JTAG circuit.
According to the technical scheme, an LTC3588-1 chip and a peripheral circuit in an energy collection unit of an energy collection module collect Alternating Current (AC) output by a cutting vibration energy collection device, a cutting noise energy collection device and a structural member deformation energy collection device, the collected Alternating Current (AC) is converted into Direct Current (DC) by a bridge rectifier, the direct current electric energy output by a bridge rectifier circuit is converted into high-power electric energy by a Buck type DC-DC converter, and the specific conversion principle is as follows.
The topology of the Buck DC-DC converter is shown in fig. 4(a), the converter includes an inductor L, a capacitor C, an active switch Q and a diode D, and since the output power of the piezoelectric plate has the characteristics of high voltage and low current, the Buck DC-DC converter is set to operate in a current interruption mode, and D is set to operate in a current interruption mode1To represent the ratio of the on-time of Q to the signal period, D2To express the ratio of Q off time to signal period, the current waveform of the inductor is shown in fig. 4(e), and the operation states of the converter are shown in fig. 4(b), (c), and (d).
At time interval D1During the period T, Q is turned on, the diode D is turned off, and the Buck converter operates as shown in fig. 4(b), where the voltage across the inductor and the capacitance current are expressed as follows:
VL(t)=Vin-Vout(t) (1)
in the formula (1), VL(t) is the voltage across the inductor L, VinFor an input voltage, V, of a Buck-type DC-DC converteroutAnd (t) is the output voltage of the Buck type DC-DC converter.
Figure BDA0002886396660000131
In the formula (2), iC(t) is the current flowing through the capacitor C, iL(t) is the current flowing through the inductor, and R is the load resistance.
At D1T<t<(D1+D2) During the period T, Q is turned off, the diode D is turned on, and the Buck converter operates as shown in fig. 4(c), where the expressions of the voltage across the inductor and the capacitance current are as follows:
VL(t)=-Vout(t) (3)
in the formula (3), VL(t) is the voltage across the inductor L, VoutAnd (t) is the output voltage of the Buck type DC-DC converter.
Figure BDA0002886396660000141
In the formula (4), iC(t) is the current flowing through the capacitor C, iL(t) is the current flowing through the inductor, and R is the load resistance.
In (D)1+D2) During the period T < T < T, Q and the diode D are both turned off, the working state of the Buck converter is shown as the working state in FIG. 4(D), and the voltage at two ends of the inductor and the capacitance current are expressed as follows:
VL(t)=0 (5)
Figure BDA0002886396660000142
the relationship between the voltage at two ends of the inductor and the input voltage is obtained according to the formula (1), the formula (3), the formula (5) and the volt-second law of the inductor as follows:
Figure BDA0002886396660000143
formula (7)) In, VL(t) is the voltage across the inductor L, VinFor a Buck type DC-DC converter input voltage, D1Is the ratio of the on-time of Q to the signal period, D2To represent the ratio of Q off time to the signal period.
At time interval D1During T, the inductor current is expressed as follows:
Figure BDA0002886396660000144
in the formula (8), iL(t) is the current through the inductor, VinFor an input voltage, V, of a Buck-type DC-DC converteroutAnd (t) is the output voltage of the Buck type DC-DC converter, and L is an inductance value. The average inductor current over the period T is expressed as follows:
Figure BDA0002886396660000151
in the formula (9), iL(t) is the current through the inductor, VinFor an input voltage, V, of a Buck-type DC-DC converterout(t) is the output voltage of Buck type DC-DC converter, L is the inductance value, D1Is the ratio of the on-time of Q to the signal period, D2To represent the ratio of Q off time to the signal period.
The output voltage relational expression obtained according to the expressions (1), (8) and (9) is as follows:
Figure BDA0002886396660000152
in the formula (10), VoutAnd (t) is the output voltage of the Buck type DC-DC converter.
The relation between the input voltage and the output voltage obtained by combining the equations (7) and (10) is:
Figure BDA0002886396660000153
in the formula (11), VinFor a Buck type DC-DC converter input voltage, VoutAnd (t) is the output voltage of the Buck type DC-DC converter, and K is 2L/RT.
The Buck type DC-DC converter is integrated in an LTC3588-1 chip, a cutting vibration energy, cutting noise energy and junction deformation energy collecting circuit shown in a figure 2(b) is designed by referring to an LTC3588-1 design manual and combining a conversion principle of the Buck type DC-DC converter according to an output voltage requirement, a higher current pulse is provided by setting the capacitance value of a fifth capacitor C5, and a 3.6V voltage is selected to be output by setting the levels of an eighth pin D0 of the LTC3588-1 and a ninth pin D1 of the LTC3588-1 and is transmitted to an energy storage unit for accumulation.
The circuit composed of the BQ25504 chip and surrounding components in the energy collection unit collects millivolt-level direct current electric energy output by the cutting heat energy collection device, and because the millivolt-level direct current electric energy is not enough to support the requirement of a sensing node, a Boost type DC-DC converter integrated in the BQ25504 chip is required to be utilized to Boost the collected weak electric energy to 5V voltage and transmit the voltage to the energy storage unit for accumulation, and larger power support is provided when the sensing node is required, wherein the conversion principle of the Boost type DC-DC converter is as follows.
The topology diagram of the Boost type DC-DC converter is shown in fig. 5(a), and the converter includes an inductor L, an active switch Q, a diode D, and a capacitor C, and the on-time of the active switch Q is designed to be D3The turn-off time of the active switch is D4With a period of TsThe voltage waveform of the inductor L is shown in fig. 5(d), the current waveform is shown in fig. 5(e), and the operating states of the Boost type DC-DC converter are shown in fig. 5(b) and (c).
At time interval D3TsDuring this time, the diode D is reverse biased, VinCharging inductor L, iLThe linear rise, the inductor current increment is:
Figure BDA0002886396660000161
Δ i in formula (12)L1Is an inductive powerLinear increment of flow, VinIs the input voltage of the Boost converter, D3For the conduction time, T, of the active switch QsIs the signal period.
At time interval D4TsIn the period, the current of the inductor L cannot change suddenly, the voltage polarity of the inductor L is reversed, the inductor L transmits the stored energy to the load, iLLinear decrease, in increments of:
Figure BDA0002886396660000162
Δ i in formula (13)L2Is a linear increment of the inductor current, VinIs the input voltage of the Boost converter, D4For the conduction time, T, of the active switch QsIs the signal period.
Since the absolute values of these two current changes are equal in the steady state, therefore:
Figure BDA0002886396660000163
in the formula (14), the compound represented by the formula (I),
the simplified voltage gain is:
Figure BDA0002886396660000164
in equation (15), M is the ratio of the output voltage to the input voltage and the voltage gain.
The output voltage of the Boost type DC-DC converter obtained by equation (15) is:
Figure BDA0002886396660000171
v in formula (16)inIs the input voltage of the Boost converter, D3The active switch Q on time.
The Boost type DC-DC converter is integrated in a BQ25504 chip, a cutting heat energy collecting circuit shown in a figure 2(a) is designed by referring to a BQ25504 design manual and combining a conversion principle of the Boost type DC-DC converter according to the requirement of output voltage, the tracking of the internal maximum power of the BQ25504 is realized by setting the resistance values of a second resistor R2 and a fourth resistor R4, the BQ25504 overvoltage protection is realized by setting the resistance values of a sixth resistor R6 and an eighth resistor R8, the BQ25504 undervoltage protection is realized by setting the resistance values of a seventh resistor R7 and a ninth resistor R9, and therefore weak electric energy output by the cutting heat energy collecting device is boosted to 3.6V and transmitted to an energy storage unit for accumulation.
The energy storage unit in the energy management module selects the high-specific-energy all-solid-state planar micro super capacitor with excellent flexibility and circulation stability as an energy storage element to store the electric energy output by the energy collection unit, and the micro super capacitor realizes the optimal configuration of energy storage capacity and energy storage time by utilizing the circulation stability of the micro super capacitor.
The energy management unit in the energy management module comprises TPS650061 and peripheral components, ADP1612 and peripheral components. The ADP1612 is internally integrated with a Boost type DC-DC converter, the Boost type converter is used for converting electric energy output by the energy storage unit, an energy management schematic diagram shown in fig. 3(a) is designed by referring to an ADP1612 design manual and combining the conversion principle of the Boost type DC-DC converter, and the output of 5V direct-current voltage is realized by setting the resistance values of the twenty-second resistor and the twenty-third resistor. The TPS650061 is internally integrated with a 2.5MHz Buck-type DC-DC converter, the electric energy output by ADP1612 is converted by using the Buck-type DC-DC converter, an energy management circuit shown in fig. 3(b) is designed by referring to a TPS650061 design manual and combining the conversion principle of the Buck-type DC-DC converter, a 3.3V direct-current voltage is output by setting the capacitance value of a fourteenth capacitor C14, the level of a thirteenth pin FB _ LDO1 of the TPS650061 and the level of a fourteenth pin VLDO1 of the TPS650061, a 1.8V direct-current voltage is output by setting the capacitance value of a fifteenth capacitor C15 and the level of a sixteenth pin FB _ LD02 of the TPS650061, and a 1.2V direct-current voltage is output by setting the resistance value of a sixteenth resistor R16, the resistance value of a fourteenth resistor R14, the resistance R13, the capacitance value of a thirteenth capacitor C20 and the capacitance value of a twelfth capacitor C12, so that energy supply for loads with different requirements is.
The monitoring unit in the energy monitoring module consists of an ADC module and an I/O module of the MPS430FR5867, wherein the ADC module is used for monitoring cutting vibration energy, cutting heat energy, cutting noise energy, energy stored in the energy storage unit after the structural member deformation energy is acted by the energy acquisition module, and the output energy of the energy management unit, and the monitoring process is as follows:
after the MSP430FR5867 is electrified, an ACTL register is programmed, the detection mode and the detection range of the voltage stored in the energy storage unit after the cutting vibration energy, the cutting heat energy, the cutting noise energy and the structural member deformation energy are acted by the energy acquisition module and the voltage output by the storage unit after the energy management unit is acted are determined, the SOC is set, and the A/D clock is activated to start analog-to-digital conversion. In the conversion process, a successive approximation search is completed on the resistor array by utilizing a successive approximation technology to find the voltage range of the voltage stored in the energy storage unit or the voltage output by the energy management unit, and the voltage V is obtained from one resistorHAnd VLThe capacitor array is based on the voltage difference (V)H-VL) The lower bits are searched using a similar bit-by-bit approximation starting with the highest bit capacitance. The voltage of the upper electrode is changed by utilizing the switch connection of the resistor array and the switch connection of the lower electrode of the capacitor array, so that the voltage of the upper electrode is as close as possible to the voltage stored in the energy storage unit of the input ADC module or the output voltage of the energy management unit. And monitoring the voltage of the upper electrode by utilizing a comparator with an offset elimination circuit to determine whether the voltage stored by the energy storage unit or the output voltage of the energy management unit is higher or lower than the voltage of the upper electrode, generating a digital control signal for determining bit-by-bit approaching to the search direction, after the conversion process is finished, indicating that the voltage stored by the energy storage unit or the digital quantity converted from the output voltage of the energy management unit is read in a DATA register and further processing the voltage, and outputting a control signal for controlling the working state of the energy management module through an I/O port after the processing is finished.
The alarm unit in the energy monitoring module comprises an I/O port of MSP430FR5867 and a peripheral buzzer driving circuit, and the driving process is as follows:
under the condition that the monitoring unit detects that the cutting vibration energy, the cutting heat energy, the cutting noise energy and the structural member deformation energy are acted by the energy acquisition module and then the voltage stored in the energy storage unit and the output voltage of the energy management unit are abnormal, the driving program controls the first IO port of the MSP430FR5867 to output high level and drives the buzzer to sound and alarm.
The reset unit in the energy monitoring module comprises an I/O port of MSP430FR5867 and a peripheral reset circuit, and the reset process is as follows:
the seventeenth resistor and the thirty-second capacitor are used for forming a power-on reset circuit, wherein the value of the seventeenth resistor and the thirty-second capacitor controls the reset time of the reset circuit, the seventeenth resistor controls the charging current of the thirty-second capacitor, so that the voltage rising rate of the thirty-second capacitor is controlled, the reset is finished after the voltage of the thirty-second capacitor rises to a certain value, the length of the reset time is controlled, the third diode is used for releasing the electric energy of the thirty-seventh capacitor after the power failure of the chip, the power-on can be continuously and reliably reset next time, the key S1 forms a manual reset circuit, the key S1 is pressed down, the reset pin of the MSP430FR5867 is directly grounded, and the energy monitoring module is reset.
The setting unit of the energy monitoring module comprises a crystal oscillator circuit, a power supply circuit and a JTAG circuit.
The crystal oscillator circuit adopts an external crystal mode, the crystal size is 24.5MHZ, in order to reduce the influence of PCB layout on the crystal oscillator circuit, the crystal is close to MSP430FR5867 as much as possible, after the external crystal oscillator is enabled, the oscillator amplitude circuit needs one end to be stable for reaching the correct position, at least 1ms of waiting is needed, external clock frequency is provided for the MSP430FR5867, and power is provided for the monitoring unit to detect cutting vibration energy, cutting heat energy, cutting noise energy and structural member deformation energy, the voltage stored in the energy storage unit after the energy collection module acts on the structural member deformation energy and the output voltage of the storage unit after the energy management unit acts on the structural member deformation energy.
The power circuit consists of a polar capacitor and a non-polar capacitor, and peaks generated at the beginning and the end of 3.6V voltage output after cutting vibration energy, cutting heat energy, cutting noise energy and structural member deformation energy are filtered by the polar capacitor under the action of the energy acquisition module, so that stable direct-current voltage required by the operation of the MSP430FR5867 and peripheral circuits is provided. The filtering function of the polar capacitor is enhanced by the non-polar capacitor.
When a test access port accesses the integrated circuit, the hybrid IC executes the function of boundary scanning, serial data leaves a chip from a test data output line, boundary scanning logic is timed by signals on the TCK, and the TMS signals drive the state of a TAP controller, so that a driving program of a monitoring unit is downloaded to an MSP430FR5867, and a software program for detecting cutting vibration energy, cutting heat energy, cutting noise energy and structural component deformation energy stored in an energy storage unit after the action of an energy acquisition module and detecting the output voltage of an energy management unit is provided for the monitoring unit.
According to the design, the LTC3588-1, the peripheral circuit, the BQ25504, the peripheral circuit, the TPS650061, the peripheral circuit, the ADP1612, the peripheral circuit, the MSP430FR5867 and the peripheral circuit are integrated to form a stable output adjustable micro power supply, 5V, 3.3V, 1.8V and 1.2V direct-current voltages are output, and wireless power supply of a sensing node is achieved. Wherein, the LTC3588-1 and the peripheral circuit are utilized to efficiently collect the electric energy converted from cutting vibration energy, cutting noise energy and structural member deformation energy in the intelligent workshop physical link manufacturing execution process, the ultra-low power consumption chip BQ25504 and the peripheral circuit are utilized to efficiently collect the electric energy converted from cutting heat energy in the intelligent workshop physical link manufacturing execution process, the collected multi-source electric energy is coupled by configuring a 1N5819 type diode on the output pins of the LTC3588-1 and the BQ25504, the coupled electric energy is stored by utilizing a high-specific-energy all-solid-state planar micro super capacitor, the electric energy output by the energy storage unit is converted to the power supply voltage required by microelectronic equipment such as a sensor and the like by utilizing an energy management unit consisting of the TPS650061, the peripheral circuit, the ADP1612 and the peripheral circuit, the voltage of the energy storage unit and the output voltage of the energy management unit are monitored by utilizing the FR 430 5867 and the peripheral circuit, and the coordination work and the safety protection among the units are realized.
While the foregoing specification illustrates and describes the practice of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the invention as described herein, either as indicated by the above teachings or as indicated by the prior art, or as otherwise known in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be protected by the following claims.

Claims (10)

1. The utility model provides a little power of multisource integration that is used for intelligent workshop thing to ally oneself with manufacturing executive process which characterized in that includes:
the energy collection module comprises an energy collection unit, the energy collection unit is used for collecting electric energy converted from cutting vibration energy, electric energy converted from cutting heat, electric energy converted from cutting noise and electric energy converted from structural member deformation energy in the intelligent workshop Internet of things manufacturing execution process, and coupling the collected multi-source electric energy;
the energy management module comprises an energy storage unit and an energy management unit, wherein the energy storage unit realizes the optimal configuration of energy storage capacity and energy storage time by using the circulation stability of the all-solid-state planar micro super capacitor with high specific energy; and
the energy monitoring module comprises a monitoring unit, an alarming unit, a resetting unit and a setting unit, wherein the monitoring unit is used for monitoring cutting vibration energy, cutting heat energy, cutting noise energy and structural member deformation energy, storing the voltage in the energy storage unit after the action of the energy acquisition module and the output voltage of the voltage in the energy storage unit after the action of the energy management unit, and controlling the on-off of the energy management unit.
2. The multi-source integrated micro power supply for the intelligent workshop internet of things manufacturing execution process according to claim 1, wherein the energy collection module comprises a first ultra-low power chip and peripheral circuits thereof, and the peripheral circuits comprise: a first capacitor (C1), a second capacitor (C2), a third capacitor (C3), an eighth capacitor (C8), a first resistor (R1), a second resistor (R2), a third resistor (R3), a fourth resistor (R4), a fifth resistor (R5), a sixth resistor (R6), a seventh resistor (R7), an eighth resistor (R8), a ninth resistor (R9) and a second diode (D2), wherein one end of the first capacitor (C1), one end of the second capacitor (C2) and a fifteenth pin (VSTOR) of the first ultra-low power consumption chip are connected, the other end of the first capacitor (C1) and the other end of the second capacitor (C2) are grounded, one end of the third capacitor (C3), one end of the first inductor (L1), one end of the second resistor (R2) and one end of the second pin (R2) of the first ultra-low power consumption chip (LBS) are connected to the ground, the other end of the first capacitor (C639) is connected to the sixteenth pin (VIN) of the first ultra-low power consumption chip (C639) and the second ultra-low power consumption chip (LBS) is connected to the first ultra-low power consumption chip (, the other end of the second resistor (R2), one end of a fourth resistor (R4) and the third pin (VOC _ SAMP) of the first ultra low power chip are connected, the other end of the fourth resistor (R4) is grounded, one end of an eighth capacitor (C8) is connected to the fourth pin (VREF _ SAMP) of the first ultra low power chip, the other end of the eighth capacitor (C8) is grounded, one end of a sixth resistor (R6), one end of an eighth resistor (R8) and the sixth pin (VBAT _ OV) of the first ultra low power chip are connected, the other end of the sixth resistor (R6), the other end of a seventh resistor (R7), the other end of a fifth resistor (R5) and the seventh pin (VRDIV) of the first ultra low power chip are connected, the other end of the eighth resistor (R8) is grounded, one end of a ninth resistor (R9), the seventh terminal (R7) and the first ultra low power chip pin (VOC _ SAMP) of the first ultra low power chip are connected, one end of the first resistor (R1) is connected with the eleventh pin (VBAT _ OK) of the first ultra-low power chip and is grounded, the other end of the first resistor (R1), one end of the third resistor (R3) and the tenth pin (OK _ PROG) of the first ultra-low power chip are connected, and the other end of the third resistor (R3), one end of the fifth resistor (R5) and the ninth pin (OK _ HYST) of the first ultra-low power chip are connected.
3. The multi-source integrated micro power supply for the intelligent workshop internet of things manufacturing execution process according to claim 1, wherein the energy collection module comprises a second ultra-low power chip and peripheral circuits thereof, and the peripheral circuits comprise: a fourth capacitor (C4), a fifth capacitor (C5), a sixth capacitor (C6), a seventh capacitor (C7) and a second inductor (L2), wherein one end of the fourth capacitor (C4) is connected with a third pin (CAP) of the second ultra-low power chip, the other end of the fourth capacitor (C4), one end of the sixth capacitor (C6) and a first pin (VIN) of the second ultra-low power chip are connected, the other end of the sixth capacitor (C6) is connected with the other end of the seventh capacitor (C7), one end of the fifth capacitor (C5), one end of the second inductor (L2), the positive electrode of the first diode (D1) and the sixth pin (VOUT) of the second ultra-low power chip are connected, the other end of the fifth capacitor (C5) is grounded, the other end of the second inductor (L2) is connected with a second pin (SW) of the second ultra-low power chip, and one end of the seventh capacitor (C7) is connected with a second pin (SW) of the second ultra-low power chip, And the seventh pin (VIN2) of the second ultra-low power chip, the eighth pin (D1) of the second ultra-low power chip and the ninth pin (D0) of the second ultra-low power chip are connected.
4. The multi-source integrated micro power supply for the intelligent workshop Internet of things manufacturing execution process according to claim 1, wherein the energy management unit comprises a first chip and peripheral circuits thereof, a second chip and peripheral circuits thereof;
wherein the peripheral circuit of the first chip comprises a ninth capacitor (C9), a tenth capacitor (C10), an eleventh capacitor (C11), a twelfth capacitor (C12), a thirteenth capacitor (C13), a fourteenth capacitor (C14), a fifteenth capacitor (C15), a tenth resistor (R10), an eleventh resistor (R11), a twelfth resistor (R12), a thirteenth resistor (R13), a fourteenth resistor (R14), a fifteenth resistor (R15), a sixteenth resistor (R16), a fourth inductor (L4), one end of the ninth capacitor (C9), an eighth pin (VINDCCDC) of the first chip and a tenth pin (EN _ DCDC) of the first chip are connected, the other end of the ninth capacitor (C9) is grounded, one end of the tenth capacitor (C10), one end of the tenth resistor (R10), one end of the eleventh resistor (R11) and a nineteenth pin (RSNS) of the first chip are connected, the other end of the tenth capacitor (C10) is grounded, the other end of the eleventh resistor (R11) is grounded, one end of the twelfth resistor (R12), one end of the S1 and the first pin (MR) of the first chip are connected, one end of the eleventh capacitor (C11) is connected with the second pin (TRST) of the first chip, the other end of the eleventh capacitor (R11) is grounded, one end of the fourth inductor (L4), one end of the thirteenth resistor (R13), one end of the thirteenth capacitor (C13), one end of the twelfth capacitor (C12) and one end of the sixteenth resistor (R16) are connected, the other end of the thirteenth resistor (R13), the other end of the thirteenth capacitor (C13), one end of the fourteenth resistor (R14) and the eleventh pin (FB _ DCDC) of the first chip are connected, the other end of the fourteenth resistor (R14) is grounded, and the other end of the twelfth capacitor (C12) is grounded, one end of the fifteenth resistor (R15) is connected to the fifth Pin (PG) of the first chip, one end of the fourteenth capacitor (C14), the thirteenth pin (FB _ LD01) of the first chip and the fourteenth pin (VLD01) of the first chip are connected, the other end of the fourteenth capacitor (C14) is grounded, one end of the fifteenth capacitor (C15), the sixteenth pin (FB _ LD02) of the first chip and the seventeenth pin (VLD02) of the first chip are connected, and the other end of the fifteenth capacitor (C15) is grounded.
5. The multi-source integrated micro power supply for the intelligent workshop Internet of things manufacturing execution process according to claim 2 or 3, wherein in the energy collection module, diodes are arranged outside output pins of the first ultra-low power consumption or the second ultra-low power consumption to couple collected multi-source energy.
6. The multi-source integrated micro power supply for the intelligent workshop internet of things manufacturing execution process according to claim 1, wherein the energy storage unit adopts an all-solid-state planar micro super capacitor (Cstr) as an energy storage element, and the positive electrode of the super capacitor (Cstr) is connected with the source electrode of the active switch (Q2) of the energy management unit, the negative electrode of the first diode (D1) of the energy collection unit and the negative electrode of the second diode (D2) of the energy collection unit.
7. The multi-source integrated micro power supply for the intelligent workshop Internet of things manufacturing execution process as claimed in claim 1, wherein the monitoring unit of the energy monitoring module comprises an ADC module and an I/O module.
8. The multi-source integrated micro power supply for the intelligent workshop Internet of things manufacturing execution process according to claim 1, wherein the alarm unit of the energy monitoring module comprises a buzzer (SW), an I/O port and a peripheral buzzer driving circuit, the positive electrode of the buzzer (SW) is connected with the emitting electrode of a triode (Q1), the negative electrode of the buzzer (SW) is grounded, and the collector electrode of the triode (Q1) is connected with the positive electrode of a fifth capacitor (C5) in the energy collection module.
9. The multi-source integrated micro power supply for the intelligent workshop Internet of things manufacturing execution process according to claim 1, wherein the reset unit of the energy monitoring module comprises an I/O port and a peripheral reset circuit.
10. The multi-source integrated micro power supply for the intelligent workshop Internet of things manufacturing execution process according to claim 1, wherein the setting unit of the energy monitoring module comprises an I/O port, a power supply circuit, a crystal oscillator circuit and a JTAG circuit.
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