CN111081621A - Use method of suction nozzle for chip mounting - Google Patents
Use method of suction nozzle for chip mounting Download PDFInfo
- Publication number
- CN111081621A CN111081621A CN201811219597.3A CN201811219597A CN111081621A CN 111081621 A CN111081621 A CN 111081621A CN 201811219597 A CN201811219597 A CN 201811219597A CN 111081621 A CN111081621 A CN 111081621A
- Authority
- CN
- China
- Prior art keywords
- suction nozzle
- chip
- size
- nozzle
- determining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 230000002950 deficient Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a using method of a suction nozzle for chip mounting, which mainly aims at the loading process of chips, and the chips are taken down from a wafer which is cut by the suction nozzle and then placed on a bearing seat. The suction nozzle for chip mounting is directly contacted with the chip, and if the suction nozzle is not used properly, the chip mounting is inevitably failed, and defective products are caused; the invention ensures the stability and reliability of the suction piece fundamentally, finally ensures the stability and reliability of chip packaging and improves the yield by standardizing the use method of the suction nozzle for chip packaging.
Description
Technical Field
The invention relates to the chip packaging industry, in particular to a using method of a suction nozzle for chip mounting before chip mounting.
Background
With the development of science and technology, the electronic industry has been rapidly advanced, the demand of various integrated and control circuits has been rapidly increased, and the demand of chip packaging has also been rapidly increased.
The chip packaging means that a precise semiconductor integrated circuit chip is mounted on a frame, then the chip is connected with frame pins by leads, finally the semiconductor integrated circuit chip is sealed by epoxy resin, and the outside carries out signal transmission with the internal chip through the pins. The packaging mainly comprises the step of fixedly packaging a precise semiconductor integrated circuit chip, so that the semiconductor integrated circuit chip is not influenced by external humidity and dust while playing a role, and meanwhile, good mechanical vibration or impact resistance protection is provided, and the applicability of the semiconductor integrated circuit chip is improved. Meanwhile, the chip is packaged on the metal frame, so that the heat dissipation area is increased, and the operation reliability of the chip is improved.
The mounting is an important link in chip packaging, namely, a tiny semiconductor integrated circuit chip is preliminarily fixed on a frame bearing seat by using an adhesive or lead-tin solder, so that support is provided for subsequent lead welding and solid sealing.
The tiny and precise chips are taken down from the wafer and then are enlarged on the bearing seat, a special suction nozzle for chip mounting is needed, the link is improperly controlled in the conventional operation, the chip mounting is easy to lose efficacy, and the final product yield is further influenced.
Disclosure of Invention
The invention aims to provide a using method of a suction nozzle for chip mounting, so as to make up for the defects in the existing measuring process.
In order to achieve the purpose, the invention provides a using method of a suction nozzle for chip mounting, which comprises the following steps:
step 1, determining the type of a suction nozzle:
(1) the lead-tin solder is loaded by using a high-temperature rubber suction nozzle;
(2) the conductive adhesive sheet is provided with a common rubber suction nozzle;
step 2, determining the size of the suction nozzle according to the size of the chip:
(1) the rectangular suction nozzle is used for determining the long side dimension A = (0.7-0.9) × X of the suction nozzle according to the long side dimension X of the chip;
determining the short edge dimension B = (0.7-0.9) multiplied by Y of the suction nozzle according to the short edge dimension Y of the chip;
a, B, the above is selected according to the actual size of the suction nozzle;
(2) the circular suction nozzle is used for determining the diameter phi of the suction nozzle according to the size Y of the short edge of the chip, wherein the diameter phi of the suction nozzle is not (0.7-0.9) multiplied by Y;
selecting the phi according to the actual size of the suction nozzle;
step 3, mounting and maintaining the suction nozzle:
(1) controlling the service life of the suction nozzle, setting a counter in the equipment to be 100K after the new suction nozzle is installed, and immediately replacing the suction nozzle when the service life of the equipment is alarmed;
(2) the maintenance of the suction nozzle, before using the apparatus each time, need to check whether the suction nozzle is clean, jammed or damaged;
(3) the suction nozzle is installed, and a finger stall needs to be worn for operation when a new suction nozzle is installed;
when A, B is determined according to the actual nozzle size, when a plurality of nozzle sizes are selectable, the nozzle with the largest A multiplied by B value is selected.
Preferably, the diameter Φ of the circular suction nozzle is an outer diameter of an end of the circular suction nozzle.
Preferably, when the phi is determined according to the actual size of the suction nozzle, when a plurality of suction nozzles with selectable sizes are available, the suction nozzle with the largest phi value is selected.
The invention provides a using method of a suction nozzle for chip mounting, which is used for a chip mounting process in chip packaging. The invention has the beneficial effects that: according to different chip curing types and sizes, the test standards of the curing strength of the chip are respectively determined, different test loading speeds and final judgment standards are formulated, so that the curing effect of the chip is determined, and the operation is facilitated.
Detailed Description
The invention mainly aims at a chip mounting process in a chip packaging process, and provides a using method of a suction nozzle for chip mounting, which comprises the following specific steps:
step 1, determining the type of a suction nozzle:
(1) the lead-tin solder is loaded by using a high-temperature rubber suction nozzle;
(2) the conductive adhesive sheet is provided with a common rubber suction nozzle;
step 2, determining the size of the suction nozzle according to the size of the chip:
(1) the rectangular suction nozzle is used for determining the long side dimension A = (0.7-0.9) × X of the suction nozzle according to the long side dimension X of the chip;
determining the short edge dimension B = (0.7-0.9) multiplied by Y of the suction nozzle according to the short edge dimension Y of the chip;
a, B, the above is selected according to the actual size of the suction nozzle;
(2) the circular suction nozzle is used for determining the diameter phi of the suction nozzle according to the size Y of the short edge of the chip, wherein the diameter phi of the suction nozzle is not (0.7-0.9) multiplied by Y;
selecting the phi according to the actual size of the suction nozzle;
when A, B is determined according to the actual size of the suction nozzle, when a plurality of suction nozzles are selectable, the suction nozzle with the maximum A multiplied by B value is selected to ensure the optimal suction force and prevent the concentration of suction stress from influencing the quality of the chip.
Preferably, the diameter Φ of the circular suction nozzle is an outer diameter of an end of the circular suction nozzle.
Preferably, when the phi is determined according to the actual size of the suction nozzle, when the sizes of a plurality of suction nozzles are selectable, the suction nozzle with the largest phi value is selected to ensure the optimal suction force and prevent the suction stress from concentrating and influencing the quality of a chip.
Step 3, mounting and maintaining the suction nozzle:
(1) controlling the service life of the suction nozzle, setting a counter in the equipment to be 100K after the new suction nozzle is installed, and immediately replacing the suction nozzle when the service life of the equipment is alarmed;
(2) the maintenance of the suction nozzle, before using the apparatus each time, need to check whether the suction nozzle is clean, jammed or damaged;
(3) the installation of the suction nozzle needs to be operated by wearing a finger stall when a new suction nozzle is installed.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The use method of the suction nozzle for chip mounting is characterized by comprising the following steps:
step 1, determining the type of a suction nozzle:
(1) the lead-tin solder is loaded by using a high-temperature rubber suction nozzle;
(2) the conductive adhesive sheet is provided with a common rubber suction nozzle;
step 2, determining the size of the suction nozzle according to the size of the chip:
(1) the rectangular suction nozzle is used for determining the long side dimension A = (0.7-0.9) × X of the suction nozzle according to the long side dimension X of the chip;
determining the short edge dimension B = (0.7-0.9) multiplied by Y of the suction nozzle according to the short edge dimension Y of the chip;
a, B, the above is selected according to the actual size of the suction nozzle;
(2) the circular suction nozzle is used for determining the diameter phi of the suction nozzle according to the size Y of the short edge of the chip, wherein the diameter phi of the suction nozzle is not (0.7-0.9) multiplied by Y;
selecting the phi according to the actual size of the suction nozzle;
step 3, mounting and maintaining the suction nozzle:
(1) controlling the service life of the suction nozzle, setting a counter in the equipment to be 100K after the new suction nozzle is installed, and immediately replacing the suction nozzle when the service life of the equipment is alarmed;
(2) the maintenance of the suction nozzle, before using the apparatus each time, need to check whether the suction nozzle is clean, jammed or damaged;
(3) the suction nozzle is installed, and a finger stall needs to be worn for operation when a new suction nozzle is installed;
when the actual nozzle size is determined A, B, when there are a plurality of nozzle sizes that can be selected, the nozzle with the largest A × B value is selected.
2. The use method of the suction nozzle for chip mounting according to claim 1, wherein the diameter Φ of the circular suction nozzle is an outer diameter of an end of the circular suction nozzle.
3. The use method of suction nozzle for chip mounting according to claim 1 or 2, wherein when Φ is determined according to actual suction nozzle size, when there are a plurality of suction nozzle sizes selectable, the suction nozzle with the largest Φ value is selected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811219597.3A CN111081621A (en) | 2018-10-19 | 2018-10-19 | Use method of suction nozzle for chip mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811219597.3A CN111081621A (en) | 2018-10-19 | 2018-10-19 | Use method of suction nozzle for chip mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111081621A true CN111081621A (en) | 2020-04-28 |
Family
ID=70308991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811219597.3A Withdrawn CN111081621A (en) | 2018-10-19 | 2018-10-19 | Use method of suction nozzle for chip mounting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111081621A (en) |
-
2018
- 2018-10-19 CN CN201811219597.3A patent/CN111081621A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200428 |