CN113013045A - Novel rapid packaging method for COB packaged integrated circuit - Google Patents
Novel rapid packaging method for COB packaged integrated circuit Download PDFInfo
- Publication number
- CN113013045A CN113013045A CN202110256266.2A CN202110256266A CN113013045A CN 113013045 A CN113013045 A CN 113013045A CN 202110256266 A CN202110256266 A CN 202110256266A CN 113013045 A CN113013045 A CN 113013045A
- Authority
- CN
- China
- Prior art keywords
- packaging
- integrated circuit
- packaged integrated
- resin
- ultraviolet light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
Abstract
The invention provides a novel rapid packaging method for a COB packaged integrated circuit. The method can more efficiently package the sensor chip, remarkably improve the outline dimension precision of the package, facilitate subsequent installation of the outer packaging shell, improve the qualification rate and reduce the cost waste caused by the package.
Description
Technical Field
The invention belongs to the field of integrated circuit semiconductor packaging, and discloses a novel rapid packaging method for a COB packaged integrated circuit.
Background
At present, in the traditional sensor chip packaging of fingerprint identification type, COB packaging is adopted for improving identification sensitivity, packaging resin is silica gel, dispensing and coating are carried out at a bare wafer or a bonding position of a lead, then the bare wafer or the bonding position of the lead is sent into high-temperature equipment for heating and curing, and after curing, if further protection is needed, the cured product is sealed and coated by metal or other shells.
In the process, in the process of resin coating, after the coating is finished, a period of time delay exists in the process of conveying the resin to high-temperature equipment for curing, so that some resin can flow or collapse to cause the sealing glue coverage area to exceed the area of the originally designed sealing glue, the packaging appearance of the product is not influenced, and meanwhile, the resin can greatly interfere with metal or other shells installed later due to the fact that the resin exceeds the originally designed area of the sealing glue, so that the shells are installed badly, even the products cannot be installed, the quality faults of the products occur, or the products are scrapped, and the production cost is increased. The longer the delay time in between, the higher the probability of occurrence of the undesirable phenomenon.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a novel rapid packaging method for a COB (chip on board) packaged integrated circuit, which can reduce the flow of COB packaging resin caused by time waiting and poor packaging caused by overflow, remarkably improve the packaging yield, simultaneously avoid losing the protection of wafers and bonding wires and reduce the production cost of products.
In the first aspect, the encapsulating resin material for protecting the chip used in the encapsulation is a UV light-sensitive resin.
In the second aspect, when the packaging resin of the chip is extruded and coated on the chip, UV ultraviolet light is used for irradiation and curing, and the light-sensitive resin can be rapidly cured under the action of the ultraviolet light.
Preferably, the UV ultraviolet light source can be fixed on the encapsulation resin extrusion device for resin extrusion, i.e. ultraviolet light irradiation real-time curing, or can be irradiated on a separate UV ultraviolet light device for curing.
The following describes embodiments of the present invention in detail. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby. It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
Example (b):
in the first aspect, the encapsulating resin material for protecting the chip used in the encapsulation is a UV light-sensitive resin.
In a second aspect, UV ultraviolet light is used for irradiation curing when the encapsulation resin of the chip is extrusion coated onto the chip.
Preferably, the UV ultraviolet light source can be fixed on the encapsulation resin extrusion device for resin extrusion, i.e. ultraviolet light irradiation real-time curing, or can be irradiated on a separate UV ultraviolet light device for curing.
For the sake of brief description, the method provided by the embodiment of the present invention may refer to the corresponding contents in the foregoing product embodiments.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (3)
1. A novel fast packaging method of COB packaged integrated circuit is characterized in that,
the packaging resin material for protecting the chip used in packaging adopts UV light-sensitive resin to package the chip.
2. A novel fast packaging method of COB packaged integrated circuit is characterized in that,
and curing the packaging resin of the chip by adopting UV ultraviolet light.
3. A novel method of rapidly packaging COB-packaged integrated circuits according to claim 2,
the UV ultraviolet light source can be fixed on packaging resin extrusion equipment for resin extrusion, namely ultraviolet light irradiation real-time curing, and can also be irradiated on separate UV ultraviolet light equipment for curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110256266.2A CN113013045A (en) | 2021-03-09 | 2021-03-09 | Novel rapid packaging method for COB packaged integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110256266.2A CN113013045A (en) | 2021-03-09 | 2021-03-09 | Novel rapid packaging method for COB packaged integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113013045A true CN113013045A (en) | 2021-06-22 |
Family
ID=76403089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110256266.2A Pending CN113013045A (en) | 2021-03-09 | 2021-03-09 | Novel rapid packaging method for COB packaged integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113013045A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102088048A (en) * | 2010-12-21 | 2011-06-08 | 杭州杭科光电有限公司 | Packaging technology of light-emitting diodes |
| CN203398110U (en) * | 2013-07-03 | 2014-01-15 | 叶逸仁 | LED light source combination of fixed-type and fixed-specification packaging |
| CN103606616A (en) * | 2013-10-24 | 2014-02-26 | 叶逸仁 | LED packaging process |
| CN204554561U (en) * | 2015-05-06 | 2015-08-12 | 新科实业有限公司 | LED backlight light source |
| CN105977365A (en) * | 2016-05-19 | 2016-09-28 | 北京大学东莞光电研究院 | COB LED packaging device and method |
| CN107946292A (en) * | 2017-11-23 | 2018-04-20 | 深圳市晶台股份有限公司 | A kind of method for packing that LED display modules are realized by inkjet printing technology |
| CN110379912A (en) * | 2019-06-28 | 2019-10-25 | 佛山市国星光电股份有限公司 | LED component, backlight module and display device |
| CN110429170A (en) * | 2019-06-21 | 2019-11-08 | 中山大学 | It is a kind of to use the cured chip device packaging technology of ultraviolet light |
| CN111408515A (en) * | 2019-01-07 | 2020-07-14 | 欧菲影像技术（广州）有限公司 | Dispensing device, dispensing method and electronic device |
| CN212257436U (en) * | 2020-04-23 | 2020-12-29 | 深圳市聚飞光电股份有限公司 | LED substrate, LED packaging body and display device |
-
2021
- 2021-03-09 CN CN202110256266.2A patent/CN113013045A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102088048A (en) * | 2010-12-21 | 2011-06-08 | 杭州杭科光电有限公司 | Packaging technology of light-emitting diodes |
| CN203398110U (en) * | 2013-07-03 | 2014-01-15 | 叶逸仁 | LED light source combination of fixed-type and fixed-specification packaging |
| CN103606616A (en) * | 2013-10-24 | 2014-02-26 | 叶逸仁 | LED packaging process |
| CN204554561U (en) * | 2015-05-06 | 2015-08-12 | 新科实业有限公司 | LED backlight light source |
| CN105977365A (en) * | 2016-05-19 | 2016-09-28 | 北京大学东莞光电研究院 | COB LED packaging device and method |
| CN107946292A (en) * | 2017-11-23 | 2018-04-20 | 深圳市晶台股份有限公司 | A kind of method for packing that LED display modules are realized by inkjet printing technology |
| CN111408515A (en) * | 2019-01-07 | 2020-07-14 | 欧菲影像技术（广州）有限公司 | Dispensing device, dispensing method and electronic device |
| CN110429170A (en) * | 2019-06-21 | 2019-11-08 | 中山大学 | It is a kind of to use the cured chip device packaging technology of ultraviolet light |
| CN110379912A (en) * | 2019-06-28 | 2019-10-25 | 佛山市国星光电股份有限公司 | LED component, backlight module and display device |
| CN212257436U (en) * | 2020-04-23 | 2020-12-29 | 深圳市聚飞光电股份有限公司 | LED substrate, LED packaging body and display device |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210622 |
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