CN111081567A - Mounting curing test method - Google Patents
Mounting curing test method Download PDFInfo
- Publication number
- CN111081567A CN111081567A CN201811216200.5A CN201811216200A CN111081567A CN 111081567 A CN111081567 A CN 111081567A CN 201811216200 A CN201811216200 A CN 201811216200A CN 111081567 A CN111081567 A CN 111081567A
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- Prior art keywords
- chip
- thrust
- test
- area
- curing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to a chip mounting curing test method, which is mainly used for performing thrust test on the curing strength of a chip after the chip mounting is completed and cured; the invention defines the test steps, the loading condition of the thrust test and the comparison requirement, defines the test standard, is convenient to operate, improves the test efficiency, further ensures the stable and reliable quality of the product and improves the yield.
Description
Technical Field
The invention relates to the chip packaging industry, in particular to a method for measuring curing strength during chip mounting.
Background
With the development of science and technology, the electronic industry has been rapidly advanced, the demand of various integrated and control circuits has been rapidly increased, and the demand of chip packaging has also been rapidly increased.
The chip packaging means that a precise semiconductor integrated circuit chip is mounted on a frame, then the chip is connected with frame pins by leads, finally the semiconductor integrated circuit chip is sealed by epoxy resin, and the outside carries out signal transmission with the internal chip through the pins. The packaging mainly comprises the step of fixedly packaging a precise semiconductor integrated circuit chip, so that the semiconductor integrated circuit chip is not influenced by external humidity and dust while playing a role, and meanwhile, good mechanical vibration or impact resistance protection is provided, and the applicability of the semiconductor integrated circuit chip is improved. Meanwhile, the chip is packaged on the metal frame, so that the heat dissipation area is increased, and the operation reliability of the chip is improved.
The mounting is an important link in chip packaging, namely, a tiny semiconductor integrated circuit chip is preliminarily fixed on a frame bearing seat by using an adhesive or lead-tin solder, so that support is provided for subsequent lead welding and solid sealing.
General adhesives can be divided into conductive adhesive/insulating adhesive, the adhesive strength is slightly low, but the operation is simple and convenient; and high-temperature welding is needed for fixing the lead and tin solder.
In order to test the strength of the chip attachment to the carrier, it is necessary to test in a certain way in order to determine the reliability of the chip mounting.
Disclosure of Invention
The invention aims to provide a mounting curing test method to make up for the defects in the existing measurement process.
In order to achieve the purpose, the invention provides a mounting curing test method, which comprises the following steps:
(1) conductive adhesive/insulating adhesive products:
a. for area>1mm2The maximum thrust value of the chip (2) is more than 10N;
b. for the area less than or equal to 1mm2The maximum thrust value of the chip (2) needs to be larger than 4N;
(2) lead-tin solder product:
a. for area>1mm2The maximum thrust value of the chip (2) needs to be more than 50N;
b. for the area less than or equal to 1mm2The maximum thrust value of the chip (2) is more than 10N;
judging the product meeting the requirements to be qualified, and circulating normally; and judging the product which does not meet the requirements as a defective product, and rechecking the chip mounting process.
Preferably, in the step 3, the curing agent climbing height h on the long side surface 2 side of the chip is visually determined, and the side with the lower climbing height h at the center part is selected as the contact surface of the thrust test probe.
Preferably, in the step 4, different thrust loading speeds are adopted for different products:
(1) conductive adhesive/insulating adhesive products:
a. for area>1mm2The thrust loading speed of the chip is 1N/s;
b. for the area less than or equal to 1mm2The thrust loading speed of the chip (2) is 0.4N/s;
(2) lead-tin solder product:
a. for area>1mm2The thrust loading speed of the chip is 5N/s;
b. for the area less than or equal to 1mm2The thrust loading speed of the chip (2) is 1N/s.
The invention discloses a mounting curing test method, which is used for a mounting process in chip packaging. The invention has the beneficial effects that: according to different chip curing types and sizes, the test standards of the curing strength of the chip are respectively determined, different test loading speeds and final judgment standards are formulated, so that the curing effect of the chip is determined, and the operation is facilitated.
Drawings
FIG. 1 is a highly schematic view of the curing agent of the present invention climbing a slope;
FIG. 2 is a schematic view of the thrust test of the present invention;
wherein, 1 is a chip; 2 is a bearing seat; 3 is a curing agent; and 4, a thrust test probe.
Detailed Description
The invention mainly aims at a chip mounting procedure in a chip packaging process, and provides a chip mounting curing test method which comprises the following specific steps:
and step 1, curing the chip subjected to preliminary chip mounting.
And 2, moving the cured chip and the bearing seat to a thrust test bench.
And 3, fixing the bearing seat on the test table board, adjusting the thrust test probe, aligning the center of the long side surface of the chip, deviating from the joint of the fixing agent, and contacting the chip body.
In this step, the climbing height of the curing agent on the long side surface 2 side of the chip is visually judged, i.e. h shown in fig. 1, and the side with the lower climbing height of the central part is selected as the contact surface of the thrust test probe. Therefore, the thrust test probe can completely and directly apply test thrust to the chip body, namely as shown in figure 2.
And 4, starting the thrust tester, uniformly loading the thrust until the chip is stripped, and recording the maximum thrust value.
In this test, to different products, adopt different thrust loading speeds:
(1) conductive adhesive/insulating adhesive products:
a. for area>1mm2The thrust loading speed of the chip is 1N/s;
b. for the area less than or equal to 1mm2The thrust loading speed of the chip (2) is 0.4N/s;
(2) lead-tin solder product:
a. for area>1mm2The thrust loading speed of the chip is 5N/s;
b. for the area less than or equal to 1mm2The thrust loading speed of the chip (2) is 1N/s.
The load application speed is too high, so that the chip is easy to break suddenly, and the test effect is influenced; and too slow application affects test efficiency.
The recorded maximum thrust value is compared with a standard value:
(1) conductive adhesive/insulating adhesive products:
a. for area>1mm2The maximum thrust value of the chip (2) is more than 10N;
b. for the area less than or equal to 1mm2The maximum thrust value of the chip (2) needs to be larger than 4N;
(2) lead-tin solder product:
a. for area>1mm2The maximum thrust value of the chip (2) needs to be more than 50N;
b. for the area less than or equal to 1mm2The maximum thrust value of the chip (2) is more than 10N;
judging the product meeting the requirements to be qualified, and circulating normally; and judging the product which does not meet the requirements as a defective product, and rechecking the chip mounting process.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. A chip mounting curing test method is characterized by comprising the following steps:
step 1, curing the chip subjected to preliminary chip mounting;
step 2, moving the cured chip and the bearing seat to a thrust test bench;
step 3, fixing the bearing seat on the test table board, adjusting the thrust test probe, aligning the center of the long side surface of the chip, deviating from the joint of the fixing agent, and contacting the chip body;
step 4, starting a thrust tester, uniformly loading thrust until the chip is peeled off, recording a maximum thrust value, and comparing the recorded maximum thrust value with a standard value:
(1) conductive adhesive/insulating adhesive products:
a. for area>1mm2The maximum thrust value of the chip (2) is more than 10N;
b. for the area less than or equal to 1mm2The maximum thrust value of the chip (2) needs to be larger than 4N;
(2) lead-tin solder product:
a. for area>1mm2The maximum thrust value of the chip (2) needs to be more than 50N;
b. for the area less than or equal to 1mm2The maximum thrust value of the chip (2) is more than 10N;
judging the product meeting the requirements to be qualified, and circulating normally; and judging the product which does not meet the requirements as a defective product, and rechecking the chip mounting process.
2. The die bonding curing test method according to claim 1, wherein in the step 3, the curing agent climbing height h on the long side surface 2 side of the chip is visually judged, and the side with the lower climbing height h at the central part is selected as the contact surface of the thrust test probe.
3. The die bonding curing test method according to claim 1, wherein in the step 4, different thrust loading speeds are adopted for different products:
(1) conductive adhesive/insulating adhesive products:
a. for area>1mm2The thrust loading speed of the chip is 1N/s;
b. for the area less than or equal to 1mm2The thrust loading speed of the chip (2) is 0.4N/s;
(2) lead-tin solder product:
a. for area>1mm2The thrust loading speed of the chip is 5N/s;
b. for the area less than or equal to 1mm2The thrust loading speed of the chip (2) is 1N/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811216200.5A CN111081567A (en) | 2018-10-18 | 2018-10-18 | Mounting curing test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811216200.5A CN111081567A (en) | 2018-10-18 | 2018-10-18 | Mounting curing test method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111081567A true CN111081567A (en) | 2020-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811216200.5A Pending CN111081567A (en) | 2018-10-18 | 2018-10-18 | Mounting curing test method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111081567A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114323379A (en) * | 2020-09-30 | 2022-04-12 | 矽磐微电子(重庆)有限公司 | Thrust test fixture and chip mounting thrust test method |
-
2018
- 2018-10-18 CN CN201811216200.5A patent/CN111081567A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114323379A (en) * | 2020-09-30 | 2022-04-12 | 矽磐微电子(重庆)有限公司 | Thrust test fixture and chip mounting thrust test method |
| CN114323379B (en) * | 2020-09-30 | 2024-05-24 | 矽磐微电子(重庆)有限公司 | Thrust testing jig and chip loading thrust testing method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200428 |