CN201682722U - Data card - Google Patents
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- Publication number
- CN201682722U CN201682722U CN2009202621082U CN200920262108U CN201682722U CN 201682722 U CN201682722 U CN 201682722U CN 2009202621082 U CN2009202621082 U CN 2009202621082U CN 200920262108 U CN200920262108 U CN 200920262108U CN 201682722 U CN201682722 U CN 201682722U
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- Prior art keywords
- data card
- modular converter
- voltage stabilizing
- generation module
- semi
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Abstract
The embodiment of the utility model discloses a data card which comprises a casing, a printed circuit board and an IC device. The data card is characterized in that a semiconductor temperature-difference power generation module is further included; and the semiconductor temperature-difference power generation module utilizes the temperature difference of the exteriors of the IC device and the data card to generate electric energy to serve as a backup battery, so as to guarantee the work of the data card. The data card of the utility model converts the heat energy in the data card generated through the semiconductor temperature-difference power generation module into electric energy supplied for the self-generation use of the data card, thereby achieving the effect of energy cycle use (electric energy to heat energy to electric energy), furthest improving the electric energy utilization ratio of the integral data card, and solving the problem of heat radiation of the data card at the same time.
Description
Technical field
The utility model relates to communication technical field, particularly a kind of data card.
Background technology
Along with the develop rapidly of mobile communication technology, more and more individuals use PC to realize the broadband wireless online by wireless data card, and the data rate of getting online without being tethered to a cable is more and more faster, and the power consumption of data card also improves thereupon.And data card portably uses for the convenience of the user, also develops towards miniaturization.These two factor combinations, cause present data card product when long-time high speed Internet access, IC such as processor inside and radio-frequency power amplifier spare (Integrated Circuit, integrated circuit) the very big power consumption of device consumption, distribute more heat transfer, and in the data card of miniaturization, be difficult for distributing in the short time, thereby cause the data card temperature rise too high.
Radiating treatment to data card in the middle of prior art is generally following two kinds:
First kind: natural heat dissipation.
Second kind: fill Heat Conduction Material in the data card enclosure, make each IC (Integrated Circuit of data card, integrated circuit) there is not the space between device and the data card shell, the heat that produces during each IC work is delivered to the data card shell by Heat Conduction Material, to reach the purpose of quick heat radiating.
State in realization in the process of heat radiation, the inventor finds that there are the following problems at least in the prior art: a big chunk energy of data card consumption has distributed by heat, and data card integral energy utilance is low.
The utility model content
The utility model embodiment provides a kind of data card to be used to improve capacity usage ratio, described data card comprises shell, pcb board and IC device, it is characterized in that also comprising semi-conductor thermo-electric generation module, described semi-conductor thermo-electric generation module utilizes the temperature difference of the outside of IC device and data card to produce electric energy as backup battery, for data card work.Data card among the utility model embodiment is converted to electric energy by semi-conductor thermo-electric generation module again with the inner heat energy that produces of data card and offers the spontaneous use of data card, thereby reach energy circulation and use (electric energy-heat energy-electric energy), the maximum whole utilization rate of electrical of data card that improves, the while has also solved the heat dissipation problem of data card.
Description of drawings
Fig. 1 is a data card structural representation in the prior art;
Fig. 2 is the utility model data card embodiment one structural representation;
Fig. 3 is the utility model data card embodiment two structural representations;
Fig. 4 is a power supply circuits schematic diagram among the utility model data card embodiment;
Fig. 5 is another schematic diagram of power supply circuits among the utility model data card embodiment;
Fig. 6 is the circuit diagram of power supply Hot Spare module embodiment in Fig. 5 power supply circuits;
Fig. 7 is the flow chart of the embodiment that handles of the power supply of the utility model data card.
Embodiment
As shown in Figure 1, the available data card comprises shell 1, pcb board 2 and IC device 3.IC device 3 is connected on the pcb board 2, because the demand of assembling generally leaves the gap between IC device 3 and the shell 1, and the heat that IC device 3 gives out is distributed by shell 1 after by the air in the gap again.Another mode radiating mode is to increase conduction material at gap location, can quicker heat be distributed.This dual mode all can not re-use the heat energy that distributes, and makes that the utilization rate of electrical of data card is low.
For the purpose, technical scheme and the advantage that make the utility model embodiment is clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, embodiment is described in further detail to the utility model.
As shown in Figure 2, be the utility model data card embodiment one structural representation.In the present embodiment, data card also comprises semi-conductor thermo-electric generation module 4 except comprising shell 1, pcb board 2 and IC device 3.
Semi-conductor thermo-electric generation module 4 one sides are close to the surface of IC device 3, and a side is close to the inner surface of shell 1, and described semi-conductor thermo-electric generation module 4 utilizes the temperature difference of IC device 3 and shell 1 to produce electric energy as backup battery, for data card work.
Further, can also comprise level voltage stabilizing modular converter 5, connect semi-conductor thermo-electric generation module 4 and pcb board 2, the electric energy that semi-conductor thermo-electric generation module 4 is produced is converted to the available power supply of data card and offers IC device 3 by pcb board 2 and use.
The efficient that radio-frequency power amplifier spare is general in the data card will be lower than 50%, the energy demand that also promptly surpasses half is converted to heat energy and distributes, and the whole efficiency of power supply also is lower than 80% in the data card, also be that the power supply place also has and surpasses 20% energy consumption in heat energy, the energy of processor and memory portion consumption then almost all transfers heat to.The energy major part that this shows data card consumption transfers heat in fact to and has distributed.The utility model is converted to electric energy by semi-conductor thermo-electric generation module again with the inner heat energy that produces of data card and offers the spontaneous use of data card, thereby reach energy circulation and use (electric energy-heat energy-electric energy), the maximum whole utilization rate of electrical of data card that improves, the while has also solved the heat dissipation problem of data card.
As shown in Figure 3, be the utility model data card embodiment two structural representations.In this enforcement among data card and Fig. 2 the data card difference be, semi-conductor thermo-electric generation module 4 combines with shell 1, become the part of shell, data card among Fig. 3 is because semi-conductor thermo-electric generation module 4 directly contacts the data card extraneous air, can better dispel the heat, and, can reduce the volume of data card better because semi-conductor thermo-electric generation module 4 becomes the part of shell.
As shown in Figure 4, be the power supply circuits schematic diagram among the utility model data card embodiment.In the present embodiment, data card comprises IC device 3, semi-conductor thermo-electric generation module 4, level voltage stabilizing modular converter 5, veneer level switch module 6.Described veneer level switch module 6 is used for electric energy with external power source and is converted to the available electric energy of data card and offers IC device 3.
When data card was started working, the voltage of the electric energy that semi-conductor thermo-electric generation module 4 produces was less than a predetermined value, and then level voltage stabilizing modular converter 5 does not start; Start veneer level switch module 6, also i.e. veneer level switch module 6 work this moment; The voltage of the electric energy that produces when described semi-conductor thermo-electric generation module 4 reaches described predetermined value, and triggering level voltage stabilizing modular converter 5 is started; An exportable control signal is closed veneer level switch module 6 after level voltage stabilizing modular converter 5 starts, and also is that veneer level switch module 6 quits work at this moment, to reduce the energy loss of data card; In the data card course of work, the voltage of the electric energy that described semi-conductor thermo-electric generation module 4 produces reduces, and when being lower than described predetermined value, will close level voltage stabilizing modular converter 5; Level voltage stabilizing modular converter 5 exportable control signals trigger 6 startups of veneer level switch module simultaneously.
As shown in Figure 5, be another schematic diagram of power supply circuits among the utility model data card embodiment.What data card was different with circuit diagram shown in Figure 4 in the present embodiment is except comprising IC device 3, semi-conductor thermo-electric generation module 4, level voltage stabilizing modular converter 5, veneer level switch module 6, also to comprise energy storage module 7.
Described energy storage module 7 connects between semi-conductor thermo-electric generation module 4 and the level voltage stabilizing modular converter 5, is used for stored energy, uses for level voltage stabilizing modular converter 5.Energy storage module 7 can be to be realized by an electric capacity particularly.
Further, data card can also comprise power supply Hot Spare module 8.Described power supply Hot Spare module 8 connects between level voltage stabilizing modular converter 5, veneer level switch module 6 and the IC device 3, be used to prevent level voltage stabilizing modular converter 5 and veneer level switch module 6 short circuits, prevent that promptly level voltage stabilizing modular converter 5 and veneer level switch module 6 from becoming the other side's load.As shown in Figure 6, an execution mode for power supply Hot Spare module 8, connect level voltage stabilizing modular converter 5 and IC device 3 by diode, and, make the electric current of level voltage stabilizing modular converter 5 and veneer level switch module 6 can only flow to IC device 3 by diode connection veneer level switch module 6 and IC device 3.Certainly it may occur to persons skilled in the art that other modes realize.
As shown in Figure 7, the flow chart that power supply is handled when working for the data card among the utility model embodiment may further comprise the steps:
Need to prove, when data card is started working, provide power supply by the veneer level switch module, promptly use external power source work, the voltage of the electric energy that produces when semi-conductor thermo-electric generation module reaches the magnitude of voltage that level voltage stabilizing modular converter starts, then triggering level voltage stabilizing modular converter is closed the veneer level switch module.When the voltage of semi-conductor thermo-electric generation module generation did not reach the magnitude of voltage of voltage voltage stabilizing modular converter startup, then the data card working power switched to the power supply of veneer level switch module, and level voltage stabilizing modular converter is not worked.
The utility model is converted to electric energy by semi-conductor thermo-electric generation module again with the inner heat energy that produces of data card and offers the spontaneous use of data card, thereby reach energy circulation and use (electric energy-heat energy-electric energy), the maximum whole utilization rate of electrical of data card that improves, the while has also solved the heat dissipation problem of data card.
More than lift preferred embodiment; the purpose of this utility model, technical scheme and advantage are further described; institute is understood that; the above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (7)
1. a data card comprises shell, pcb board and IC device, it is characterized in that also comprising semi-conductor thermo-electric generation module, and described semi-conductor thermo-electric generation module utilizes the temperature difference of the outside of IC device and data card to produce electric energy as backup battery, for data card work.
2. data card as claimed in claim 1 is characterized in that, also comprises level voltage stabilizing modular converter, and the electric energy that described level voltage stabilizing modular converter produces semi-conductor thermo-electric generation module is converted to the available power supply of data card and offers the use of IC device.
3. data card as claimed in claim 2 is characterized in that, also comprises energy storage module,
Described energy storage module connects semi-conductor thermo-electric generation module and level voltage stabilizing modular converter, is used to receive the electric energy that semi-conductor thermo-electric generation module produces, and stored energy is for level voltage stabilizing modular converter.
4. data card as claimed in claim 2 is characterized in that, also comprises veneer level switch module, power supply Hot Spare module;
Described veneer level switch module is used for that external power source is converted to the available power supply of data card and offers described IC device;
Described power supply Hot Spare module connects described level voltage stabilizing modular converter, described veneer level switch module and described IC device, is used to prevent described level voltage stabilizing modular converter and described veneer level switch module short circuit.
5. data card as claimed in claim 4, it is characterized in that, when the voltage of described semi-conductor thermo-electric generation module generation electric energy reached the magnitude of voltage of described level voltage stabilizing modular converter startup, described level voltage stabilizing modular converter started, and sent the described veneer level switch module of signal controlling and closed; When the voltage of described semi-conductor thermo-electric generation module generation electric energy was reduced to the magnitude of voltage that is lower than described level voltage stabilizing modular converter startup, described level voltage stabilizing modular converter was closed, and sent the described veneer level switch module of signal controlling and started.
6. data card as claimed in claim 1 is characterized in that, described semi-conductor thermo-electric generation module is close to described inner surface of outer cover and IC device.
7. data card as claimed in claim 1 is characterized in that, described semi-conductor thermo-electric generation module forms the part of shell, is close to the IC device in data card inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202621082U CN201682722U (en) | 2009-12-28 | 2009-12-28 | Data card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202621082U CN201682722U (en) | 2009-12-28 | 2009-12-28 | Data card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201682722U true CN201682722U (en) | 2010-12-22 |
Family
ID=43347753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202621082U Expired - Lifetime CN201682722U (en) | 2009-12-28 | 2009-12-28 | Data card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201682722U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096651A (en) * | 2011-10-31 | 2013-05-08 | 富泰华工业（深圳）有限公司 | Electronic device |
| CN106655893A (en) * | 2016-12-25 | 2017-05-10 | 北京工业大学 | Module in chip and used for converting heat energy into electric energy |
-
2009
- 2009-12-28 CN CN2009202621082U patent/CN201682722U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096651A (en) * | 2011-10-31 | 2013-05-08 | 富泰华工业（深圳）有限公司 | Electronic device |
| CN103096651B (en) * | 2011-10-31 | 2016-06-08 | 镇江福科鑫电子科技有限公司 | Electronic installation |
| TWI561156B (en) * | 2011-10-31 | 2016-12-01 | Hon Hai Prec Ind Co Ltd | Electronic device |
| CN106655893A (en) * | 2016-12-25 | 2017-05-10 | 北京工业大学 | Module in chip and used for converting heat energy into electric energy |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei Device Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190104 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101222 |