CN112952537A

CN112952537A - Manifold type micro-channel heat sink with boss structure

Info

Publication number: CN112952537A
Application number: CN202110378650.XA
Authority: CN
Inventors: 陈建辉; 陈宇鹏; 程度煦; 赵帅; 于世杰
Original assignee: China Electronics Technology Group Corp No 16 Institute
Current assignee: China Electronics Technology Group Corp No 16 Institute; CETC 16 Research Institute
Priority date: 2021-04-08
Filing date: 2021-04-08
Publication date: 2021-06-11

Abstract

The manifold type microchannel heat sink with the boss-like structure comprises a microchannel layer, a liquid separation layer and a liquid inlet layer, wherein the liquid separation layer is provided with an S-shaped manifold type liquid separation flow channel for separating a liquid inlet channel from a liquid return channel, and an outlet of the liquid separation layer is connected with an inlet of the microchannel layer; after the cooling liquid enters the liquid separation layer through the liquid inlet layer, the cooling liquid is conveyed into the micro-channel layer through the manifold flow dividing structure, the cooling liquid enters each micro-channel through the manifold, heat exchange between the liquid and the crystals is completed in the micro-channels, and then the cooling liquid upwards enters the liquid return manifold through the flow fluid to complete the cooling task. The invention utilizes the spherical convex structure to solve the problem of low temperature of the heat sink radiating surface caused by the inlet impact area of the manifold microchannel heat sink microchannel, adjusts the temperature of the low temperature area by adjusting the structural size of the spherical convex structure, further achieves the purpose of uniform temperature of the radiating surface, and simultaneously enables the flow distribution of cooling reaching each microchannel to be uniform in the heat sink liquid separating layer, thereby further improving the temperature uniformity of the heat sink radiating surface.

Description

Manifold type micro-channel heat sink with boss structure

Technical Field

The invention relates to the technical field of high heat flux density heat dissipation and laser crystal heat dissipation, in particular to a manifold type micro-channel heat sink with a boss-like structure.

Background

In recent years, high-frequency, high-energy and high-output power lasers play a vital role in the fields of national defense (laser weapons), industrial processing and scientific research, and people put forward higher and higher requirements on the output power and the beam quality of the lasers. The laser crystal is a crystal material which converts energy provided by the outside into laser with high parallelism and monochromaticity which is coherent in space and time through an optical resonant cavity, and the quality of light emission is seriously influenced by the temperature and the uniformity of the crystal temperature.

The temperature and the thermal stress of the laser crystal are different, so that the refractive indexes of all the parts are different, when the pumping light passes through the crystal, the optical path of the light is continuously changed, the lens effect is caused, and the main expression is as follows: the laser divergence angle is increased, the directivity is poor, the output performance is reduced, and the cooling mode of the crystal is a key link of the laser design.

The sensitivity of the laser crystal to temperature makes the laser crystal have strict requirements on heat dissipation and heat sink, and not only the temperature of the crystal cannot exceed the temperature, but also the temperature uniformity of the surface of the crystal is ensured.

The existing laser crystal heat dissipation mode adopts a micro-channel and diamond heat spreading plate mode, and solves the problems of high heat flow heat dissipation and temperature uniformity of the laser crystal, on one hand, the traditional micro-channel structure has larger flow resistance, and the manifold type micro-channel structure heat sink can effectively reduce the flow resistance, but still causes larger temperature non-uniformity at the inlet of the micro-channel due to the impact of inflow; on the other hand, the use of diamond as a heat diffusion material can greatly increase the cost of the heat sink.

Disclosure of Invention

The manifold type micro-channel heat sink with the boss-like structure provided by the invention can solve the technical defects.

In order to achieve the purpose, the invention adopts the following technical scheme:

a manifold type microchannel heat sink with a boss-like structure comprises a microchannel layer, a liquid separation layer and a liquid inlet layer which are sequentially arranged from bottom to top, wherein the liquid separation layer is provided with an S-shaped manifold type liquid separation flow channel and separates a liquid inlet channel from a liquid return channel, an outlet of the liquid separation layer is connected with an inlet of the microchannel layer, and the size of the outlet of the liquid separation layer is smaller than the structural size of the S-shaped liquid separation flow channel;

after the cooling liquid enters the liquid separation layer through the liquid inlet layer, the cooling liquid is conveyed into the micro-channel layer through the manifold flow dividing structure, the cooling liquid enters each micro-channel through the manifold, heat exchange between the liquid and the crystals is completed in the micro-channels, and then the cooling liquid upwards enters the liquid return manifold through the flow fluid to complete the cooling task.

Further, the feed liquor layer includes that inlet, liquid return mouth advance in outside cold source respectively, return the liquid mouth and connect, and inside contains the runner, with the coolant liquid drainage to dividing the liquid layer, the liquid that flows back simultaneously returns the liquid runner through inside and returns outside cold source, feed liquor layer export with divide liquid layer access connection, feed liquor layer liquid return mouth with divide liquid layer liquid return mouth to be connected.

Furthermore, the microchannel layer is of a microchannel structure with a boss-like structure, and the size L of the boss structure can be adjusted according to the actual inlet flow rate of the microchannel.

Further, the boss structure is a ball-like boss structure.

According to the technical scheme, the boss-like structure is arranged in the microchannel, so that the high temperature uniformity of the manifold-type microchannel heat sink is realized, the liquid inlet channel and the liquid return channel are separated through the S-shaped manifold-type liquid separation channel of the liquid separation layer, the inlets of the outlet microchannel layers of the liquid separation layer are connected, the outlet size of the liquid separation layer is far smaller than the structural size of the S-shaped manifold-type liquid separation channel, and the purpose of uniform flow distribution is achieved; the size L of the boss structure can be adjusted according to the actual inlet flow velocity of the microchannel.

The invention designs a special manifold type micro-channel structure, utilizes a spherical convex structure to reduce the low temperature of the heat sink radiating surface caused by the inlet impact area of a manifold micro-channel heat sink micro-channel, adjusts the temperature of the low temperature area by adjusting the structural size of the spherical convex structure, and further achieves the purpose of uniform temperature of the radiating surface.

The invention utilizes a manifold type micro-channel structure to solve the problem of large flow resistance of the traditional micro-channel, designs a novel micro-channel structure to improve the problem of low temperature of a local area (micro-channel inlet impact area) of a heat dissipation surface of the manifold type micro-channel, and further designs a liquid inlet layer flow distribution structure to ensure the uniformity of flow distribution of each micro-channel and further improve the temperature uniformity of the heat dissipation surface of a heat sink.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic fluid stroke diagram of the present invention;

fig. 3, fig. 4 and fig. 5 are schematic diagrams of liquid inlet layers of the invention at different angles;

FIGS. 6 and 7 are schematic views of the structure of the liquid separation layer of the present invention;

FIG. 8 is a schematic view of a fluid flow path of a separator of the present invention;

fig. 9 and fig. 10 are schematic views of microchannel layer structures according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.

As shown in fig. 1, the manifold-type microchannel heat sink with a boss structure in this embodiment includes a liquid inlet layer 1, a liquid separation layer 2, and a microchannel layer 3, which are sequentially arranged from top to bottom, and after the cooling liquid enters the liquid separation layer 2 through the liquid inlet layer 1, the cooling liquid is sent into the microchannel layer through a manifold flow-dividing structure, as shown in fig. 2, the cooling liquid enters each microchannel from manifold (r) to bottom, and heat exchange between the liquid and the crystal is completed in the microchannel, and then the cooling liquid enters liquid return manifold (r) upwards through a shorter flow path, so as to complete the cooling task.

As shown in fig. 3, fig. 4 and fig. 5, the liquid inlet layer 1 includes a liquid inlet 11, a liquid return port 12 connected to the liquid inlet and the liquid return port of the external cold source, and the liquid inlet layer contains a flow channel, so as to drain the cooling liquid to the liquid separation layer, and simultaneously, the backflow liquid returns to the external cold source through the internal liquid return flow channel, the liquid inlet layer outlet 13 is connected to the liquid separation layer inlet, and the liquid inlet layer liquid return port 14 is connected to the liquid separation layer liquid return port.

As shown in fig. 6, 7 and 8, the liquid separation layer 2 is provided with an S-shaped manifold type liquid separation channel, which includes a liquid separation layer liquid inlet 21 and a liquid separation layer liquid return port 22, and separates liquid inlet and liquid return channels, a liquid separation layer outlet 23 is connected with an inlet of the microchannel layer, and the size of the liquid separation layer outlet is far smaller than the structural size of the S-shaped liquid separation channel, so as to achieve the purpose of uniform flow distribution;

as shown in fig. 9 and 10, the microchannel layer is a microchannel structure with a boss-like structure, specifically, a spherical boss-like structure, and the size L of the boss structure can be adjusted according to the actual inlet flow rate of the microchannel.

From the above, the manifold-type microchannel heat sink with the boss-like structure according to the embodiment of the invention is composed of a liquid inlet layer, a liquid separation layer and a microchannel layer. Particularly, be connected heat sink and outside cold source, the coolant liquid is got into heat sink by the feed liquor layer, divide the liquid layer through the simple minute liquid entering of entering the liquid layer, utilize the special construction that divides the liquid layer with the even distribution of coolant liquid to each microchannel, the coolant liquid accomplishes the heat exchange in the heat source in the microchannel, set up this regional low temperature that the class boss structure compensation fluid caused when getting into simultaneously in the microchannel and assaulted the microchannel bottom, the coolant liquid returns outside cold source along returning the liquid channel after accomplishing the heat exchange with the heat source, accomplish whole cooling cycle.

According to the embodiment of the invention, the boss-like structure is added into the manifold-type micro-channel, and the local too low temperature caused by the fact that the cooling liquid at the inlet of the micro-channel impacts the bottom of the micro-channel is compensated, so that the effect of uniform temperature of the whole radiating surface is achieved.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a manifold formula microchannel of area class boss structure is heat sink, includes from down up setting gradually the microchannel layer, divide the liquid layer, advance the liquid layer, its characterized in that:

the liquid separation layer is provided with an S-shaped manifold type liquid separation flow channel for separating a liquid inlet channel from a liquid return channel, an outlet of the liquid separation layer is connected with an inlet of the micro-channel layer, and the size of the outlet of the liquid separation layer is smaller than the structural size of the S-shaped liquid separation flow channel;

2. The manifolded microchannel heat sink with a boss-like structure of claim 1, wherein: the liquid inlet layer comprises a liquid inlet and a liquid return port which are respectively connected with the liquid return port through an external cold source, a flow channel is arranged inside the liquid inlet layer, the cooling liquid is drained to the liquid separating layer, meanwhile, the backflow liquid returns to the external cold source through the internal liquid return flow channel, the outlet of the liquid inlet layer is connected with the inlet of the liquid separating layer, and the liquid return port of the liquid inlet layer is connected with the liquid separating layer.

3. The manifolded microchannel heat sink with a boss-like structure of claim 1, wherein: the microchannel layer is of a microchannel structure with a boss-like structure, and the size L of the boss structure can be adjusted according to the actual inlet flow rate of the microchannel.

4. The manifolded microchannel heat sink with a boss-like structure of claim 3, wherein: the boss structure is a sphere-like boss structure.