CN112996357A - Integrated radiator - Google Patents
Integrated radiator Download PDFInfo
- Publication number
- CN112996357A CN112996357A CN202110179893.0A CN202110179893A CN112996357A CN 112996357 A CN112996357 A CN 112996357A CN 202110179893 A CN202110179893 A CN 202110179893A CN 112996357 A CN112996357 A CN 112996357A
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- heat
- chamber
- channel
- heat sink
- connecting channel
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- 238000001704 evaporation Methods 0.000 claims abstract description 70
- 230000008020 evaporation Effects 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000004907 flux Effects 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 27
- 238000010438 heat treatment Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011555 saturated liquid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The utility model relates to a technical field of radiator relates to integral type radiator, including evaporating chamber, communicate in the condenser of evaporating chamber, the evaporating chamber is equipped with inlet, its characterized in that: the condenser comprises a plurality of radiating fins arranged at intervals, a plurality of connecting channels positioned between the adjacent radiating fins and communicated with the evaporation chamber, and a collecting channel fixedly connected to one ends of the radiating fins far away from the evaporation chamber, wherein the collecting channel is communicated with the connecting channels; because the condenser is directly communicated with the evaporation chamber, gasified steam can enter the connecting channel at once, and then the radiating fins can rapidly cool the steam, so that the heat flux density is higher, and the radiating effect is improved.
Description
Technical Field
The application relates to the field of radiators, in particular to an integrated radiator.
Background
At present, devices or instruments which timely transfer heat generated by machinery or other appliances in the working process to avoid influencing the normal work of the devices or instruments become radiators, and common radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode; along with the improvement of whole quick-witted security requirement to and electronic components operating frequency is higher and higher, and the volume is littleer and more, but the density of generating heat is bigger and bigger, and current crowded, the forming relieved tooth technique of aluminium can not satisfy the heat dissipation demand of high heat flux density far away, along with the development of science and technology, electronic components's heat dissipation problem has been solved to a great extent to the appearance of heat pipe radiator.
The existing heat pipe radiator consists of a sealing pipe, a liquid absorption core and a vapor channel, wherein the liquid absorption core surrounds the pipe wall of the sealing pipe and is immersed with volatile saturated liquid; when the heat pipe radiator operates, the evaporation section absorbs the heat generated by the heat source (power semiconductor device, etc.) to boil the liquid in the liquid absorption core pipe into vapor, the vapor with heat moves from the evaporation section to the cooling section of the heat pipe radiator, when the vapor transmits the heat to the cooling section, the vapor is condensed into liquid, the condensed liquid returns to the evaporation section through the capillary action of the liquid absorption core on the pipe wall, and the circulation process is repeated to continuously dissipate the heat.
With respect to the related art in the above, the inventors consider that: the heat pipe radiator is provided with a longer containing cavity, so that the heat flow density is lower, and the heat radiation effect is influenced.
Disclosure of Invention
For the radiating effect of effectual improvement radiator, this application provides the integral type radiator.
The application provides an integral type radiator adopts following technical scheme:
integral type radiator, including the evaporating chamber, communicate in the condenser of evaporating chamber, the evaporating chamber is equipped with the inlet, the condenser includes a plurality of radiating fins that the interval set up, is located adjacently between the radiating fin and with a plurality of interface channel, the fixed connection of evaporating chamber intercommunication in radiating fin keeps away from the aggregate passageway of the one end of evaporating chamber, aggregate passageway communicate in interface channel.
By adopting the technical scheme, the working medium is injected into the evaporation chamber from the liquid injection port, the evaporation chamber is vacuumized and sealed and welded, then the evaporation chamber is attached to a heating workpiece or equipment, heat enters the evaporation chamber through heat transfer, evaporation liquid in the evaporation chamber absorbs the heat, is gasified and rises, and enters the condenser along the connecting channel, the heat of the connecting channel is transferred to the radiating fins, so that the temperature of the part of steam is reduced and enters the collecting channel, and then enters the evaporation chamber through the connecting channel again, and the process is repeated continuously, so that the radiating function of the radiator is completed; the condenser is directly communicated with the evaporation chamber, so that the gasified steam can immediately enter the connecting channel, and the heat radiating fins can quickly cool the steam, so that the heat flux density and the heat flux are higher, and the heat radiating effect is improved; on the other hand, the volume of the radiator is further reduced.
Preferably, the radiating fins are arranged in a wave-shaped bending mode, and the wave amplitude of the wave bending of the radiating fins is larger than the wave length of the wave bending of the radiating fins.
By adopting the technical scheme, the surface area of the radiating fins is increased, and the radiating effect of the radiating fins is improved.
Preferably, the distance between adjacent heat dissipation fins on any one plane perpendicular to the length direction of the connecting channel is equal.
By adopting the technical scheme, through the design, the heat dissipation of the connecting channel is more uniform, so that the heat dissipation effect of the heat dissipation fins is improved, the phenomenon that the position heat of the connecting channel is higher is reduced, and the service life of the connecting channel is prolonged.
Preferably, the condenser still includes two difference fixed connection in the evaporation chamber is one served backplate of keeping away from each other, the backplate is kept away from the one end fixed connection of evaporation chamber in the one end that the collection passageway kept away from each other, backplate, collection passageway and evaporation chamber enclose to close and form the chamber that holds that supplies connecting channel and radiating fin installation.
By adopting the technical scheme, the protective plate plays a role in protecting the radiating fins and the connecting channel; on the other hand, the guard plate can reduce the direct contact of workers with the radiating fins and the connecting channel, so that the safety of the radiator is improved; meanwhile, the guard plate improves the connection strength of the radiator.
Preferably, two sealing strips are arranged between the adjacent connecting channels, the sealing strips extend along the width direction of the collecting channel, one sides, far away from each other, of the sealing strips are fixedly connected to one sides of the collecting channel and the evaporating chamber respectively, and the radiating fins are located between the two sealing strips.
By adopting the technical scheme, the seal strip plays a role in enhancing the structural strength of the radiator; on the other hand, the seal strip can improve the connection firmness of the connecting channel and the evaporation chamber, and further ensure the air tightness of the evaporation chamber, the connecting channel and the collecting channel.
Preferably, an inner fin is mounted inside the connecting channel, and a plurality of inner fins are arranged along the extending direction of the connecting channel.
By adopting the technical scheme, the structural strength of the connecting channel can be effectively increased through the plurality of inner fins; the cross-sectional area of the gas flow channel can be increased in performance through the plurality of inner fins on the other end face, the pressure-resistant and temperature-resistant strength of the connecting channel is improved, and the applicability of the radiator is further improved.
Preferably, the inner fin comprises a plurality of first connecting portions and a plurality of second connecting portions, the first connecting portions and the second connecting portions are vertically arranged, the first connecting portions and the second connecting portions are sequentially connected in an end-to-end mode, and the first connecting portions and the second connecting portions are all parallel to the steam flowing direction.
Through adopting above-mentioned technical scheme, interior fin, first connecting portion and second connecting portion play the effect of water conservancy diversion for liquid that flows back in the evaporating chamber can flow to the evaporating chamber along the side wall of first connecting portion and second connecting portion, reduces the flow resistance of liquid, and then is favorable to liquid backward flow.
Preferably, the adjacent first connecting parts are arranged in a staggered manner.
By adopting the technical scheme, the reflux efficiency of the liquid is further improved.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present application.
Fig. 2 is a cross-sectional view for showing a porous capillary body.
Fig. 3 is a partial schematic view for showing the inner fin.
Description of reference numerals: 1. an evaporation chamber; 11. a liquid inlet; 12. a base; 13. a connecting seat; 15. a seal; 17. a porous wick; 2. a condenser; 21. a heat dissipating fin; 22. a connecting channel; 23. a collection channel; 24. a guard plate; 3. an inner fin; 4. an accommodating chamber; 5. a first connection portion; 51. a second connecting portion.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses integral type radiator.
Referring to fig. 1 and 2, the integrated radiator includes an evaporation chamber 1, a condenser 2 communicated with the evaporation chamber 1, a liquid inlet 11 for a working medium to enter the evaporation chamber 1 is formed in one side of the evaporation chamber 1, after the working medium is introduced into the evaporation chamber 1, the evaporation chamber 1 is vacuumized and sealed and welded, in this embodiment, the condenser 2 includes a plurality of heat dissipation fins 21 arranged at intervals, a plurality of connecting channels 22, an aggregation channel 23, and two guard plates 24, one ends of the two guard plates 24 are respectively welded to one end of the aggregation channel 23, the other end of the two guard plates are welded to one end of the evaporation chamber 1, the two guard plates 24, the aggregation channel 23 and the evaporation chamber 1 enclose and form an accommodation cavity 4, the heat dissipation fins 21 and the connecting channels 22 are both located in the accommodation cavity 4, the guard plates 24 play a role in protecting the heat dissipation fins 21 and the connecting channels 22, and play a role in.
Connecting channel 22 is located between adjacent radiating fin 21, and simultaneously, set passageway 23 is located radiating fin 21 and keeps away from the one end of evaporating chamber 1, connecting channel 22 one end and evaporating chamber 1 intercommunication, the other end and set passageway 23 intercommunication, and radiating fin 21 is connected with connecting channel 22 through the welded mode, the gas in the evaporating chamber 1 flows to set passageway 23 in through connecting channel 22, this part gas flows to the in-process and carries out the heat exchange with external atmosphere under radiating fin 21's assistance, and then realize that the cooling condensation is liquid, the rethread connecting channel 22 enters into in the evaporating chamber 1.
In this embodiment, the evaporation chamber 1 includes a base 12 for attaching a heat source, and a connection seat 13 welded to one side of the base 12, and a porous capillary body 17 is welded to an inner wall of the base 12 close to the heat source, where the porous capillary body 17 is metal powder such as sintered copper powder or aluminum powder; the porous capillary body 17 can effectively control and reduce the thermal contact resistance of a heat absorption area, when the heat of a heat source is transferred to the inside of the base 12, the heat can be transferred to the porous capillary body 17, the heat transfer area of the evaporation liquid can be increased by the porous capillary body 17, so that the evaporation liquid can quickly absorb the heat, the evaporation liquid is gasified and rises and enters the connecting channel 22 from the evaporation chamber 1, the vapor circulating in the connecting channel 22 can transfer the heat to the radiating fins 21, the radiating fins 21 transfer the heat to the surrounding atmosphere, the temperature of the vapor in the connecting channel 22 is reduced, the cooled vapor forms the evaporation liquid again and flows into the connecting channel 22 from the collecting channel 23 and then enters the base 12, and the process is repeated in a cycle, and the heat source is continuously cooled.
Preferably, the heat dissipating fins 21 are arranged in a wave-shaped bending manner, the wave amplitude of the wave bending of the heat dissipating fins 21 is greater than the wave length of the wave bending of the heat dissipating fins 21, and meanwhile, the distance between adjacent heat dissipating fins 21 on any plane vertical to the length direction of the connecting channel 22 is equal, so that the cooling effect on steam in the connecting channel 22 is improved.
Referring to fig. 2 and 3, in the present embodiment, a plurality of inner fins 3 are welded inside the connecting channel 22, in the present embodiment, each inner fin 3 includes a plurality of first connecting portions 5 and second connecting portions 51, the first connecting portions 5 and the second connecting portions 51 are vertically arranged, and the plurality of first connecting portions 5 and the plurality of second connecting portions 51 are sequentially connected in an end-to-end manner, and meanwhile, the first connecting portions 5 and the second connecting portions 51 are both parallel to the vapor flowing direction, so as to improve the efficiency of liquid flowing back to the evaporation chamber 1; on the other hand, the structural strength of the connecting channel 22 and the pressure-resistant and temperature-resistant performance strength are improved; better; the adjacent first connecting portions 5 are arranged in a staggered manner.
In this embodiment, in order to guarantee the air tightness of the evaporation chamber 1, the connection channel 22 and the collection channel 23, two seals 15 are arranged between the adjacent connection channels 22, the two seals 15 extend along the width direction of the collection channel 23, and the two seals 15 are respectively located at the end where the connection channel 22 is far away from each other, one side where the seals 15 are far away from each other is respectively welded at one side where the adjacent connection channels 22 are close to each other, one side where the two seals 15 are far away from each other is respectively welded at one side of the collection channel 23 and the evaporation chamber 1, the heat dissipation fin 21 is located between the two seals 15, through the arrangement of the seals 15, the connection firmness of the connection channel 22 and the evaporation chamber 1 can be effectively improved, and the connection firmness of the connection channel 22 and the collection channel.
The related radiator B has the following differences from the radiator in the embodiment: the connecting channel 22 is not provided with the inner fins 3, and the evaporation chamber 1 is connected with the connecting channel 22 through a water pipe; for the sake of convenience of distinction, the heat sink in this embodiment is referred to as heat sink a, and the specifications of heat sink a and heat sink B are the same.
Now, a radiator B is selected as a comparative example, and the heat radiation performance of the radiator A in the example and the radiator B in the comparative example is detected, wherein the detection method comprises the following steps:
the test steps are as follows:
1. preparing two heat generation sources a1 and B1 of the same type;
2. mounting the radiator A on a heating source A1, mounting the radiator B on a heating source B1, and measuring the indoor temperature;
3. inputting enough power into the heat-generating source A1 to make the heat quantity emitted by the heat-generating source A1 be at the maximum heat quantity value (namely after steady state), then starting to record the temperature of the heat-generating source A1, and recording the input power of the heat-generating source A1 at the moment; inputting a sufficient power to the heat generation source B1 so that the amount of heat emitted by the heat generation source B1 is at the maximum calorific value, then starting recording the temperature of the heat generation source B1, and recording the input power of the heat generation source B1 at that time;
4. and (5) obtaining the test result through the data of the table I under the calculation of the calculation formula.
A first table:
| 5min after steady state | 20min after steady state | 40min after steady state | 60min after steady state | 120min after steady state | 180min after steady state | |
| Heating source A1 (degree centigrade) | 68.5 | 68．8 | 68.9 | 68.6 | 68.8 | 68.5 |
| Heat source B1 (degree centigrade) | 70.3 | 70.5 | 70.2 | 70.5 | 70.1 | 70.4 |
Data one: the output power of the heat source A1 was 650W, and the output power of the heat generating B2 was 500W.
According to the table one and the data one, the following results are obtained: after the steady state, the heat source a1 and the heat source B1 are in a state of maximum heat dissipation, at this time, the heat sink a can control the temperature of the heat source a1 to be 68.83 ℃, and the heat sink B can control the temperature of the heat source B1 to be 70.33 ℃, and the temperatures of the two are close to each other, that is, the heat sink a can effectively dissipate the heat source with the input power of 650W, and the heat sink can only effectively dissipate the heat source with the input power of 500W, so that the heat dissipation effect of the heat sink a in the embodiment of the present application is much better than that of the heat sink B in the proportion.
The implementation principle of the embodiment is as follows: the base 12 is tightly attached to the heating source, the heat of the heating source is transferred to the evaporating liquid in the base 12, the evaporating liquid is heated and gasified to enter the connecting channel 22, the steam dissipates the heat to the atmosphere with the help of the inner fins 3 and the radiating fins 21, so that the steam entering the collecting channel 23 is cooled to form the evaporating liquid again, then the evaporating liquid enters the evaporating chamber 1 through the connecting channel 22, the heating source is cooled repeatedly, and the radiating function of the radiator is completed; the evaporation chamber 1 is directly connected with the condenser 2, so that the volume of the radiator is reduced, the heat flux density is improved, and the heat radiation effect is further improved; the design of the inner fins 3 further improves the heat dissipation effect and the reflux speed of the liquid to the evaporation chamber 1.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. Integral type radiator, including evaporating chamber (1), communicate in condenser (2) of evaporating chamber (1), evaporating chamber (1) is equipped with inlet (11), its characterized in that: condenser (2) including a plurality of radiating fin (21) that the interval set up, be located adjacently between radiating fin (21) and with a plurality of connecting channel (22), fixed connection that evaporating chamber (1) communicates are in radiating fin (21) keep away from aggregate passageway (23) of the one end of evaporating chamber (1), aggregate passageway (23) communicate in connecting channel (22).
2. The integrated heat sink of claim 1, wherein: the radiating fins (21) are arranged in a wave-shaped bending mode, and the wave amplitude of the wave bending of the radiating fins (21) is larger than the wave length of the wave bending of the radiating fins (21).
3. The integrated heat sink of claim 1, wherein: the distances between the adjacent heat dissipation fins (21) on any plane vertical to the length direction of the connecting channel (22) are equal.
4. The integrated heat sink of claim 3, wherein: condenser (2) still include two respectively fixed connection in evaporation chamber (1) one end on backplate (24) of keeping away from each other, backplate (24) are kept away from the one end fixed connection of evaporation chamber (1) in the one end of keeping away from each other of collection passageway (23), backplate (24), collection passageway (23) and evaporation chamber (1) enclose to close and form holding chamber (4) that supply connecting channel (22) and radiating fin (21) installation.
5. The integrated heat sink of claim 1, wherein: it is adjacent be provided with two seals (15) between connecting channel (22), seal (15) are followed set up of collection passageway (23) width direction extension, and two one side that seal (15) kept away from each other is fixed connection in one side of set passageway (23) and evaporating chamber (1) respectively, radiating fin (21) are located two between seal (15).
6. The integrated heat sink of claim 5, wherein: the inner fin (3) is arranged in the connecting channel (22), and a plurality of inner fins (3) are arranged along the extending direction of the connecting channel (22).
7. The integrated heat sink of claim 6, wherein: interior fin (3) include first connecting portion (5) of a plurality of and second connecting portion (51), first connecting portion (5) with second connecting portion (51) are perpendicular setting, and a plurality of first connecting portion (5) with second connecting portion (51) end-to-end connection in proper order, first connecting portion (5) with second connecting portion (51) all are on a parallel with the direction of steam flow through.
8. The integrated heat sink of claim 7, wherein: the adjacent first connecting parts (5) are arranged in a staggered manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110179893.0A CN112996357A (en) | 2021-02-07 | 2021-02-07 | Integrated radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110179893.0A CN112996357A (en) | 2021-02-07 | 2021-02-07 | Integrated radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112996357A true CN112996357A (en) | 2021-06-18 |
Family
ID=76392712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110179893.0A Pending CN112996357A (en) | 2021-02-07 | 2021-02-07 | Integrated radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112996357A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115468337A (en) * | 2022-09-26 | 2022-12-13 | 深圳见炬科技有限公司 | Condenser for high-dimensional heat dissipation system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003028584A (en) * | 2001-05-11 | 2003-01-29 | Denso Corp | Ebullient cooling apparatus |
| CN2566460Y (en) * | 2002-07-29 | 2003-08-13 | 李建明 | Heat pipe radiator with multistage radiating structure |
| CN204666011U (en) * | 2015-03-27 | 2015-09-23 | 重庆超力高科技股份有限公司 | A kind of split type inner fin for oil cooler |
| CN205089411U (en) * | 2015-11-02 | 2016-03-16 | 山东厚丰汽车散热器有限公司 | Closed oil cooler of range upon range of end cap of pipeline |
| CN106304805A (en) * | 2016-10-18 | 2017-01-04 | 中车大连机车研究所有限公司 | A kind of plate-fin microcirculation radiator and microcirculation heat-exchange system |
| CN205860564U (en) * | 2016-07-04 | 2017-01-04 | 杭州新都奥兰汽车空调有限公司 | The double parallel flow evaporator core of a kind of fin-tube type |
| CN211291134U (en) * | 2019-10-11 | 2020-08-18 | 株洲时代金属制造有限公司 | Phase change radiator |
| CN212231981U (en) * | 2020-06-22 | 2020-12-25 | 深圳市鸿富诚屏蔽材料有限公司 | 3D phase change superconducting radiator |
-
2021
- 2021-02-07 CN CN202110179893.0A patent/CN112996357A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003028584A (en) * | 2001-05-11 | 2003-01-29 | Denso Corp | Ebullient cooling apparatus |
| CN2566460Y (en) * | 2002-07-29 | 2003-08-13 | 李建明 | Heat pipe radiator with multistage radiating structure |
| CN204666011U (en) * | 2015-03-27 | 2015-09-23 | 重庆超力高科技股份有限公司 | A kind of split type inner fin for oil cooler |
| CN205089411U (en) * | 2015-11-02 | 2016-03-16 | 山东厚丰汽车散热器有限公司 | Closed oil cooler of range upon range of end cap of pipeline |
| CN205860564U (en) * | 2016-07-04 | 2017-01-04 | 杭州新都奥兰汽车空调有限公司 | The double parallel flow evaporator core of a kind of fin-tube type |
| CN106304805A (en) * | 2016-10-18 | 2017-01-04 | 中车大连机车研究所有限公司 | A kind of plate-fin microcirculation radiator and microcirculation heat-exchange system |
| CN211291134U (en) * | 2019-10-11 | 2020-08-18 | 株洲时代金属制造有限公司 | Phase change radiator |
| CN212231981U (en) * | 2020-06-22 | 2020-12-25 | 深圳市鸿富诚屏蔽材料有限公司 | 3D phase change superconducting radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115468337A (en) * | 2022-09-26 | 2022-12-13 | 深圳见炬科技有限公司 | Condenser for high-dimensional heat dissipation system |
| CN115468337B (en) * | 2022-09-26 | 2023-10-10 | 深圳见炬科技有限公司 | Condenser for high-dimensional heat radiation system |
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