CN112994622A - Doherty radio frequency power amplifier and communication equipment - Google Patents
Doherty radio frequency power amplifier and communication equipment Download PDFInfo
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- CN112994622A CN112994622A CN201911295350.4A CN201911295350A CN112994622A CN 112994622 A CN112994622 A CN 112994622A CN 201911295350 A CN201911295350 A CN 201911295350A CN 112994622 A CN112994622 A CN 112994622A
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 78
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- 230000017525 heat dissipation Effects 0.000 abstract description 19
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- 230000005678 Seebeck effect Effects 0.000 description 2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/04—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in discharge-tube amplifiers
- H03F1/06—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in discharge-tube amplifiers to raise the efficiency of amplifying modulated radio frequency waves; to raise the efficiency of amplifiers acting also as modulators
- H03F1/07—Doherty-type amplifiers
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Abstract
The application discloses a Doherty radio-frequency power amplifier and communication equipment, wherein a mean value power amplifier and a peak value power amplifier are arranged on a first side surface of a circuit board, a thermoelectric conversion module is arranged on a second side surface of the circuit board, which is opposite to the first side surface, and the output end of the thermoelectric conversion module is connected with an electricity utilization module on the circuit board; the thermoelectric conversion module is arranged at a position corresponding to the position of the average power amplifier, absorbs heat energy generated by the operation of the average power amplifier when the average power amplifier operates, converts the absorbed heat energy into electric energy and inputs the electric energy to the power utilization module connected with the output end. The Doherty power amplifier disclosed by the application solves the technical problem that the heat dissipation structure of the Doherty power amplifier is unreasonable in the prior art.
Description
Technical Field
The present application relates to the field of electronic technologies, and in particular, to a Doherty rf power amplifier and a communication device.
Background
The most important characteristic of the Doherty power amplifier in current wireless communication is load modulation (load modulation), which combines the asymmetric output powers of the two amplifiers. The Doherty amplifier comprises an average power amplifier and a peak power amplifier; only the carrier amplifier operates at low power levels; the peak power amplifier generates power at higher power levels and due to good load modulation characteristics the mean power amplifier operates in peak efficiency mode in this region. This feature provides efficient amplification of the amplitude modulated signal. The load modulated by the current ratio of the carrier and peak power amplifier can be self-regulated, and peak efficiency at two output power levels can be achieved: wherein the average power amplifier provides a first peak efficiency when the peak power amplifier is just turned on, and the Doherty amplifier is at a second peak efficiency point at this output power level when both amplifiers are producing their full power.
With the emergence of device elements and software applications with high power requirements, the operation time and the heat productivity of the power amplifier are continuously increased, so that a reasonable scheme is provided to realize the heat dissipation of the power amplifier, and the problem to be solved is solved urgently. According to the operating principle of the Doherty power amplifier and the setting of the power amplifier, the average power amplifier is always in an operating state in the whole operating engineering of the Doherty power amplifier, so that the average power amplifier can continuously generate heat, and if the heat cannot be effectively dissipated, the power amplifier can be damaged, and even components arranged around the average power amplifier can be damaged.
Disclosure of Invention
The application provides a Doherty radio-frequency power amplifier and communication equipment, which are used for solving the technical problem that the heat dissipation structure of the Doherty power amplifier in the prior art is unreasonable.
In a first aspect, a Doherty rf power amplifier is provided, where the average power amplifier and the peak power amplifier are disposed on a first side of a circuit board, and the Doherty rf power amplifier further includes:
arranging a thermoelectric conversion module on a second side surface of the circuit board, which is opposite to the first side surface, and connecting an output end of the thermoelectric conversion module with an electricity utilization module on the circuit board; the thermoelectric conversion module is arranged at a position corresponding to the position of the average power amplifier, absorbs heat energy generated by the operation of the average power amplifier when the average power amplifier operates, converts the absorbed heat energy into electric energy and inputs the electric energy to the power utilization module connected with the output end.
In the embodiment of the application, based on the combination of thermoelectric conversion and a Doherty high-efficiency technology, a new high-efficiency Doherty power amplifier architecture based on a thermoelectric converter is provided, so that the conversion efficiency is improved, and the thermoelectric conversion of the Doherty power amplifier is realized by the area of a thermoelectric conversion module as small as possible, thereby achieving the effects of reducing the cost and improving the energy utilization rate of equipment.
In an alternative embodiment, the power amplifier further includes a first thermal conductor disposed between the thermoelectric conversion module and the circuit board.
In an alternative embodiment, the first thermal conductor comprises a first portion and a second portion; wherein the first portion is connected to the circuit board, and the second portion is connected to the thermoelectric conversion module; and the first portion has a greater thermal conductivity than the second portion.
In an optional embodiment, the Doherty rf power amplifier further comprises a second thermal conductor, the second thermal conductor is disposed at a position corresponding to the peak power amplifier on the second side, and a projection area of the second thermal conductor and the peak power amplifier on the circuit board is the same.
In an alternative embodiment, the power consuming module is the peak power amplifier; the output terminal of the thermoelectric conversion module is connected to the drain of the peaking power amplifier.
In this embodiment, since the peak power amplifier in the Doherty rf power amplifier has a great influence on the linearity of the communication signal, the overall saturation power of the Doherty rf power amplifier can be increased by increasing the leakage voltage, and the linearity is improved, so that in this example, the output end of the thermoelectric conversion module can be directly connected to the drain of the peak power amplifier, so that the power amplifier structure provided by the embodiment can increase the energy utilization rate and also increase the saturation power of the Doherty rf power amplifier by an optimized design.
In an alternative embodiment, the Doherty rf power amplifier comprises a plurality of peak power amplifiers, and the output terminal of the thermoelectric conversion module is connected to the drain of at least one of the plurality of peak power amplifiers.
In an alternative embodiment, the thermoelectric conversion module has a rectangular sheet structure.
In an alternative embodiment, the thermoelectric conversion module includes a high temperature end and a low temperature end, wherein the high temperature end is connected to the second side of the circuit board.
In an alternative embodiment, the attaching the high temperature end to the second side of the circuit board includes:
the high-temperature end is connected to the second side surface of the circuit board through paste or elastic heat-conducting silica gel.
In a second aspect, a communication device is provided, which includes the Doherty rf power amplifier and the communication element as described in the first aspect and any optional implementation manner of the first aspect.
The beneficial effect of this application is as follows:
in view of the above problems in the prior art, the present application provides a new Doherty power amplifier structure, in which a thermoelectric conversion module is disposed in the Doherty power amplifier structure, and the heat energy released by an average amplifier in the Doherty power amplifier is converted into electric energy, so that the influence of the heat dissipation of the average power amplifier on the average power amplifier and surrounding components can be reduced. Meanwhile, the heat dissipation method provided in the prior art adjusts the heat released by the power amplifier in a diffusion manner by increasing the heating area, but the heat inside the device cannot be reduced, and although the heat dissipation method reduces the influence on the heating element, the heat dissipation method may damage the elements around the heating element. According to the scheme provided by the embodiment of the application, heat energy can be directly converted into electric energy, so that the heat of the content of the equipment is effectively reduced, and the influence of heating of the element on the equipment and the element is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a Doherty rf power amplifier according to an embodiment of the present application;
fig. 2 is a schematic diagram of a connection structure between a thermoelectric conversion module and a peak power amplifier according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a communication device according to an embodiment of the present application.
Detailed Description
With the emergence of device elements and software applications with high power requirements, the operation time and the heat productivity of the power amplifier are continuously increased, so that a reasonable scheme is provided to realize the heat dissipation of the power amplifier, and the problem to be solved is solved urgently. According to the operating principle of the Doherty power amplifier and the setting of the power amplifier, the average power amplifier is always in an operating state in the whole operating engineering of the Doherty power amplifier, so that the average power amplifier can continuously generate heat, and if the heat cannot be effectively dissipated, the power amplifier can be damaged, and even components arranged around the average power amplifier can be damaged.
In view of the above problems in the prior art, the present application provides a new Doherty power amplifier structure, in which a thermoelectric conversion module is disposed in the Doherty power amplifier structure, and the heat energy released by an average amplifier in the Doherty power amplifier is converted into electric energy, so that the influence of the heat dissipation of the average power amplifier on the average power amplifier and surrounding components can be reduced. Meanwhile, the heat dissipation method provided in the prior art adjusts the heat released by the power amplifier in a diffusion manner by increasing the heating area, but the heat inside the device cannot be reduced, and although the heat dissipation method reduces the influence on the heating element, the heat dissipation method may damage the elements around the heating element. According to the scheme provided by the embodiment of the application, heat energy can be directly converted into electric energy, so that the heat of the content of the equipment is effectively reduced, and the influence of heating of the element on the equipment and the element is reduced.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
The terms "first," "second," "third," and "fourth," etc. in the description and claims of this application and in the accompanying drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The following describes the apparatus provided in the embodiments of the present application in further detail with reference to the accompanying drawings and specific application scenarios:
example one
As shown in fig. 1, the embodiment of the present application provides a Doherty rf power amplifier, which includes an average power amplifier 102 and a peak power amplifier 103 disposed on a first side of a circuit board 101, and further includes:
a thermoelectric conversion module 104 is arranged on a second side surface of the circuit board 101 opposite to the first side surface, and an output end of the thermoelectric conversion module 104 is connected with an electricity utilization module on the circuit board 101; the thermoelectric conversion module 104 is disposed at a position corresponding to the position of the average power amplifier 102, and when the average power amplifier 102 is operated, the thermoelectric conversion module 104 absorbs the thermal energy generated when the average power amplifier 102 is operated, and converts the absorbed thermal energy into electrical energy to be input to the electricity utilization module connected to the output terminal.
The output end of the thermoelectric conversion module 104 is connected to the circuit board 101, the purpose of reducing energy consumption is achieved by recycling part of electric energy, the thermoelectric conversion module can also be directly connected to the electric modules on the circuit board and directly connected to the power supply circuits of the electric modules, and the purpose of improving energy consumption can be achieved by saving battery electric energy; meanwhile, the temperature rise of the communication terminal is reduced, and the influence of high temperature on the use of a user is reduced.
In this embodiment, in order to achieve good heat transfer between the thermoelectric conversion module 104 and the average power amplifier 102, the thermoelectric conversion module 104 is disposed generally on the front and back sides of the average power amplifier 102; alternatively, the thermoelectric conversion module 104 and the mean power amplifier 102 are projected on the circuit board 101 in an overlapping manner.
In the embodiment of the application, the PA (Power Amplifier) is generally arranged on the front side of the circuit board, and no component is arranged on the back side, so that a better heat dissipation effect can be obtained; for best heat transfer, the thermoelectric conversion module may be disposed on the back side of the circuit board on which the PA is disposed.
The operation principle of the thermoelectric conversion module 104 is as follows: the PA generates heat when working, and a part of the heat is firstly conducted to the circuit board which is in contact with the PA and then conducted to the thermoelectric conversion module which is in contact with the circuit board; a part of the heat reaches the thermoelectric conversion module through heat convection and heat radiation at the heat dissipation through hole on the circuit board; the thermoelectric conversion module absorbs heat energy generated when the PA works, so that the temperature of the high-temperature end of the PA rises, and a temperature difference is formed between the high-temperature end and the low-temperature end of the PA, and therefore electromotive force is generated at the output end of the thermoelectric conversion module by utilizing the Seebeck effect of a semiconductor.
Further, in order to ensure that the voltage of the electric energy converted by the thermoelectric conversion module 104 is more stable and can be applied to more components, a DC-DC conversion module 107 may be further included in this example. The DC-DC conversion module 107 inverts the DC power supplied from the thermoelectric conversion module 104 (performs a step-up or step-down operation) to an ac power, and then rectifies the ac power to another DC voltage.
Further, in order to ensure the heat transfer effect between the thermoelectric conversion module 104 and the average power amplifier 102, and to enable the heat dissipation of the average power amplifier 102 and the heat dissipation of the average power amplifier to enable the thermoelectric conversion module 104 to convert better, the Doherty rf power amplifier in this example further comprises a first heat conductor 105, which is disposed between the thermoelectric conversion module 104 and the circuit board 101.
Further, in order to achieve better conversion efficiency of the thermoelectric conversion module 104 and better heat dissipation of the average power amplifier 102, the first thermal conductor 105 may further include a first portion and a second portion in this embodiment;
wherein the first part is connected with the circuit board (i.e. the first part realizes the part of the average power amplifier 102 for heat dissipation), and the second part is connected with the thermoelectric conversion module (i.e. the second part transmits the heat released by the average power amplifier 102 to the thermoelectric conversion module 104 in a reasonable manner); and the first portion has a greater thermal conductivity than the second portion.
Of course, the first portion and the second portion of the first thermal conductor 105 can be formed by combining a plurality of heat transfer materials, and the portion of the first thermal conductor 105 in contact with the average power amplifier 102 has high heat transfer efficiency, so as to achieve the purpose of transferring the heat released by the average power amplifier 102 at the fastest speed; the portion (i.e., the second portion) of the first thermal conductor 105 in contact with the thermoelectric conversion module 104 may be a heat transfer material with a thermal conductivity matching the thermal conversion efficiency of the thermoelectric conversion module, so that the thermoelectric conversion module 104 can convert all heat released by the average power amplifier 102 into electric energy as much as possible, thereby improving the energy conversion rate and the utilization rate.
In the embodiment of the application, because the communication debugging signal generally has the peak-to-average ratio characteristic, the communication debugging signal mainly transmits an average value signal, and a peak value appears under a certain probability and affects the linear performance; meanwhile, according to the Doherty technology theory, Doherty is an impedance modulation technology, and two or more power amplifiers comprise a mean power amplifier (or called mean power amplifier) and a peak power amplifier (or called peak power amplifier); the mean power amplifier may be PA 1; the peak power amplifier can be PA2, PA3.; when the average signal is input, only the average power amplifier (namely PA1) works, and when the peak signal is input, the average power amplifier (namely PA1) and the peak power amplifier (namely PA2 and PA 3.) work simultaneously, so that the aim of high efficiency and high power is fulfilled;
according to the operating principle of the Doherty radio-frequency power amplifier, when the Doherty radio-frequency power amplifier works, most of debugging signal power is generated by a mean power amplifier (namely PA1), and heat consumption is concentrated on the back of the mean power amplifier; therefore, in the embodiment of the present application, the thermoelectric conversion module 104 is disposed on the back side of the mean power amplifier, so that the heat dissipated by the Doherty rf power amplifier can be converted into electric energy to the greatest extent. In addition, since the Doherty radio-frequency power amplifier basically uses the mean value power amplifier when working, the heat emitted by the mean value power amplifier is collected for electric energy conversion, and the forwarded electric energy can achieve relatively continuous and stable effect, so that the Doherty radio-frequency power amplifier can be applied to more electric elements.
Certainly, it can be determined from the above operating principle of the Doherty rf power amplifier that when the Doherty rf power amplifier operates, although the operation time of the peak power amplifier 103 is not large, and the operation of the peak power amplifier 103 corresponds to relatively large power, the Doherty rf power amplifier in this embodiment further includes a second thermal conductor 106, the second thermal conductor 106 is disposed at a position on the second side corresponding to the peak power amplifier 103, and the projection area of the second thermal conductor 106 and the projection area of the peak power amplifier 103 on the circuit board 101 are the same.
In this example, because peak power amplifier's work persistence is not high, and because peak power amplifier need correspond at high-power work then probably be the instantaneous release a relatively large amount of heat, if the heat that peak power amplifier and mean value power amplifier distribute is converted simultaneously, then can lead to the voltage of thermoelectric conversion module output to be unstable fairly, thereby the use of the conversion electric energy of not being convenient for, so will be to peak power amplifier and mean value power amplifier's different characteristics in this application embodiment, adopt different modes to carry out the heat dissipation and handle, can also effectually provide energy utilization when improving equipment radiating effect.
In addition, based on another characteristic of the Doherty rf power amplifier: the Doherty peak power amplifier (namely PA2 and PA3.) has great influence on the linearity performance of communication signals, and the saturation power of the Doherty radio frequency power amplifier can be increased and the linearity can be improved by increasing the leakage voltage (namely VDD2 and VDD3.). Therefore, in this embodiment, the output end of the thermoelectric conversion module 104 may also be connected to the peak power amplifier (the connection structure of the thermoelectric conversion module 104 and the peak power amplifier is shown in fig. 2), and the specific implementation may be:
using an electronic module as the peak power amplifier; the output terminal of the thermoelectric conversion module 104 is connected to the drain of the peak power amplifier 103.
When the Doherty rf power amplifier includes a plurality of peak power amplifiers, the output terminal of the thermoelectric conversion module is connected to the drain of at least one of the plurality of peak power amplifiers (as shown in fig. 2).
The thermoelectric conversion module 104 may be a rectangular plate structure. And the thermoelectric conversion module 104 includes a high temperature side and a low temperature side, wherein the high temperature side is connected to the second side of the circuit board.
The high-temperature end is connected to the second side face of the circuit board through paste or elastic heat-conducting silica gel.
As shown in fig. 1, the thermoelectric conversion module 104 absorbs the heat energy generated by the operation of the average power amplifier (i.e., PA1), causing the temperature at one end (high temperature end) to rise and form a temperature difference with the other end (low temperature end), thereby generating an electromotive force at the output end of the thermoelectric conversion module by using the seebeck effect of the semiconductor, and the output end is connected to the drain of the peak power amplifier; as shown in fig. 2, the output terminal is connected to the drain of the peak power amplifier (i.e., PA2, PA 3..) and the drain voltage of the peak power amplifier (i.e., VDD2, vdd3..) such as PA2, PA3, etc.) is superimposed on the voltage output by the output terminal, so that the drain voltage of the peak power amplifier is increased, the saturation power of the Doherty rf power amplifier as a whole is increased, and the linearity performance is improved.
Compared with the traditional Doherty radio-frequency power amplifier, the scheme provided by the embodiment of the application improves the conversion efficiency on the original basis, reduces the area of the thermoelectric conversion module, reduces the cost, and improves the saturation power of the Doherty radio-frequency power amplifier.
As shown in fig. 3, based on the Doherty rf power amplifier provided in the above embodiment, the embodiment of the present application further provides a communication device 300, where the communication device 300 is configured to implement a communication function, and the communication device 300 includes a plurality of communication elements 302 with other functions in addition to the Doherty rf power amplifier 301, and in this embodiment, the communication elements 302 with other functions implement the functions of the communication device in combination with the Doherty rf power amplifier 301; the communication device 300 may be a mobile terminal, a base station, etc., and any communication device that can apply a Doherty rf power amplifier may be the communication device 300 in this embodiment. Of course, the communication element 302 in this embodiment may include many specific implementations, not examples here, based on the specific implementation functions of the communication device;
according to the structural description of the Doherty rf power amplifier in the above embodiment, the thermoelectric conversion module in the Doherty rf power amplifier can output electric energy to other electric elements, so in the communication device of this embodiment, in combination with the function of the Doherty rf power amplifier, the communication element 302 can include an electric communication element and other communication elements; in some cases, the power communication element may be connected to an output terminal of the thermoelectric conversion module of the Doherty rf power amplifier, thereby effectively utilizing the electric power output from the thermoelectric conversion module.
In addition, for a communication device with relatively high requirements on efficiency and linearity, the output terminal of the thermoelectric conversion module of the Doherty rf power amplifier 301 in this embodiment is connected to the drain of the peak power amplifier in the Doherty rf power amplifier 301. Therefore, the design of the Doherty radio-frequency power amplifier can be optimized, the saturation power of the Doherty radio-frequency power amplifier 301 is improved, and the efficiency of communication equipment can be improved, the power consumption is reduced, the cost is reduced and the linearity is improved by matching with a carrier signal with a high peak-to-average ratio; especially, the linearity performance of the communication equipment can be improved in the application scene of the Doherty technology, and the mutual interference of the communication equipment is reduced.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A Doherty rf power amplifier wherein an average power amplifier and a peak power amplifier are disposed at a first side of a circuit board, further comprising:
arranging a thermoelectric conversion module on a second side surface of the circuit board, which is opposite to the first side surface, and connecting an output end of the thermoelectric conversion module with an electricity utilization module on the circuit board; the thermoelectric conversion module is arranged at a position corresponding to the position of the average power amplifier, absorbs heat energy generated by the operation of the average power amplifier when the average power amplifier operates, converts the absorbed heat energy into electric energy and inputs the electric energy to the power utilization module connected with the output end.
2. The Doherty radio-frequency power amplifier of claim 1 further comprising a first thermal conductor disposed between the thermoelectric conversion module and the circuit board.
3. The Doherty radio frequency power amplifier of claim 2 wherein the first thermal conductor comprises a first portion and a second portion; wherein the first portion is connected to the circuit board, and the second portion is connected to the thermoelectric conversion module; and the first portion has a greater thermal conductivity than the second portion.
4. The Doherty rf power amplifier of claim 1 further comprising a second thermal conductor disposed at a second side at a position corresponding to the peak power amplifier, and wherein the second thermal conductor has the same projected area on the circuit board as the peak power amplifier.
5. The Doherty radio frequency power amplifier of claim 1 wherein the power consuming module is the peak power amplifier; the output terminal of the thermoelectric conversion module is connected to the drain of the peaking power amplifier.
6. The Doherty radio-frequency power amplifier of claim 5, wherein the Doherty radio-frequency power amplifier comprises a plurality of peaking power amplifiers, and the output terminal of the thermoelectric conversion module is connected to a drain of at least one of the plurality of peaking power amplifiers.
7. The Doherty RF power amplifier of any one of claims 1 to 6, wherein the thermoelectric conversion module is a rectangular sheet structure.
8. The Doherty rf power amplifier of claim 7 wherein the thermoelectric conversion module includes a high temperature end and a low temperature end, wherein the high temperature end is connected to the second side of the circuit board.
9. The Doherty radio frequency power amplifier of claim 8 wherein the high temperature terminal connection at the second side of the circuit board comprises:
the high-temperature end is connected to the second side surface of the circuit board through paste or elastic heat-conducting silica gel.
10. A communication device comprising a Doherty rf power amplifier and a communication element as claimed in claims 1 to 9.
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| CN201911295350.4A CN112994622B (en) | 2019-12-16 | 2019-12-16 | Doherty radio frequency power amplifier and communication equipment |
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| CN201911295350.4A CN112994622B (en) | 2019-12-16 | 2019-12-16 | Doherty radio frequency power amplifier and communication equipment |
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| CN112994622A true CN112994622A (en) | 2021-06-18 |
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| CN107404290A (en) * | 2017-07-10 | 2017-11-28 | 东南大学 | The LDMOS power amplifiers with self-powered function of internet of things oriented |
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