CN112996252A - Manufacturing method of small-spacing LED display screen splicing process - Google Patents
Manufacturing method of small-spacing LED display screen splicing process Download PDFInfo
- Publication number
- CN112996252A CN112996252A CN202110179492.5A CN202110179492A CN112996252A CN 112996252 A CN112996252 A CN 112996252A CN 202110179492 A CN202110179492 A CN 202110179492A CN 112996252 A CN112996252 A CN 112996252A
- Authority
- CN
- China
- Prior art keywords
- pcb
- display screen
- led display
- manufacturing
- aluminum alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000741 silica gel Substances 0.000 claims abstract description 12
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000008358 core component Substances 0.000 claims abstract description 4
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 239000000565 sealant Substances 0.000 claims abstract description 4
- 238000004080 punching Methods 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
Abstract
The invention discloses a manufacturing method of a splicing process of small-spacing LED display screens, wherein the size of the display screen is selected, and the display size of the display screen is designed according to requirements; selecting the specifications of the outer frame and the LED unit plate; manufacturing a core component PCB (printed Circuit Board) included in the LED unit board; the corrugated waterproof silica gel pad is arranged at a corrugated groove at the upper part of the aluminum alloy box body by adopting the aluminum alloy box body and the corrugated waterproof silica gel pad; installing and fixing the PCB on a corrugated waterproof silica gel pad in the aluminum alloy box body; injecting the sealant into the gap in the PCB and the gap between the edge of the PCB and the edge of the aluminum alloy box body by using a glue injection machine to form a waterproof layer; and then fixing the mask on the PCB to form the LED display screen splicing assembly. The invention provides a process method better used for splicing LED display screens, which can realize the use effect of small distance for splicing the LED display screens and achieve the use effects of saving cost, protecting environment and improving efficiency.
Description
Technical Field
The invention relates to a manufacturing method of a small-spacing LED display screen splicing process, and belongs to the technical field of LED display screens.
Background
A Light Emitting Diode (LED) can convert electrical energy into Light energy efficiently, and has the characteristics of low current consumption, long service life, and the like. Therefore, the LED can be applied not only to lighting fixtures but also to display devices. In recent years, LEDs have been widely used as a new type of light source in various display fields. In the prior art, a process method better used for splicing the LED display screen does not exist, so that the splicing of the LED display screen cannot realize the use effect of small spacing, and the use effects of saving cost, protecting environment and improving efficiency cannot be achieved. Therefore, a manufacturing method of a small-spacing LED display screen splicing process is urgently needed to solve the problem in the prior art.
In order to solve the technical problems, a new technical scheme is especially provided.
Disclosure of Invention
The invention aims to provide a manufacturing method of a small-spacing LED display screen splicing process, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a manufacturing method of a small-spacing LED display screen splicing process comprises the following steps:
selecting the size of a display screen, and designing the display size of the display screen according to requirements; selecting the specifications of the outer frame and the LED unit plate;
step two, manufacturing a core component PCB circuit board contained in the LED unit board: manufacturing a circuit board according to a designed circuit drawing; cutting the edge of the PCB by using a milling cutter matched with a CCD (charge coupled device) engraving and milling machine to ensure that the edge of one side of the PCB, which is provided with the electric element, is cut to have a certain included angle; punching by using a circuit board punching machine at the position where an electrical element needs to be inserted into the PCB according to a circuit drawing; punching a mounting hole for mounting the LED lamp module on the PCB; inserting the electric element into the punched pin hole according to a circuit design drawing and welding and fixing; erecting the PCB by using an auxiliary tool, and primarily splicing the PCB together by adjusting the auxiliary tool; brushing glue on the joint positions of the edges of the vertically assembled PCB so as to enable the vertically assembled PCB to be adhered together; after the glue is bonded, the auxiliary tool is removed; coating epoxy resin on one side welded by soldering tin to seal and repair the holes of the pins; connecting the PCB board with a lead which is required to be connected between the PCB boards;
thirdly, mounting the corrugated waterproof silica gel pad at a corrugated groove at the upper part of the aluminum alloy box body by adopting the aluminum alloy box body and the corrugated waterproof silica gel pad; installing and fixing the PCB on a corrugated waterproof silica gel pad in the aluminum alloy box body; injecting the sealant into the gap in the PCB and the gap between the edge of the PCB and the edge of the aluminum alloy box body by using a glue injection machine to form a waterproof layer; and then fixing the mask on the PCB to form the LED display screen splicing assembly.
Preferably, the LED display screen splicing assembly is used for acquiring the outline of a wall body to be provided with the display screen through a measuring device before splicing, and determining a reference plane and position information according to the outline of the wall body.
Preferably, the measuring device is a total station, and the total station scans the contour of the wall to be installed and determines a reference plane based on the contour of the wall.
Preferably, the measuring device is a laser tracker.
Compared with the prior art, the invention has the beneficial effects that: the technical method is better used for splicing the LED display screens, so that the splicing of the LED display screens can realize the use effect of small spacing, and the use effects of saving cost, protecting environment and improving efficiency are achieved.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that: a manufacturing method of a small-spacing LED display screen splicing process comprises the following steps:
selecting the size of a display screen, and designing the display size of the display screen according to requirements; selecting the specifications of the outer frame and the LED unit plate;
step two, manufacturing a core component PCB circuit board contained in the LED unit board: manufacturing a circuit board according to a designed circuit drawing; cutting the edge of the PCB by using a milling cutter matched with a CCD (charge coupled device) engraving and milling machine to ensure that the edge of one side of the PCB, which is provided with the electric element, is cut to have a certain included angle; punching by using a circuit board punching machine at the position where an electrical element needs to be inserted into the PCB according to a circuit drawing; punching a mounting hole for mounting the LED lamp module on the PCB; inserting the electric element into the punched pin hole according to a circuit design drawing and welding and fixing; erecting the PCB by using an auxiliary tool, and primarily splicing the PCB together by adjusting the auxiliary tool; brushing glue on the joint positions of the edges of the vertically assembled PCB so as to enable the vertically assembled PCB to be adhered together; after the glue is bonded, the auxiliary tool is removed; coating epoxy resin on one side welded by soldering tin to seal and repair the holes of the pins; connecting the PCB board with a lead which is required to be connected between the PCB boards;
thirdly, mounting the corrugated waterproof silica gel pad at a corrugated groove at the upper part of the aluminum alloy box body by adopting the aluminum alloy box body and the corrugated waterproof silica gel pad; installing and fixing the PCB on a corrugated waterproof silica gel pad in the aluminum alloy box body; injecting the sealant into the gap in the PCB and the gap between the edge of the PCB and the edge of the aluminum alloy box body by using a glue injection machine to form a waterproof layer; and then fixing the mask on the PCB to form the LED display screen splicing assembly.
Preferably, the LED display screen splicing assembly is used for acquiring the outline of a wall body to be provided with the display screen through a measuring device before splicing, and determining a reference plane and position information according to the outline of the wall body.
Preferably, the measuring device is a total station, and the total station scans the contour of the wall to be installed and determines a reference plane based on the contour of the wall.
Preferably, the measuring device is a laser tracker.
When in use, the invention provides a process method better used for splicing the LED display screen, so that the splicing of the LED display screen can realize the use effect of small distance, and the use effects of saving cost, protecting environment and improving efficiency are achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A manufacturing method of a small-spacing LED display screen splicing process is characterized by comprising the following steps:
selecting the size of a display screen, and designing the display size of the display screen according to requirements; selecting the specifications of the outer frame and the LED unit plate;
step two, manufacturing a core component PCB circuit board contained in the LED unit board: manufacturing a circuit board according to a designed circuit drawing; cutting the edge of the PCB by using a milling cutter matched with a CCD (charge coupled device) engraving and milling machine to ensure that the edge of one side of the PCB, which is provided with the electric element, is cut to have a certain included angle; punching by using a circuit board punching machine at the position where an electrical element needs to be inserted into the PCB according to a circuit drawing; punching a mounting hole for mounting the LED lamp module on the PCB; inserting the electric element into the punched pin hole according to a circuit design drawing and welding and fixing; erecting the PCB by using an auxiliary tool, and primarily splicing the PCB together by adjusting the auxiliary tool; brushing glue on the joint positions of the edges of the vertically assembled PCB so as to enable the vertically assembled PCB to be adhered together; after the glue is bonded, the auxiliary tool is removed; coating epoxy resin on one side welded by soldering tin to seal and repair the holes of the pins; connecting the PCB board with a lead which is required to be connected between the PCB boards;
thirdly, mounting the corrugated waterproof silica gel pad at a corrugated groove at the upper part of the aluminum alloy box body by adopting the aluminum alloy box body and the corrugated waterproof silica gel pad; installing and fixing the PCB on a corrugated waterproof silica gel pad in the aluminum alloy box body; injecting the sealant into the gap in the PCB and the gap between the edge of the PCB and the edge of the aluminum alloy box body by using a glue injection machine to form a waterproof layer; and then fixing the mask on the PCB to form the LED display screen splicing assembly.
2. The manufacturing method of the small-spacing LED display screen splicing process according to claim 1, is characterized in that: the LED display screen splicing assembly is used for acquiring the outline of a wall body of a display screen to be installed through a measuring device before splicing, and determining a reference plane and position information according to the outline of the wall body.
3. The manufacturing method of the small-spacing LED display screen splicing process according to claim 1, is characterized in that: the measuring device is a total station which scans the outline of the wall to be installed and determines a reference plane based on the outline of the wall.
4. The manufacturing method of the small-spacing LED display screen splicing process according to claim 1, is characterized in that: the measuring device is a laser tracker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110179492.5A CN112996252A (en) | 2021-02-09 | 2021-02-09 | Manufacturing method of small-spacing LED display screen splicing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110179492.5A CN112996252A (en) | 2021-02-09 | 2021-02-09 | Manufacturing method of small-spacing LED display screen splicing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112996252A true CN112996252A (en) | 2021-06-18 |
Family
ID=76394269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110179492.5A Pending CN112996252A (en) | 2021-02-09 | 2021-02-09 | Manufacturing method of small-spacing LED display screen splicing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112996252A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102663967A (en) * | 2012-04-13 | 2012-09-12 | 北京彩讯科技股份有限公司 | Waterproof structure of LED display screen and manufacturing process method for waterproof structure |
| US20170023215A1 (en) * | 2014-04-18 | 2017-01-26 | Unilumin Group Co., Ltd | Small-spacing LED Screen |
| CN111867258A (en) * | 2020-09-01 | 2020-10-30 | 龙岩金时裕电子有限公司 | Seamless splicing process for PCB (printed circuit board) of cuboid LED (light-emitting diode) display screen |
-
2021
- 2021-02-09 CN CN202110179492.5A patent/CN112996252A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102663967A (en) * | 2012-04-13 | 2012-09-12 | 北京彩讯科技股份有限公司 | Waterproof structure of LED display screen and manufacturing process method for waterproof structure |
| US20170023215A1 (en) * | 2014-04-18 | 2017-01-26 | Unilumin Group Co., Ltd | Small-spacing LED Screen |
| CN111867258A (en) * | 2020-09-01 | 2020-10-30 | 龙岩金时裕电子有限公司 | Seamless splicing process for PCB (printed circuit board) of cuboid LED (light-emitting diode) display screen |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210618 |
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| RJ01 | Rejection of invention patent application after publication |