CN113016079A - 半导体芯片封装结构、封装方法及电子设备 - Google Patents
半导体芯片封装结构、封装方法及电子设备 Download PDFInfo
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- CN113016079A CN113016079A CN201980034236.8A CN201980034236A CN113016079A CN 113016079 A CN113016079 A CN 113016079A CN 201980034236 A CN201980034236 A CN 201980034236A CN 113016079 A CN113016079 A CN 113016079A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 314
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 64
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 278
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- 229910020658 PbSn Inorganic materials 0.000 claims description 8
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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Abstract
一种半导体芯片封装结构、封装方法及电子设备。该封装结构，包括：设置在基板(300)上的发光单元(30)和反射镜(400)；发光单元(30)包括：第一载片台(301)，设置于基板(300)上；第一焊料层(302)，设置于第一载片台(301)的第一承载面上；半导体发光芯片(303)，具有一出光端面(3031)以及与出光端面(3031)相对的第二端面(3032)；当半导体发光芯片(303)通过第一焊料层(302)固定于第一承载面时，第一承载面具有超出出光端面(3031)的第一边沿(3011)以及超出第二端面(3032)的第二边沿(3012)，出光端面(3031)与第一边沿(3011)形成的第一间隔小于第二端面(3032)与第二边沿(3012)形成的第二间隔；反射镜(400)，具有至少一反射面，反射面靠近出光端面(3031)。该结构能够引导并容纳溢出的多余焊料，避免焊料溢出载片台。
Description
PCT国内申请，说明书已公开。
Claims (34)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/111874 WO2021072731A1 (zh) | 2019-10-18 | 2019-10-18 | 半导体芯片封装结构、封装方法及电子设备 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113016079A true CN113016079A (zh) | 2021-06-22 |
| CN113016079B CN113016079B (zh) | 2022-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980034236.8A Active CN113016079B (zh) | 2019-10-18 | 2019-10-18 | 半导体芯片封装结构、封装方法及电子设备 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113016079B (zh) |
| WO (1) | WO2021072731A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115090491B (zh) * | 2022-07-13 | 2024-04-26 | 北京无线电测量研究所 | 一种微小型高密度载片贴片工装和贴片方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008198841A (ja) * | 2007-02-14 | 2008-08-28 | Elpida Memory Inc | 半導体装置 |
| CN101728762A (zh) * | 2008-10-14 | 2010-06-09 | 夏普株式会社 | 半导体激光装置及其制造方法 |
| CN103165806A (zh) * | 2011-12-14 | 2013-06-19 | 旭明光电股份有限公司 | 垂直式发光二极管晶粒及其制作方法 |
| DE102013101262A1 (de) * | 2013-02-08 | 2014-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer |
| CN203910779U (zh) * | 2014-06-26 | 2014-10-29 | 三垦电气株式会社 | 半导体装置 |
| WO2017220026A1 (zh) * | 2016-06-23 | 2017-12-28 | 亿光电子工业股份有限公司 | 发光二极管及其制作方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006109407A1 (ja) * | 2005-04-06 | 2006-10-19 | Matsushita Electric Industrial Co., Ltd. | フリップチップ実装方法及びバンプ形成方法 |
| US9418919B2 (en) * | 2010-07-29 | 2016-08-16 | Nxp B.V. | Leadless chip carrier having improved mountability |
| CN104201120B (zh) * | 2014-08-28 | 2017-05-24 | 通富微电子股份有限公司 | 半导体倒装封装方法 |
| CN204732400U (zh) * | 2015-06-11 | 2015-10-28 | 亚昕科技股份有限公司 | 引线框架结构 |
| CN106856218B (zh) * | 2016-12-20 | 2019-06-11 | 创维液晶器件(深圳)有限公司 | 一种免封装led结构及其制作方法 |
-
2019
- 2019-10-18 CN CN201980034236.8A patent/CN113016079B/zh active Active
- 2019-10-18 WO PCT/CN2019/111874 patent/WO2021072731A1/zh active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008198841A (ja) * | 2007-02-14 | 2008-08-28 | Elpida Memory Inc | 半導体装置 |
| CN101728762A (zh) * | 2008-10-14 | 2010-06-09 | 夏普株式会社 | 半导体激光装置及其制造方法 |
| CN103165806A (zh) * | 2011-12-14 | 2013-06-19 | 旭明光电股份有限公司 | 垂直式发光二极管晶粒及其制作方法 |
| DE102013101262A1 (de) * | 2013-02-08 | 2014-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer |
| CN203910779U (zh) * | 2014-06-26 | 2014-10-29 | 三垦电气株式会社 | 半导体装置 |
| WO2017220026A1 (zh) * | 2016-06-23 | 2017-12-28 | 亿光电子工业股份有限公司 | 发光二极管及其制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021072731A1 (zh) | 2021-04-22 |
| CN113016079B (zh) | 2022-06-24 |
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