CN219959683U - Laser light source module - Google Patents
Laser light source module Download PDFInfo
- Publication number
- CN219959683U CN219959683U CN202320210723.9U CN202320210723U CN219959683U CN 219959683 U CN219959683 U CN 219959683U CN 202320210723 U CN202320210723 U CN 202320210723U CN 219959683 U CN219959683 U CN 219959683U
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- Prior art keywords
- module
- diode
- light source
- laser
- laser diode
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 230000008707 rearrangement Effects 0.000 claims abstract description 14
- 230000010287 polarization Effects 0.000 claims abstract description 10
- 239000000428 dust Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- 238000013461 design Methods 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- CJDNEKOMKXLSBN-UHFFFAOYSA-N 1-chloro-3-(4-chlorophenyl)benzene Chemical group C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1 CJDNEKOMKXLSBN-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The utility model provides a laser light source module, the light source module is whole through the bolt installation in base plate top, be equipped with the semiconductor refrigerator between base plate and the heat dissipation module, install polarization on the heat dissipation module and close optical module and diode equipment module, be equipped with collimation module and rearrangement module on the diode equipment module respectively, laser diode installs inside the diode equipment module, diode equipment module one end screw thread is fixed with the clamp plate, clamp plate middle part one side fixed mounting has laser diode, laser diode pin department welded fastening has the PCB board, laser diode and PCB board all are provided with two sets of, and set up with diode equipment module central symmetry, heat dissipation module one end is provided with the semiconductor refrigerator, semiconductor refrigerator middle part one side is provided with laser diode. The design of the utility model solves the problems of poor beam quality and insufficient heat dissipation of the same light source module in the current market, improves the production efficiency and reduces the failure rate.
Description
Technical Field
The utility model belongs to the technical field of semiconductor laser application, and relates to a laser light source module.
Background
In recent years, the development of laser technology and application is rapid, and a plurality of application technical fields are formed by combining a plurality of disciplines, and the development of traditional industry and emerging industry is greatly promoted by the occurrence of the crossing technology and new disciplines. The stage laser lamp makes up the defect that only a beam lamp exists in the performance, and the application of the laser lamp is more extensive and diversified in recent years, but the light source module of the laser lamp always has the problems of poor heat dissipation and light splitting, and the effect of the laser lamp is directly influenced.
Disclosure of Invention
The embodiment of the utility model provides a laser light source module, which solves a series of complex problems in the prior art.
The technical scheme adopted for solving the technical problems is as follows:
a laser light source module comprises a diode assembly module, a collimation module, a rearrangement module, a polarization light combination module, a heat dissipation module, a substrate and a dust cover; wherein, the liquid crystal display device comprises a liquid crystal display device,
the diode assembly module is internally provided with a laser diode, and plays roles in fixing and radiating;
the laser diode is fixed in the diode module through the pressing plate, the PCB is used for supplying power to the laser diode, and a plurality of laser diodes can be connected in series;
the collimation module, the rearrangement module and the polarization light combining module are all of optical designs, and different requirements are realized by adopting different concave-convex lenses, reflecting mirrors, half wave plates, polarization light splitting sheets and the like;
the heat radiation module is used for radiating the laser diode, the heat generated by the laser diode is conducted to the heat radiation module in a heat conduction mode, and then the semiconductor refrigerator counteracts the heat of the heat radiation module to realize the heat radiation of the laser diode;
the substrate is a flat aluminum alloy plate and is used for ensuring the flatness of the laser light source module, and simultaneously, heat generated by the semiconductor refrigerator is conducted to the outside of the laser light source module and then radiated by an external radiating device;
the dustproof cover has the functions of preventing dust from entering the laser light source module, preventing stray light from overflowing, and has a certain protection function, the dustproof cover is positioned at the uppermost part of the laser light source module, and a light outlet is reserved on the side edge of the dustproof cover and used for light emission.
The laser diode is arranged in the diode assembly module, and the pressing plate is connected with the diode assembly module through bolts to fix the laser diode.
After the laser diode is assembled, a PCB is welded at the pin of the laser diode, and the PCB is used for preparing the subsequent power supply and optical collimation of the laser diode.
The heat radiation module is refrigerated by the semiconductor refrigerator, counteracts the heat generated by the laser diode in a heat conduction mode, and then conducts the heat generated by the heat radiation module out of the laser light source module through the substrate.
The collimating module and the rearrangement module are arranged on the diode assembly module, and the collimating module and the rearrangement module are bonded with the lens and the reflector to compress the light spots into the required shape.
The utility model also has the following additional technical characteristics:
the technical scheme of the utility model is further specifically optimized: the laser light source module can be made into three modules of red, green and blue, and white light is synthesized outside through the light combining lens;
the technical scheme of the utility model is further specifically optimized: the number of the laser diodes 11 can be increased or decreased to match the power of the corresponding laser light source module;
the technical scheme of the utility model is further specifically optimized: the laser diode 11 adopts a wiring method of firstly connecting in series and then connecting in parallel, and adopts a PCB board for welding, so that the wiring procedure is simplified;
the technical scheme of the utility model is further specifically optimized: increase the seal groove, install joint strip, prevent that the dust from getting into inside the light source module.
Compared with the prior art, the utility model has the advantages that:
advantage 1: the design of the utility model solves the problem of complex wiring of the traditional laser light source module in the current market, improves the production efficiency and reduces the failure rate.
Advantage 2: the design of the utility model solves the problem that the traditional laser light source module in the current market uses too much welding flux, and reduces the environmental pollution degree.
Advantage 3: the design of the utility model solves the defect that the traditional laser light source module in the current market adopts a mechanical adjusting optical piece, and solves the problem of light splitting.
Advantage 3: the design of the utility model solves the problem of complex repair of the traditional laser light source module in the current market, and has modularized production and convenient maintenance.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the overall structure of the present utility model (without dust cap);
FIG. 2 is a schematic view of the overall structure of the present utility model (with dust cover added);
FIG. 3 is a schematic diagram of a diode assembly module according to the present utility model;
FIG. 4 is a schematic diagram of a heat dissipating module according to the present utility model;
fig. 5 is a schematic top view of the present utility model.
Reference numerals illustrate: 1. a diode assembly module; 2. a collimation module; 3. a rearrangement module; 4. a polarization light combining module; 5. a heat dissipation module; 6. a substrate; 7. a dust cover; 11. a laser diode; 12. a PCB power supply board; 13. a PCB board; 51. a semiconductor refrigerator.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings, in order to provide a more thorough understanding of the present disclosure, and to fully convey the scope of the disclosure to those skilled in the art. While the drawings illustrate exemplary embodiments of the present disclosure, it should be understood that the utility model is not limited to the embodiments set forth herein.
As shown in fig. 1 to 5, a laser light source module comprises a diode assembly module 1, a collimation module 2, a rearrangement module 3, a polarization light combining module 4, a heat dissipation module 5, a substrate 6 and a dust cover 7; wherein, the liquid crystal display device comprises a liquid crystal display device,
referring to fig. 3, a laser diode 11 is installed in the diode assembly module 1 to perform fixing and heat dissipation functions;
referring to fig. 3, the laser diode 11 is fixed inside the diode module 1 by the pressing plate 12, and the PCB 13 functions to supply power to the laser diode 11, so that a plurality of laser diodes 11 can be connected in series;
referring to fig. 1, the collimation module 2, the rearrangement module 3 and the polarization light combining module 4 are all of optical designs, and different concave-convex lenses, reflecting mirrors, half wave plates, polarization light splitting sheets and the like are adopted to realize different requirements;
referring to fig. 3, the laser diode 11 is installed inside the diode assembly module 1, and the pressing plate 12 is connected with the diode assembly module 1 by bolts, thereby fixing the laser diode 11
Referring to fig. 1 to 4, the heat dissipation module 5 is used for dissipating heat of the laser diode 11, the heat generated by the laser diode 11 is conducted to the heat dissipation module 5 in a heat conduction manner, and then the heat of the heat dissipation module 5 is counteracted by the semiconductor refrigerator 51, so that the heat dissipation of the laser diode 11 is realized;
referring to fig. 1 to 4, the substrate 6 is a flat aluminum alloy plate, which functions to ensure flatness of the laser light source module, and simultaneously, to conduct heat generated by the semiconductor refrigerator 51 to the outside of the laser light source module, and then to dissipate heat by an external heat dissipating device;
referring to fig. 2, the dust cover 7 has a function of preventing dust from entering the laser light source module, and meanwhile, preventing stray light from overflowing, and has a certain protection function, the dust cover 7 is positioned at the uppermost part of the laser light source module, and a light outlet is reserved at the side edge for light extraction.
Referring to fig. 3, the laser diode 11 is installed inside the diode assembly module 1, and the pressing plate 12 is connected with the diode assembly module 1 by bolts, functioning to fix the laser diode 11.
Referring to fig. 3, after the laser diode 11 is assembled, the PCB 13 is soldered to the pins of the laser diode 11, and the PCB 13 is used to prepare the laser diode 11 for subsequent power supply and optical alignment.
Referring to fig. 1 to 4, the heat dissipation module 5 is cooled by a semiconductor refrigerator 51, and counteracts the heat generated by the laser diode 11 by heat conduction, and then conducts the heat generated by itself out of the laser light source module itself through the substrate 6.
Referring to fig. 1, a collimator block 2 and a rearranging block 3 are mounted on a diode assembly block 1, and lenses and mirrors are bonded to the collimator block 2 and the rearranging block 3 to compress the light spots into a desired shape.
Example 1
Firstly, the parts marked on the figures are assembled according to the figures, the wiring is referred to a wiring instruction book, a PCB power supply board 12 is welded on a diode assembly module 1 on which the laser diode 11 is mounted, an O ring is additionally arranged at a laser pin to prevent short circuits, and the welding pins are round and have no defects.
When the semiconductor refrigerator 51 is installed, the semiconductor refrigerator is arranged according to fig. 4, one side of the wiring is inwards, the wires are prevented from being exposed, heat conduction silicone grease is smeared on two sides of the semiconductor refrigerator, and the wiring method of connecting in series and then in parallel is adopted, so that the voltage is reduced, the current is increased, and more heat can be dissipated for the heat dissipation module 5.
After all welding is finished, each assembled diode assembly module is installed on the heat dissipation module 5, heat conduction silicone grease is smeared at the bottom, heat conduction efficiency is improved, the collimating lenses are sequentially bonded in sequence, the light spot shape and the position are noted, the rearrangement module 3 is bonded after the collimating module 2 is assembled, and the bonding method of the rearrangement module 3 refers to the collimating module 2.
And finally, bonding the polarization light combining module 4 to ensure that near-far field light spots are completely overlapped and bonded.
After all the bonding is completed, a sealing strip is installed on the heat dissipation module 5, and finally, a lens of a light outlet of the dust cover is bonded, the dust cover is covered, and the installation is completed.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model are clearly and completely described above in conjunction with the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Accordingly, the above detailed description of the embodiments of the utility model provided in the accompanying drawings is not intended to limit the scope of the utility model as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Claims (4)
1. The laser light source module is characterized by comprising a diode assembly module (1), a collimation module (2), a rearrangement module (3), a polarization light combination module (4), a heat dissipation module (5), a substrate (6) and a dust cover (7);
a pressing plate (12) is fixed at one end of the diode assembly module (1) in a threaded manner, a laser diode (11) is fixedly installed on one side of the middle part of the pressing plate (12), and the laser diode (11) is installed inside the diode assembly module (1);
the PCB (13) is welded and fixed at the pin of the laser diode (11), and the laser diode (11) and the PCB (13) are both provided with two groups and are arranged in a central symmetry manner by the diode assembly module (1).
2. The laser light source module of claim 1, wherein: one end of the heat radiation module (5) is provided with a semiconductor refrigerator (51), one side of the middle part of the semiconductor refrigerator (51) is provided with a laser diode (11), and the middle part of the lower end of the laser light source module is provided with a substrate (6).
3. The laser light source module of claim 1, wherein: the LED light source is characterized in that a collimation module (2) is arranged on one side of the upper end of the diode assembly module (1), a rearrangement module (3) is arranged on the other side of the upper end of the diode assembly module (1), the collimation module (2) is arranged on one side in an adhering mode, a lens and a reflector are adhered to the collimation module (2) and the rearrangement module (3), and the rearrangement module (3) is arranged on the other side of the lens and the reflector in an adhering mode.
4. A laser light source module as claimed in any one of claims 2-3, wherein: the upper end of the laser diode (11) is provided with a diode assembly module (1), and the diode assembly module (1) is arranged above the heat dissipation module (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320210723.9U CN219959683U (en) | 2023-02-14 | 2023-02-14 | Laser light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320210723.9U CN219959683U (en) | 2023-02-14 | 2023-02-14 | Laser light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219959683U true CN219959683U (en) | 2023-11-03 |
Family
ID=88548422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320210723.9U Active CN219959683U (en) | 2023-02-14 | 2023-02-14 | Laser light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219959683U (en) |
-
2023
- 2023-02-14 CN CN202320210723.9U patent/CN219959683U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |