CN113013724A - Laser packaging structure - Google Patents
Laser packaging structure Download PDFInfo
- Publication number
- CN113013724A CN113013724A CN202110389055.6A CN202110389055A CN113013724A CN 113013724 A CN113013724 A CN 113013724A CN 202110389055 A CN202110389055 A CN 202110389055A CN 113013724 A CN113013724 A CN 113013724A
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- China
- Prior art keywords
- heat
- heat dissipation
- grooves
- laser diode
- package structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention provides a laser packaging structure which comprises a tube tongue, a binding layer arranged on the tube tongue, a laser diode arranged on the binding layer and a heat dissipation assembly arranged on the tube tongue, wherein the binding layer is positioned between the tube tongue and the laser diode, the binding layer is provided with a plurality of protruding parts arranged at intervals, the laser diode is provided with a plurality of first grooves arranged at intervals, and the protruding parts are matched with the first grooves; the pipe tongue is provided with a heat dissipation cavity, the heat dissipation assembly comprises a fitting piece and a magnetic piece, the fitting piece is installed in the heat dissipation cavity, a moving channel is formed between the fitting piece and the side wall of the heat dissipation cavity, and the magnetic piece is located in the moving channel; the heat dissipation effect of the laser diode is improved by improving the contact area between the laser diode and the adhesive layer, and the laser diode can work under the condition of high power.
Description
Technical Field
The invention relates to the technical field of laser packaging, in particular to a laser packaging structure.
Background
The semiconductor laser has small volume, light weight, long service life, high efficiency and other advantages, and may be used widely in optical communication, optical pumping, optical storage, laser display and other fields.
At present, the output power of a semiconductor laser is small, which limits the application of the semiconductor laser, and therefore, the industry is continuously working on improving the output power of the semiconductor laser. The main problem faced by the present high-power semiconductor laser is that the temperature of the laser is too high under the injection of large current, which causes serious degradation of the semiconductor laser and seriously affects the stability and the service life of the semiconductor laser, and the phenomenon is originated from that the traditional TO tube seat comprises a tube shell, a tube tongue and a tube pin, the tube tongue is arranged on the tube shell, a laser diode is pasted on the tube tongue, and a sealing cap is packaged on the tube tongue. This package can only direct heat from the laser chip TO the TO stem through the TO stem tab. The mounting method between the laser diode and the tube tongue is planar mounting, the mounting positions are all planar, the thermal resistance is large, and the overall heat dissipation effect is influenced.
Disclosure of Invention
In order to solve the above problems, the present invention provides a laser packaging technology, which enables a laser diode to transfer more heat to a pipe tongue through an adhesive layer by increasing a contact area between the laser diode and the adhesive layer, and finally, the pipe tongue is matched with a heat dissipation assembly to dissipate heat, so that a heat dissipation effect of the laser diode is improved, and the laser diode can work under a high power condition.
In order to achieve the above object, the technical scheme adopted by the present invention is to provide a laser package structure, which includes a tube tongue, an adhesive layer mounted on the tube tongue, a laser diode mounted on the adhesive layer, and a heat dissipation assembly mounted on the tube tongue, wherein the adhesive layer is located between the tube tongue and the laser diode, the adhesive layer has a plurality of protrusions arranged at intervals, the laser diode has a plurality of first grooves arranged at intervals, and the protrusions are arranged in a manner of matching with the first grooves; the pipe tongue is provided with a heat dissipation cavity, the heat dissipation assembly comprises a fitting piece and a magnetic piece, the fitting piece is installed in the heat dissipation cavity, a moving channel is formed between the fitting piece and the side wall of the heat dissipation cavity, and the magnetic piece is located in the moving channel.
Preferably, the protrusion is one of an elongated shape, a square shape, a circular shape, or a triangular shape.
As a preferred scheme, the lamination layer has a plurality of through grooves arranged at intervals, and the through grooves are arranged corresponding to the first grooves.
As a preferable scheme, the heat sink is filled in the through groove, and one end of the heat sink is located in the first groove.
As a preferable scheme, the pipe tongue is provided with a plurality of second grooves arranged at intervals, the second grooves are arranged corresponding to the through grooves, and the other end of the heat sink is installed in the second grooves.
As a preferable scheme, the heat sink is made of a high thermal conductivity material, and the material of the heat sink is graphene.
As a preferable scheme, the heat sink further comprises a heat conduction layer, and the heat conduction layer is plated or coated on the surfaces of the heat sink and the laminating layer; the heat conduction layer is made of high-heat-conduction materials through processing, and the heat conduction layer is made of a diamond film.
Preferably, the heat-conducting plate is mounted on the pipe tongue, and one end of the heat-conducting plate is located in the moving channel.
Preferably, the bonding layer is made of solder paste.
Preferably, the number of the magnetic members is 1 or more.
The invention has the beneficial effects that: by improving the contact area between the laser diode and the adhesive layer, the laser diode can transmit more heat to the tube tongue through the adhesive layer, and finally the tube tongue is matched with the heat dissipation assembly for heat dissipation, so that the heat dissipation effect of the laser diode is improved, and the laser diode can work under the condition of high power; the heat conduction layer made of the high heat conduction material can reduce the thermal resistance of the joint, so that the heat of the laser diode can be more easily led out to the tube tongue through the joint layer, and finally the tube tongue is used for heat dissipation, and the heat dissipation efficiency of the laser diode is further accelerated.
Drawings
Fig. 1 is a schematic structural diagram of a laser package structure according to a first embodiment of the invention.
Fig. 2 is a schematic structural diagram of an embodiment of a bonding layer in the laser package structure of fig. 1.
Fig. 3 is a schematic structural diagram of another embodiment of a bonding layer in the laser package structure of fig. 1.
Fig. 4 is a schematic structural diagram of a second embodiment of a laser package structure of the present invention.
Fig. 5 is a schematic structural diagram of the laser package structure of fig. 4 with a heat conductive layer added.
Fig. 6 is a schematic structural diagram of the laser package structure of fig. 4 with a heat dissipation assembly added.
The reference numbers illustrate: 101-tube tongue, 102-laminating layer, 103-laser diode, 104-heat sink, 105-heat conduction layer, 106-heat dissipation cavity, 107-magnetic element, 108-fitting element and 109-heat conduction sheet.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 6, the present invention relates to a laser package structure, which includes a tube tongue 101, a bonding layer 102 mounted on the tube tongue 101, a laser diode 103 mounted on the bonding layer 102, and a heat dissipation assembly (not shown) mounted on the tube tongue 101, wherein the bonding layer 102 is located between the tube tongue 101 and the laser diode 103, the bonding layer 102 has a plurality of protrusions (not shown) arranged at intervals, the laser diode 103 has a plurality of first grooves (not shown) arranged at intervals, and the protrusions are arranged in a manner matching with the first grooves; in this embodiment, by increasing the contact area between the laser diode 103 and the adhesive layer 102, the heat conduction area is further increased, so that the laser diode 103 can transfer more heat to the tube tongue 101 through the adhesive layer 102, and finally the heat is dissipated through the tube tongue 101.
As shown in fig. 6, in the present embodiment, the tube tongue 101 is provided with a heat dissipation cavity 106, the heat dissipation assembly includes a fitting 108 and a magnetic member 107 which are installed in the heat dissipation cavity 106, a moving channel (not shown) is formed between the fitting 108 and a side wall of the heat dissipation cavity 106, the magnetic member 107 is located in the moving channel, and the heat conduction sheet 109 is installed in the tube tongue 101, and one end of the heat conduction sheet 109 is located in the moving channel; in this embodiment, when a driving magnetic field exists outside, the magnetic field can drive the magnetic member 107 to move in the moving channel, so as to push the microfluid to circularly move in the moving channel, and when the heat flow flows through the heat-conducting fins 109, the heat-conducting fins 109 can transfer the heat to the outside of the tube tongue 101, thereby achieving heat dissipation and further improving the heat dissipation efficiency.
In another embodiment, the pipe tongue 101 is further installed with a micro compressor, and the heat on the pipe tongue 101 can be dissipated through the micro compressor, thereby further improving the heat dissipation efficiency.
As shown in fig. 2 and fig. 3, in the present embodiment, the protruding portion may be one of an elongated shape, a square shape, a circular shape, or a triangular shape, and the elongated, square, circular, or triangular protruding portion may achieve the effect of increasing the contact area between the laser diode 103 and the adhesive layer 102.
As shown in fig. 4, a second embodiment of the disclosure is provided, in which the lamination layer 102 has a plurality of through grooves (not shown) disposed at intervals, and the through grooves are disposed corresponding to the first grooves; the heat sink 104 is filled in the through groove, one end of the heat sink 104 is positioned in the first groove, the pipe tongue 101 is provided with a plurality of second grooves (not shown) which are arranged at intervals, the second grooves are arranged corresponding to the through groove, and the other end of the heat sink 104 is arranged in the second grooves; one end of the heat sink 104 is installed in the first groove of the laser diode 103, the other end of the heat sink 104 is installed in the second groove of the tube tongue 101, and the heat sink 104 is used for connecting the laser diode 103 and the tube tongue 101 and increasing the contact area between the laser diode 103 and the tube tongue 101; the laser diode 103 conducts heat with the pipe tongue 101 mostly through the adhesive layer 102, and conducts heat partially through the heat sink 104.
The heat sink 104 is made of a high thermal conductivity material, the heat sink 104 is made of graphene, the heat sink 104 made of the high thermal conductivity material can improve the thermal conductivity rate, and further improve the heat dissipation, in this embodiment, the heat sink 104 may also be made of carbon nanotubes and diamond, or a composite of graphene and carbon nanotubes or a composite of graphene and diamond.
As shown in fig. 5 and 6, in the present embodiment, a heat conducting layer 105 is further included, and the heat conducting layer 105 is plated or coated on the joint surface of the stem 101 and the laser diode 103; the heat conduction layer 105 is made of a high heat conduction material, and the heat conduction layer 105 is made of a diamond film; the arrangement of the heat conducting layer can reduce the thermal resistance between the laser diode 103 and the adhesive layer 102 and the thermal resistance between the adhesive layer 102 and the tube tongue 101, so that the heat conduction efficiency is improved, and further the heat dissipation efficiency is improved.
The bonding layer 102 is made of solder paste, the laser diode 103 can be stably mounted on the tube tongue 101 by the solder paste, and meanwhile, the solder paste has a good heat conduction effect, so that heat on the laser diode 103 can be conveniently conducted to the tube tongue 101.
When the number of the magnetic members 107 is 1, the external magnetic field drives the magnetic members 107 to move in the moving channel, so that the microfluid can be pushed to circularly move in the moving channel, and when heat flows through the heat-conducting fins 109, the heat-conducting fins 109 can transfer heat to the outside of the tube tongues 101, so that heat dissipation is realized; when a plurality of magnetic pieces are arranged, more micro air flows can be driven to do circular motion, and heat dissipation is accelerated.
The working principle of the invention is as follows: when the laser diode 103 works, a certain amount of heat is generated, the heat is conducted to the tube tongue 101 through the adhesive layer 102, and then the tube tongue 101 dissipates the heat, so that the laser diode 103 can work stably, the laser diode 103 can transmit more heat to the tube tongue 101 through the adhesive layer 102 by improving the contact area between the laser diode 103 and the adhesive layer 102, and finally the tube tongue 101 is matched with a heat dissipation assembly to dissipate the heat, so that the heat dissipation effect of the laser diode 103 is improved, and the laser diode 103 can work under a high-power condition; in another embodiment, most of the heat in the laser diode 103 is conducted to the tube tongue 101 through the adhesive layer 102, and a small part of the heat is conducted to the tube tongue 101 through the heat sink 104, and finally the tube tongue 101 is matched with the heat dissipation assembly for heat dissipation, so that the stable work of the laser diode 103 is effectively ensured; the heat conduction layer 105 made of high-thermal-conductivity materials can reduce thermal resistance at the joint, so that heat of the laser diode 103 can be more easily led out to the tube tongue 101 through the joint layer 102, the tube tongue 101 is used for heat dissipation, heat dissipation efficiency of the laser diode 103 is further improved, and the heat sink 104 made of high-thermal-conductivity materials can accelerate heat conduction rate, and further heat dissipation effect is improved.
The above embodiments are merely illustrative of the preferred embodiments of the present invention, and not restrictive, and various changes and modifications to the technical solutions of the present invention may be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are intended to fall within the scope of the present invention defined by the appended claims.
Claims (10)
1. A laser package structure, characterized in that: the pipe tongue heat dissipation device comprises a pipe tongue, an attaching layer arranged on the pipe tongue, a laser diode arranged on the attaching layer and a heat dissipation assembly arranged on the pipe tongue, wherein the attaching layer is positioned between the pipe tongue and the laser diode and is provided with a plurality of protruding parts arranged at intervals, the laser diode is provided with a plurality of first grooves arranged at intervals, and the protruding parts are matched with the first grooves; the pipe tongue is provided with a heat dissipation cavity, the heat dissipation assembly comprises a fitting piece and a magnetic piece, the fitting piece is installed in the heat dissipation cavity, a moving channel is formed between the fitting piece and the side wall of the heat dissipation cavity, and the magnetic piece is located in the moving channel.
2. The laser package structure of claim 1, wherein: the protruding part is one of a strip shape, a square shape, a round shape or a triangle shape.
3. The laser package structure of claim 1, wherein: the laminating layer is provided with a plurality of through grooves arranged at intervals, and the through grooves correspond to the first grooves.
4. The laser package structure of claim 3, wherein: the heat sink is filled in the through groove, and one end of the heat sink is located in the first groove.
5. The laser package structure of claim 4, wherein: the pipe tongue is provided with a plurality of second grooves arranged at intervals, the second grooves correspond to the through grooves, and the other end of the heat sink is arranged in the second grooves.
6. The laser package structure of claim 4, wherein: the heat sink is made of high-thermal-conductivity materials in a processing mode, and the heat sink is made of graphene.
7. The laser package structure of claim 4, wherein: the heat conduction layer is plated or coated on the surfaces of the heat sink and the laminating layer; the heat conduction layer is made of high-heat-conduction materials through processing, and the heat conduction layer is made of a diamond film.
8. The laser package structure of claim 1, wherein: the heat conducting fin is arranged on the pipe tongue, and one end of the heat conducting fin is positioned in the moving channel.
9. The laser package structure of claim 1, wherein: the material of the jointing layer is solder paste.
10. The laser package structure of claim 1, wherein: the number of the magnetic pieces is 1 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110389055.6A CN113013724A (en) | 2021-04-12 | 2021-04-12 | Laser packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110389055.6A CN113013724A (en) | 2021-04-12 | 2021-04-12 | Laser packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113013724A true CN113013724A (en) | 2021-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110389055.6A Pending CN113013724A (en) | 2021-04-12 | 2021-04-12 | Laser packaging structure |
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| Country | Link |
|---|---|
| CN (1) | CN113013724A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030127661A1 (en) * | 2001-12-27 | 2003-07-10 | Shinichi Takagi | Optical module and optical transceiver apparatus |
| CN201444534U (en) * | 2009-08-11 | 2010-04-28 | 山东华光光电子有限公司 | Semiconductor laser TO package tube seat |
| CN103794583A (en) * | 2012-10-30 | 2014-05-14 | 中国科学院上海微系统与信息技术研究所 | Method for enhancing the adhesiveness between solder ball and UBM |
| CN106329294A (en) * | 2016-11-30 | 2017-01-11 | 中国工程物理研究院应用电子学研究所 | Diode-pumped-laser-module crystal bar |
| CN109818254A (en) * | 2019-03-28 | 2019-05-28 | 广东汉瑞通信科技有限公司 | A kind of 905nm high power laser and packaging technology with optical lens |
| CN112312743A (en) * | 2020-10-28 | 2021-02-02 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Enhanced heat exchange micro-channel liquid cooling radiator |
-
2021
- 2021-04-12 CN CN202110389055.6A patent/CN113013724A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030127661A1 (en) * | 2001-12-27 | 2003-07-10 | Shinichi Takagi | Optical module and optical transceiver apparatus |
| CN201444534U (en) * | 2009-08-11 | 2010-04-28 | 山东华光光电子有限公司 | Semiconductor laser TO package tube seat |
| CN103794583A (en) * | 2012-10-30 | 2014-05-14 | 中国科学院上海微系统与信息技术研究所 | Method for enhancing the adhesiveness between solder ball and UBM |
| CN106329294A (en) * | 2016-11-30 | 2017-01-11 | 中国工程物理研究院应用电子学研究所 | Diode-pumped-laser-module crystal bar |
| CN109818254A (en) * | 2019-03-28 | 2019-05-28 | 广东汉瑞通信科技有限公司 | A kind of 905nm high power laser and packaging technology with optical lens |
| CN112312743A (en) * | 2020-10-28 | 2021-02-02 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Enhanced heat exchange micro-channel liquid cooling radiator |
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Application publication date: 20210622 |
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| RJ01 | Rejection of invention patent application after publication |