CN102386177A - Light-emitting diode (LED) lamp - Google Patents
Light-emitting diode (LED) lamp Download PDFInfo
- Publication number
- CN102386177A CN102386177A CN2011103454322A CN201110345432A CN102386177A CN 102386177 A CN102386177 A CN 102386177A CN 2011103454322 A CN2011103454322 A CN 2011103454322A CN 201110345432 A CN201110345432 A CN 201110345432A CN 102386177 A CN102386177 A CN 102386177A
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- circuit board
- led lamp
- temperature
- silica gel
- led
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Abstract
The invention discloses a light-emitting diode (LED) lamp, which comprises LED chips, a circuit board and a radiation base, wherein the LED chips are arranged on the circuit board. The LED lamp is characterized by further comprising a temperature equalization plate and a reflection container. The radiation base is arranged in the reflection container. The temperature equalization plate is arranged on the radiation base. The circuit board is arranged on the temperature equalization plate. Transparent silica gel is encapsulated on the LED chips. The whole reflection container is filled with the transparent silica gel. The LED lamp provided by the invention solves the problems that the radiation effects of the circuit board of the LED lamp in the prior art are poor, that the color temperature consistency of the product is low and that the service life of the product is short, and has a rational structure and low cost; the circuit board can be rapidly radiated; and the color temperature consistency of a light source is high.
Description
Technical field
The present invention relates to a kind of LED lamp, particularly relate to a kind of LED lamp that has temperature-uniforming plate.
Background technology
At present the LED lamp has only 15%～25% electric energy to convert luminous energy in the course of the work, and remaining electric energy nearly all changes into heat energy, the temperature of LED lamp is raise, and every increase by 10 its reliabilities of degree of temperature will reduce half the.In high-powered LED lamp, heat radiation is a big problem especially.At present there is following defective in common high power white lighting source structure: when 1, the LED lamp utilized silica gel to encapsulate, it was complicated to carry out twice packaging technology, uses the silica gel amount many, and cost is higher; 2, to encapsulate silica gel twice on the LED lamp, so the bad control of product colour temperature consistency; 3, the light energy of led chip is too many through medium, thereby has reduced the utilance of luminous energy, and the illumination light efficiency is not so good.
In addition, because circuit board and cooling base are different materials, solder side can produce some distortion and then produce the slit when circuit board of LED lamp and cooling base welding, the bad situation of contact occurs and takes place.And circuit board directly conducts heat on the cooling base, requires a great deal of time, and heat energy just accumulates on the circuit board easily like this, thereby influences light quality and useful life.
Summary of the invention
Poor in order to solve in the prior art LED circuit for lamp plate radiating effect, product colour temperature consistency is bad, and the problem that useful life is short the invention provides a kind of rational in infrastructurely, with low cost, and circuit board can quick heat radiating, the LED lamp that the consistency of light source color temperature is high.
In order to address the above problem, the technical scheme that the present invention taked is:
A kind of LED lamp comprises led chip, circuit board and cooling base, and said led chip is installed on the circuit board; It is characterized in that: also comprise temperature-uniforming plate and reflection containers; In reflection containers, be provided with cooling base, cooling base is provided with temperature-uniforming plate, and temperature-uniforming plate is provided with circuit board; On led chip, be packaged with transparent silica gel, said transparent silica gel is full of the entire emission container.
Aforesaid a kind of directed LED lamp that has the secondary heat sinking function, it is characterized in that: said temperature-uniforming plate and cooling base adopt dismountable connected mode.
Aforesaid a kind of LED lamp is characterized in that: said cooling base is heat radiation copper pedestal.
Aforesaid a kind of LED lamp is characterized in that: on led chip, be packaged with the transparent silica gel that exceeds the reflection containers opening, said transparent silica gel forms protruding lenticular.
Aforesaid a kind of LED lamp is characterized in that: said circuit board is by copper or aluminum and aluminium oxide or aluminium nitride material be combined into.
The invention has the beneficial effects as follows:
1, the present invention only need get final product by silica gel of encapsulation on led chip, has saved the use amount of silica gel, has reduced cost, adopts once to encapsulate simultaneously can not make a big impact to colour temperature, has improved the consistency of light source color temperature.
2, the present invention use temperature-uniforming plate this light, thin, average temperature performance is good, pass to the passive heat radiation element that heat energy speed is exceedingly fast; Can in the extremely short time, conduct heat energy a large amount of on the circuit board; Having avoided heat energy to accumulate in influences light quality and useful life on the circuit board, the useful life of whole LED lamp is longer.
Description of drawings
Fig. 1 is the structural representation of LED lamp of the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is done further description.
As shown in Figure 1, a kind of LED lamp comprises reflection containers 1, cooling base 2, temperature-uniforming plate 3, circuit board 4 and led chip 5; Circuit board 4 can be by copper or aluminum and aluminium oxide or aluminium nitride material be combined into during design; Cooling base 2 can adopt heat radiation copper pedestal, in reflection containers 1, is provided with cooling base 2, and cooling base 2 is provided with temperature-uniforming plate 3; Temperature-uniforming plate 3 is provided with circuit board 4; Led chip 5 is installed on the circuit board 4, on led chip 5, is packaged with transparent silica gel 6, and transparent silica gel 6 is full of the entire emission container.Transparent silica gel and reflection containers 1 top can form surface tension; Surface tension makes transparent silica gel raise into lenticular; Thereby saved the use of PC lens cover; The lentiform transparent silica gel of solidifying the back reservation adopts once to encapsulate can not make a big impact to colour temperature in order to increase source efficiency simultaneously, has improved the consistency of light source color temperature.
Circuit board 4 adopts thick film technology to be connected with temperature-uniforming plate 3; Connection through thick film technology; Two contact-making surfaces of two plates fit together closely; In the middle of circuit board 4 and cooling base 2, added a temperature-uniforming plate 3 like this, avoided circuit board 4 and cooling base 2 to adopt and contacted bad situation generation when being welded to connect.Use simultaneously temperature-uniforming plate 3 this light, thin, average temperature performance is good, pass to the passive heat radiation element that heat energy speed is exceedingly fast; Can in the extremely short time, conduct heat energy a large amount of on the circuit board 4, having avoided heat energy to accumulate in influences light quality and useful life on the circuit board 4.In addition; Temperature-uniforming plate 3 adopts dismountable connected mode with cooling base 2; Because circuit board 4 adopts thick film technology to fit tightly together with temperature-uniforming plate 3; Such temperature-uniforming plate 3 adopts dismountable fixed form also to reach the effect of circuit board 4 with cooling base 2 easy accessibility with cooling base 2, greatly reduces the maintenance and operation cost.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (5)
1. a LED lamp comprises led chip, circuit board and cooling base, and said led chip is installed on the circuit board; It is characterized in that: also comprise temperature-uniforming plate and reflection containers; In reflection containers, be provided with cooling base, cooling base is provided with temperature-uniforming plate, and temperature-uniforming plate is provided with circuit board; On led chip, be packaged with transparent silica gel, said transparent silica gel is full of the entire emission container.
2. a kind of directed LED lamp that has the secondary heat sinking function according to claim 1, it is characterized in that: said temperature-uniforming plate and cooling base adopt dismountable connected mode.
3. a kind of LED lamp according to claim 2 is characterized in that: said cooling base is heat radiation copper pedestal.
4. a kind of LED lamp according to claim 3 is characterized in that: on led chip, be packaged with the transparent silica gel that exceeds the reflection containers opening, said transparent silica gel forms protruding lenticular.
5. a kind of LED lamp according to claim 4 is characterized in that: said circuit board is by copper or aluminum and aluminium oxide or aluminium nitride material be combined into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103454322A CN102386177A (en) | 2011-11-04 | 2011-11-04 | Light-emitting diode (LED) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103454322A CN102386177A (en) | 2011-11-04 | 2011-11-04 | Light-emitting diode (LED) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102386177A true CN102386177A (en) | 2012-03-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103454322A Pending CN102386177A (en) | 2011-11-04 | 2011-11-04 | Light-emitting diode (LED) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102386177A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102788277A (en) * | 2012-07-31 | 2012-11-21 | 苏州晶雷光电照明科技有限公司 | LED lamp provided with dual heat dissipation functions |
| CN102788276A (en) * | 2012-07-31 | 2012-11-21 | 苏州晶雷光电照明科技有限公司 | LED lamp provided with heat dissipation function |
| CN103542300A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED (light-emitting diode) lamp |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201262368Y (en) * | 2008-09-02 | 2009-06-24 | 安徽乾正光电股份有限公司 | LED lighting device |
| CN201651843U (en) * | 2010-01-22 | 2010-11-24 | 深圳市世纪安耐光电科技有限公司 | Light source of LED lamp |
| CN102064247A (en) * | 2010-11-29 | 2011-05-18 | 苏州纳晶光电有限公司 | Packaging method and packaging structure for embedded light emitting diode |
-
2011
- 2011-11-04 CN CN2011103454322A patent/CN102386177A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201262368Y (en) * | 2008-09-02 | 2009-06-24 | 安徽乾正光电股份有限公司 | LED lighting device |
| CN201651843U (en) * | 2010-01-22 | 2010-11-24 | 深圳市世纪安耐光电科技有限公司 | Light source of LED lamp |
| CN102064247A (en) * | 2010-11-29 | 2011-05-18 | 苏州纳晶光电有限公司 | Packaging method and packaging structure for embedded light emitting diode |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102788277A (en) * | 2012-07-31 | 2012-11-21 | 苏州晶雷光电照明科技有限公司 | LED lamp provided with dual heat dissipation functions |
| CN102788276A (en) * | 2012-07-31 | 2012-11-21 | 苏州晶雷光电照明科技有限公司 | LED lamp provided with heat dissipation function |
| CN103542300A (en) * | 2013-10-29 | 2014-01-29 | 路旺培 | LED (light-emitting diode) lamp |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120321 |